JPS49139A - - Google Patents
Info
- Publication number
- JPS49139A JPS49139A JP47039645A JP3964572A JPS49139A JP S49139 A JPS49139 A JP S49139A JP 47039645 A JP47039645 A JP 47039645A JP 3964572 A JP3964572 A JP 3964572A JP S49139 A JPS49139 A JP S49139A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47039645A JPS5123266B2 (ja) | 1972-04-21 | 1972-04-21 | |
SE7305651A SE379674B (ja) | 1972-04-21 | 1973-04-19 | |
DE2320099A DE2320099C3 (de) | 1972-04-21 | 1973-04-19 | Verfahren zur Herstellung eines Kunststoffsubstrates mit aufgerauhter Oberfläche |
GB1897173A GB1374934A (en) | 1972-04-21 | 1973-04-19 | Production of roughened surfaces on synthetic resin substrates |
US353106A US3876479A (en) | 1972-04-21 | 1973-04-20 | Method for producing a synthetic resin substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47039645A JPS5123266B2 (ja) | 1972-04-21 | 1972-04-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS49139A true JPS49139A (ja) | 1974-01-05 |
JPS5123266B2 JPS5123266B2 (ja) | 1976-07-15 |
Family
ID=12558809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47039645A Expired JPS5123266B2 (ja) | 1972-04-21 | 1972-04-21 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3876479A (ja) |
JP (1) | JPS5123266B2 (ja) |
DE (1) | DE2320099C3 (ja) |
GB (1) | GB1374934A (ja) |
SE (1) | SE379674B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5435271U (ja) * | 1978-07-21 | 1979-03-08 | ||
WO1980000294A1 (en) * | 1978-07-13 | 1980-02-21 | Tokyo Shibaura Electric Co | Method of fabricating printed circuits |
JPS5568380U (ja) * | 1978-10-31 | 1980-05-10 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51142765U (ja) * | 1975-05-12 | 1976-11-17 | ||
DE2801218C3 (de) * | 1978-01-12 | 1980-11-20 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum elektrolytischen Ätzen einer rekristallisierten Aluminiumfolie und deren Verwendung |
JPS599050A (ja) | 1982-07-08 | 1984-01-18 | 日立電線株式会社 | 銅張積層板の製造方法 |
JPS6155994A (ja) * | 1984-08-27 | 1986-03-20 | 信越化学工業株式会社 | 銅張りフレキシブルプリント回路用基板 |
DE3510202A1 (de) * | 1985-03-21 | 1986-09-25 | Bayer Ag, 5090 Leverkusen | Elektrische leiterplatten |
DE3510201A1 (de) * | 1985-03-21 | 1986-09-25 | Bayer Ag, 5090 Leverkusen | Elektrische leiterplatten |
JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
EP1843650B1 (en) | 1998-09-03 | 2012-03-07 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
AU2003901559A0 (en) * | 2003-04-07 | 2003-05-01 | Unisearch Limited | Glass texturing method |
US8198540B2 (en) * | 2006-06-06 | 2012-06-12 | Mitsubishi Materials Corporation | Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module |
DE102016113641A1 (de) | 2016-07-25 | 2018-01-25 | Christian-Albrechts-Universität Zu Kiel | Aluminium-Kupfer-Konnektor aufweisend eine Heterostruktur und Verfahren zur Herstellung der Heterostruktur |
DE102021111149A1 (de) | 2021-04-29 | 2022-11-03 | Christian-Albrechts-Universität zu Kiel, Körperschaft des öffentlichen Rechts | Polymer-kompositstruktur aufweisend eine aluminium-polymer verankerungsschicht sowie ätzverfahren |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2930741A (en) * | 1960-03-29 | Electrolytic capacitors | ||
BE516819A (ja) * | 1952-01-10 | |||
US2932599A (en) * | 1955-05-09 | 1960-04-12 | Sanders Associates Inc | Method of preparation of thermoplastic resin coated printed circuit |
US3438127A (en) * | 1965-10-21 | 1969-04-15 | Friden Inc | Manufacture of circuit modules using etched molds |
US3574070A (en) * | 1967-05-11 | 1971-04-06 | Shipley Co | Metal plating over plastic |
US3784440A (en) * | 1969-12-31 | 1974-01-08 | Macdermid Inc | Aluminum-clad plastic substrate laminates |
-
1972
- 1972-04-21 JP JP47039645A patent/JPS5123266B2/ja not_active Expired
-
1973
- 1973-04-19 DE DE2320099A patent/DE2320099C3/de not_active Expired
- 1973-04-19 SE SE7305651A patent/SE379674B/xx unknown
- 1973-04-19 GB GB1897173A patent/GB1374934A/en not_active Expired
- 1973-04-20 US US353106A patent/US3876479A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1980000294A1 (en) * | 1978-07-13 | 1980-02-21 | Tokyo Shibaura Electric Co | Method of fabricating printed circuits |
JPS5435271U (ja) * | 1978-07-21 | 1979-03-08 | ||
JPS5568380U (ja) * | 1978-10-31 | 1980-05-10 |
Also Published As
Publication number | Publication date |
---|---|
SE379674B (ja) | 1975-10-20 |
US3876479A (en) | 1975-04-08 |
DE2320099A1 (de) | 1973-10-25 |
GB1374934A (en) | 1974-11-20 |
DE2320099B2 (de) | 1974-07-18 |
JPS5123266B2 (ja) | 1976-07-15 |
DE2320099C3 (de) | 1979-10-11 |