JPS4922552A - - Google Patents
Info
- Publication number
- JPS4922552A JPS4922552A JP6324072A JP6324072A JPS4922552A JP S4922552 A JPS4922552 A JP S4922552A JP 6324072 A JP6324072 A JP 6324072A JP 6324072 A JP6324072 A JP 6324072A JP S4922552 A JPS4922552 A JP S4922552A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6324072A JPS4922552A (ja) | 1972-06-26 | 1972-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6324072A JPS4922552A (ja) | 1972-06-26 | 1972-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4922552A true JPS4922552A (ja) | 1974-02-28 |
Family
ID=13223487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6324072A Pending JPS4922552A (ja) | 1972-06-26 | 1972-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4922552A (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50158875A (ja) * | 1974-06-14 | 1975-12-23 | ||
| JPS5341765A (en) * | 1976-09-28 | 1978-04-15 | Nippon Electric Co | Method of producing high density multilayer circuit board |
| JPS58119694A (ja) * | 1982-01-12 | 1983-07-16 | 株式会社日立製作所 | 配線基板の製造方法 |
| JPS58121698A (ja) * | 1982-01-12 | 1983-07-20 | 株式会社日立製作所 | 多層配線基板 |
| JPS61179597A (ja) * | 1985-02-04 | 1986-08-12 | 沖電気工業株式会社 | 多層配線形成方法 |
-
1972
- 1972-06-26 JP JP6324072A patent/JPS4922552A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50158875A (ja) * | 1974-06-14 | 1975-12-23 | ||
| JPS5341765A (en) * | 1976-09-28 | 1978-04-15 | Nippon Electric Co | Method of producing high density multilayer circuit board |
| JPS5819158B2 (ja) * | 1976-09-28 | 1983-04-16 | 日本電気株式会社 | 高密度多層配線基板の製造方法 |
| JPS58119694A (ja) * | 1982-01-12 | 1983-07-16 | 株式会社日立製作所 | 配線基板の製造方法 |
| JPS58121698A (ja) * | 1982-01-12 | 1983-07-20 | 株式会社日立製作所 | 多層配線基板 |
| JPH0451998B2 (ja) * | 1982-01-12 | 1992-08-20 | Hitachi Ltd | |
| JPH0544199B2 (ja) * | 1982-01-12 | 1993-07-05 | Hitachi Ltd | |
| JPS61179597A (ja) * | 1985-02-04 | 1986-08-12 | 沖電気工業株式会社 | 多層配線形成方法 |
| JPH0438157B2 (ja) * | 1985-02-04 | 1992-06-23 | Oki Electric Ind Co Ltd |