US20140197027A1 - Electroplating aid board and electroplating device using same - Google Patents
Electroplating aid board and electroplating device using same Download PDFInfo
- Publication number
- US20140197027A1 US20140197027A1 US13/739,001 US201313739001A US2014197027A1 US 20140197027 A1 US20140197027 A1 US 20140197027A1 US 201313739001 A US201313739001 A US 201313739001A US 2014197027 A1 US2014197027 A1 US 2014197027A1
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- US
- United States
- Prior art keywords
- electroplating
- plated
- workpiece
- anode
- holes
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Definitions
- the present invention generally relates to an electroplating aid board and an electroplating device using the electroplating aid board, wherein the electroplating aid board is arrange between anode and cathode of the electroplating device and comprises a plurality of holes so that an electroplated product can be manufactured with excellent and homogeneous thickness of plated layers without using a conventionally used shielding plate.
- the primary requirement for an electroplating operation is to provide homogenous and excellent thickness of plated layers on the electroplated product.
- a late developed anode comprises an iridium alloy made anode screen (which is an insoluble anode), which is characterized by large current flow for fast plating.
- FIGS. 5 and 6 schematic views are given to illustrate a copper plating operation carried out with a conventional electroplating device, which comprises a plating solution 90 , two anode baskets 91 (serving as anode of electroplating operation) located in the plating solution 90 and a workpiece 92 to be plated (serving as a cathode of the electroplating operation and the workpiece to be plated 92 being a circuit board in the instant embodiment), wherein the workpiece 92 to be plated is clamped by a clip 93 .
- a drive device is provided to drive the workpiece 92 to be plated to move between the anode baskets 91 .
- a solution commonly adopted in the industry is setting up a V-shaped shielding plate 94 adjacent to a workpiece 92 to be plated.
- the V-shaped shielding plate 94 functions to block excessive positive ions (such as copper ions, arrows shown in the drawings indicating the positive ions) so as to prevent the occurrence of non-homogeneous thickness of plated layers on the workpiece 92 to be plated (the thick black line segments shown on surfaces of the workpiece 92 to be plated of FIG. 7 indicating the plated layers).
- V-shaped shielding plate 94 effectively prevents the occurrence of non-homogeneous thickness of plated layers on the workpiece 92 to be plated.
- the V-shaped shielding plate 94 must be properly moved up and down to correspond to peripheral sites of the workpiece 92 to be plated.
- a driving mechanism and associated controller must be additionally provided. This makes the components of the electroplating facility complicated and numerous. Further, errors may occur in the up and down movement of the V-shaped shielding plate 94 .
- the present invention aims to provide a solution to overcome such problems.
- An object of the present invention is to provide an electroplating aid board that is applicable to electroplating facility to make electroplated product having excellent plated layers of homogeneous thickness.
- the present invention provides an electroplating aid board, which is made of a plastic material that is not electrically conductive and comprises a plurality of holes formed therein.
- the holes function to guide positive ions contained in the plating solution in such a way that excessive positive ions induced by the portion of an anode basket (which is the anode) that exceeds a workpiece to be plated are prohibited from moving obliquely into these holes and thus cannot reach the workpiece to be plated, thereby achieving an effect of shielding to prevent inhomogeneous thickness of plated layers on the workpiece.
- Another object of the present invention is to provide an electroplating device that makes an electroplated product having excellent plated layers of homogeneous thickness.
- the present invention provides an electroplating device that comprises a plating solution, at least one anode basket, and a workpiece to be plated, wherein the anode baskets are located in the plating solution and are connected to an anode of a power supply.
- the workpiece to be plated is placed in the plating solution and connected to a cathode of the power supply.
- the invention is characterized in that an electroplating aid board is arranged between the anode basket and the workpiece to be plated.
- the electroplating aid board has at least one side that has a length exceeds the workpiece to be plated.
- the electroplating aid board is made of a plastic material that is not electrically conductive and comprises a plurality of holes formed therein, whereby in an electroplating operation, with an effect of tunnel provided by the holes, positive ions of the plating solution are guided to flow from the anode baskets (namely anode) straightforward to the nearest surface portion of the workpiece to be plated and also guide the positive ions to move straightforward to fully occupy the corresponding holes.
- FIG. 1 is a perspective view of an electroplating aid board according to the present invention.
- FIG. 2 is a side elevational view of an electroplating device according to the present invention.
- FIG. 3 is a top plan view of a plating tank of the electroplating device according to the present invention.
- FIG. 4 is a schematic view illustrating an electroplating operation carried out by the electroplating device according to the present invention to provide a homogeneous thickness of a plated layer for a workpiece to be plated.
- FIG. 4A is an enlarged view of a portion of FIG. 4 .
- FIG. 5 is a schematic view illustrating a conventional electroplating device carrying out a copper plating operation.
- FIG. 6 is a schematic view illustrating the conventional electroplating device that manufactures a workpiece having inhomogeneous thickness of plated layer.
- FIG. 7 is a schematic view showing a conventional electroplating device that includes a V-shaped shielding plate.
- the present invention provides an electroplating aid board 10 , which is applicable to electroplating facility, is made of a plastic material that is not electrically conductive, and comprises a plurality of holes 11 formed therein.
- the holes 11 function to guide the movement of the positive ions (such as copper ions) contained in a plating solution.
- the holes 11 are arranged in multiple rows and the holes 11 are arranged alternating with respect to each other.
- the present invention also provides an electroplating device 1 , which may be a vertical continuous electroplating machine capable of operations of plating copper on a circuit board.
- the electroplating device 1 comprises a chassis 20 .
- the chassis 20 comprises a plating tank 30 that receives and contains therein a plating solution 31 ; a plurality of anode baskets 40 that are placed in the plating solution 31 and arranged in two rows to receive and contain therein a plating material, such as a copper sphere, and are electrically connected to an anode of an electroplating power supply.
- a workpiece 50 to be plated, such as a circuit board, is placed in the plating solution 31 and is connected to a cathode of the electroplating power supply.
- the workpiece 50 to be plated is clamped by a clip 60 and the clip 60 is moved by a drive device 70 mounted to the chassis 20 , whereby the workpiece 50 to be plated is positionable in the space between the two rows of anode baskets 40 and is movable.
- the electroplating device 1 is generally characterized in that electroplating boards 10 are arranged between the anode baskets 40 and the workpiece 50 to be plated.
- the electroplating aid boards 10 can be secured to fasteners 81 of spray tubes 80 .
- the electroplating aid boards 10 have at least one side having a length exceeding the workpiece 50 to be plated. In the instant embodiment, the electroplating aid boards 10 have lower sides that exceed the workpiece 50 to be plated.
- the electroplating aid boards 10 of the present invention provide an effect of tunnel with the holes thereof to guide the positive ions of the plating solution 31 (such as copper ions indicated by arrows in FIG. 4 ) to move straightforward from each of the anode baskets 40 toward the nearest surface portion of the workpiece 50 to be plated (the thick black line segments on the surfaces of the workpiece 50 to be plated of FIG. 4 indicating plated layers) and also guide the positive ions to move straightforward to fully occupy the corresponding holes 11 .
- the positive ions of the plating solution 31 such as copper ions indicated by arrows in FIG. 4
- the electroplating aid board 10 of the present invention is preferably of a thickness of 6-10 mm.
- the holes 11 of the electroplating aid board 10 according to the present invention are preferably of a hole diameter of 2-5 mm.
- Distance between the holes 11 formed in the electroplating aid board 10 of the present invention is preferably 0.3-0.5 mm. It is preferred that the number of holes 11 formed in a unit area of the electroplating aid board 10 is as many as possible.
- the arrows shown in FIG. 2 indicate the flow of the plating solution 31 that enters and is sprayed from the spray tube 80 so that the plating solution 31 is cyclically circulated for further circulation with fresh solution.
- an electroplated product may be manufactured with excellent plated layers that have homogeneous thickness without using the conventionally used shielding plate.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
An electroplating device includes a plating solution, at least one anode basket located in the plating solution, and a workpiece to be plated. An electroplating aid board is arranged between the anode basket and the workpiece to be plated. The electroplating aid board has at least one side that has a length exceeding the workpiece to be plated. The electroplating aid board is made of a plastic material that is not electrically conductive and includes a plurality of holes formed therein. In an electroplating operation, the holes provide an effect of tunnel that guides positive ions (such as copper ions) of the plating solution to flow from the anode basket (namely anode) straightforward to the nearest surface portion of the workpiece to be plated.
Description
- The present invention generally relates to an electroplating aid board and an electroplating device using the electroplating aid board, wherein the electroplating aid board is arrange between anode and cathode of the electroplating device and comprises a plurality of holes so that an electroplated product can be manufactured with excellent and homogeneous thickness of plated layers without using a conventionally used shielding plate.
- For electroplating devices that are commonly used in the electroplating industry, such as vertical continuous electroplating machine, the primary requirement for an electroplating operation, such as plating copper on a circuit board, is to provide homogenous and excellent thickness of plated layers on the electroplated product.
- The traditional electroplating operation uses a copper-made anode. The copper-made anode, however, will get increasingly thinner. A late developed anode comprises an iridium alloy made anode screen (which is an insoluble anode), which is characterized by large current flow for fast plating.
- Referring to
FIGS. 5 and 6 , schematic views are given to illustrate a copper plating operation carried out with a conventional electroplating device, which comprises aplating solution 90, two anode baskets 91 (serving as anode of electroplating operation) located in theplating solution 90 and aworkpiece 92 to be plated (serving as a cathode of the electroplating operation and the workpiece to be plated 92 being a circuit board in the instant embodiment), wherein theworkpiece 92 to be plated is clamped by aclip 93. A drive device is provided to drive theworkpiece 92 to be plated to move between theanode baskets 91. - Since there may be a large number of
workpieces 92 that are to be plated, theseworkpieces 92 are generally of different sizes, so that the anode baskets 91 (anode) may be greater in size than theworkpiece 92 to be plated (cathode) and thus the anode baskets 91 (anode) and theworkpiece 92 to be plated (cathode) do not match each other. Consequently, a central portion of theworkpiece 92 to be plated (cathode), which is not affected by the size of the anode baskets 91 (anode), may have a normal plated layer (the thick black line segments on theworkpiece 92 ofFIG. 5 indicating the plated layers), while three side edges of theworkpiece 92 that are located in theplating solution 90 may be provided with excessive supply of positive ions (such as copper ions indicated by arrows in the drawing) due to the anode baskets 91 (anode) being greater in size than the workpiece 92 (cathode). The excessive positive ions are attached to the three side edges, making aplated layer 921 formed in the three edges having a thickness greater than that of the central area. Consequently, such an electroplating device cannot provide homogeneous and excellent plating thickness for electroplated products. - Referring to
FIG. 7 , to overcome such a shortcoming of non-homogeneous thickness of plated layers formed on an electroplated product, a solution commonly adopted in the industry is setting up a V-shaped shielding plate 94 adjacent to aworkpiece 92 to be plated. The V-shaped shielding plate 94 functions to block excessive positive ions (such as copper ions, arrows shown in the drawings indicating the positive ions) so as to prevent the occurrence of non-homogeneous thickness of plated layers on theworkpiece 92 to be plated (the thick black line segments shown on surfaces of theworkpiece 92 to be plated ofFIG. 7 indicating the plated layers). - The arrangement of V-
shaped shielding plate 94 effectively prevents the occurrence of non-homogeneous thickness of plated layers on theworkpiece 92 to be plated. However, the V-shaped shielding plate 94 must be properly moved up and down to correspond to peripheral sites of theworkpiece 92 to be plated. To move the V-shaped shielding plate 94 up and down, a driving mechanism and associated controller must be additionally provided. This makes the components of the electroplating facility complicated and numerous. Further, errors may occur in the up and down movement of the V-shaped shielding plate 94. - So far, in the electroplating industry, a perfect electroplating device that provides an excellent electroplated product having a homogeneous thickness of plated layers is yet available.
- Thus, the present invention aims to provide a solution to overcome such problems.
- An object of the present invention is to provide an electroplating aid board that is applicable to electroplating facility to make electroplated product having excellent plated layers of homogeneous thickness.
- To achieve the object, the present invention provides an electroplating aid board, which is made of a plastic material that is not electrically conductive and comprises a plurality of holes formed therein. The holes function to guide positive ions contained in the plating solution in such a way that excessive positive ions induced by the portion of an anode basket (which is the anode) that exceeds a workpiece to be plated are prohibited from moving obliquely into these holes and thus cannot reach the workpiece to be plated, thereby achieving an effect of shielding to prevent inhomogeneous thickness of plated layers on the workpiece.
- Another object of the present invention is to provide an electroplating device that makes an electroplated product having excellent plated layers of homogeneous thickness.
- To achieve the object, the present invention provides an electroplating device that comprises a plating solution, at least one anode basket, and a workpiece to be plated, wherein the anode baskets are located in the plating solution and are connected to an anode of a power supply. The workpiece to be plated is placed in the plating solution and connected to a cathode of the power supply. The invention is characterized in that an electroplating aid board is arranged between the anode basket and the workpiece to be plated. The electroplating aid board has at least one side that has a length exceeds the workpiece to be plated. The electroplating aid board is made of a plastic material that is not electrically conductive and comprises a plurality of holes formed therein, whereby in an electroplating operation, with an effect of tunnel provided by the holes, positive ions of the plating solution are guided to flow from the anode baskets (namely anode) straightforward to the nearest surface portion of the workpiece to be plated and also guide the positive ions to move straightforward to fully occupy the corresponding holes. Further, for those anode baskets (namely anode) that are located at portions exceeding the workpiece to be plated, the positive ions generated thereby are not allowed to move obliquely into the holes and cannot reach the workpiece to be plated, whereby an effect of shielding is realized to prevent inhomogeneous thickness of plated layers formed on the workpiece to be plated without applying the conventionally used shielding board.
- The foregoing objectives and summary provide only a brief introduction to the present invention. To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the invention and the claims should be read in conjunction with the accompanying drawings. Throughout the specification and drawings identical reference numerals refer to identical or similar parts.
- Many other advantages and features of the present invention will become manifest to those versed in the art upon making reference to the detailed description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example.
-
FIG. 1 is a perspective view of an electroplating aid board according to the present invention. -
FIG. 2 is a side elevational view of an electroplating device according to the present invention. -
FIG. 3 is a top plan view of a plating tank of the electroplating device according to the present invention. -
FIG. 4 is a schematic view illustrating an electroplating operation carried out by the electroplating device according to the present invention to provide a homogeneous thickness of a plated layer for a workpiece to be plated. -
FIG. 4A is an enlarged view of a portion ofFIG. 4 . -
FIG. 5 is a schematic view illustrating a conventional electroplating device carrying out a copper plating operation. -
FIG. 6 is a schematic view illustrating the conventional electroplating device that manufactures a workpiece having inhomogeneous thickness of plated layer. -
FIG. 7 is a schematic view showing a conventional electroplating device that includes a V-shaped shielding plate. - The following descriptions are exemplary embodiments only, and are not intended to limit the scope, applicability or configuration of the invention in any way. Rather, the following description provides a convenient illustration for implementing exemplary embodiments of the invention. Various changes to the described embodiments may be made in the function and arrangement of the elements described without departing from the scope of the invention as set forth in the appended claims.
- Referring to
FIG. 1 , the present invention provides anelectroplating aid board 10, which is applicable to electroplating facility, is made of a plastic material that is not electrically conductive, and comprises a plurality ofholes 11 formed therein. Theholes 11 function to guide the movement of the positive ions (such as copper ions) contained in a plating solution. - The
holes 11 are arranged in multiple rows and theholes 11 are arranged alternating with respect to each other. - Referring to
FIGS. 2 and 3 , the present invention also provides anelectroplating device 1, which may be a vertical continuous electroplating machine capable of operations of plating copper on a circuit board. Theelectroplating device 1 comprises achassis 20. Thechassis 20 comprises aplating tank 30 that receives and contains therein aplating solution 31; a plurality ofanode baskets 40 that are placed in theplating solution 31 and arranged in two rows to receive and contain therein a plating material, such as a copper sphere, and are electrically connected to an anode of an electroplating power supply. Aworkpiece 50 to be plated, such as a circuit board, is placed in theplating solution 31 and is connected to a cathode of the electroplating power supply. Theworkpiece 50 to be plated is clamped by aclip 60 and theclip 60 is moved by adrive device 70 mounted to thechassis 20, whereby theworkpiece 50 to be plated is positionable in the space between the two rows ofanode baskets 40 and is movable. - Referring to
FIGS. 2-4 , theelectroplating device 1 according to the present invention is generally characterized in thatelectroplating boards 10 are arranged between theanode baskets 40 and theworkpiece 50 to be plated. Theelectroplating aid boards 10 can be secured tofasteners 81 ofspray tubes 80. Further, theelectroplating aid boards 10 have at least one side having a length exceeding theworkpiece 50 to be plated. In the instant embodiment, theelectroplating aid boards 10 have lower sides that exceed theworkpiece 50 to be plated. In an electroplating operation, when theworkpiece 50 to be plated is driven by thedrive device 70 to move into the space between the two rows ofanode baskets 40, theelectroplating aid boards 10 of the present invention provide an effect of tunnel with the holes thereof to guide the positive ions of the plating solution 31 (such as copper ions indicated by arrows inFIG. 4 ) to move straightforward from each of theanode baskets 40 toward the nearest surface portion of theworkpiece 50 to be plated (the thick black line segments on the surfaces of theworkpiece 50 to be plated ofFIG. 4 indicating plated layers) and also guide the positive ions to move straightforward to fully occupy thecorresponding holes 11. Further, for thoseanode baskets 40 that are located at portions exceeding theworkpiece 50 to be plated (see the portion below the phantom line ofFIG. 4 ), the positive ions generated thereby are not allowed to move obliquely into theholes 11 and cannot reach theworkpiece 50 to be plated, whereby an effect of shielding is realized. As such, the problem of non-homogenous thickness of a plated layer formed on theworkpiece 50 to be plated is avoided. - Practical tests and experiments show that the
electroplating aid board 10 of the present invention is preferably of a thickness of 6-10 mm. Theholes 11 of theelectroplating aid board 10 according to the present invention are preferably of a hole diameter of 2-5 mm. Distance between theholes 11 formed in theelectroplating aid board 10 of the present invention is preferably 0.3-0.5 mm. It is preferred that the number ofholes 11 formed in a unit area of theelectroplating aid board 10 is as many as possible. - The arrows shown in
FIG. 2 indicate the flow of theplating solution 31 that enters and is sprayed from thespray tube 80 so that theplating solution 31 is cyclically circulated for further circulation with fresh solution. - In summary, through using the electroplating aid board and the electroplating device according to the present invention, an electroplated product may be manufactured with excellent plated layers that have homogeneous thickness without using the conventionally used shielding plate.
- It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above.
- While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.
Claims (5)
1. An electroplating aid board, which is adapted to be used in electroplating facility, is made of a plastic material that is not electrically conductive, and comprises a plurality of holes formed therein, the holes guiding positive ions contained in a plating solution.
2. The electroplating aid board according to claim 1 , wherein the holes are arranged in rows and the holes are set to alternate each other.
3. An electroplating device, comprising:
a plating solution;
at least one anode basket, which is located in the plating solution and is connected to an anode of a power supply; and
a workpiece to be plated, which is placed in the plating solution and is connected to a cathode of the power supply; and
characterized in that an electroplating aid board is arranged between the anode basket and the workpiece to be plated, the electroplating aid board having at least one side that has a length exceeding the workpiece to be plated, the electroplating aid board being made of a plastic material that is not electrically conductive and comprising a plurality of holes formed therein.
4. The electroplating device according to claim 3 , wherein the holes are arranged in rows and the holes are set to alternate each other.
5. The electroplating device according to claim 3 , wherein the electroplating aid board is secured to a fastener provided on a spray tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US13/739,001 US20140197027A1 (en) | 2013-01-11 | 2013-01-11 | Electroplating aid board and electroplating device using same |
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US13/739,001 US20140197027A1 (en) | 2013-01-11 | 2013-01-11 | Electroplating aid board and electroplating device using same |
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US20140197027A1 true US20140197027A1 (en) | 2014-07-17 |
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US13/739,001 Abandoned US20140197027A1 (en) | 2013-01-11 | 2013-01-11 | Electroplating aid board and electroplating device using same |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017177924A (en) * | 2016-03-29 | 2017-10-05 | 株式会社ファルテック | Vehicular exterior component |
CN114887975A (en) * | 2022-05-23 | 2022-08-12 | 广德三生科技有限公司 | Automatic copper ball adding and cleaning device |
CN115802633A (en) * | 2022-11-28 | 2023-03-14 | 福莱盈电子股份有限公司 | Electroplating uniformity method of circuit board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3835017A (en) * | 1972-12-22 | 1974-09-10 | Buckbee Mears Co | Reusable shields for selective electrodeposition |
US4240880A (en) * | 1978-07-25 | 1980-12-23 | Sumitomo Metal Mining Co., Ltd. | Method and apparatus for selectively plating a material |
US4367125A (en) * | 1979-03-21 | 1983-01-04 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
-
2013
- 2013-01-11 US US13/739,001 patent/US20140197027A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3835017A (en) * | 1972-12-22 | 1974-09-10 | Buckbee Mears Co | Reusable shields for selective electrodeposition |
US4240880A (en) * | 1978-07-25 | 1980-12-23 | Sumitomo Metal Mining Co., Ltd. | Method and apparatus for selectively plating a material |
US4367125A (en) * | 1979-03-21 | 1983-01-04 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017177924A (en) * | 2016-03-29 | 2017-10-05 | 株式会社ファルテック | Vehicular exterior component |
CN114887975A (en) * | 2022-05-23 | 2022-08-12 | 广德三生科技有限公司 | Automatic copper ball adding and cleaning device |
CN115802633A (en) * | 2022-11-28 | 2023-03-14 | 福莱盈电子股份有限公司 | Electroplating uniformity method of circuit board |
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