JPS4847273A - - Google Patents
Info
- Publication number
- JPS4847273A JPS4847273A JP46080881A JP8088171A JPS4847273A JP S4847273 A JPS4847273 A JP S4847273A JP 46080881 A JP46080881 A JP 46080881A JP 8088171 A JP8088171 A JP 8088171A JP S4847273 A JPS4847273 A JP S4847273A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46080881A JPS5029622B2 (ja) | 1971-10-15 | 1971-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46080881A JPS5029622B2 (ja) | 1971-10-15 | 1971-10-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4847273A true JPS4847273A (ja) | 1973-07-05 |
| JPS5029622B2 JPS5029622B2 (ja) | 1975-09-25 |
Family
ID=13730671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46080881A Expired JPS5029622B2 (ja) | 1971-10-15 | 1971-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5029622B2 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524414A (en) * | 1978-08-09 | 1980-02-21 | Hitachi Ltd | Electrode forming process |
| JPS57106140A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPS60224248A (ja) * | 1984-04-23 | 1985-11-08 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH03114228A (ja) * | 1990-04-13 | 1991-05-15 | Seiko Epson Corp | 金属メッキ配線を有する半導体装置の製造方法 |
-
1971
- 1971-10-15 JP JP46080881A patent/JPS5029622B2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524414A (en) * | 1978-08-09 | 1980-02-21 | Hitachi Ltd | Electrode forming process |
| JPS57106140A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPS6322464B2 (ja) * | 1980-12-24 | 1988-05-12 | Hitachi Ltd | |
| JPS60224248A (ja) * | 1984-04-23 | 1985-11-08 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH0129064B2 (ja) * | 1984-04-23 | 1989-06-07 | Oki Electric Ind Co Ltd | |
| JPH03114228A (ja) * | 1990-04-13 | 1991-05-15 | Seiko Epson Corp | 金属メッキ配線を有する半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5029622B2 (ja) | 1975-09-25 |