JPS4915444A - - Google Patents

Info

Publication number
JPS4915444A
JPS4915444A JP47050101A JP5010172A JPS4915444A JP S4915444 A JPS4915444 A JP S4915444A JP 47050101 A JP47050101 A JP 47050101A JP 5010172 A JP5010172 A JP 5010172A JP S4915444 A JPS4915444 A JP S4915444A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47050101A
Other versions
JPS5422115B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5010172A priority Critical patent/JPS5422115B2/ja
Priority to US00361326A priority patent/US3816847A/en
Publication of JPS4915444A publication Critical patent/JPS4915444A/ja
Publication of JPS5422115B2 publication Critical patent/JPS5422115B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Light Receiving Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP5010172A 1972-05-19 1972-05-19 Expired JPS5422115B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP5010172A JPS5422115B2 (ja) 1972-05-19 1972-05-19
US00361326A US3816847A (en) 1972-05-19 1973-05-17 Light-sensible semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5010172A JPS5422115B2 (ja) 1972-05-19 1972-05-19

Publications (2)

Publication Number Publication Date
JPS4915444A true JPS4915444A (ja) 1974-02-09
JPS5422115B2 JPS5422115B2 (ja) 1979-08-04

Family

ID=12849670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5010172A Expired JPS5422115B2 (ja) 1972-05-19 1972-05-19

Country Status (2)

Country Link
US (1) US3816847A (ja)
JP (1) JPS5422115B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127375U (ja) * 1974-04-01 1975-10-18
JPS5450507A (en) * 1977-09-29 1979-04-20 Ishii Tekkosho Kk Combustion apparatus for cyclic lpg reforming apparatus
JPS63108651U (ja) * 1986-12-27 1988-07-13

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1454188A (ja) * 1973-12-03 1976-10-27
US3964157A (en) * 1974-10-31 1976-06-22 Bell Telephone Laboratories, Incorporated Method of mounting semiconductor chips
US4013915A (en) * 1975-10-23 1977-03-22 Bell Telephone Laboratories, Incorporated Light emitting device mounting arrangement
JPS5946434B2 (ja) * 1978-01-10 1984-11-12 キヤノン株式会社 半導体レ−ザ装置
US4307934A (en) * 1978-05-08 1981-12-29 General Dynamics, Pomona Division Packaged fiber optic modules
NL178376C (nl) * 1978-06-19 1986-03-03 Philips Nv Koppelelement met een lichtbron en een lens.
NL7904283A (nl) * 1979-05-31 1980-12-02 Philips Nv Koppelelement met een lichtbron en en lensvormig element.
JPS58500921A (ja) * 1981-06-12 1983-06-02 モトロ−ラ・インコ−ポレ−テツド セルフアライン・レンズを備えたリ−ド
DE3128418A1 (de) * 1981-07-17 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer elektronische bauelemente, insbesondere optoelektronische halbleiterbauelemente
JPS58145169A (ja) * 1982-02-23 1983-08-29 Nec Corp 光半導体装置
US4659170A (en) * 1983-07-29 1987-04-21 Rca Corporation Packages for electro-optic devices
NL8303316A (nl) * 1983-09-28 1985-04-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting voor het uitzenden van licht.
FR2554606B1 (fr) * 1983-11-04 1987-04-10 Thomson Csf Dispositif optique de concentration du rayonnement lumineux emis par une diode electroluminescente, et diode electroluminescente comportant un tel dispositif
US4644096A (en) * 1985-03-18 1987-02-17 Alpha Industries, Inc. Surface mounting package
JPH073874B2 (ja) * 1987-07-22 1995-01-18 工業技術院長 半導体装置
US5122621A (en) * 1990-05-07 1992-06-16 Synergy Microwave Corporation Universal surface mount package
US5160810A (en) * 1990-05-07 1992-11-03 Synergy Microwave Corporation Universal surface mount package
SE468027B (sv) * 1991-02-27 1992-10-19 Asea Brown Boveri Optoelektronisk komponent med halvledarelement innefattade i sluten kapsel, vilken kapsel bestaar av en kaapa som centreras och laases relativt en sockel medelst ett byggelement
DE4129421C2 (de) * 1991-09-05 1997-01-30 Lajos Kuene Solar-Drehdisplay
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
US5760834A (en) * 1992-09-30 1998-06-02 Lsi Logic Electronic camera with binary lens element array
US5529936A (en) * 1992-09-30 1996-06-25 Lsi Logic Corporation Method of etching a lens for a semiconductor solid state image sensor
US5340978A (en) * 1992-09-30 1994-08-23 Lsi Logic Corporation Image-sensing display panels with LCD display panel and photosensitive element array
US6031253A (en) * 1997-09-30 2000-02-29 Kyocera Corporation Package for housing photosemiconductor device
US6229088B1 (en) 1998-01-09 2001-05-08 Legacy Technologies, Inc. Low profile electronic enclosure
US6798931B2 (en) * 2001-03-06 2004-09-28 Digital Optics Corp. Separating of optical integrated modules and structures formed thereby
US7343535B2 (en) * 2002-02-06 2008-03-11 Avago Technologies General Ip Dte Ltd Embedded testing capability for integrated serializer/deserializers
US6823582B1 (en) * 2002-08-02 2004-11-30 National Semiconductor Corporation Apparatus and method for force mounting semiconductor packages to printed circuit boards
US6903382B2 (en) * 2003-07-07 2005-06-07 Lightop Technology Co., Ltd. Light emitting diode mounting structure
US6982437B2 (en) * 2003-09-19 2006-01-03 Agilent Technologies, Inc. Surface emitting laser package having integrated optical element and alignment post
US7520679B2 (en) * 2003-09-19 2009-04-21 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical device package with turning mirror and alignment post
US20050063431A1 (en) * 2003-09-19 2005-03-24 Gallup Kendra J. Integrated optics and electronics
US6998691B2 (en) * 2003-09-19 2006-02-14 Agilent Technologies, Inc. Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
US20050063648A1 (en) * 2003-09-19 2005-03-24 Wilson Robert Edward Alignment post for optical subassemblies made with cylindrical rods, tubes, spheres, or similar features
US20050213995A1 (en) * 2004-03-26 2005-09-29 Myunghee Lee Low power and low jitter optical receiver for fiber optic communication link
US7201495B2 (en) * 2004-08-03 2007-04-10 Philips Lumileds Lighting Company, Llc Semiconductor light emitting device package with cover with flexible portion
US8896005B2 (en) * 2010-07-29 2014-11-25 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
DE102011003969B4 (de) * 2011-02-11 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements
US10439358B2 (en) * 2016-04-28 2019-10-08 Nichia Corporation Manufacturing method of light-emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062958A (en) * 1959-05-20 1962-11-06 Edward J Warner Radiation detector

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3288585A (en) * 1962-06-22 1966-11-29 Philco Corp Method of making a miniature lens
FR1487314A (fr) * 1965-09-24 1967-07-07 Radiotechnique Diode électroluminescente et son procédé de fabrication

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062958A (en) * 1959-05-20 1962-11-06 Edward J Warner Radiation detector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127375U (ja) * 1974-04-01 1975-10-18
JPS5450507A (en) * 1977-09-29 1979-04-20 Ishii Tekkosho Kk Combustion apparatus for cyclic lpg reforming apparatus
JPS63108651U (ja) * 1986-12-27 1988-07-13
JPH0517891Y2 (ja) * 1986-12-27 1993-05-13

Also Published As

Publication number Publication date
JPS5422115B2 (ja) 1979-08-04
US3816847A (en) 1974-06-11

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