JPH1174289A - Manufacture of semiconductor device and mask used for the manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a highly reliable semiconductor device by a method, wherein an elastomer is uniformly applied on a substrate from the aperture part of a mask through a reticulated sheet without the generation of a protuberance or an inclination. SOLUTION: Aperture parts 9 are formed, leaving the prescribed interval on a metal mask 8, and a reticulated sheet 10 where meshes are formed, is adhered to the upper surface of the metal mask 8 using a chemical resisting bonding agent or an emulsion. An elastomer 1 is applied to a substrate 5 in such a manner that the reticulated sheet 10 is placed on the substrate, the elastomer 1 is fed to the upper surface of the reticulated sheet 10, while the elastomer 1 is being pushed forward by a squeegee 11. When the elastomer 1 is applied, since the reticulated sheet 10 is provided on the mask 8, the elastomer 1 is pushed forward on the aperture part 9, and it streams down into a narrow strip form via meshes. As a result, the elastomer 1 can be applied uniformly with a constant thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a semiconductor device and a mask for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art For example, in the production of a μBGA, a semiconductor chip is mounted on a flexible substrate such as a TAB tape provided with a conductive circuit pattern via an elastomer having elasticity, and the substrate is connected to the substrate. The structure is such that the thermal expansion difference of the semiconductor chip is absorbed.

[0003] The elastomer must be applied uniformly to a predetermined thickness required to absorb the difference in thermal expansion.

[0004] Conventionally, an elastomer is applied by screen printing using a metal mask of the thickness to obtain an elastomer having a predetermined thickness. In this application, a metal mask provided with an opening is placed on a substrate, and a fluid elastomer is kneaded into the substrate from the opening with a squeegee. As shown in FIG. 5 (a), a protrusion 2 of the elastomer 2 having a height of, for example, 30 to 40 .mu.m is generated near the end of the opening.

[0005]

SUMMARY OF THE INVENTION The aforementioned elastomers
A problem arises due to the bulge 2 of 1. One of them is to apply an adhesive 4 for mounting the semiconductor chip 3, as shown in FIG.
(B) As shown in FIG.
Must be applied more than necessary in order to cover the substrate. In the subsequent die attach, as shown in FIG. 5 (C), the adhesive 4 protrudes and contaminates the substrate 5 and the like, which hinders subsequent wire bonding and the like. .

[0006] The swelling 2 of the elastomer-1
Is generated only on one side, and there is generally a difference in the swelling height between the left and right sides, and the semiconductor chip 3 is easily inclined as shown in FIG. For these reasons, it is difficult to manufacture a highly reliable semiconductor device. In addition, repairing the unevenness of the thickness of the elastomer requires skill and time, and lowers productivity.

Further, the conventional mask used for the application of the elastomer is liable to be worn and has a short service life.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a highly reliable semiconductor device with high productivity by uniformly applying an elastomer to a substrate to a predetermined thickness without causing swelling or inclination. A second object is to obtain a mask having a long service life.

[0009]

The gist of the present invention to achieve the above object is to apply an elastomer to a desired region of a substrate provided with a conductor circuit pattern and to mount a semiconductor chip through the elastomer. In the method of manufacturing a device, there is provided a method of manufacturing a semiconductor device, characterized in that the elastomer is applied to a substrate from an opening of a mask provided with a stitch sheet through the mesh sheet.

Another point is that in a mask for applying an elastomer before mounting a semiconductor chip on a substrate provided with a conductive circuit pattern, a mesh sheet is provided on a mask having openings. In a mask for manufacturing a semiconductor device.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a cross section of the substrate 5. The substrate 5 is, for example, a flexible substrate formed by bonding an insulating film 6 and a conductor circuit pattern 7 formed of a copper foil. Elastomer-1 is applied to mount the semiconductor chip at a predetermined position on the substrate 5. This application is performed by setting the mask 8 shown in FIG.

The mask 8 is made of, for example, a metal mask and has openings 9 formed at predetermined intervals, and a mesh sheet 10 having a mesh formed on the upper surface thereof is made of a chemical-resistant adhesive or emulsion. It is adhered by. The bonding means may be arbitrarily determined as long as the bonding is performed. However, it is desirable that the adhesive does not protrude into the opening 9. Although the size of the mesh of the mesh sheet 10 is not specified, the mesh is made into a fine mesh and is made of a synthetic resin such as polyester or a thin wire such as gold.

The application of the elastomer-1 to the substrate 5 is as follows.
The mesh sheet 10 is placed on the substrate 5 as described above, and FIG.
As shown in (1), the elastomer-1 is supplied to the upper surface, kneaded from the opening 9 while being pushed by the squeegee 11, and applied to the substrate 5.

At the time of the application, since the mesh sheet 10 is provided on the mask 8 as described above, the elastomer 1 is pushed out over the opening 9 and is made to pass through the mesh from a uniform state. It is applied down the strip. Thereby, the squeegee 11 is uniformly applied to a constant thickness without swelling or inclination on the end side of the opening 9 in the traveling direction of the squeegee 11. Although the upper surface of the applied elastomer-1 has fine irregularities, there is no problem because the thickness is uniform throughout.

Thereafter, in order to mount the semiconductor chip 3 on the substrate 5, an adhesive 4 is applied on the elastomer 1, but since the elastomer 1 does not have any protruding portions as described above, it may be thinly applied. It is sufficient that the adhesive 4 does not protrude when mounting the semiconductor chip 3 or the like, and the semiconductor chip 3 is accurately mounted in a normal posture without tilting as shown in FIG.

Thereafter, as is well known, the semiconductor chip 3
And the conductor circuit pattern 7 of the substrate 5 are connected by wires (not shown), the connection portion is encapsulated, and external terminals such as solder balls (not shown) are provided to manufacture a semiconductor device. Is done.

The mask 8 provided with the mesh sheet 10 of the present invention has a high abrasion resistance when the elastomer 1 is applied to the substrate 5, has almost no abrasion, and has a shape of the opening 9 thereof. For a long time, the service life is greatly improved, for example, by a factor of 5 or more.

[0018]

According to the present invention, as described above, the elastomer can be applied to the substrate to a constant thickness, and a semiconductor device having excellent reliability can be manufactured. Elastomers are also in the process of being manufactured.
Since there is no need to correct the coating shape of the coating, productivity is improved. Further, the life of the mask is extended and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing a substrate on which an elastomer is applied according to an embodiment of the present invention.

FIG. 2 is a diagram showing a mask according to one embodiment of the present invention.

FIG. 3 is a diagram showing an elastomer coating in one embodiment of the present invention.

FIG. 4 is a diagram showing a semiconductor device according to one embodiment of the present invention.

FIG. 5 is a view for explaining a problem relating to a conventional elastomer coating.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 elastomer 2 swell 3 semiconductor chip 4 adhesive 5 substrate 6 insulating film 7 conductor circuit pattern 8 mask 9 opening 10 mesh sheet 11 squeegee

Claims (2)

[Claims] In a method of manufacturing a semiconductor device in which an elastomer is applied to a substrate provided with a conductive circuit pattern and a semiconductor chip is mounted via the elastomer, the elastomer is meshed through an opening of a mask. A method of manufacturing a semiconductor device, wherein the method is applied to a substrate via a substrate. 2. A mask for applying an elastomer to said substrate prior to mounting a semiconductor chip on a substrate provided with a conductive circuit pattern, wherein a mesh sheet is provided on a mask having openings formed therein. A mask for manufacturing a semiconductor device, comprising: