JPS49123271A - - Google Patents

Info

Publication number
JPS49123271A
JPS49123271A JP3451373A JP3451373A JPS49123271A JP S49123271 A JPS49123271 A JP S49123271A JP 3451373 A JP3451373 A JP 3451373A JP 3451373 A JP3451373 A JP 3451373A JP S49123271 A JPS49123271 A JP S49123271A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3451373A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3451373A priority Critical patent/JPS49123271A/ja
Publication of JPS49123271A publication Critical patent/JPS49123271A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Wire Bonding (AREA)
JP3451373A 1973-03-28 1973-03-28 Pending JPS49123271A (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3451373A JPS49123271A (cs) 1973-03-28 1973-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3451373A JPS49123271A (cs) 1973-03-28 1973-03-28

Publications (1)

Publication Number Publication Date
JPS49123271A true JPS49123271A (cs) 1974-11-26

Family

ID=12416328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3451373A Pending JPS49123271A (cs) 1973-03-28 1973-03-28

Country Status (1)

Country Link
JP (1) JPS49123271A (cs)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355466U (cs) * 1976-10-13 1978-05-12
JPS55124248A (en) * 1979-03-20 1980-09-25 Nec Corp Leadless package
JPS56137659A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device and its manufacture
JPS57196548A (en) * 1981-05-28 1982-12-02 Toshiba Corp Plastic chip carrier
JPS58127352A (ja) * 1982-01-25 1983-07-29 Mitsubishi Electric Corp 半導体装置パツケ−ジ
JPS601847A (ja) * 1983-06-20 1985-01-08 Toshiba Corp 混成集積回路
JPS61188956A (ja) * 1985-02-18 1986-08-22 Matsushita Electronics Corp 半導体チツプキヤリヤ
JPS63229842A (ja) * 1987-03-19 1988-09-26 Ibiden Co Ltd 表面実装用パツケ−ジ
JPS63258048A (ja) * 1987-04-15 1988-10-25 Mitsubishi Electric Corp 半導体装置
JPH0287558A (ja) * 1988-09-24 1990-03-28 Murata Mfg Co Ltd Ｉｃチップ
JPH0313746U (cs) * 1989-06-26 1991-02-12

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459630Y1 (cs) * 1967-07-18 1970-05-06
JPS4519370Y1 (cs) * 1967-07-17 1970-08-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4519370Y1 (cs) * 1967-07-17 1970-08-06
JPS459630Y1 (cs) * 1967-07-18 1970-05-06

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355466U (cs) * 1976-10-13 1978-05-12
JPS5727154Y2 (cs) * 1976-10-13 1982-06-14
JPS55124248A (en) * 1979-03-20 1980-09-25 Nec Corp Leadless package
JPS56137659A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device and its manufacture
JPS57196548A (en) * 1981-05-28 1982-12-02 Toshiba Corp Plastic chip carrier
JPS58127352A (ja) * 1982-01-25 1983-07-29 Mitsubishi Electric Corp 半導体装置パツケ−ジ
JPS601847A (ja) * 1983-06-20 1985-01-08 Toshiba Corp 混成集積回路
JPS61188956A (ja) * 1985-02-18 1986-08-22 Matsushita Electronics Corp 半導体チツプキヤリヤ
JPS63229842A (ja) * 1987-03-19 1988-09-26 Ibiden Co Ltd 表面実装用パツケ−ジ
JPS63258048A (ja) * 1987-04-15 1988-10-25 Mitsubishi Electric Corp 半導体装置
JPH0287558A (ja) * 1988-09-24 1990-03-28 Murata Mfg Co Ltd Ｉｃチップ
JPH0313746U (cs) * 1989-06-26 1991-02-12

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