JPH1194896A - Wiring interface inspection device for semiconductor testing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce final inspecting man-hour of a wiring interface, by fetching test signals transmitted to pins of an IC socket mounted on a socket board via jig board, and connecting it to a body via an inspecting cable. SOLUTION: An IC socket 35 is mounted on an upper surface of a socket board 34 mounted on a wiring interface 33. Pins of the socket 35 are respectively connected to coaxial cables 43i of the interface 33 via printed wirings. Also bolts 16j are positioned in grooves 17j of the board 34 via coupling holes 15j, and a jig board 10 is coupled to the board 34. In the board 10, pin connectors are respectively connected to pin ends of the socket 35, and an inspecting cable 36 is connected to a cable connecting land provided on a periphery. Thus, test signals transmitted to the respective pins of the socket 35 are fetched by the board 10, and can be connected to a body via the cable 36. That is, an inspection of a final product can be finished at once by positioning and coupling the board 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a DUT (semiconductor IC under test) mounted on a test head of a semiconductor test apparatus.
The present invention relates to an inspection apparatus for determining the quality of connection of a wiring interface by multiple wirings between the two.

[0002]

2. Description of the Related Art A wiring interface is a wiring interface wired between a performance board unique to each model of a semiconductor test apparatus and each pin of each semiconductor IC socket of various types of semiconductor ICs.
When the number of wirings connected to the wiring interface is small, the wiring can be easily checked by performing a visual inspection or a continuity test between the connections manually.

[0003] However, the wiring interface between the performance board of the test head of the semiconductor test apparatus and the DUT connector has several thousand channels in a narrow space.
This is a wiring interface using a (channel) coaxial cable. Therefore, even a continuity test by hand as well as visual inspection becomes impossible. The progress of semiconductor ICs has been tremendous, and the number of pins on the package has increased from 256 pins to more than 512 pins. Some can be up to 1,000 CH. In addition, since the semiconductor test apparatus is driven by a high-frequency pulse train exceeding several hundred MHz, a coaxial line is used.

FIG. 4 shows an external view of a wiring interface inspection apparatus. In the figure, reference numeral 30 denotes an inspection apparatus main body (hereinafter abbreviated as “main body”), 31 is a test head, 32 is a performance board, 33 is a wiring interface which is an object to be measured, 34 is a socket board, and 35 is an IC. The sockets 36 and 37 are test cables.

[0005] Inside the main body 30, as shown in FIG.
Mainly programmable voltage / current generator (hereinafter “VIG”)
) 41 and a DC test unit (hereinafter, “DCT”) comprising a voltage / current measuring device (hereinafter, “DVM”) 42.
U "), a switch 46i, a load resistor 44, and the like. Inside the test head 31, a switch 45i for selecting the coaxial cable 43i inside the wiring interface 33 and conducting the constant current I, and this switch 45i
There is a control unit for controlling. Reed relays with small leakage current are used for the switches 45i and 46i.

FIG. 5 shows the principle of measurement. FIG. 5 shows a method of measuring a current applied voltage. DCTU 40 in body 30
A constant current I is sent from the VIG 41 to the test head 31 through the inspection cable 37. The constant current I is the test head 3
The coaxial cable 43i of the wiring interface 33 to be measured via one selected switch 45i (i = 1 to n)
(I = 1 to n). The constant current I is returned to the main body 30 via the socket board 34, the IC socket 35, and the inspection cable 36. Constant current I returned to main body 30
Is a switch 46i (i = 1) corresponding to the switch 45i.
To n) and grounded via the load resistor 44. For example, assuming that the constant current I is 20 mA and the load resistance is 50Ω, the DVM 42 measures 1 V unless the wiring is incorrect. If the wiring is incorrect, no current will flow, and the voltage will be a clamp voltage that can be set by the program. Although not shown, this inspection apparatus is also capable of measuring a voltage applied current.

FIG. 6 is a detailed view of the performance board 32 and the wiring interface 33 of the test head 31, the socket board 34, the IC socket 35, and the inspection cable 36. The number n of the coaxial cables 43i (i = 1 to n) wired inside the wiring interface 33 is several thousand channels as described above. When used as a semiconductor test device, a test signal from the performance board 32 unique to the semiconductor test device is transmitted to the IC socket 35.
Correctly transmitted to each pin. The conventional wiring interface inspection apparatus uses an IC socket 35 and an inspection cable 36.
Are connected by soldering and attached to the socket board 34,
Measured by current applied voltage measurement.

[0008]

In the conventional inspection, an IC socket 35 connected to an inspection cable is used as a jig because of ease of manufacturing the inspection jig. However, in the inspection method using this jig, the IC socket 35
Corresponds to the jig, so that the final product of the wiring interface 33 in which the IC socket 35 is mounted on the socket board 34 is not inspected. After inspection using a jig,
Remove the IC socket 35 of the jig, and remove the IC socket 3 of the product.
5 must be newly installed and a final inspection must be performed.

This final inspection is mainly a leak inspection of each pin of the IC socket 35. That is, it is checked one pin at a time to see if there is any leakage to the ground side or to the power supply side. Although this final inspection is an overlap with the inspection using the jig, it is not possible to shorten the inspection time of the duplicated item in order to maintain the quality. The present invention solves the above-mentioned problems and provides a wiring interface 33 in which an IC socket 35 is mounted on a socket board 34.
It is intended to reduce the shipping inspection time of the final product, that is, the man-hour.

[0010]

In order to achieve the above-mentioned object, the present invention provides an IC socket 35 with a socket board 3
4 is to be inspected with the final product of the wiring interface 33 attached. That is, an IC socket is mounted on a socket board, a test signal transmitted to each pin of the IC socket is taken out by a newly devised jig board, and connected to the main body via an inspection cable.

The problem here is what kind of configuration is required for the jig board. How to make a jig board IC
The position of each pin of the socket is fixed and connected to the IC socket. Alignment and connection were solved with connection holes, bolts and nuts. In the jig board, pin connection gold pads having the same pitch and arrangement of the tips of the pins of the IC socket were arranged at the pin connection portions. For connection to the inspection cable, a land for cable connection was provided in a wide land around the jig board without depending on the pitch of the pins of the IC socket. Therefore, the strength of the cable connection portion is also superior to that of the related art. Hereinafter, the configuration will be described.

In the first invention, a nut groove is provided in a socket board, and a connecting hole is provided in a jig board, and the socket board is positioned and connected by bolts. The configuration is as follows. One side is connected to an IC socket, and the other side is connected to a wiring interface. Each pin of the IC socket is connected to each coaxial cable of the wiring interface by a printed wiring board. And a plurality of connection holes, bolts and nut grooves of the socket board are positioned and connected to each other, and the tip of each pin of the IC socket is connected to the pin connection gold pad of the pin connection portion. The wiring interface and the inspection cable are connected by a jig board formed of a plurality of layers of printed circuit boards provided with cable connection lands to be connected to the inspection cable.

A second invention is to provide a nut groove in an IC socket,
The jig board is provided with a connection hole, and is positioned and connected with bolts. The configuration is as follows. An IC socket having a plurality of nut grooves on one side is connected, and the other side is connected to a wiring interface, and each pin is configured by a multilayer printed circuit board in which each pin of the IC socket and each coaxial cable of the wiring interface are connected by printed wiring. And the plurality of connection holes, bolts, and nut grooves of the IC socket are positioned and connected to each other, and the tip of each pin of the IC socket is connected to the pin connection gold pad of the pin connection portion. The wiring interface and the inspection cable are connected by a jig board formed of a plurality of layers of printed circuit boards provided with cable connection lands to be connected to the inspection cable.

The third invention is an example of the structure of the jig board used in the first invention and the second invention. Jig board is IC
A pin contact gold pad is provided at a portion in contact with the tip of each pin of the socket, a cable connection land is provided around the pin, and the pin contact gold pad and the cable connection land are connected by printed wiring. It is a multilayer printed circuit board having a connection hole.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described based on embodiments with reference to the drawings. FIG. 1 is a configuration diagram of an embodiment of the first invention, FIG. 2 is a configuration diagram of an embodiment of the second invention, and FIG. 3 is a configuration diagram of an example of a jig board. First, FIG. 1 will be described.

In FIG. 1, a socket interface 34 is attached to the wiring interface 33. An IC socket 35 is connected to the upper surface (one surface) of the socket board 34, and a wiring board 33 is connected to the lower surface (the other surface). Each pin of the IC socket 35 and each coaxial cable 43i of the wiring interface 33 are internally connected by printed wiring, and two to four nut grooves 17j (j = 1 to 4) are provided so that the jig board 10 is provided. Connect with

As shown in FIG. 3, the jig board 10 is a multi-layer printed circuit board having a pin connection portion 13, a cable connection portion 11, and two to four connection holes 15j. And board 16 with bolt 16j
Is positioned and connected to the nut groove 17j. A plurality of pin connection gold pads 14k of the pin connection portion 13 (k = 1 to
(m, m = number of pins) is connected to the tip of each pin of the IC socket 35, and is connected to another position of the jig board 10, for example, a cable connection land 12k provided in a peripheral portion by printed wiring. The inspection cable 36 is connected by soldering at the cable connection land 12k.

With the above configuration, the final product of the wiring interface 33 in which the IC socket 35 is mounted on the socket board 34 is connected to the jig board 10 so that the product can be inspected. became.

FIG. 2 shows a configuration in which the IC socket 35 is slightly enlarged and a nut groove 18j is provided in the IC socket 35. That is, the jig board 10 was positioned and connected to the nut groove 18j of the IC socket 35 with two to four connection holes 15j and bolts 16j. Thereby, the fixing of the jig board 10 was further stabilized. Other parts are almost the same as the configuration of FIG.

FIG. 3 is a front view of an example of the jig board 10. This is a case where 7 × 17 pins of the IC socket 35 are regularly and horizontally and vertically arranged. There is also a 7x19 one. Some pins have a pitch interval of 1 mm or less. Each of these pins is composed of a pogo pin. Also,
There are other types of IC sockets 35. This IC
Pin connection part 1 of socket 35 and jig board 10
3 are connected to the respective pin connection gold pads 14k. A cable connection portion 11 is provided around the jig board 10.
Are provided, and a cable connection land 12k is arranged.

The cable connection lands 12k are connected to the pin connection gold pads 14k by printed wiring inside the multilayer printed circuit board. The cable connection land 12k and the inspection cable 36 are connected by soldering. The jig board 10 is connected to the nut groove 17j of the socket board 34 or the nut groove 18j of the IC socket 35 by a bolt 16j through a connection hole 15j for inspection.

[0022]

As described above in detail, in the conventional inspection apparatus, the inspection of the wiring interface 33 from the performance board 32 to the socket board 34 is inspected by the jig IC socket 35 to which the inspection cable 36 is connected. Was. Thereafter, a two-stage inspection was performed in which the jig IC socket 35 was removed, a new IC socket 35 was attached, and the inspection was performed again.

According to the present invention, the jig board 1 is used for a final product.
It was decided to attach 0 and complete all tests in one test. Therefore, it is possible to reduce the shipping inspection time and man-hour for the shipping inspection of the product, and it is possible to perform the inspection more easily.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram of another embodiment of the present invention.

FIG. 3 is a front view of an example of a jig board used in the inventions of FIGS. 1 and 2;

FIG. 4 is an external view of a wiring interface inspection device.

FIG. 5 is a diagram illustrating a measurement principle of the wiring interface inspection device.

FIG. 6 is a cross-sectional view around the wiring interface.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Jig board 11 Cable connection part 12k Cable connection land 13 Pin connection part 14k Pin connection gold pad 15j Connection hole 16j Bolt 17j Nut groove 18j Nut groove 30 Inspection device main body 31 Test head 32 Performance board 33 Wiring interface 34 Socket Board 35 IC socket 36, 37 Inspection cable 40 DCTU (DC test unit) 41 VIG (programmable voltage / current generator) 42 DVM (voltage / current measuring instrument) 43i Coaxial cable 44 Load resistance 45i, 46i Switch

Claims (3)

[Claims] 1. An apparatus for inspecting a wiring interface (33) used in a semiconductor test apparatus, wherein an IC socket (35) is connected to one surface, and the other surface is connected to the wiring interface (33).
5) Each pin and each coaxial cable (43i) of the wiring interface (33) are constituted by a printed circuit board of a plurality of layers connected by printed wiring, and a plurality of nut grooves (17j).
A socket board (34) having a plurality of connecting holes (15j) and bolts (16j), which are positioned and connected to a nut groove (17j) of the socket board (34), and a tip of each pin of the IC socket (35). Is connected to the pin connection gold pad (14k) of the pin connection portion (13), and is provided with a cable connection land (12k) for connection to the inspection cable (36) at another position. A wiring interface inspection device for a semiconductor testing device, comprising: a component board (10); and a wiring interface (33) and an inspection cable (36). 2. An apparatus for inspecting a wiring interface (33) used in a semiconductor test apparatus, wherein an IC socket (35) having a plurality of nut grooves (18j) on one surface is connected, and the wiring interface (3) is connected on the other surface.
3) a socket board (34) composed of a plurality of layers of printed boards in which each pin of the IC socket (35) and each coaxial cable (43i) of the wiring interface (33) are connected by printed wiring; A plurality of connection holes (15j) and bolts (16j) are positioned and connected to the nut groove (18j) of the IC socket (35), and the tips of the pins of the IC socket (35) are connected to the pins of the pin connection portion (13). Connect with the connection gold pad (14k),
A jig board (10) of a printed circuit board having a plurality of layers provided with cable connection lands (12k) for connecting to the inspection cable (36) at other positions; and a wiring interface (33) and an inspection A cable interface inspection device for a semiconductor test device, which is connected to a cable (36). 3. The jig board (10) is provided with a pin connection gold pad (14k) at a portion in contact with the tip of each pin of the IC socket (35), and a cable connection land (12k) is provided around the pin pad. The pin connection gold pad (14k) and the cable connection land (12k) are connected by printed wiring, and are a multilayer printed circuit board having a plurality of connection holes (15j). Item 3. A wiring interface inspection device for a semiconductor test device according to Item 1 or 2.