JPS4983868A - - Google Patents
Info
- Publication number
- JPS4983868A JPS4983868A JP12004673A JP12004673A JPS4983868A JP S4983868 A JPS4983868 A JP S4983868A JP 12004673 A JP12004673 A JP 12004673A JP 12004673 A JP12004673 A JP 12004673A JP S4983868 A JPS4983868 A JP S4983868A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Magnetic Heads (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31100672A | 1972-11-30 | 1972-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4983868A true JPS4983868A (en) | 1974-08-12 |
JPS5733703B2 JPS5733703B2 (en) | 1982-07-19 |
Family
ID=23204973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12004673A Expired JPS5733703B2 (en) | 1972-11-30 | 1973-10-26 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5733703B2 (en) |
FR (1) | FR2209216B1 (en) |
GB (1) | GB1441781A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5580819A (en) * | 1978-12-14 | 1980-06-18 | Mitsubishi Electric Corp | Manufacture of thin film magnetic head |
JPS5691494A (en) * | 1979-12-25 | 1981-07-24 | Nippon Electric Co | Method of forming conductor pattern |
JPS5766523A (en) * | 1980-10-13 | 1982-04-22 | Hitachi Ltd | Thin-film magnetic head |
JPS57164413A (en) * | 1981-03-31 | 1982-10-09 | Fujitsu Ltd | Manufacture of thin film magnetic head |
JPS5819716A (en) * | 1981-07-27 | 1983-02-04 | Hitachi Ltd | Thin film magnetic head and its production |
JPH05235173A (en) * | 1992-02-24 | 1993-09-10 | Nec Corp | Semiconductor device and manufacturing method thereof |
JPH0644531A (en) * | 1993-02-24 | 1994-02-18 | Hitachi Ltd | Thin film magnetic head |
US5407530A (en) * | 1992-11-18 | 1995-04-18 | Mitsumi Electric Co., Ltd. | Method of preparing fine conductive pattern |
US5556814A (en) * | 1994-03-28 | 1996-09-17 | Kabushiki Kaisha Toshiba | Method of forming wirings for integrated circuits by electroplating |
CN114501833A (en) * | 2020-10-23 | 2022-05-13 | 深南电路股份有限公司 | Method for processing solder mask on circuit board |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7704186A (en) * | 1977-04-18 | 1978-10-20 | Philips Nv | PROCEDURE FOR GALVANIC REINFORCEMENT OF A CONDUCTIVE BASIC PATTERN AND EQUIPMENT OBTAINED USING THE PROCESS. |
IE51854B1 (en) * | 1980-12-03 | 1987-04-15 | Memorex Corp | Method of fabricating a metallic pattern on a substrate |
US4375390A (en) * | 1982-03-15 | 1983-03-01 | Anderson Nathaniel C | Thin film techniques for fabricating narrow track ferrite heads |
GB2213325B (en) * | 1987-12-04 | 1992-01-02 | Marconi Electronic Devices | A method of forming electrical conductors |
CN112993087A (en) * | 2021-03-02 | 2021-06-18 | 苏州太阳井新能源有限公司 | Manufacturing method of photovoltaic cell electrode |
CN114173510B (en) * | 2021-12-08 | 2022-12-13 | 上海交通大学 | Miniature multi-layer heat insulation structure with air heat insulation layer and preparation and application thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3154450A (en) * | 1960-01-27 | 1964-10-27 | Bendix Corp | Method of making mesas for diodes by etching |
US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
US3507756A (en) * | 1967-08-04 | 1970-04-21 | Bell Telephone Labor Inc | Method of fabricating semiconductor device contact |
-
1973
- 1973-10-23 FR FR7338736A patent/FR2209216B1/fr not_active Expired
- 1973-10-26 JP JP12004673A patent/JPS5733703B2/ja not_active Expired
- 1973-10-29 GB GB5028773A patent/GB1441781A/en not_active Expired
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6115491B2 (en) * | 1978-12-14 | 1986-04-24 | Mitsubishi Electric Corp | |
JPS5580819A (en) * | 1978-12-14 | 1980-06-18 | Mitsubishi Electric Corp | Manufacture of thin film magnetic head |
JPS5691494A (en) * | 1979-12-25 | 1981-07-24 | Nippon Electric Co | Method of forming conductor pattern |
JPS5766523A (en) * | 1980-10-13 | 1982-04-22 | Hitachi Ltd | Thin-film magnetic head |
JPH0447368B2 (en) * | 1981-03-31 | 1992-08-03 | Fujitsu Ltd | |
JPS57164413A (en) * | 1981-03-31 | 1982-10-09 | Fujitsu Ltd | Manufacture of thin film magnetic head |
JPS5819716A (en) * | 1981-07-27 | 1983-02-04 | Hitachi Ltd | Thin film magnetic head and its production |
JPH0544087B2 (en) * | 1981-07-27 | 1993-07-05 | Hitachi Ltd | |
JPH05235173A (en) * | 1992-02-24 | 1993-09-10 | Nec Corp | Semiconductor device and manufacturing method thereof |
US5407530A (en) * | 1992-11-18 | 1995-04-18 | Mitsumi Electric Co., Ltd. | Method of preparing fine conductive pattern |
JPH0644531A (en) * | 1993-02-24 | 1994-02-18 | Hitachi Ltd | Thin film magnetic head |
US5556814A (en) * | 1994-03-28 | 1996-09-17 | Kabushiki Kaisha Toshiba | Method of forming wirings for integrated circuits by electroplating |
CN114501833A (en) * | 2020-10-23 | 2022-05-13 | 深南电路股份有限公司 | Method for processing solder mask on circuit board |
CN114501833B (en) * | 2020-10-23 | 2024-05-14 | 深南电路股份有限公司 | Processing method of solder mask layer on circuit board |
Also Published As
Publication number | Publication date |
---|---|
GB1441781A (en) | 1976-07-07 |
JPS5733703B2 (en) | 1982-07-19 |
FR2209216B1 (en) | 1977-09-30 |
FR2209216A1 (en) | 1974-06-28 |