JPS4845175A - - Google Patents
Info
- Publication number
- JPS4845175A JPS4845175A JP47094672A JP9467272A JPS4845175A JP S4845175 A JPS4845175 A JP S4845175A JP 47094672 A JP47094672 A JP 47094672A JP 9467272 A JP9467272 A JP 9467272A JP S4845175 A JPS4845175 A JP S4845175A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W40/611—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H10W40/235—
-
- H10W40/625—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Connecting Device With Holders (AREA)
- Cosmetics (AREA)
- Fats And Perfumes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18598071A | 1971-10-04 | 1971-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4845175A true JPS4845175A (cg-RX-API-DMAC10.html) | 1973-06-28 |
| JPS5225222B2 JPS5225222B2 (cg-RX-API-DMAC10.html) | 1977-07-06 |
Family
ID=22683166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47094672A Expired JPS5225222B2 (cg-RX-API-DMAC10.html) | 1971-10-04 | 1972-09-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3757271A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS5225222B2 (cg-RX-API-DMAC10.html) |
| DE (1) | DE2242337C2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2156006B1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1375430A (cg-RX-API-DMAC10.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51100005U (cg-RX-API-DMAC10.html) * | 1975-02-10 | 1976-08-11 | ||
| JPS5362653U (cg-RX-API-DMAC10.html) * | 1976-10-29 | 1978-05-27 | ||
| JPS55128274A (en) * | 1979-03-28 | 1980-10-03 | Nippon Electric Co | Electronic circuit package connecting structure |
| JPS60100455A (ja) * | 1983-11-05 | 1985-06-04 | Mitsubishi Electric Corp | 半導体装置 |
| JPS6144786U (ja) * | 1984-08-27 | 1986-03-25 | 第一精工株式会社 | Ｉｃパツケ−ジ用ソケツト |
| JPS61278159A (ja) * | 1985-06-03 | 1986-12-09 | Yamaichi Electric Mfg Co Ltd | Ｉｃパツケ−ジ用キヤリア |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1430114A (en) * | 1972-07-03 | 1976-03-31 | Ibm | Electrical connector |
| US3877064A (en) * | 1974-02-22 | 1975-04-08 | Amp Inc | Device for connecting leadless integrated circuit packages to a printed-circuit board |
| JPS5740678B2 (cg-RX-API-DMAC10.html) * | 1974-02-26 | 1982-08-28 | ||
| US3960423A (en) * | 1974-10-02 | 1976-06-01 | Amp Incorporated | Multi-contact connector for substrate-to-board connections |
| US4063791A (en) * | 1976-12-27 | 1977-12-20 | Cutchaw John M | Connector for leadless integrated circuit packages |
| US4166665A (en) * | 1976-12-27 | 1979-09-04 | Cutchaw John M | Liquid cooled connector for large scale integrated circuit packages |
| EP0002166A3 (fr) * | 1977-11-18 | 1979-08-08 | International Business Machines Corporation | Support pour microplaquettes de circuits intégrés, et son procédé de fabrication |
| US4331373A (en) * | 1980-03-24 | 1982-05-25 | Burroughs Corporation | Modular system with system carrier, test carrier and system connector |
| US4351932A (en) * | 1980-03-27 | 1982-09-28 | Hitco | Bis-maleimide/divinyl aryl crosslinking agent resin system |
| US4402561A (en) * | 1981-03-27 | 1983-09-06 | Amp Incorporated | Socket for integrated circuit package with extended leads |
| DE8234198U1 (de) * | 1982-12-06 | 1986-03-13 | Siemens AG, 1000 Berlin und 8000 München | Kleinhörgerät |
| US4571015A (en) * | 1984-03-16 | 1986-02-18 | Amp Incorporated | Electrical connector having rotating clamps for securing electronic packages therein |
| US4595794A (en) * | 1984-03-19 | 1986-06-17 | At&T Bell Laboratories | Component mounting apparatus |
| US4747017A (en) * | 1986-05-27 | 1988-05-24 | General Motors Corporation | Surface mountable integrated circuit package equipped with sockets |
| US4731693A (en) * | 1986-09-29 | 1988-03-15 | Tektronix, Inc. | Connection apparatus for integrated circuit |
| US5053853A (en) * | 1990-05-08 | 1991-10-01 | International Business Machines Corporation | Modular electronic packaging system |
| EP0654822A1 (en) * | 1993-11-19 | 1995-05-24 | BULL HN INFORMATION SYSTEMS ITALIA S.p.A. | Heat sink assembly for integrated circuit |
| US6016852A (en) * | 1994-12-01 | 2000-01-25 | Intel Corporation | Leaded grid array IC package having coplanar bent leads for surface mount technology |
| US5933327A (en) * | 1998-04-03 | 1999-08-03 | Ericsson, Inc. | Wire bond attachment of a integrated circuit package to a heat sink |
| US10104812B2 (en) * | 2011-09-01 | 2018-10-16 | Infineon Technologies Ag | Elastic mounting of power modules |
| CN103124488A (zh) * | 2011-11-21 | 2013-05-29 | 鸿富锦精密工业（深圳）有限公司 | 散热组件 |
| US11910566B1 (en) * | 2021-03-18 | 2024-02-20 | Amazon Technologies, Inc. | Processor heat exchanger with separate mounting structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3335327A (en) * | 1965-01-06 | 1967-08-08 | Augat Inc | Holder for attaching flat pack to printed circuit board |
| US3297974A (en) * | 1965-04-15 | 1967-01-10 | Ind Electronic Hardware Corp | Receptacle for integrated circuit module |
| DE1242726B (de) * | 1965-11-26 | 1967-06-22 | Telefunken Patent | Chassis fuer ein Geraet der Elektrotechnik aus einer gedruckten Leiterplatte und einem rahmenfoermigen Traeger |
| US3391383A (en) * | 1966-06-20 | 1968-07-02 | Hughes Aircraft Co | Electrical connector for integrated circuit elements |
-
1971
- 1971-10-04 US US00185980A patent/US3757271A/en not_active Expired - Lifetime
-
1972
- 1972-08-29 DE DE2242337A patent/DE2242337C2/de not_active Expired
- 1972-09-22 GB GB4390372A patent/GB1375430A/en not_active Expired
- 1972-09-22 JP JP47094672A patent/JPS5225222B2/ja not_active Expired
- 1972-09-27 FR FR7235073A patent/FR2156006B1/fr not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51100005U (cg-RX-API-DMAC10.html) * | 1975-02-10 | 1976-08-11 | ||
| JPS5362653U (cg-RX-API-DMAC10.html) * | 1976-10-29 | 1978-05-27 | ||
| JPS55128274A (en) * | 1979-03-28 | 1980-10-03 | Nippon Electric Co | Electronic circuit package connecting structure |
| JPS60100455A (ja) * | 1983-11-05 | 1985-06-04 | Mitsubishi Electric Corp | 半導体装置 |
| JPS6144786U (ja) * | 1984-08-27 | 1986-03-25 | 第一精工株式会社 | Ｉｃパツケ−ジ用ソケツト |
| JPS61278159A (ja) * | 1985-06-03 | 1986-12-09 | Yamaichi Electric Mfg Co Ltd | Ｉｃパツケ−ジ用キヤリア |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2156006A1 (cg-RX-API-DMAC10.html) | 1973-05-25 |
| US3757271A (en) | 1973-09-04 |
| DE2242337A1 (de) | 1973-04-12 |
| FR2156006B1 (cg-RX-API-DMAC10.html) | 1976-05-21 |
| JPS5225222B2 (cg-RX-API-DMAC10.html) | 1977-07-06 |
| GB1375430A (cg-RX-API-DMAC10.html) | 1974-11-27 |
| DE2242337C2 (de) | 1983-04-14 |