JPS4868170A - - Google Patents
Info
- Publication number
- JPS4868170A JPS4868170A JP46105027A JP10502771A JPS4868170A JP S4868170 A JPS4868170 A JP S4868170A JP 46105027 A JP46105027 A JP 46105027A JP 10502771 A JP10502771 A JP 10502771A JP S4868170 A JPS4868170 A JP S4868170A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46105027A JPS4868170A (ja) | 1971-12-20 | 1971-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46105027A JPS4868170A (ja) | 1971-12-20 | 1971-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4868170A true JPS4868170A (ja) | 1973-09-17 |
Family
ID=14396540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46105027A Pending JPS4868170A (ja) | 1971-12-20 | 1971-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4868170A (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240974A (en) * | 1975-09-27 | 1977-03-30 | Mitsubishi Electric Corp | Package for semiconductor chips |
| JPS5324259U (ja) * | 1976-08-09 | 1978-03-01 | ||
| JPS5951324U (ja) * | 1983-07-20 | 1984-04-04 | セイコーエプソン株式会社 | 液晶表示装置 |
| JPS60140727A (ja) * | 1983-12-27 | 1985-07-25 | Fujitsu Ltd | 半導体集積回路装置 |
| JPS61225829A (ja) * | 1985-03-29 | 1986-10-07 | Fujitsu Ltd | 半導体装置 |
| JPS63250140A (ja) * | 1987-04-07 | 1988-10-18 | Matsushita Electric Ind Co Ltd | 半導体チツプの実装方法 |
| JPH0258247A (ja) * | 1988-08-23 | 1990-02-27 | Nec Corp | 半導体装置 |
-
1971
- 1971-12-20 JP JP46105027A patent/JPS4868170A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240974A (en) * | 1975-09-27 | 1977-03-30 | Mitsubishi Electric Corp | Package for semiconductor chips |
| JPS5324259U (ja) * | 1976-08-09 | 1978-03-01 | ||
| JPS5727141Y2 (ja) * | 1976-08-09 | 1982-06-14 | ||
| JPS5951324U (ja) * | 1983-07-20 | 1984-04-04 | セイコーエプソン株式会社 | 液晶表示装置 |
| JPS60140727A (ja) * | 1983-12-27 | 1985-07-25 | Fujitsu Ltd | 半導体集積回路装置 |
| JPH0351098B2 (ja) * | 1983-12-27 | 1991-08-05 | Fujitsu Ltd | |
| JPS61225829A (ja) * | 1985-03-29 | 1986-10-07 | Fujitsu Ltd | 半導体装置 |
| JPS63250140A (ja) * | 1987-04-07 | 1988-10-18 | Matsushita Electric Ind Co Ltd | 半導体チツプの実装方法 |
| JPH0258247A (ja) * | 1988-08-23 | 1990-02-27 | Nec Corp | 半導体装置 |