JPH118107A - Manufacture of ceramic electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic electronic parts having uniform divided shape dimensions after baking with high production efficiency, by a method wherein a metallic die having the ceiling surface of a protruding part in mesa shape is adopted to form a groove by pressing down the metallic die having the protrusions on a ceramic green sheet surface. SOLUTION: After forming a separating groove by pressing down a metallic die to the surface of a ceramic green sheet 1, the ceramic green sheet 1 is baked. Next, in the step of dividing the green sheet 1 into individual pieces along the separating groove after the formation of an electrode on the surface of the green sheet 1, a metallic die 2 having mesa-shaped protrusions 3 in lattice is used to form the separating groove. Through these procedures, the inverse mesa-shaped separating grooves are formed on the surface of the sheet 1 so that the bottom parts 6 of the separating grooves 1a are made denser than other parts by the pressurization. Accordingly, when the force to divide green sheet into individual pieces is applied after the baking step the stress is concentrated along the interface between the denser part and other parts, so that the individual pieces may be cleanly divided, at the interface thereby manufacturing the individual pieces having uniform shape dimensions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component by a scribe method.

[0002]

2. Description of the Related Art As shown in FIG. 5, a conventional method of manufacturing a scribe-type ceramic electronic component is to press a mold 10 having an acute projection 11 formed on the surface of a ceramic green sheet 1 to form a split groove. After formation, the ceramic green sheet 1 is fired. Next, the electrode 8 and the electrode 9 of FIG. 6 are applied to the upper and lower surfaces of the fired body, fired, and then divided into individual pieces as shown in FIG. 6 along the dividing grooves.

[0003]

In the above-mentioned conventional manufacturing method, the protrusions 11 of the mold 10 which presses the surface of the ceramic green sheet 1 to form the split grooves have a triangular shape and the apex thereof is at an acute angle. Therefore, when divided into individual pieces after firing, they will be divided along the dividing grooves, but the divided grooves will be diffused irregularly, and the divided individual pieces will be eroded by the dividing grooves. As shown in FIG. 7, there is a problem in that the individual piece dimensions vary, and the production efficiency is reduced due to the variation. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a ceramic electronic component with high production efficiency, which can be divided into ceramic pieces having small variations in shape and size.

[0004]

According to the present invention, there is provided a method in which a protrusion of a mold for forming a split groove by pressing against the surface of a ceramic green sheet is formed in a trapezoidal shape. The one-dimensional shape can be made small in variation.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is to form a split groove by pressing against the surface of a ceramic green sheet, then firing this ceramic green sheet, and then forming an electrode on the surface. After that, in the step of dividing into individual pieces along the dividing grooves, the mold for forming the dividing grooves uses trapezoidal projections formed in a lattice shape, thereby forming a ceramic green sheet. An inverted trapezoidal split groove is formed on the surface, and the bottom of the groove becomes denser by pressing than other portions. For this reason, when a force for dividing into individual pieces is applied after firing, the stress is concentrated along the boundary between the dense part and the other parts, and the division can be performed neatly from the boundary, and the shape and dimensions can be reduced. It is possible to obtain uniform pieces.

According to a second aspect of the present invention, the top surface of the trapezoidal projection has a shape in which the central portion is depressed, whereby the boundary between the pressed dense portion and the other portion is formed. When the surface becomes more reinforced and a force for dividing by the difference in strain is applied, the stress is concentrated on the boundary surface, and the surface can be divided into pieces having more uniform dimensions.

An embodiment of the present invention will be described below with reference to the accompanying drawings. A mold 2 in which a trapezoidal protrusion 3 having a width of 10 μm on the top surface shown in FIG. 1 is formed on one surface of a ceramic green sheet having a thickness of 600 μm in FIG. , Depth 200
A groove of about 300 μm is formed. The depth of the groove 1a is the mold 2
The stopper (not shown) provided on the sliding shaft (not shown) of the present invention can be adjusted arbitrarily. At this time, the lower part 6 of the bottom surface of the groove 1a is pressurized and becomes denser than other parts. As shown in FIG. 2, the projection 3 of the mold 2 had a depression 4 at the center of the top surface and projections 5 on both sides. Ten such ceramic green sheets 1 having the grooves 1a formed thereon were stacked and sandwiched above and below by a ceramic plate and fired at a temperature of 1250 ° C. for 2 hours. Next, the electrodes 8 and 9 were baked on the upper and lower surfaces of the sintered body 7 shown in FIG. 3 and then divided into pieces having the shape shown in FIG. The divided surfaces and the dimensions of the obtained individual pieces were evaluated, and the results are shown in Table 1 together with the evaluation results of the individual pieces prepared by the conventional method.

[0008]

[Table 1]

As shown in (Table 1), the size of the ceramic piece after division is not much different from the method of the present invention and the conventional method. However, in the conventional method, the flatness of the divided surface is not as shown in FIG.
It can be seen that distortions occur as shown in FIG. 5 and that the shape defects are large and the yield is reduced. That is, in the case of the projection 11 of the mold 10 that forms the split groove according to the conventional method, the part of the split groove formed in the ceramic green sheet 1 is such that the tip of the projection 11 is cut into the ceramic green sheet 1. This is considered to be because, when a dividing force after firing is applied, the strained portion of the sintered body is not clear, and the stress is hardly concentrated along the dividing grooves.

[0010]

As described above, in the production of the scribe-type ceramic electronic component, when forming the grooves by pressing the mold having the projections formed on the surface of the ceramic green sheet, as in the present invention, the top of the projections is formed. By using a mold having a trapezoidal surface, it is possible to obtain a ceramic electronic component having a uniform shape and dimensions by division after firing.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a state in which a mold having projections according to an embodiment of the present invention is pressed against a ceramic green sheet surface.

FIG. 2 is a partially enlarged sectional view of a protrusion formed on a mold according to an embodiment of the present invention.

FIG. 3 is a sectional view showing a state in which electrodes are formed on a sintered body.

FIG. 4 is a cross-sectional view of the divided ceramic electronic component.

FIG. 5 is a cross-sectional view showing a state in which a mold having projections formed by a conventional method is pressed against a ceramic green sheet surface.

FIG. 6 is a sectional view of a ceramic electronic component after division by a conventional method.

FIG. 7 is a sectional view of another ceramic electronic component after the division.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic green sheet 2 Die 3 Projection 4 Depressed part 5 Projection part 6 Pressurization part 7 Sintered body 8 Electrode 9 Electrode

Claims (2)

[Claims] 1. A mold having projections on the surface of a ceramic green sheet is pressed to form a split groove, then the green sheet is fired, and then an electrode is applied and baked on the surface of the fired body. In the step of dividing into ceramic pieces along the dividing groove, a method of manufacturing a ceramic electronic component, wherein a mold having trapezoidal projections formed in a lattice shape is used as the mold for forming the dividing groove. 2. The method for manufacturing a ceramic electronic component according to claim 1, wherein the central portion of the top surface of the trapezoidal projection is depressed.