JPS4896075A - - Google Patents

Info

Publication number
JPS4896075A
JPS4896075A JP2827172A JP2827172A JPS4896075A JP S4896075 A JPS4896075 A JP S4896075A JP 2827172 A JP2827172 A JP 2827172A JP 2827172 A JP2827172 A JP 2827172A JP S4896075 A JPS4896075 A JP S4896075A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2827172A
Other languages
Japanese (ja)
Other versions
JPS5113614B2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2827172A priority Critical patent/JPS5113614B2/ja
Publication of JPS4896075A publication Critical patent/JPS4896075A/ja
Publication of JPS5113614B2 publication Critical patent/JPS5113614B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Weting (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2827172A 1972-03-21 1972-03-21 Expired JPS5113614B2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2827172A JPS5113614B2 (de) 1972-03-21 1972-03-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2827172A JPS5113614B2 (de) 1972-03-21 1972-03-21

Publications (2)

Publication Number Publication Date
JPS4896075A true JPS4896075A (de) 1973-12-08
JPS5113614B2 JPS5113614B2 (de) 1976-05-01

Family

ID=12243905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2827172A Expired JPS5113614B2 (de) 1972-03-21 1972-03-21

Country Status (1)

Country Link
JP (1) JPS5113614B2 (de)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910672A (de) * 1972-05-24 1974-01-30
JPS5052980A (de) * 1973-09-10 1975-05-10
JP2003037234A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037235A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037237A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003051574A (ja) * 2001-08-07 2003-02-21 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2009054690A (ja) * 2007-08-24 2009-03-12 Denso Corp リードフレーム構造体
JP2016021515A (ja) * 2014-07-15 2016-02-04 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP2017168691A (ja) * 2016-03-16 2017-09-21 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3046192U (ja) * 1997-08-11 1998-02-24 株式会社金子製作所 コンクリート製品用の鉄筋構造

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910672A (de) * 1972-05-24 1974-01-30
JPS5724655B2 (de) * 1972-05-24 1982-05-25
JPS5052980A (de) * 1973-09-10 1975-05-10
JPS5613026B2 (de) * 1973-09-10 1981-03-25
JP2003037234A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037235A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003037237A (ja) * 2001-07-23 2003-02-07 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP2003051574A (ja) * 2001-08-07 2003-02-21 Sumitomo Metal Mining Co Ltd リードフレームの製造方法
JP4507473B2 (ja) * 2001-08-07 2010-07-21 住友金属鉱山株式会社 リードフレームの製造方法
JP2009054690A (ja) * 2007-08-24 2009-03-12 Denso Corp リードフレーム構造体
JP2016021515A (ja) * 2014-07-15 2016-02-04 Ｓｈマテリアル株式会社 半導体装置用リードフレーム及びその製造方法
JP2017168691A (ja) * 2016-03-16 2017-09-21 Ｓｈマテリアル株式会社 Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法

Also Published As

Publication number Publication date
JPS5113614B2 (de) 1976-05-01

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