JPH1197392A5 - - Google Patents

Info

Publication number
JPH1197392A5
JPH1197392A5 JP1997269306A JP26930697A JPH1197392A5 JP H1197392 A5 JPH1197392 A5 JP H1197392A5 JP 1997269306 A JP1997269306 A JP 1997269306A JP 26930697 A JP26930697 A JP 26930697A JP H1197392 A5 JPH1197392 A5 JP H1197392A5
Authority
JP
Japan
Prior art keywords
filling
cavities
micro
fine
ultrafine particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997269306A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1197392A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9269306A priority Critical patent/JPH1197392A/ja
Priority claimed from JP9269306A external-priority patent/JPH1197392A/ja
Publication of JPH1197392A publication Critical patent/JPH1197392A/ja
Publication of JPH1197392A5 publication Critical patent/JPH1197392A5/ja
Pending legal-status Critical Current

Links

JP9269306A 1997-09-16 1997-09-16 微細窪みの充填方法及び装置 Pending JPH1197392A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9269306A JPH1197392A (ja) 1997-09-16 1997-09-16 微細窪みの充填方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9269306A JPH1197392A (ja) 1997-09-16 1997-09-16 微細窪みの充填方法及び装置

Publications (2)

Publication Number Publication Date
JPH1197392A JPH1197392A (ja) 1999-04-09
JPH1197392A5 true JPH1197392A5 (https=) 2004-10-14

Family

ID=17470512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9269306A Pending JPH1197392A (ja) 1997-09-16 1997-09-16 微細窪みの充填方法及び装置

Country Status (1)

Country Link
JP (1) JPH1197392A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100741040B1 (ko) * 1999-10-15 2007-07-20 가부시키가이샤 에바라 세이사꾸쇼 배선형성방법 및 장치
KR100805128B1 (ko) 2000-05-02 2008-02-21 쇼꾸바이 카세이 고교 가부시키가이샤 집적 회로의 제조방법 및 집적 회로의 제조방법에 의해형성된 집적 회로를 지닌 기판
JP3951750B2 (ja) * 2002-03-07 2007-08-01 セイコーエプソン株式会社 物質充填方法、膜形成方法、デバイスおよびデバイスの製造方法
JP4619050B2 (ja) * 2003-06-30 2011-01-26 株式会社半導体エネルギー研究所 表示装置の作製方法
JP4273871B2 (ja) 2003-08-12 2009-06-03 セイコーエプソン株式会社 配線パターンの形成方法、半導体装置の製造方法、電気光学装置及び電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593952A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd アルミニウム配線層の形成方法
JPH09134891A (ja) * 1995-09-06 1997-05-20 Vacuum Metallurgical Co Ltd 半導体基板への薄膜形成方法
JP3521200B2 (ja) * 1995-12-12 2004-04-19 松下電器産業株式会社 配線構造およびその形成方法

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