JPS4822665B1 - - Google Patents

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Publication number
JPS4822665B1
JPS4822665B1 JP44098557A JP9855769A JPS4822665B1 JP S4822665 B1 JPS4822665 B1 JP S4822665B1 JP 44098557 A JP44098557 A JP 44098557A JP 9855769 A JP9855769 A JP 9855769A JP S4822665 B1 JPS4822665 B1 JP S4822665B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44098557A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4822665B1 publication Critical patent/JPS4822665B1/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L23/293Organic, e.g. plastic
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    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2924/1301Thyristor
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    • H01L2924/35Mechanical effects
    • H01L2924/351Thermal stress

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP44098557A 1968-12-09 1969-12-08 Pending JPS4822665B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78208368A 1968-12-09 1968-12-09

Publications (1)

Publication Number Publication Date
JPS4822665B1 true JPS4822665B1 (enrdf_load_stackoverflow) 1973-07-07

Family

ID=25124888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44098557A Pending JPS4822665B1 (enrdf_load_stackoverflow) 1968-12-09 1969-12-08

Country Status (4)

Country Link
JP (1) JPS4822665B1 (enrdf_load_stackoverflow)
BR (1) BR6914802D0 (enrdf_load_stackoverflow)
GB (1) GB1288058A (enrdf_load_stackoverflow)
IE (1) IE33422B1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346042U (enrdf_load_stackoverflow) * 1986-09-10 1988-03-28

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2046024B (en) * 1979-03-30 1983-01-26 Ferranti Ltd Circuit assembly
WO1999012201A1 (de) * 1997-09-03 1999-03-11 Eupec Europäische Gesellschaft Für Leistungshalbleiter Mbh + Co. Kg Feuchtigkeitsschutz für boratglashalbleiterpassivierungsschichten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346042U (enrdf_load_stackoverflow) * 1986-09-10 1988-03-28

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Publication number Publication date
IE33422B1 (en) 1974-06-26
GB1288058A (enrdf_load_stackoverflow) 1972-09-06
BR6914802D0 (pt) 1973-01-02
IE33422L (en) 1970-06-09

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