JPS4896075A - - Google Patents

Info

Publication number
JPS4896075A
JPS4896075A JP2827172A JP2827172A JPS4896075A JP S4896075 A JPS4896075 A JP S4896075A JP 2827172 A JP2827172 A JP 2827172A JP 2827172 A JP2827172 A JP 2827172A JP S4896075 A JPS4896075 A JP S4896075A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2827172A
Other languages
Japanese (ja)
Other versions
JPS5113614B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2827172A priority Critical patent/JPS5113614B2/ja
Publication of JPS4896075A publication Critical patent/JPS4896075A/ja
Publication of JPS5113614B2 publication Critical patent/JPS5113614B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Weting (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2827172A 1972-03-21 1972-03-21 Expired JPS5113614B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2827172A JPS5113614B2 (enrdf_load_stackoverflow) 1972-03-21 1972-03-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2827172A JPS5113614B2 (enrdf_load_stackoverflow) 1972-03-21 1972-03-21

Publications (2)

Publication Number Publication Date
JPS4896075A true JPS4896075A (enrdf_load_stackoverflow) 1973-12-08
JPS5113614B2 JPS5113614B2 (enrdf_load_stackoverflow) 1976-05-01

Family

ID=12243905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2827172A Expired JPS5113614B2 (enrdf_load_stackoverflow) 1972-03-21 1972-03-21

Country Status (1)

Country Link
JP (1) JPS5113614B2 (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910672A (enrdf_load_stackoverflow) * 1972-05-24 1974-01-30
JPS5052980A (enrdf_load_stackoverflow) * 1973-09-10 1975-05-10
JP2003037234A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037235A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037237A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003051574A (ja) * 2001-08-07 2003-02-21 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2009054690A (ja) * 2007-08-24 2009-03-12 Denso Corp リードフレーム構造体
JP2016021515A (ja) * 2014-07-15 2016-02-04 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP2017168691A (ja) * 2016-03-16 2017-09-21 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3046192U (ja) * 1997-08-11 1998-02-24 株式会社金子製作所 コンクリート製品用の鉄筋構造

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910672A (enrdf_load_stackoverflow) * 1972-05-24 1974-01-30
JPS5052980A (enrdf_load_stackoverflow) * 1973-09-10 1975-05-10
JP2003037234A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037235A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037237A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003051574A (ja) * 2001-08-07 2003-02-21 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2009054690A (ja) * 2007-08-24 2009-03-12 Denso Corp リードフレーム構造体
JP2016021515A (ja) * 2014-07-15 2016-02-04 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP2017168691A (ja) * 2016-03-16 2017-09-21 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法

Also Published As

Publication number Publication date
JPS5113614B2 (enrdf_load_stackoverflow) 1976-05-01

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