JPH1174432A - Boiling and cooling device for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the high heat exchange efficiency by arranging the device wherein air flows in the vertical directions when an heating electronic part such as a rectifying diode is cooled. SOLUTION: A flat shaped coolant tank 11 is arranged in the vertical direction. At the same time, opening parts are provided at both end parts of a porous tube container 13, which is formed by bending a flat and long shaped porous tube at the upper part of one-side surface 11a of this coolant tank 11. Then, at the lower part of an other side surface 11b of the coolant tank 11, an electronic device mounting part 11c, wherein an electronic device 15 is mounted, is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boil cooling device for electronic components for cooling electronic components that generate heat such as rectifier diodes.

[0002]

2. Description of the Related Art Conventionally, as a boiling cooling device for an electronic component for cooling an electronic component which generates heat such as a rectifier diode, for example, a device disclosed in Japanese Patent Application Laid-Open No. Hei 8-31996 is known.

FIG. 6 shows a boil cooling device for electronic components disclosed in this publication. In this boil cooling device for electronic components, an electronic component 2 is fixed to a side surface of a cooling tank 1 in which a refrigerant is stored. Have been. A plurality of radiating tubes 3 are erected at predetermined intervals on the upper surface of the cooling tank 1 to form a heat exchange core 4.

[0004] In such a boiling cooling device for electronic parts,
The amount of heat generated in the electronic component 2 is transmitted to the refrigerant in the cooling bath 1, and the boiling refrigerant exchanges heat with the external air in the radiating tube 3 to be condensed and circulated in the cooling bath 1. 2 is performed.

[0005]

However, in such a conventional boiling cooling device for electronic parts, a plurality of radiating tubes 3 are erected at a predetermined interval on the upper surface of the cooling tank 1 so that the core portion 4 is formed. Since it is formed, in order to improve the heat exchange efficiency, it is necessary to flow air A from the horizontal direction to the core portion 4,
For example, when such a boiling cooling device for electronic components is disposed in a casing in which air flows vertically, there is a problem that it is difficult to obtain a sufficient heat exchange efficiency.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and a boiling cooling device for electronic parts which can obtain a high heat exchange efficiency by being arranged in a casing in which air flows vertically. It is intended to provide a device.

[0007]

According to a first aspect of the present invention, there is provided a boil cooling device for electronic parts, wherein a flat refrigerant tank is vertically arranged, and a flat elongate refrigerant tank is provided on one side of the refrigerant tank. Both ends of a multi-hole tube container formed by bending a multi-hole tube are opened, and an electronic component mounting portion for mounting an electronic component is formed at a lower portion of the other side surface of the refrigerant tank. It is characterized by.

According to a second aspect of the present invention, in the boil cooling device for an electronic component according to the first aspect, the refrigerant tank is formed with a tube hole into which both ends of the multi-hole tube container are inserted. And a cold plate disposed adjacent to the tube plate, a tank plate disposed adjacent to the tube plate and having a tank hole formed therein, and a cold plate disposed adjacent to the tank plate.

According to a third aspect of the present invention, there is provided an electronic component boiling cooling apparatus according to the first or second aspect, wherein the multi-hole tube container is provided such that a side opposite to the both ends of the multi-hole tube container is upward. Characterized in that it is arranged so as to be inclined so as to be located at

In the electronic component boiling cooling device according to the first aspect, the amount of heat generated from the electronic component mounted on the electronic component mounting portion is transmitted to the refrigerant below the refrigerant tank via the refrigerant tank. .

The refrigerant evaporates due to the transmitted heat,
The refrigerant flows into the multi-hole tube container at the upper part of the refrigerant tank, exchanges heat with the outside air in the multi-hole tube container, is cooled, condensed, and liquefied, and is recycled to the refrigerant tank. In the electronic component boiling cooling device according to claim 2, the refrigerant tank includes:
It is formed by joining three plate members consisting of a tube plate, a tank plate and a cold plate.

According to a third aspect of the present invention, there is provided a boiling and cooling device for electronic parts.
The multi-well tube container is arranged at an angle so that the opposite sides of both ends of the multi-well tube container are located upward.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 show an embodiment of a boiling and cooling apparatus for electronic parts according to the present invention. Reference numeral 11 denotes a flat refrigerant tank. This refrigerant tank 11
Has a rectangular outer shape and is arranged vertically. Both ends of a multi-well container 13 formed by bending a flat and long multi-well tube T are opened in the upper and middle portions of one side surface 11a of the refrigerant tank 11.

The other side surface 11b of the refrigerant tank 11
An electronic component mounting portion 11c on which an electronic component 15 that generates heat, such as a rectifier diode, is mounted. In this embodiment, the multi-well tube container 13 is formed by bending a flat and long multi-well tube T shown in FIG. 3 into a U-shape. The multi-well tube T is made of aluminum having good thermal conductivity.

Further, the multi-well tube T is formed by extrusion molding, and has a plurality of holes T1 serving as pipelines at predetermined intervals in the width direction. This hole T1
Is formed on the inner surface of the substrate with small irregularities (not shown). As shown in FIG. 2, the multi-well tube containers 13 are arranged in a pair at intervals in the horizontal direction.

Both ends of each multi-hole tube container 13 are open to the refrigerant tank 11. In this embodiment, the corrugated fins 17 made of aluminum clad material are provided inside the multi-well pipe container 13, between the multi-well pipe containers 13, and outside the multi-well pipe container 13.
Are arranged to form a core portion 19.

Outside the outermost corrugated fin 17, a side plate 21 made of aluminum is arranged. In this embodiment, the refrigerant tank 11 is formed by joining three aluminum plate members including a tube plate 23, a tank plate 25, and a cold plate 27 by brazing.

As shown in FIG. 4, the tube plate 23 has a rectangular shape, and has a tube hole 23a into which the end of the multi-well tube container 13 is inserted. This tube hole 23a is formed by press working. The tank plate 25 has a rectangular shape as shown in FIG. 4B, and the tank plate 25 has a rectangular tank hole 25a formed therethrough.

The tank hole 25a is formed by press working. A filler tube hole 25b into which the filler tube 29 shown in FIG. 1 is inserted is formed on the side surface of the tank plate 25. The cold plate 27 has a rectangular shape as shown in FIG. In this embodiment, as shown in FIG. 1, the refrigerant tank 11 is located on the opposite side of the multi-hole pipe container 13 near the lower side of the multi-hole pipe container 13 disposed in the middle part of the refrigerant tank 11, for example, It is bent at an angle θ of more than degrees.

The multi-well tube container 13
However, the multi-hole tube container 13 is disposed so as to be inclined at an angle θ of, for example, 5 degrees or more so that the opposite sides of both ends of the multi-hole tube container 13 are located above. The above-described electronic component boiling cooling device is manufactured as described below. That is, first, the end of the multi-well tube container 13 is
In the tube hole 23a.

A corrugated fin 17 is arranged inside the multi-well tube container 13, between the multi-well tube containers 13, and outside the multi-well tube container 13, and a side plate 21 is arranged outside the corrugated fin 17. 19 is assembled. Then, the tank plate 2 is placed on the tube plate 23.
5 and the cold plate 27 are assembled, and after flux is applied in a brazing furnace, the respective parts are integrally brazed.

The filler tube 29 is inserted into the filler tube hole 25b of the tank plate 25 before the tank plate 25 is assembled. Thereafter, the inside of the refrigerant tank 11 and the multi-well tube container 13 is evacuated from the filler tube 29 of the tank plate 25, a refrigerant such as ammonia and freon is sealed, and the filler tube 29 is sealed by, for example, welding. .

In this embodiment, the amount of the refrigerant is about 30 to 50% of the inner volume of the multi-hole tube container 13, for example, as shown in FIG. The refrigerant is filled up to the vicinity of the located refrigerant liquid level A. For example, as shown in FIG. 5, in the above-described electronic component boiling cooling device, the refrigerant tank 11 is positioned vertically in a housing 31 such as a control panel in which outside air is forcibly circulated or naturally circulated from below to above. Used to be arranged.

The heat generated from the electronic component 15 mounted on the electronic component mounting portion 11c is transmitted to the refrigerant below the refrigerant tank 11 via the refrigerant tank 11. The refrigerant evaporates due to the transmitted heat, and the refrigerant tank 11
Flows into the multi-hole tube container 13 in the middle and upper portions of the container, and in the multi-hole tube container 13, heat exchanges with air B flowing from below to above in the housing 31, cooling, condensing, and liquefying the refrigerant tank. Recirculated to 11.

In the electronic component boil cooling device configured as described above, a flat multi-well tube T formed by bending a flat and long multi-hole tube T is formed on one side surface 11a of the refrigerant tank 11. Both ends of the pipe container 13 are opened, and the refrigerant tank 1 is opened.
The electronic component mounting portion 11c on which the electronic component 15 is mounted is formed below the other side surface 11b of the refrigerant tank 1.
There is no obstruction on the one side surface 11a side of the air B in the vertical direction, so that the air B flowing in the vertical direction can be reliably circulated to the multi-hole tube container 13.

Therefore, this electronic component boiling cooling device is
High heat exchange efficiency can be obtained by arranging in the case 31 of the type in which the air B flows vertically. Also,
In the above electronic component boiling cooling device, the tube plate 23, the tank plate 25, and the cold plate 2
Since the three refrigerant plates 7 are joined to form the refrigerant tank 11, the refrigerant tank 11 can be easily and reliably formed.

Further, in the above-described boiling cooling device for electronic parts, the multi-hole tube container 13 is
The two sides of the multi-well tube container 13 are heat-exchanged and cooled and condensed and liquefied. it can. In the above-described embodiment, an example in which the multi-hole tube container 13 is arranged at an angle has been described. However, the present invention is not limited to such an embodiment. Is also good.

Further, in the above-described embodiment, an example is described in which the multi-hole tube container 13 is disposed only on one side surface 11a of the refrigerant tank 11, but the present invention is not limited to this embodiment. A multi-hole tube container may be arranged on the side surface 11b to increase the heat exchange efficiency. Further, in the above-described embodiment, an inner fin may be arranged in the tank hole 25a of the tank plate 25 to increase the heat exchange efficiency.

[0030]

As described above, in the electronic component boiling cooling device according to the first aspect, the upper part of one side surface of the refrigerant tank is provided with:
Both ends of a multi-hole tube container formed by bending a flat long multi-hole tube are opened, and an electronic component mounting portion for mounting electronic components is formed at a lower portion of the other side surface of the refrigerant tank. Therefore, there is no obstruction on the one side surface of the refrigerant tank that obstructs the flow of air in the up-down direction, and the air flowing in the up-down direction can be reliably circulated to the multi-hole tube container.

Therefore, this electronic component boiling cooling device is
High heat exchange efficiency can be obtained by arranging in a case in which air flows vertically. In the boiling cooling device for electronic parts according to the second aspect, the refrigerant tank is formed by joining the three plate members including the tube plate, the tank plate, and the cold plate, so that the refrigerant tank can be easily and reliably formed.

According to the third aspect of the present invention, there is provided a boiling and cooling apparatus for electronic parts.
Since the multi-well pipe container is arranged at an angle so that the opposite sides of the multi-well pipe container are located on the opposite sides, the multi-well pipe container exchanges heat with air in the multi-well pipe container. Can be reliably recycled to the tank.

[Brief description of the drawings]

FIG. 1 is a side view showing an embodiment of an electronic component boiling / cooling device of the present invention.

FIG. 2 is a top view of FIG.

FIG. 3 is a sectional view showing the multi-well tube of FIG. 1;

FIG. 4 is an explanatory view showing components of the refrigerant tank of FIG. 1;

FIG. 5 is an explanatory diagram showing the operation of the electronic component boiling cooling device of FIG. 1;

FIG. 6 is a perspective view showing a conventional electronic component boiling cooling device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Refrigerant tank 11a One side surface 11b The other side surface 11c Electronic component mounting part 13 Multi-hole tube container 15 Electronic components 23 Tube plate 23a Tube hole 25 Tank plate 25a Tank hole 27 Cold plate T Multi-hole tube

Claims (3)

[Claims] A flat refrigerant tank (11) is vertically arranged, and a flat long multi-hole tube (T) is provided on one side (11a) of the refrigerant tank (11). The electronic component in which the electronic component (15) is mounted at the lower end of the other side surface (11b) of the refrigerant tank (11) by opening both ends of the multi-hole tube container (13) formed by bending A boil cooling device for electronic parts, wherein a mounting part (11c) is formed. 2. The evaporative cooling device for electronic parts according to claim 1, wherein the refrigerant tank (11) is provided in the multi-hole tube container (1).
3) A tube plate (23) having a tube hole (23a) into which both ends are inserted, and a tank plate (25) arranged adjacent to the tube plate (23) and having a tank hole (25a) formed therein. ) And a cold plate (27) arranged adjacent to the tank plate (25). 3. The boil cooling device for electronic parts according to claim 1, wherein the multi-hole tube container (13) is positioned such that opposite sides of the multi-hole tube container (13) are located above. A boiling cooling device for electronic components, wherein the cooling device is arranged to be inclined.