JPS4876087A - - Google Patents

Info

Publication number
JPS4876087A
JPS4876087A JP47090069A JP9006972A JPS4876087A JP S4876087 A JPS4876087 A JP S4876087A JP 47090069 A JP47090069 A JP 47090069A JP 9006972 A JP9006972 A JP 9006972A JP S4876087 A JPS4876087 A JP S4876087A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47090069A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4876087A publication Critical patent/JPS4876087A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/16Wiring arrangements for selector switches or relays in frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP47090069A 1971-09-10 1972-09-09 Pending JPS4876087A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE1154971 1971-09-10

Publications (1)

Publication Number Publication Date
JPS4876087A true JPS4876087A (es) 1973-10-13

Family

ID=20294168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47090069A Pending JPS4876087A (es) 1971-09-10 1972-09-09

Country Status (10)

Country Link
US (1) US3796923A (es)
JP (1) JPS4876087A (es)
AU (1) AU470758B2 (es)
BE (1) BE788558A (es)
DE (1) DE2243970C3 (es)
ES (1) ES406544A1 (es)
FR (1) FR2152246A5 (es)
GB (1) GB1402310A (es)
IT (1) IT967332B (es)
NL (1) NL7212068A (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302723B1 (en) 1991-10-11 2001-10-16 Tyco Electronics Corporation Telecommunications terminal block
US5557250A (en) * 1991-10-11 1996-09-17 Raychem Corporation Telecommunications terminal block
AT515664B1 (de) * 2014-05-20 2015-11-15 Hofstätter Josef Einschubelement für Rahmengestelle
US11088066B2 (en) 2018-03-19 2021-08-10 Tactotek Oy Multilayer structure and related method of manufacture for electronics

Also Published As

Publication number Publication date
GB1402310A (en) 1975-08-06
AU4619972A (en) 1974-03-07
DE2243970A1 (de) 1973-03-22
IT967332B (it) 1974-02-28
US3796923A (en) 1974-03-12
FR2152246A5 (es) 1973-04-20
BE788558A (fr) 1973-01-02
AU470758B2 (en) 1976-03-25
DE2243970B2 (de) 1975-03-13
NL7212068A (es) 1973-03-13
DE2243970C3 (de) 1975-10-30
ES406544A1 (es) 1976-01-01

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