JPH1187482A - Semiconductor substrate transportation storage tool and method of semiconductor substrate recognition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor substrate transportation storage jig for preventing a semiconductor substrate from being damaged and at the same time for effectively recognizing the semiconductor substrate, and a method for recognizing the semiconductor substrate. SOLUTION: A box-shaped semiconductor substrate transportation storage jig 2 accommodates a semiconductor substrate 1, the semiconductor substrate 1 has a recognition sheet 4, and the storage jig 2 has a positioning part 5 in the inside. Since the travel of the semiconductor substrate 1 is regulated by the positioning part 5, positional deviation is prevented, and an upper part 2a of the semiconductor substrate transportation storage jig 2 is constituted of a transparent material, the recognition sheet 4 is recognized directly from the upper part 2a of the tool, without taking out the semiconductor substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention prevents damage to a semiconductor substrate when transporting or storing a semiconductor substrate (wafer), and recognizes various data such as the type of each semiconductor substrate and processing steps. TECHNICAL FIELD The present invention relates to a semiconductor substrate transport / storage jig and a method for recognizing a semiconductor substrate.

[0002]

2. Description of the Related Art A conventional semiconductor substrate is housed in a semiconductor substrate transfer / storage jig capable of storing one semiconductor substrate, and the semiconductor substrate is taken out from the semiconductor substrate transfer / storage jig and is attached to an identification tag attached to the semiconductor substrate. Was aware of.

FIG. 8 is a schematic diagram showing a conventional semiconductor substrate transfer / jig, and the internal structure is indicated by broken lines. A conventional semiconductor substrate transport / storage jig is a box-shaped semiconductor substrate transport / storage jig 2 on which a semiconductor substrate 1 is placed and stored. A lid 3 is provided on the front surface of the jig. This operation is performed with the lid 3 opened, and the lid 3 is closed during normal transportation and storage. A recognition tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate can be performed and individual semiconductor substrates can be recognized.

In the conventional semiconductor substrate transport / storage jig, the semiconductor substrate 1 is placed in the semiconductor substrate transport / storage jig 2, but the position of the semiconductor substrate 1 is not fixed in the jig. Since the semiconductor substrate has moved, it has been difficult to recognize the identification tag 4 of the semiconductor substrate 1 attached to the semiconductor substrate 1 even if the upper surface of the semiconductor substrate transport / storage jig 2 is made of a transparent material.

[0005]

In a conventional semiconductor substrate transfer jig, there is no mechanism for positioning and holding the stored semiconductor substrate, and when the semiconductor substrate moves during the transfer and the position of the semiconductor substrate shifts, a semiconductor misalignment occurs. Even when the upper surface of the substrate transport / storage jig 2 is made of a transparent material, it is difficult to recognize the identification tag attached to the semiconductor substrate. Therefore, in order to recognize what the semiconductor substrate is, the semiconductor substrate must be taken out from the jig for transporting and storing the semiconductor substrate, and the identification tag attached to the semiconductor substrate must be recognized. Such a recognition method is not preferable because not only the recognition time is spent but also the operation of removing the semiconductor substrate may damage the semiconductor substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and has been made with a primary focus on recognizing a semiconductor substrate in a state where the semiconductor substrate is housed in a jig for transporting and storing a semiconductor substrate. It is another object of the present invention to provide a semiconductor substrate transport / storage jig and a semiconductor substrate recognition method capable of effectively recognizing a semiconductor substrate in addition to preventing damage to the semiconductor substrate.

[0007]

Means for Solving the Problems To solve the above-mentioned problems, a semiconductor substrate transport / storage jig and a method for recognizing a semiconductor substrate of the present invention have the following means.

That is, the jig for transporting and storing a semiconductor substrate of the present invention is a jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with an identification tag, and at least the upper surface of the box is made of a transparent material. The box has a lid that can be opened and closed, and a positioning portion is provided in the box to prevent the stored semiconductor substrate from rotating.

A jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with a first identification tag, wherein at least an upper surface portion of the box is made of a transparent material;
The box has a lid that can be opened and closed, a positioning portion for preventing rotation of the stored semiconductor substrate is provided in the box, and a second identification tag is provided inside the bottom of the box. Things.

A semiconductor substrate transport / storage jig comprising a box for accommodating a semiconductor substrate provided with a first identification tag, wherein at least an upper surface portion of the box is made of a transparent material,
The box has a lid that can be opened and closed, a positioning portion for preventing rotation of the semiconductor substrate housed in the box is provided, and a second identification tag is provided outside the upper surface of the box. It is.

A jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with a first identification tag, wherein at least an upper surface portion of the box is made of a transparent material;
The box has a lid that can be opened and closed, a positioning portion for preventing rotation of the stored semiconductor substrate is provided in the box, and a second identification tag is provided inside the upper surface of the box. It is.

[0012] Also, there is provided a jig for transporting and storing a semiconductor substrate comprising a tray for storing a semiconductor substrate provided with an identification tag,
A groove for inserting a jig for holding the stored semiconductor substrate is provided on the upper surface of the tray body, and a positioning part for preventing rotation of the stored semiconductor substrate is provided for the tray body. .

A jig for transporting and storing a semiconductor substrate comprising a tray for accommodating a semiconductor substrate provided with a first identification tag, the jig for holding the accommodated semiconductor substrate on an upper surface of the tray. The tray body is provided with a positioning portion for preventing rotation of the stored semiconductor substrate, and the tray body is provided with a second recognition body on the upper surface thereof.

A jig for transporting and storing a semiconductor substrate comprising a tray for storing a semiconductor substrate provided with a first identification tag, wherein the tray is made of a transparent material, and the semiconductor mounted on the upper surface of the tray is provided. A groove for inserting a jig for holding the substrate is provided, a tray body is provided with a positioning portion for preventing rotation of the stored semiconductor substrate, and a second recognition body is buried on the upper surface of the tray body. Is what it is.

Further, the method for recognizing a semiconductor substrate according to the present invention comprises a box for housing the semiconductor substrate provided with the first identification tag, and at least an upper surface portion of the box is made of a transparent material;
The box has a lid that can be opened and closed, a positioning portion is provided in the box to prevent rotation of the stored semiconductor substrate, and a second identification tag is provided outside the upper surface of the box. A semiconductor substrate recognition method for recognizing a semiconductor substrate stored in a substrate transfer / storage jig, wherein after recognizing a first recognition tag of a semiconductor substrate, recognizing a second recognition tag of a box, and matching the same. By doing so, the semiconductor substrate is recognized.

Further, the box comprises a box for storing the semiconductor substrate provided with the first identification tag, at least an upper surface portion of the box is made of a transparent material, and the box has a lid which can be opened and closed. A positioning portion for preventing rotation of the stored semiconductor substrate is provided, and a second identification tag is provided outside the upper surface of the box body. A semiconductor for recognizing a semiconductor substrate stored in a semiconductor substrate transport / storage jig. A method for recognizing a substrate, comprising: recognizing a first identification tag of a semiconductor substrate, and then recognizing a second identification tag of a box, and performing matching to recognize the semiconductor substrate. It is to check whether the target semiconductor substrate is stored in the box.

As described above, the box constituting the semiconductor substrate transport / storage jig is made of a transparent material, and the identification tag attached to the semiconductor substrate can be externally attached without removing the stored semiconductor substrate from the box. Since the semiconductor substrate can be recognized, damage to the semiconductor substrate can be prevented, and the semiconductor substrate can be efficiently recognized without removing the semiconductor substrate from the jig. Also, when the semiconductor substrate carrying jig is transported, the semiconductor substrate is fixed because it has a positioning portion, and the stored semiconductor substrate is also fixed in position by the vibration or the like, so that the positional shift is prevented. It can be recognized from outside without waking up.

In addition, since the identification tag is provided not only for the semiconductor substrate but also for the semiconductor substrate transport / storage jig, the identification tag of the semiconductor substrate transport / storage jig is recognized and the identification tag of the semiconductor substrate is recognized. By matching the contents of the recognition tags, the accuracy of recognition can be improved. In particular, it is effective in matching recognition between the stored and mounted semiconductor substrate and the semiconductor substrate transport / storage jig, and confirm whether the target semiconductor substrate is stored in the target semiconductor substrate transport / storage jig. Can be.

[0019]

An embodiment of the present invention will be described below with reference to the drawings.

First, a first embodiment will be described. FIG. 1 is a schematic view showing a semiconductor substrate transport / storage jig of the present embodiment, and the internal configuration is indicated by a broken line.

As shown in FIG. 1, the semiconductor substrate transfer and storage jig of this embodiment is a single-wafer type semiconductor substrate transfer and storage jig, and is a box-shaped semiconductor substrate transfer and storage jig on which the semiconductor substrate 1 is placed and stored. The storage jig 2 is provided with a lid 3 on the front surface thereof. When the semiconductor substrate 1 is taken in and out, the lid 3 is opened, and the lid 3 is closed during normal transportation and storage. It is in a state where it is. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized.

Here, the semiconductor substrate transport / storage jig of the present embodiment has a positioning portion 5 therein. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 5, a mechanism is provided in which the semiconductor substrate 1 does not rotate in the semiconductor substrate transport / storage jig 2. The upper surface portion 2a of the main body of the semiconductor substrate transport / jig 2 is made of a transparent material. Therefore, at least the upper part of the identification tag 4 of the semiconductor substrate 1 attached to the semiconductor substrate 1 of the semiconductor substrate transport / storage jig 2 is transparent, so that the semiconductor substrate 1 can be directly recognized from the upper surface portion 2a of the jig without being taken out. Vote 4 can be recognized.

The jig for transporting and storing a semiconductor substrate of the present embodiment can prevent damage to the semiconductor substrate and efficiently recognize the semiconductor substrate without removing the semiconductor substrate from the jig.

Next, a second embodiment will be described. FIG. 2 is a schematic view showing the semiconductor substrate transport / storage jig of the present embodiment.

As shown in FIG. 2, the jig for transporting and storing semiconductor substrates according to the present embodiment is a jig 6 for transporting and storing semiconductor substrates in the form of a tray for mounting and storing the semiconductor substrate 1. It has no body. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized.

Here, the jig for transporting and storing semiconductor substrates of the present embodiment has a positioning portion 7 on the upper surface 6a. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 7, the semiconductor substrate 1 is transferred to the semiconductor substrate transport / storage jig 6.
It has a mechanism that does not rotate inside. Therefore, since there is no obstacle on the semiconductor substrate 1, the identification tag 4 added to the semiconductor substrate 1 can be easily recognized. The semiconductor substrate transport / storage jig 6 is provided with a groove portion 8. When the semiconductor substrate 1 is taken out, or when the semiconductor substrate 1 is stored and placed in the semiconductor substrate transport / storage jig 6, the semiconductor substrate 1 is taken out. A jig for use enters the groove 8 and can be held from the bottom side of the semiconductor substrate 1.

The jig for transporting and storing semiconductor substrates according to the present embodiment can prevent damage to the semiconductor substrates and can efficiently recognize the semiconductor substrates without removing the semiconductor substrates from the jigs.

Next, a third embodiment will be described. FIG. 3 is a schematic view showing a semiconductor substrate transport / storage jig according to the present embodiment, and the internal configuration is indicated by broken lines.

As shown in FIG. 3, the semiconductor substrate transport / storage jig of the present embodiment is a box-shaped semiconductor substrate transport / storage jig 2 on which a semiconductor substrate 1 is placed and stored. When the body 3 is provided and the semiconductor substrate 1 is taken in and out,
This operation is performed with the lid 3 opened.
Is closed. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized. Further, an identification tag 9 is attached to the upper surface or the lower surface of the jig 2 inside the semiconductor substrate transport / storage jig 2.

Here, the jig for transporting and storing semiconductor substrates according to the present embodiment has a positioning portion 5 therein. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 5, a mechanism is provided in which the semiconductor substrate 1 does not rotate in the semiconductor substrate transport / storage jig 2. The upper surface portion 2a of the main body of the semiconductor substrate transport / jig 2 is made of a transparent material. Therefore, at least the upper part of the identification tag 4 of the semiconductor substrate 1 attached to the semiconductor substrate 1 of the semiconductor substrate transport / storage jig 2 is transparent, so that the semiconductor substrate 1 can be directly recognized from the upper surface portion 2a of the jig without being taken out. Vote 4 can be recognized. Further, the identification tag 9 of the semiconductor substrate transport / storage jig added inside the semiconductor substrate transport / storage jig 2 can be recognized if the surface in the opposite direction is made of a transparent material. By associating the identification tag 9 of the storage jig with the identification tag 4 of the semiconductor substrate, when the identification tag 9 of the semiconductor substrate transport / storage jig is recognized, the identification tag 4 of the semiconductor substrate can be recognized, and the accuracy of recognition can be improved. Also leads to.

The jig for transporting and storing a semiconductor substrate according to the present embodiment can prevent damage to the semiconductor substrate and efficiently recognize the semiconductor substrate without removing the semiconductor substrate from the jig.

Next, a fourth embodiment will be described. FIG. 4 is a schematic diagram showing the semiconductor substrate transport / storage jig of the present embodiment, and the internal configuration is indicated by broken lines.

As shown in FIG. 4, the jig for transporting and storing semiconductor substrates according to the present embodiment is a box-shaped semiconductor substrate transporting and storage jig 2 for placing and storing a semiconductor substrate 1, and a lid is provided on the front surface thereof. When the body 3 is provided and the semiconductor substrate 1 is taken in and out,
This operation is performed with the lid 3 opened.
Is closed. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized. Further, an identification tag 9 is provided outside the upper surface of the jig 2 for transporting and storing semiconductor substrates.

Here, the semiconductor substrate transport / storage jig of the present embodiment has a positioning portion 5 therein. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 5, a mechanism is provided in which the semiconductor substrate 1 does not rotate in the semiconductor substrate transport / storage jig 2. The upper surface portion 2a of the main body of the semiconductor substrate transport / jig 2 is made of a transparent material. Therefore, at least the upper part of the identification tag 4 of the semiconductor substrate 1 attached to the semiconductor substrate 1 of the semiconductor substrate transport / storage jig 2 is transparent, so that the semiconductor substrate 1 can be directly recognized from the upper surface portion 2a of the jig without being taken out. Vote 4 can be recognized. Furthermore, since the identification tag 9 of the semiconductor substrate transfer / storage jig added outside the upper surface of the semiconductor substrate transfer / storage jig 2 is attached to the outside, it can be recognized as it is, and the identification tag of the semiconductor substrate transfer / storage jig can be recognized. By associating the identification tag 9 of the semiconductor substrate transport jig 2 with the identification tag 4 of the semiconductor substrate, the identification tag 4 of the semiconductor substrate transport jig is recognized even if the material of the semiconductor substrate transport jig 2 is not transparent. Can be recognized, leading to an improvement in recognition accuracy.

The jig for transporting and storing semiconductor substrates according to the present embodiment can prevent semiconductor substrates from being damaged and efficiently recognize the semiconductor substrates without removing the semiconductor substrates from the jigs.

Next, a fifth embodiment will be described. FIG. 5 is a schematic view showing the semiconductor substrate transport / storage jig of the present embodiment.

As shown in FIG. 5, the jig for transporting and storing semiconductor substrates according to the present embodiment has the same configuration as the jig shown in FIG. It is a transport storage jig 6 which is not box-shaped and has no lid. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized.

Here, the jig for transporting and storing semiconductor substrates of the present embodiment has a positioning portion 7 on its upper surface 6a. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 7, the semiconductor substrate 1 is transferred to the semiconductor substrate transport / storage jig 6.
It has a mechanism that does not rotate inside. Therefore, since there is no obstacle on the semiconductor substrate 1, the identification tag 4 added to the semiconductor substrate 1 can be easily recognized. Further, an identification tag 9 is also provided on the upper surface of the semiconductor substrate transport / storage jig 2 so that it can be recognized as it is.
By associating the identification tag 9 of the semiconductor substrate transport / storage jig with the identification tag 4 of the semiconductor substrate, the identification tag 9 of the semiconductor substrate transport / storage jig can be recognized. Also leads to an improvement in accuracy. Note that the semiconductor substrate transport / storage jig 6 is provided with a groove portion 8 serving as a passage when the semiconductor substrate 1 is held.

The jig for transporting and storing a semiconductor substrate of this embodiment can prevent damage to the semiconductor substrate and efficiently recognize the semiconductor substrate without removing the semiconductor substrate from the jig.

Next, a sixth embodiment will be described. FIG. 6 is a schematic view showing a semiconductor substrate transport / storage jig according to the present embodiment, and the internal configuration is indicated by broken lines.

As shown in FIG. 6, the semiconductor substrate transport / storage jig of this embodiment is a box-shaped semiconductor substrate transport / storage jig 2 on which a semiconductor substrate 1 is placed and stored. When the body 3 is provided and the semiconductor substrate 1 is taken in and out,
This operation is performed with the lid 3 opened.
Is closed. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized. Further, an identification tag 9 is provided inside the upper surface 2a of the semiconductor substrate transport / storage jig 2.

Here, the semiconductor substrate transport / storage jig of the present embodiment has a positioning portion 5 therein. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 5, a mechanism is provided in which the semiconductor substrate 1 does not rotate in the semiconductor substrate transport / storage jig 2. The upper surface portion 2a of the main body of the semiconductor substrate transport / jig 2 is made of a transparent material. Therefore, at least the upper part of the identification tag 4 of the semiconductor substrate 1 attached to the semiconductor substrate 1 of the semiconductor substrate transport / storage jig 2 is transparent, so that the semiconductor substrate 1 can be directly recognized from the upper surface portion 2a of the jig without being taken out. Vote 4 can be recognized. Further, although the identification tag 9 of the semiconductor substrate transport / storage jig is provided inside the upper surface 2a, it can be recognized as it is because the material of the upper surface 2a is made of a transparent material. Also, by associating the identification tag 9 of the semiconductor substrate transport / storage jig with the identification tag 4 of the semiconductor substrate, the identification tag 9 of the semiconductor substrate transport / storage jig can be recognized. , Leading to improved recognition accuracy.

The jig for transporting and storing a semiconductor substrate of the present embodiment can prevent damage to the semiconductor substrate and efficiently recognize the semiconductor substrate without removing the semiconductor substrate from the jig.

Next, a seventh embodiment will be described. FIG. 7 is a schematic view showing a semiconductor substrate transport / jig of this embodiment.

As shown in FIG. 7, the jig for transporting and storing semiconductor substrates according to the present embodiment has the same configuration as the jig shown in FIGS. The jig 6 has a structure which is not box-shaped and has no lid. An identification tag 4 is attached to the semiconductor substrate 1 so that data recognition of the semiconductor substrate 1 can be performed and individual semiconductor substrates can be recognized.

The jig for transporting and storing semiconductor substrates of this embodiment has a positioning portion 7 on the upper surface 6a. Since the movement angle of the semiconductor substrate 1 is regulated by the positioning portion 7, the semiconductor substrate 1 is moved
It has a mechanism that does not rotate inside. Therefore, since there is no obstacle on the semiconductor substrate 1, the identification tag 4 added to the semiconductor substrate 1 can be easily recognized. Further, an identification tag 9 is also buried inside the upper surface of the semiconductor substrate transport / storage jig 2, and by using a transparent jig material, it can be directly recognized as it is. By associating the identification tag 9 of the semiconductor substrate with the identification tag 4 of the semiconductor substrate, when the identification tag 9 of the semiconductor substrate transport / storage jig is recognized, the identification tag 4 of the semiconductor substrate can be recognized, leading to an improvement in recognition accuracy. .
Note that the semiconductor substrate transport / storage jig 6 is provided with a groove portion 8 serving as a passage when the semiconductor substrate 1 is held.

With the jig for transporting and storing semiconductor substrates of the present embodiment, it is possible to prevent damage to the semiconductor substrates and to efficiently recognize the semiconductor substrates without removing the semiconductor substrates from the jigs.

As described above, the jig for transporting and storing semiconductor substrates of the present embodiment has a positioning portion so that the stored semiconductor substrate does not shift, and the jig is partially made of a transparent material. By doing so, it is possible to directly recognize the substrate without removing the semiconductor substrate from the jig, to prevent damage to the semiconductor substrate, and to efficiently recognize the semiconductor substrate without removing the semiconductor substrate from the jig. be able to. In addition to the semiconductor substrate, an identification tag is attached or buried in the semiconductor substrate transport and storage jig, and the jig is made of a transparent material. Can be recognized, preventing mistakes and improving recognition accuracy. In particular, the present invention is effective for matching recognition between the stored and placed semiconductor substrate and the semiconductor substrate transport / storage jig.

In this embodiment, the semiconductor substrate 1
Alternatively, the identification tags 4 and 9 attached or embedded in the semiconductor substrate transport / storage jig may be pasted with characters or barcodes or may be directly printed, or may be non-contact rewritable or readable / writable by light or magnetism. Such as an IC card may be used.

Next, an embodiment of the method for recognizing a semiconductor substrate according to the present invention will be described. The method for recognizing a semiconductor substrate according to the present embodiment includes storing and placing a semiconductor substrate provided with an identification tag in a jig for transporting and storing a semiconductor substrate, and recognizing what the stored and mounted semiconductor substrate is. After recognizing the identification tag of the semiconductor substrate, recognizing the identification tag of the semiconductor substrate transport / storage jig, and performing matching, thereby recognizing the semiconductor substrate and aiming at the target semiconductor substrate transport / storage jig. It is possible to check whether the semiconductor substrate is stored, which is effective for storage management.

[0051]

As described above, the semiconductor substrate transport / storage jig of the present invention provides a semiconductor substrate transport / storage jig with a semiconductor substrate positioning portion provided therein to regulate the angle of the semiconductor substrate. Since the position can be fixed and the substrate does not shift, the semiconductor substrate identification tag can be easily recognized without removing the semiconductor substrate from the semiconductor substrate transport / storage jig, and the substrate can be recognized. Also, in addition to the semiconductor substrate, the identification tag is attached or buried in the semiconductor substrate transport storage jig,
By using a transparent material for the jig, the identification tag of the semiconductor substrate transport jig can be recognized, and the identification tag of the semiconductor substrate can be recognized, and the identification tags can be matched with each other. This also leads to improved accuracy. In particular, it is effective in matching recognition between the stored and mounted semiconductor substrate and the semiconductor substrate transport / storage jig, and confirm whether the target semiconductor substrate is stored in the target semiconductor substrate transport / storage jig. It is effective for storage management.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a semiconductor substrate transfer and storage jig according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a semiconductor substrate transfer and storage jig according to an embodiment of the present invention.

FIG. 3 is a schematic view showing a semiconductor substrate transfer and storage jig according to one embodiment of the present invention.

FIG. 4 is a schematic diagram showing a semiconductor substrate transfer and storage jig according to an embodiment of the present invention.

FIG. 5 is a schematic view showing a semiconductor substrate transfer and storage jig according to one embodiment of the present invention.

FIG. 6 is a schematic view showing a semiconductor substrate transfer and storage jig according to an embodiment of the present invention.

FIG. 7 is a schematic view showing a semiconductor substrate transfer and storage jig according to an embodiment of the present invention.

FIG. 8 is a schematic view showing a conventional semiconductor substrate transport / storage jig.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor substrate 2 semiconductor substrate transport and storage jig 3 lid 4 identification tag 5 positioning section 6 semiconductor substrate transport and storage jig 7 positioning section 8 groove 9 identification tag

Claims (9)

[Claims] 1. A jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with an identification tag, wherein at least an upper surface portion of the box is made of a transparent material, and the box is a lid which can be opened and closed. A jig for transporting and storing a semiconductor substrate, comprising: a body; and a positioning portion for preventing rotation of the stored semiconductor substrate in the box. 2. A jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with a first identification tag, wherein at least an upper surface portion of the box is made of a transparent material, and the box is opened and closed. A positioning portion for preventing rotation of the stored semiconductor substrate is provided in the box body, and a second identification tag is provided inside the bottom surface of the box body. Jig for transporting and storing semiconductor substrates. 3. A jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with a first identification tag, wherein at least an upper surface portion of the box is made of a transparent material, and the box is opened and closed. A positioning portion for preventing rotation of the stored semiconductor substrate is provided in the box body, and a second identification tag is provided outside the upper surface of the box body. Jig for transporting and storing semiconductor substrates. 4. A jig for transporting and storing a semiconductor substrate comprising a box for accommodating a semiconductor substrate provided with a first identification tag, wherein at least an upper surface portion of the box is made of a transparent material, and the box is opened and closed. A positioning portion for preventing rotation of the housed semiconductor substrate is provided in the box, and a second identification tag is provided inside the upper surface of the box. Jig for transporting and storing semiconductor substrates. 5. A jig for transporting and storing a semiconductor substrate comprising a tray for storing a semiconductor substrate provided with an identification tag, wherein a jig for holding the stored semiconductor substrate is inserted into an upper surface of the tray. A jig for transporting and storing a semiconductor substrate, wherein a groove is provided, and a positioning portion for preventing the tray body from rotating the stored semiconductor substrate is provided. 6. A jig for transporting and storing a semiconductor substrate comprising a tray for accommodating a semiconductor substrate provided with a first identification tag, the jig for holding the accommodated semiconductor substrate on an upper surface of the tray. The tray body is provided with a positioning portion for preventing the stored semiconductor substrate from rotating, and the tray body is provided with a second recognition body on the upper surface thereof. A jig for transporting and storing semiconductor substrates. 7. A jig for transporting and storing a semiconductor substrate comprising a tray for accommodating a semiconductor substrate provided with a first identification tag, wherein the tray is made of a transparent material and is accommodated on an upper surface of the tray. A groove for inserting a jig for holding the semiconductor substrate is provided, the tray body is provided with a positioning portion for preventing rotation of the stored semiconductor substrate, and a second recognition body is provided on an upper surface of the tray body. A jig for transporting and storing semiconductor substrates, which is buried. 8. A box for accommodating a semiconductor substrate provided with a first identification tag, at least an upper surface portion of the box is made of a transparent material, and the box has a lid that can be opened and closed. A positioning portion for preventing rotation of the stored semiconductor substrate is provided in the box, and a semiconductor substrate stored in a semiconductor substrate transport / storage jig provided with a second identification tag is provided on the outer surface of the upper surface of the box. A method for recognizing a semiconductor substrate, comprising: recognizing a first recognition tag of the semiconductor substrate, recognizing a second recognition tag of the box, and performing matching, thereby recognizing the semiconductor substrate. A method for recognizing a semiconductor substrate. 9. A box for accommodating a semiconductor substrate provided with a first identification tag, at least an upper surface portion of the box is made of a transparent material, and the box has a lid that can be opened and closed. A positioning portion for preventing rotation of the stored semiconductor substrate is provided in the box, and a semiconductor substrate stored in a semiconductor substrate transport / storage jig provided with a second identification tag is provided on the outer surface of the upper surface of the box. A method for recognizing a semiconductor substrate, comprising: recognizing a first recognition tag of the semiconductor substrate, recognizing a second recognition tag of the box, and performing matching, thereby recognizing the semiconductor substrate. A method for recognizing a semiconductor substrate, comprising: confirming whether a target semiconductor substrate is stored in a target box.