JP2000213880A - Evaporative cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To drastically improve the circulation property of the refrigerant of a evaporative cooling device for cooling electronic parts or the like for generating heat such as a rectification diode. SOLUTION: In a device, a refrigerant tank 13 that is arranged in upper and lower directions, a shell 15 for heat dissipation where an upper opening part 15a and a lower opening part 15b that are open at a refrigerant tank 13 at upper and lower portions while being arranged in upper and lower directions vertically to the refrigerant tank 13 at one side of the refrigerant tank 13, and an upper opening part 17a and a lower opening part 17b that are open at the refrigerant tank 13 at upper and lower potions while being arranged in upper and lower directions vertical to the refrigerant tank 13 at the lower portion of the other side of the refrigerant tank 13 are formed. Also, the device is provided with a shell 17 for receiving heat where the upper opening part 17a is located at a higher position than the lower opening part 15b of the shell 15 for cooling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling an electronic component that generates heat, such as a rectifier diode.

[0002]

2. Description of the Related Art Conventionally, as a boiling cooling device for cooling an electronic component that generates heat such as a rectifier diode, there is known a cooling device disclosed in, for example, Japanese Patent Application Laid-Open No. 8-227954. FIG. 26 shows this type of boiling cooling device. In this boiling cooling device, a flat refrigerant tank 1 is vertically arranged.

[0003] At the upper side of one side surface 1a of the refrigerant tank 1, both ends of a multi-well tube container 2 formed by bending a flat and long multi-well tube are opened. Corrugated fins 3 are arranged between the multi-hole pipe containers 2,
On both sides, side plates 4 are arranged and heat radiating portions 5 are formed. Further, a heat receiving portion 7 on which the electronic component 6 is mounted is opened at a lower portion of the other side surface 1b of the refrigerant tank 1.

The heat receiving section 7 is formed of a flat and long multi-hole tube, and the end face is sealed by a plate member 8. In such a boiling cooling device, the amount of heat generated in the electronic component 6 is transmitted to the refrigerant in the heat receiving unit 7, and the boiling refrigerant is guided to the multi-hole tube container 2 through the refrigerant tank 1,
The heat is exchanged with the external air in the heat radiating section 5, condensed and recirculated into the heat receiving section 7, thereby cooling the electronic component 6.

[0005]

However, in such a conventional boiling cooling apparatus, as shown in FIG. 27, the flow of steam B from the heat receiving section 7 to the heat radiating section 5 and the heat radiating section 5
And the flow of the condensed liquid L flowing from the
The condensate L is pushed back by the vapor B, and the liquid return property is poor.
Further, there is a problem that the circulation of the refrigerant is poor, and it is difficult to obtain high cooling efficiency because the steams B impede each flow.

[0006] The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a boiling cooling device capable of greatly improving the circulation of a refrigerant as compared with the conventional one.

[0007]

According to a first aspect of the present invention, there is provided a boiling cooling apparatus comprising: a refrigerant tank disposed in a vertical direction; and a refrigerant tank disposed on one side of the refrigerant tank in a direction perpendicular to the refrigerant tank. A heat dissipation shell in which an upper opening and a lower opening that open to the refrigerant tank are formed at the lower part and a lower part on the other side of the refrigerant tank. An upper opening and a lower opening that open to the refrigerant tank are formed at a lower portion, and a heat receiving shell that is positioned higher than the lower opening of the heat radiating shell is provided with the upper opening. It is characterized by the following.

According to a second aspect of the present invention, in the boiling cooling apparatus according to the first aspect, the heat radiating shell is formed by joining a pair of heat radiating plates to face each other. And a guide projection for guiding the refrigerant from the upper opening to the lower opening.

A third aspect of the present invention is directed to the boiling cooling apparatus according to the first or second aspect, wherein the refrigerant tank is formed by joining first and second tank plates in opposition to each other. The upper and lower openings of the heat-radiating shell are formed at intervals above and below the first tank plate, and these projections are formed on the first tank plate. It is characterized in that it is communicated by a refrigerant passage.

According to a fourth aspect of the present invention, in the boiling cooling apparatus according to any one of the first to third aspects, the heat receiving shell includes a mounting plate on which a heating element is mounted and a cold plate. The protruding portion formed on the cold plate is bonded to the mounting plate. According to a fifth aspect of the present invention, there is provided the boiling cooling apparatus according to any one of the first to fourth aspects, wherein an opening valve that is opened to the atmosphere at a predetermined pressure is provided in the refrigerant tank. And

According to the first aspect of the present invention, the refrigerant in the heat-receiving shell evaporates due to the amount of heat generated from the heat-generating element such as an electronic component mounted on the heat-receiving shell. After flowing into the refrigerant tank from the upper opening of the radiating shell, it flows into the radiating shell from the upper opening of the radiating shell, exchanges heat with the outside air in the radiating shell, and is cooled, condensed, and liquefied. Flows into the refrigerant tank from the lower opening of the shell, and is recirculated to the lower opening of the heat receiving shell.

According to a second aspect of the present invention, the heat radiating shell is formed by joining a pair of heat radiating plates to face each other, and the refrigerant is guided to the heat radiating plate from the upper opening of the heat radiating shell to the lower opening. Guide projections are integrally formed.

According to the third aspect of the present invention, the refrigerant tank is formed by joining the first and second tank plates so as to face each other, and is formed at intervals above and below the first tank plate. The portion is a header portion in which an upper opening and a lower opening of the heat dissipation shell are opened. According to the fourth aspect of the present invention, the heat receiving shell is formed by joining the mounting plate on which the heating element is mounted and the cold plate so as to face each other, and the protrusion formed on the cold plate is joined to the mounting plate. You.

According to the fifth aspect of the present invention, when the pressure in the refrigerant tank exceeds a predetermined pressure, the release valve is opened to the atmosphere, and the internal pressure is reduced.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 to 3 show a first embodiment of a boiling cooling apparatus according to the present invention, and reference numeral 13 denotes a flat refrigerant tank. The refrigerant tank 13 has a rectangular outer shape, and is arranged vertically. In the refrigerant tank 13, a plurality of heat dissipation shells 15 are vertically arranged at intervals in the horizontal direction.

An upper opening 15a and a lower opening 15b opening to the refrigerant tank 13 are formed above and below the heat radiation shell 15. A heat receiving shell 17 is arranged at a lower portion of the refrigerant tank 13 opposite to the heat radiating shell 15. The heat receiving shell 17 is arranged vertically up and down with respect to the refrigerant tank 13.

Above and below the heat receiving shell 17, an upper opening 17a and a lower opening 17b which open to the refrigerant tank 13 are formed. And the upper opening 17
a is opened at a position higher than the lower opening 15b of the heat radiation shell 15. As shown in FIG.
As shown in FIG. 7, a mounting surface 17c on which an electronic component 19 that generates heat, such as a rectifier diode, is mounted.

In this embodiment, the heat radiating shell 1 is used.
Corrugated fins 23 made of an aluminum clad material are arranged between 5 and outside the heat radiating shell 15 to form a heat radiating portion 26. Outside the outermost corrugated fins 23, side plates 27 made of aluminum are arranged.

In this embodiment, the heat radiation shell 15 is formed by joining a pair of heat radiation plates 29 so as to face each other as shown in FIG. The pair of heat radiating plates 29 are formed of aluminum having good thermal conductivity. An upper opening 15 is provided above and below the heat radiation shell 15.
a and a lower opening 15b.

In this embodiment, the refrigerant tank 13
As shown in FIG. 5, is formed by joining two aluminum plate members including a first tank plate 31 and a second tank plate 33 by brazing. The first tank plate 31 has a rectangular shape,
Above and below, horizontally projecting portions 31 are spaced horizontally.
a, 31b are formed.

The horizontal projecting portions 31a and 31b have an arcuate cross section, and are spaced apart in the horizontal direction and have holes 31c into which the upper opening 15a and the lower opening 15b of the heat radiation shell are inserted. Are formed.

The upper and lower horizontal projections 31a, 31b
Is connected to the first tank plate 31 by a vertically protruding portion 31d formed in a vertical direction to form a refrigerant passage. On the other hand, in the second tank plate 33, the upper opening 17a and the lower opening 17b of the heat receiving shell 17 are provided.
Are formed in the holes 33a and 33b. The holes 33a and 33b are provided in the first tank plate 3
1 are formed above and below the horizontal projecting portion 31b.

Further, a hole 31e for a filler tube into which the filler tube 35 shown in FIG. 2 is inserted is formed below the vertical protruding portion 31d of the first tank plate 31. Further, in this embodiment, the heat receiving shell 1
As shown in FIG. 6, reference numeral 7 is formed by joining a mounting plate 37 on which the electronic component 19 is mounted and a cold plate 39 to face each other.

The mounting plate 37 and the cold plate 39
Are made of aluminum and brazed to each other. An upper opening 17a and a lower opening 17b are formed above and below the heat receiving shell 17. The cold plate 39 has a large number of circular protrusions 39a.

The projections 39a are directly brazed to the mounting plate 37 as shown in FIG. In the above-mentioned boiling cooling device, after applying flux to each member, assembling as shown in FIG. 2, and performing heat treatment in a brazing furnace, each part is integrally brazed.

Then, after that, from the filler tube 35 of the refrigerant tank 13, the refrigerant tank 13, the heat radiation shell 1
5 and the inside of the heat receiving shell 17 are evacuated, and a refrigerant such as ammonia or freon is sealed therein.
5 is sealed, for example, by welding.

In this embodiment, the amount of the refrigerant is about 30 to 50% of the inner volume of the heat radiation shell 15, for example,
The refrigerant is filled up to the refrigerant liquid level A shown in FIG. The above-described boiling cooling device is used, for example, in a case such as a control panel in which the outside air is forcedly circulated or naturally circulated from below to above, such that the refrigerant tank 13 is positioned vertically.

The amount of heat generated from the heating element such as the electronic component 19 mounted on the heat receiving shell 17 is transmitted to the refrigerant in the heat receiving shell 17 via the heat receiving shell 17. The refrigerant in the heat receiving shell 17 evaporates due to the transmitted heat, and the evaporated refrigerant flows into the refrigerant tank 13 through the upper opening 17 a of the heat receiving shell 17. And, the vertical protruding portion 31 which is the refrigerant passage of the refrigerant tank 13
d, flows into the radiating shell 15 from the upper opening 15a of the radiating shell 15, exchanges heat with the outside air in the radiating shell 15, cools, condenses, and liquefies the lower portion of the radiating shell 15. From the opening 15b to the refrigerant tank 1
3, and is recirculated into the heat receiving shell 17 from the lower opening 17 b of the heat receiving shell 17.

In the boiling cooling device configured as described above, the refrigerant in the heat receiving shell 17 evaporates due to the amount of heat generated from the heat generating element such as the electronic component 19 mounted on the heat receiving shell 17, and the evaporated refrigerant is removed. After flowing into the refrigerant tank 13 from the upper opening 17a of the heat receiving shell 17, it flows into the heat radiating shell 15 from the upper opening 15a of the heat radiating shell 15, and the heat radiating shell 15 exchanges heat with outside air and is cooled. The condensed and liquefied state flows into the refrigerant tank 13 from the lower opening 15b of the heat radiating shell 15 and is recirculated to the lower opening 17b of the heat receiving shell 17, so that the liquefied refrigerant is pushed back to the evaporated refrigerant. Is gone,
The circulation property of the refrigerant can be greatly improved as compared with the related art.

In the above-mentioned boiling cooling device, the refrigerant tank 13 is divided into the first and second tank plates 31 and 3.
3 are formed by joining the first tank plate 3
1, horizontal projections 31a and 31b are formed to open the upper opening 15a and the lower opening 15b of the heat radiation shell 15, and these projections 31a and 3b are formed.
Since the first tank 1b communicates with the first tank plate 31 through the vertical protrusion 31d, the refrigerant tank 13 can be easily manufactured using two plates.

Further, in the above-mentioned boiling cooling device, the heat receiving shell 17 is formed by joining the mounting plate 37 on which the electronic component 19 is mounted and the cold plate 39 so as to face each other. Shell 17 can be easily manufactured. In addition, the refrigerant is supplied to the mounting plate 3
7, the heat transfer from the heating element such as the electronic component 19 to the refrigerant can be improved.

That is, as shown in FIG.
When the heat receiving shell 43 is formed by joining a pair of cold plates 41 where a is formed, and the mounting plate 37 is joined to the heat receiving shell 43, the mounting plate 37 is used.
A space 45 is formed between the heat sink and the cold plate 41, and the heat transfer from the heating element such as the electronic component 19 to the coolant is reduced. In this embodiment, however, the coolant directly contacts the mounting plate 37. It is possible to improve the heat transfer from the heating element such as the component 19 to the refrigerant.

In the boiling cooling device described above, since the projecting portion 39a formed on the cold plate 39 is directly joined to the mounting plate 37, the strength of the heat receiving shell 17 can be improved. FIG. 9 shows a heat radiation shell 15A according to a second embodiment of the boiling cooling device of the present invention. In this embodiment, a pair of heat radiation plates 29 are provided.
Guide projections 29a and 29b for guiding the refrigerant from the upper opening 15a to the lower opening 15b of the heat radiation shell 15A are integrally formed.

In this embodiment, the guide projection 29
a, 29b are formed so that the refrigerant may meander and flow in the horizontal direction from the outer edge and the inner edge of the heat dissipation plate 29. The guide projections 29a and 29b formed on the pair of heat radiating plates 29 are brazed to each other with the pair of heat radiating plates 29 facing each other.

In the second embodiment, the same effects as those of the first embodiment can be obtained. However, in this embodiment, the heat radiation plate 29 forming the heat radiation shell 15A is used.
In addition, since the guide projections 29a and 29b for guiding the refrigerant from the upper opening 15a to the lower opening 15b of the heat radiation shell 15 are integrally formed, the refrigerant passage can be freely set, and the refrigerant can be condensed. The required refrigerant passage length can be reliably ensured.

Further, the guide projection 29 is provided on the heat radiation plate 29.
Since the a and 29b are integrally formed, the bending deformation of the heat radiation plate 29 can be reduced, and the joining property between the pair of heat radiation plates 29 can be improved. FIG.
FIG. 14 shows a heat radiation shell 15B of a third embodiment of the boiling cooling device of the present invention. In this embodiment, a large number of circular protrusions 29c are protruded inward from a pair of heat radiation plates 29. ing.

The projections 29c formed on the pair of heat radiating plates 29 are brazed to each other with the pair of heat radiating plates 29 facing each other. In this embodiment, the same portions as those of the second embodiment are denoted by the same reference numerals, and detailed description is omitted. In the third embodiment, the same effect as that of the second embodiment can be obtained. However, in this embodiment, the strength of the heat radiation shell 15B can be easily increased by changing the size or the interval of the protruding portion 29c. Can be adjusted.

FIG. 11 shows a heat radiation shell 15C according to a fourth embodiment of the present invention, in which a corrugated fin 47 is disposed between a pair of heat radiation plates 29. I have.

The top 47a of the corrugated fin 47 is brazed to the pair of heat radiating plates 29. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted.
In the fourth embodiment, the same effect as in the second embodiment can be obtained.

FIG. 12 shows a heat receiving shell 17A according to a fifth embodiment of the boiling cooling device of the present invention. In this embodiment, the upper edge 39b of the cold plate 39 extends from the upper opening 17a side. For example, it is formed to be inclined downward at an angle θ of about 2 to 3 degrees toward the back side.
In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted.

In the fifth embodiment, the same effects as in the first embodiment can be obtained. However, in this embodiment, the upper edge 39b of the cold plate 39 is moved from the upper opening 17a side to the rear side. , The refrigerant evaporated in the heat receiving shell 17A can be smoothly guided to the upper opening 17a. FIG. 13 shows a heat receiving shell 17B according to a sixth embodiment of the boiling cooling device of the present invention. In this embodiment, a cold plate 39 is provided.
The thickness of the internal space between the cooling tank 13 and the mounting plate 37 is increased as approaching the refrigerant tank 13.

In this embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted. In the sixth embodiment, the same effects as in the fifth embodiment can be obtained. FIG. 14 shows a seventh embodiment of the boiling cooling device of the present invention. In this embodiment, an opening valve 51 which is opened to the atmosphere at a predetermined pressure is arranged in the refrigerant tank 13.

As shown in FIG. 15, this release valve 51
The coolant tank 13 has a main body 55 that is screwed into a seat 53 formed on the second tank plate 33. A hole 55a is formed in the center of the main body 55, and a communication hole 55b communicating with a hole 33d formed in the second tank plate 33 is formed at the tip of the hole 55a.

The communication hole 5 is provided in the hole 55a of the main body 55.
A packing 57, a first holder 59, a coil spring 61, and a second holder 63 are arranged in this order from the 5b side. As shown in FIG. 16, the first holder 59 has a hexagonal shape, and a packing 57 is fixed to an end thereof. The second holder 63 includes a caulking portion 55c
Has been fixed through.

A through hole 63 a is formed in the second holder 63, and the through hole 63 a is sealed by a seal 65. In the opening valve 51, the refrigerant tank 1
When a pressure exceeding a predetermined pressure acts on the inside of the first holder 59, as shown in FIG. 17, the first holder 59 is pressed, the refrigerant flows out from the outer peripheral portion of the first holder 59, and the seal 65 is broken by the pressure. Thereby, the inside of the refrigerant tank 13 is opened to the atmosphere.

In the seventh embodiment, the same effect as in the first embodiment can be obtained. However, in this embodiment, an opening valve 51 which is opened to the atmosphere at a predetermined pressure is arranged in the refrigerant tank 13. Therefore, it is possible to reliably eliminate the possibility that the device is damaged by high pressure. FIG. 18 shows a heat radiation shell 15D according to an eighth embodiment of the present invention.
In this embodiment, a notch 29d is formed at the tip of the heat dissipation plate 29.

The notch 29d is bent outward to form a fin stopper 29e for positioning the corrugated fin 23. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted. In the eighth embodiment, the same effects as those of the first embodiment can be obtained, but in this embodiment, the fin stopper 29e is provided.
Is formed, the positioning of the corrugated fins 23 can be easily performed, and the heat radiation portion 26 can be easily assembled.

That is, conventionally, the projection of the corrugated fins 23 had to be separately prevented by a plate-shaped jig. However, such a jig becomes unnecessary, and the heat radiation portion 26 can be easily assembled. . In the above-described embodiment, as shown in FIG. 19 or FIG. 20, by forming the bent portions 39c and 39d on the cold plate 39 of the heat receiving shell 17, the heat receiving shell 17 is Positioning at right angles is easily possible.

Further, in the above-described embodiment, FIG.
Alternatively, as shown in FIG. 22, the upper opening 15a and the lower opening 15b of the radiation plate 29 of the radiation shell 15 are formed.
Are formed with projections 29f and 29h.
f, 29h to the second tank plate 3 of the refrigerant tank 13
3, the strength of the heat radiation shell 15 attached to the refrigerant tank 13 can be increased.

Further, in the above embodiment, FIG.
As shown in FIG. 3, the upper opening 15a of the heat dissipation shell 15
By making the lower opening 15b tapered at the tip, the insertability of the refrigerant tank 13 into the hole 31c of the first tank plate 31 can be improved. Further, in the above-described embodiment, as shown in FIG. 24, by projecting the hole 31 c of the first tank plate 31 of the refrigerant tank 13 inward, the upper opening 15 a and the lower The opening 15b can be easily inserted into the hole 31c of the first tank plate 31 of the refrigerant tank 13, and the brazing property can be improved.

Further, in the above embodiment, FIG.
As shown in FIG. 5, the upper opening 15a of the heat radiation shell 15
Is formed in an arc shape according to the shape of the hole 31c of the first tank plate 31 of the refrigerant tank 13,
The inflow resistance of the refrigerant can be reduced. In the above-described embodiment, an example in which the electronic component 19 is mounted on the heat receiving shell 17 and the electronic component 19 is cooled has been described. However, the present invention is not limited to this embodiment. Can be widely used.

[0053]

As described above, in the boiling cooling device according to the first aspect, the refrigerant in the heat receiving shell evaporates and evaporates due to the amount of heat generated from the heating element such as an electronic component mounted on the heat receiving shell. After the refrigerant flows into the refrigerant tank from the upper opening of the shell for heat reception, it flows into the shell for heat radiation from the upper opening of the shell for heat radiation, exchanges heat with the outside air in the shell for heat radiation, is cooled, condensed, and liquefied. In this state, the refrigerant flows into the refrigerant tank from the lower opening of the radiating shell and is recirculated to the lower opening of the heat receiving shell, so that the liquefied refrigerant is not pushed back by the evaporated refrigerant, and the circulating characteristics of the refrigerant are reduced. It can be significantly improved.

In the boiling cooling device according to the second aspect, the guide plate for guiding the refrigerant from the upper opening to the lower opening of the heat radiating shell is integrally formed on the heat radiating plate forming the heat radiating shell. This can be set freely, and the refrigerant passage length required for condensing the refrigerant can be reliably ensured. Further, since the guide projection is formed integrally with the heat radiating plate, it is possible to reduce the bending deformation of the heat radiating plate, and it is possible to improve the joining property between the pair of heat radiating plates.

According to the third aspect of the present invention, the cooling tank is formed by joining the first and second tank plates so as to face each other, and the cooling tank is disposed above and below the first tank plate at intervals. The upper opening and the lower opening are formed with projections, and these projections are communicated with the refrigerant passage projecting from the first tank plate. Therefore, the refrigerant tank is formed by two plate members. It can be easily manufactured.

According to the fourth aspect of the present invention, since the heat receiving shell is formed by joining the mounting plate on which the heating element is mounted and the cold plate so as to face each other, the heat receiving shell can be easily formed of two plates. Can be manufactured. In addition, since the refrigerant directly contacts the mounting plate, heat transfer from the heating element to the refrigerant can be improved.

Furthermore, since the projection formed on the cold plate is directly joined to the mounting plate, the strength of the heat receiving shell can be improved. In the boiling cooling device according to the fifth aspect, since the release valve that is opened to the atmosphere at a predetermined pressure is disposed in the refrigerant tank, the possibility of damage to the device due to high pressure can be reliably eliminated.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a boiling cooling device of the present invention.

FIG. 2 is a perspective view of FIG.

FIG. 3 is a perspective view of FIG. 1;

FIG. 4 is an explanatory view showing a heat radiation shell of FIG. 1;

FIG. 5 is a perspective view showing the refrigerant tank of FIG. 1;

FIG. 6 is an exploded perspective view showing the heat receiving shell of FIG. 1;

FIG. 7 is a sectional view showing a part of the heat receiving shell of FIG. 1;

FIG. 8 is an explanatory diagram showing an effect of the heat receiving shell of FIG. 7;

FIG. 9 is an explanatory view showing a heat radiation shell of a second embodiment of the boiling cooling device of the present invention.

FIG. 10 is an explanatory view showing a heat radiation shell of a third embodiment of the boiling cooling device of the present invention.

FIG. 11 is an explanatory view showing a heat radiation shell of a fourth embodiment of the boiling cooling device of the present invention.

FIG. 12 is an explanatory view showing a heat receiving shell of a fifth embodiment of the boiling cooling device of the present invention.

FIG. 13 is an explanatory view showing a heat receiving shell of a sixth embodiment of the boiling cooling device of the present invention.

FIG. 14 is a side view showing a seventh embodiment of the boiling cooling device of the present invention.

FIG. 15 is a sectional view showing the release valve of FIG. 14;

16 is a cross-sectional view showing a cross section of the first holder of FIG.

FIG. 17 is a cross-sectional view showing the operation of the release valve of FIG.

FIG. 18 is an explanatory view showing a heat radiation shell of an eighth embodiment of the boiling cooling device of the present invention.

FIG. 19 is an explanatory view showing another example of the heat receiving shell of the boiling cooling device of the present invention.

FIG. 20 is an explanatory view showing another example of the heat receiving shell of the boiling cooling device of the present invention.

FIG. 21 is an explanatory view showing another example of the heat radiation shell of the boiling cooling device of the present invention.

FIG. 22 is an explanatory view showing another example of the heat radiation shell of the boiling cooling device of the present invention.

FIG. 23 is an explanatory view showing another example of the heat radiation shell of the boiling cooling device of the present invention.

FIG. 24 is an explanatory view showing another example of the heat radiation shell of the boiling cooling device of the present invention.

FIG. 25 is an explanatory view showing another example of the heat dissipation shell of the boiling cooling device of the present invention.

FIG. 26 is a perspective view showing a conventional boiling cooling device.

FIG. 27 is an explanatory view showing the operation of the boiling cooling device of FIG. 26;

[Explanation of symbols]

 13 Refrigerant tank 15, 15A, 15B, 15C, 15D Heat dissipation shell 15a Upper opening 15b Lower opening 17, 17A, 17B Heat receiving shell 17a Upper opening 17b Lower opening 29 Heat dissipation plate 31 First tank plate 31a, 31b Horizontal protrusion 31d Vertical protrusion 33 Second tank plate 37 Mounting plate 39 Cold plate 39a Projection

Claims (5)

[Claims] A refrigerant tank (1) arranged vertically.
3) and the refrigerant tank (1) is provided on one side of the refrigerant tank (13).
3) The upper opening (1) is arranged vertically in the vertical direction with respect to the upper part and the lower part opening to the refrigerant tank (13).
5a) and a radiating shell (15, 15A, 15B, 15C, 15D) in which a lower opening (15b) is formed; and a lower part of the refrigerant tank (13) on the other side with respect to the refrigerant tank (13). An upper opening (17a) and a lower opening (17b) which are vertically arranged vertically and open to the refrigerant tank (13) are formed in the upper and lower portions, and the upper opening (17a) is provided with the heat radiation. Shell (1
And a heat receiving shell (17, 17A, 17B) located at a position higher than the lower opening (15b) of each of the cooling cooling units (5, 15A, 15B, 15C, 15D). 2. The boiling cooling device according to claim 1, wherein the heat radiating shell (15, 15A, 15B, 15C, 1) is provided.
5D) is formed by joining a pair of heat radiating plates (29) to face each other. The heat radiating plate (29) is provided with an upper opening (15a) of the heat radiating shell (15, 15A, 15B, 15C, 15D). And a guide projection (29b) for guiding the refrigerant from the bottom to the lower opening (15b). 3. The boiling cooling device according to claim 1, wherein the refrigerant tank (13) is formed by joining first and second tank plates (31, 33) so as to face each other. The radiation shells (15, 15A, 15B, 15C, 15) are spaced above and below the first tank plate (31).
D) upper opening (15a) and lower opening (15
b) to form projections (31a, 31b) that are opened,
These protrusions (31a, 31b) are connected to the refrigerant passages (31) formed to protrude from the first tank plate (31).
A boiling cooling device, characterized in that it is in communication with d). 4. The boiling cooling device according to claim 1, wherein the heat receiving shell (17, 17A, 17B) has a mounting plate (37) on which a heating element (19) is mounted. ) And a cold plate (39) are joined to face each other, and a protrusion (39a) formed on the cold plate (39) is joined to the mounting plate (37). Cooling system. 5. The boiling cooling device according to claim 1, wherein an opening valve (51) that is opened to the atmosphere at a predetermined pressure is arranged in the refrigerant tank (13). A boiling cooling device.