JPS4733176B1 - - Google Patents
Info
- Publication number
- JPS4733176B1 JPS4733176B1 JP186867A JP186867A JPS4733176B1 JP S4733176 B1 JPS4733176 B1 JP S4733176B1 JP 186867 A JP186867 A JP 186867A JP 186867 A JP186867 A JP 186867A JP S4733176 B1 JPS4733176 B1 JP S4733176B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP186867A JPS4733176B1 (ru) | 1967-01-11 | 1967-01-11 | |
US695576A US3580820A (en) | 1967-01-11 | 1968-01-04 | Palladium-nickel alloy plating bath |
GB1474/68A GB1143178A (en) | 1967-01-11 | 1968-01-10 | Palladium-nickel alloy plating bath |
US136588A US3677909A (en) | 1967-01-11 | 1971-04-22 | Palladium-nickel alloy plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP186867A JPS4733176B1 (ru) | 1967-01-11 | 1967-01-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4733176B1 true JPS4733176B1 (ru) | 1972-08-23 |
Family
ID=11513510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP186867A Pending JPS4733176B1 (ru) | 1967-01-11 | 1967-01-11 |
Country Status (3)
Country | Link |
---|---|
US (2) | US3580820A (ru) |
JP (1) | JPS4733176B1 (ru) |
GB (1) | GB1143178A (ru) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5615656A (en) * | 1979-07-18 | 1981-02-14 | Nissan Shoji Kk | Preservation of formed rice |
JPS6051992U (ja) * | 1983-09-19 | 1985-04-12 | 株式会社 ダイケイ | 串刺し米飯加工食品 |
WO1985005381A1 (en) * | 1984-05-24 | 1985-12-05 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles |
JPS63110227A (ja) * | 1986-10-27 | 1988-05-14 | Sanyo Electric Co Ltd | スチロ−ル樹脂成形品 |
JP2018059166A (ja) * | 2016-10-07 | 2018-04-12 | 松田産業株式会社 | パラジウム−ニッケル合金皮膜及びその製造方法 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH572989A5 (ru) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
US3925170A (en) * | 1974-01-23 | 1975-12-09 | American Chem & Refining Co | Method and composition for producing bright palladium electrodepositions |
JPS5254369A (en) * | 1975-10-29 | 1977-05-02 | Mitsubishi Electric Corp | Schottky barrier semiconductor device |
JPS5267961A (en) * | 1975-12-03 | 1977-06-06 | Mitsubishi Electric Corp | Electrode formation of semiconductor unit |
US4098656A (en) * | 1976-03-11 | 1978-07-04 | Oxy Metal Industries Corporation | Bright palladium electroplating baths |
US4100039A (en) * | 1976-11-11 | 1978-07-11 | International Business Machines Corporation | Method for plating palladium-nickel alloy |
JPS5760090A (en) * | 1980-09-29 | 1982-04-10 | Nisshin Kasei Kk | Supplying method for palladium to palladium-nickel alloy plating solution |
US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
US4487665A (en) * | 1980-12-17 | 1984-12-11 | Omi International Corporation | Electroplating bath and process for white palladium |
US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
DE3108466C2 (de) * | 1981-03-06 | 1983-05-26 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
DE3108508C2 (de) * | 1981-03-06 | 1983-06-30 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
DE3108467C2 (de) * | 1981-03-06 | 1983-05-26 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verwendung eines Acetylenamins und/oder eines Aminoalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
BE894190A (fr) * | 1981-09-11 | 1982-12-16 | Langbein Pfanhauser Werke Ag | Procede pour accroitre la resistance a la corrosion d'un alliage palladium-nickel depose par electrolyse |
GB2113477B (en) * | 1981-12-31 | 1985-04-17 | Hara J B O | Method of producing printed circuits |
FR2539145B1 (fr) * | 1983-01-07 | 1986-08-29 | Omi Int Corp | Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede |
GB2168381B (en) * | 1984-12-12 | 1988-03-09 | Stc Plc | Gold plated electrical contacts |
US4741818A (en) * | 1985-12-12 | 1988-05-03 | Learonal, Inc. | Alkaline baths and methods for electrodeposition of palladium and palladium alloys |
US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
CN101348928B (zh) * | 2007-07-20 | 2012-07-04 | 罗门哈斯电子材料有限公司 | 镀钯及镀钯合金之高速方法 |
US20110147225A1 (en) | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
-
1967
- 1967-01-11 JP JP186867A patent/JPS4733176B1/ja active Pending
-
1968
- 1968-01-04 US US695576A patent/US3580820A/en not_active Expired - Lifetime
- 1968-01-10 GB GB1474/68A patent/GB1143178A/en not_active Expired
-
1971
- 1971-04-22 US US136588A patent/US3677909A/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5615656A (en) * | 1979-07-18 | 1981-02-14 | Nissan Shoji Kk | Preservation of formed rice |
JPS6051992U (ja) * | 1983-09-19 | 1985-04-12 | 株式会社 ダイケイ | 串刺し米飯加工食品 |
WO1985005381A1 (en) * | 1984-05-24 | 1985-12-05 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles |
JPS63110227A (ja) * | 1986-10-27 | 1988-05-14 | Sanyo Electric Co Ltd | スチロ−ル樹脂成形品 |
JP2018059166A (ja) * | 2016-10-07 | 2018-04-12 | 松田産業株式会社 | パラジウム−ニッケル合金皮膜及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US3677909A (en) | 1972-07-18 |
US3580820A (en) | 1971-05-25 |
GB1143178A (en) | 1969-02-19 |