JPS4731405U - - Google Patents
Info
- Publication number
- JPS4731405U JPS4731405U JP3058971U JP3058971U JPS4731405U JP S4731405 U JPS4731405 U JP S4731405U JP 3058971 U JP3058971 U JP 3058971U JP 3058971 U JP3058971 U JP 3058971U JP S4731405 U JPS4731405 U JP S4731405U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058971U JPS5081Y2 (ja) | 1971-04-20 | 1971-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3058971U JPS5081Y2 (ja) | 1971-04-20 | 1971-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4731405U true JPS4731405U (ja) | 1972-12-08 |
| JPS5081Y2 JPS5081Y2 (ja) | 1975-01-06 |
Family
ID=27893015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3058971U Expired JPS5081Y2 (ja) | 1971-04-20 | 1971-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5081Y2 (ja) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5034466A (ja) * | 1973-07-30 | 1975-04-02 | ||
| JPS5183266U (ja) * | 1974-12-25 | 1976-07-03 | ||
| JPS5537253A (en) * | 1978-09-04 | 1980-03-15 | Matsushita Electric Ind Co Ltd | Wafer breaking method |
| JPS5898214A (ja) * | 1981-11-25 | 1983-06-11 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | セラミツク板を片に細分割する方法およびこれに用いる装置 |
| US4412949A (en) * | 1980-07-02 | 1983-11-01 | Basf Aktiengesellschaft | Pigments comprising cyanomethylquinazolones coupled to diazo compounds prepared from 1-aminoanthroquinones |
| JPS59125639A (ja) * | 1983-01-05 | 1984-07-20 | Nec Kyushu Ltd | 半導体素子の分割方法 |
| JPS60164385A (ja) * | 1984-02-06 | 1985-08-27 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
| JPS60165778A (ja) * | 1984-02-07 | 1985-08-28 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
| JPS6116591A (ja) * | 1984-07-02 | 1986-01-24 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
| JPS63108709U (ja) * | 1987-01-07 | 1988-07-13 |
-
1971
- 1971-04-20 JP JP3058971U patent/JPS5081Y2/ja not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5034466A (ja) * | 1973-07-30 | 1975-04-02 | ||
| JPS5183266U (ja) * | 1974-12-25 | 1976-07-03 | ||
| JPS5537253A (en) * | 1978-09-04 | 1980-03-15 | Matsushita Electric Ind Co Ltd | Wafer breaking method |
| US4412949A (en) * | 1980-07-02 | 1983-11-01 | Basf Aktiengesellschaft | Pigments comprising cyanomethylquinazolones coupled to diazo compounds prepared from 1-aminoanthroquinones |
| JPS5898214A (ja) * | 1981-11-25 | 1983-06-11 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | セラミツク板を片に細分割する方法およびこれに用いる装置 |
| JPS59125639A (ja) * | 1983-01-05 | 1984-07-20 | Nec Kyushu Ltd | 半導体素子の分割方法 |
| JPS60164385A (ja) * | 1984-02-06 | 1985-08-27 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
| JPS60165778A (ja) * | 1984-02-07 | 1985-08-28 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
| JPH055195B2 (ja) * | 1984-02-07 | 1993-01-21 | Rohm Kk | |
| JPS6116591A (ja) * | 1984-07-02 | 1986-01-24 | Rohm Co Ltd | 半導体レ−ザのチツプ製造方法 |
| JPS63108709U (ja) * | 1987-01-07 | 1988-07-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5081Y2 (ja) | 1975-01-06 |