GB1288058A - - Google Patents

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Publication number
GB1288058A
GB1288058A GB5883669A GB5883669A GB1288058A GB 1288058 A GB1288058 A GB 1288058A GB 5883669 A GB5883669 A GB 5883669A GB 5883669 A GB5883669 A GB 5883669A GB 1288058 A GB1288058 A GB 1288058A
Authority
GB
United Kingdom
Prior art keywords
semi
mil
ohm
resistivity
volts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5883669A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1288058A publication Critical patent/GB1288058A/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
GB5883669A 1968-12-09 1969-12-02 Expired GB1288058A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78208368A 1968-12-09 1968-12-09

Publications (1)

Publication Number Publication Date
GB1288058A true GB1288058A (enrdf_load_stackoverflow) 1972-09-06

Family

ID=25124888

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5883669A Expired GB1288058A (enrdf_load_stackoverflow) 1968-12-09 1969-12-02

Country Status (4)

Country Link
JP (1) JPS4822665B1 (enrdf_load_stackoverflow)
BR (1) BR6914802D0 (enrdf_load_stackoverflow)
GB (1) GB1288058A (enrdf_load_stackoverflow)
IE (1) IE33422B1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3010770A1 (de) * 1979-03-30 1980-10-09 Ferranti Ltd Schaltungsanordnung mit duennfilm- komponenten
WO1999012201A1 (de) * 1997-09-03 1999-03-11 Eupec Europäische Gesellschaft Für Leistungshalbleiter Mbh + Co. Kg Feuchtigkeitsschutz für boratglashalbleiterpassivierungsschichten

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346042U (enrdf_load_stackoverflow) * 1986-09-10 1988-03-28

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3010770A1 (de) * 1979-03-30 1980-10-09 Ferranti Ltd Schaltungsanordnung mit duennfilm- komponenten
WO1999012201A1 (de) * 1997-09-03 1999-03-11 Eupec Europäische Gesellschaft Für Leistungshalbleiter Mbh + Co. Kg Feuchtigkeitsschutz für boratglashalbleiterpassivierungsschichten

Also Published As

Publication number Publication date
JPS4822665B1 (enrdf_load_stackoverflow) 1973-07-07
IE33422B1 (en) 1974-06-26
BR6914802D0 (pt) 1973-01-02
IE33422L (en) 1970-06-09

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PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee