JPH1168392A - Tow-element mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a prescribed number of paired elements to be laminated without fail even if an element hoop lacks for elements, by a method wherein a two-element mounting apparatus is controlled by the output signal outputted from an element detector to cope with the luck of elements, and a mounting member is stopped from being transferred when a suction head lacks for two elements. SOLUTION: Eelement detectors 23a and 23b are arranged in a vertical direction by sandwiching elements 2 each located at both the edges of an element hoop 1 to detect an element lacking part 3, a detection result is stored, and the output signal is inputted into an element lack processing part. An adhesive pan 37 is rotated by a pulse motor 38 to apply adhesive agent to the rears of the elements attracted to vacuum suction pins 24 and 24a, and when both the vacuum suction pins 24 and 24a attract no element 2 or both the vacuum suction pins 24 and 24a lack for elements 2 because the elements 2 are not present at an element cutting section in a preceding process, and a drive motor 7 is stopped to prevent a lead frame 4 from being transferred even it the vacuum pins 24 and 24a are made to descend toward a lead frame 4 in a mounting operation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-element mounting apparatus for simultaneously mounting two elements constituting an electronic component or the like on a mounting member in a stacked manner.

[0002]

2. Description of the Related Art A conventional device mounting apparatus generally employs a vertical and front and rear transfer unit, in which a vacuum suction pin is attached to an upper, lower, front and rear head in the unit, and an element is suctioned and taken out by the operation of the vacuum suction pin. It was held and mounted where needed.

A conventional device mounting apparatus will be described below with reference to the drawings. FIG. 13 is a perspective view of a main part of a conventional device mounting apparatus.

In FIG. 13, reference numeral 61 denotes a front / rear vertical transfer unit which holds a front / rear upper / lower head 62 having a plurality of vacuum suction pins 63 at a lower portion so as to be able to be driven back and forth and up and down.

[0005] Reference numeral 64 denotes an element hoop in which elements 69 constituting an electronic component are arranged to face each other. The element hoop is transferred by the rotation of a pin wheel 66 connected to a pulse motor 65.

Reference numeral 70 denotes a mounted member (hereinafter, referred to as a lead frame) for forming a product, and the element 69 is mounted at a predetermined position. 67 is an element cutting die, and 68 is an element cutting punch, which cuts and separates the element 69 arranged on the element hoop 64.

The operation of the element mounting apparatus constructed as described above is performed by two rows of elements 69 arranged opposite to the element hoop 64 transferred by the rotation of the pin wheel 66.
The two opposing elements 69 are simultaneously cut and separated by the element cutting die 67 and the two element cutting punches 68.

Next, the two elements 69 cut by the vacuum suction pins 63 are suction-held, and thereafter, the front and rear upper and lower heads 62 are moved.
Moves forward and downward to mount the element 69 at a predetermined position on the lead frame 70.

[0009]

However, in the above-described conventional device mounting apparatus, when the defective device 69 is mixed in the device hoop 64, the defective device 69 is cut and removed in advance by a characteristic test or the like. In some cases, the element hoop 64 lacks the element 69.
Nine elements do not always match.

Therefore, if the element 69 is directly mounted on the lead frame 70 using the conventional element mounting apparatus, a defect state in which the element is missing occurs.

Although there is a method of mounting the elements 69 one by one, it is difficult to match the directions, and the productivity is reduced to 50% or less as compared with the above. Further, the front / rear vertical transfer unit 61 has many operations for mounting, and has a problem that the mounting speed cannot be increased.

An object of the present invention is to solve the above-mentioned conventional problems. A two-element mounting apparatus capable of reliably mounting two elements at a time and stacking a predetermined number of elements even if the element hoop lacks elements. The purpose is to provide.

[0013]

In order to solve the above-mentioned problems, a two-element mounting device according to the present invention comprises an element supply section for continuously supplying elements at a constant pitch, and suctioning two elements corresponding to the number of indexes. Indexing table in which suction heads to be arranged are arranged at the circumferential end, an element detector for detecting the absence of two elements and outputting an output signal, an element cutting section for processing into an element shape to be mounted, and corresponding to the absence state of the element. An element lacking processing unit that is controlled by an output signal of the element detector and processes the lack of an element, an adhesive application unit that applies an adhesive to one surface of the element, and two elements mounted simultaneously if both elements are When the suction head is not provided, the device is provided with an element mount for stopping the transfer of the mounted member.

According to the present invention, even if the element hoop has an element lacking, the lead frame has two elements at the same time without the lack.
In addition, it is possible to mount the element at high speed and high efficiency, to prevent the occurrence of a trouble state due to the lack of the element, and to reduce the number of mounting operations.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention provides an element supply section for continuously supplying elements at a constant pitch;
An indexing table with suction heads that adsorb two elements corresponding to the indexing number arranged at the circumferential end, an element detector that detects the absence of two elements and outputs an output signal, and processed into the element shape to be mounted An element cutting section, an element lacking processing section that is controlled by an output signal of the element detector in response to an element lacking state, and processes an element lacking, and an adhesive application section that applies an adhesive to one surface of the element. A two-element mounting device comprising an element mounting part for simultaneously mounting two elements and stopping the transfer of the mounted member when both elements are lacking in the suction head; There is no lack, the number of operations is small, and the function of stacking a predetermined number of layers at a time at high speed can be achieved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a main part of a two-element mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of an element hoop supplied by the same element, FIG. 3 is a perspective view of the same element alone, and FIG. FIG. 5 is a perspective view of the lead frame, FIG. 5 is a cross-sectional view of a main part of the element cut section and the element mount section, FIG. 6 is a cross-sectional view of a main part of a chipping processing section of the element, and FIG. 8 (a), 8 (b) and 8 (c) are schematic process diagrams of the device punching and cutting operation, FIGS. 9, 10 and 11 are cross-sectional views for explaining the operation of the device lacking process, and FIG.
FIG. 3 is a plan view for explaining the configuration and operation of the vacuum suction slip ring.

In FIG. 2, a continuous band-shaped element hoop 1 made of a metal material or a resin material has elements 2 constituting various electronic components formed so as to face a band portion 1b provided with a feed hole 1a. I have. Then, in the manufacturing process of the element 2, the missing portion 3 of the element 2 which has been cut and removed due to defective characteristics is randomly generated. FIG. 3 shows an example of a single element state of the element 2 punched and cut from the element hoop 1.

FIG. 4 shows a state in which a set number (four in the present embodiment) is stacked and mounted in order to make the element 2 an electronic component. Reference numeral 4 denotes a thin band-shaped member to be mounted such as a metal material. The element mounts 4a and 4b are stamped with the transfer holes 5 at both ends and opposed to each other with the center band 4c interposed therebetween.

Next, the configuration of the two-element mounting device will be described. The two-element mounting device mainly includes an element supply section, an element cutting section, an element lack processing section, an element positioning section, an adhesive application section, and an element mounting section.

In FIG. 1, reference numeral 8 denotes an index handler, which is driven via a timing belt 12 and a timing pulley 10 by using the rotational force (a driving mechanism is not shown) of a timing pulley 13 fixed to a cam shaft 14 as power. You. Reference numeral 11 denotes a take-up pulley, which applies an appropriate tension to the timing belt 12.

Reference numeral 9 denotes an indexing vertical table which can be rotated and moved up and down in the direction of the arrow.
The above operation provides a rotation indexing operation and a vertical movement operation.

Further, on the indexing upper and lower table 9, suction heads 18 which are slidable up and down by the same number as the number of indexing and which are slidable up and down are installed at the same pitch at the circumferential end. The vacuum force for adsorbing the element 2 and the air pressure required for mounting the element 2 are determined by a slip ring installed on the upper surface of the indexing upper and lower table 9 inside the adsorption head 18 from the pipes 19a, 19b, 19c and 19d. Suction or supply via 20. Reference numeral 8a denotes a holding spring, which is a slip ring 2a.
0 is prevented from floating from the indexing upper and lower table 9.

Reference numeral 16 denotes a bracket for fixing the index handler 8 to the upper side surface.
Is a frame made of a metal material that holds and forms the entire apparatus, for example, by fixing the apparatus to the upper surface.

Reference numerals 23a and 23b denote element detectors, which are disposed vertically above and below the element 2 at both ends of the element hoop 1 described with reference to FIG. The output signal is input to the element lack processing section. The element hoop 1 is a driving motor 3 such as a pulse motor.
The belt 1b is transported at a specified pitch in the direction of the arrow by the pin pulley 30 and the pressing roller 31 connected to the belt 2, and the unnecessary band 1b is transported into the frame 17.

Reference numeral 25 denotes an element cutting die, which is an element detector 2
An element cutting punch 26 is provided on the upper surface side of the element hoop 1 on the lower surface side of the element hoop 1 following 3a and 23b.

A pair of vacuum suction pins 24a and 24a are attached to the lower end of the suction head 18, and are installed on the upper surface side of the element hoop 1 close to the element cutting die 25. The element cutting die 25 and the element cutting punch 26
Thereby, the element 2 punched and cut from the element hoop 1 is sucked and transported to the next indexing position.

Reference numeral 29 denotes a groove cam fixed to one end of the cam shaft 14. The drive roller 15 slidably fitted in the cam groove 29a is operated to swing a lever 28 having the drive roller 15 attached to one end. Dynamically driven. And lever 2
The element cutting punch 26 attached to the other end of the device 8 is driven up and down while being supported by a slide bearing 27.

Reference numeral 33 denotes an element receiving table on which the element 2 is mounted on one end of the upper surface, which can be rotated by 180 degrees by a driving motor 34 such as a pulse motor. When the element 2 is not attracted to the pins 24, 24a, the element detector 23a,
According to the output signal of 23b, rotation is performed by 180 degrees, the element is transferred, and the like, so that the lack of the element 2 does not hinder the mounting on the lead frame 4.

Reference numeral 39a denotes a cylinder, which is a suction head 1
8, the suction head 18 is not lowered when the processing for removing the element 2 from the element receiving table 33 is not required. Reference numeral 51 denotes a pipe, which prevents the element 2 from deviating from a predetermined position of the element receiving base 33 by vacuum suction.

Reference numeral 35 denotes an element positioning portion, which accurately positions the element 2 by positioning claws 36 provided on the upper surface.

Numeral 37 denotes an adhesive tray (adhesive supply mechanism is not shown), which is rotationally driven by a driving motor 38 such as a pulse motor, and is adhered to the adhesive application position of the element 2 by the concave end of the squeegee 37a. A convex portion is formed by the agent, and an adhesive is applied to the back surface of the element 2 of the vacuum suction pins 24, 24a.

Reference numeral 39b denotes a cylinder, which is a suction head 1
In addition to the vertical drive of the suction head 8, when the adhesive application to the element 2 is unnecessary, the suction head 18 is not lowered.

The element 2 is conveyed to the next indexing position by the vacuum suction pins 24 and 24a, and is mounted on the lead frame 4 at a predetermined position and in a predetermined direction as described with reference to FIG.

A pin 40a is inserted into the transfer hole 5 of the lead frame 4.
The lead frame 4 is supported between the pin pulley 40 for inserting the lead frame and the pressing roller 6, and the lead frame 4 is transferred at a specified pitch by the rotational drive of a driving motor 7 such as a pulse motor connected to the pin pulley 40.

Reference numeral 21 denotes a rotation stopper, which is fixed to the index handler 8 and is installed so as to be slidable through a slide bearing 22 attached to the slip ring 20. The slip ring 20 can be moved up and down freely, but rotation is prevented. Work.

Next, the operation will be described. Element hoop 1
Is transported in the direction of the arrow by the drive motor 32 and the element 2
Is detected by the element detectors 23a and 23b. Then, the next element cutting die 25 and the element cutting punch 2
6 cuts and separates the element 2 from the element hoop 1.

The punched, cut and separated element 2 is held by suction on a pair of vacuum suction pins 24 and 24a, and is conveyed by rotating the upper and lower table 9 to the next indexing position.

The transported element 2 reaches the element receiving base 33, and as described above, the element detectors 23a and 23b
If the vacuum suction pins 24, 24a of the pair have a lack of the element 2 by the operation of the element receiving base 33 in response to the lack signal from the device, processing such as replenishment or suction is performed, and the pair of vacuum suction pins 2
When both the elements 2 are not adsorbed on the elements 4 and 24a, they are indexed to the next element positioning section 35 and the upper and lower tables 9 are rotated and conveyed.

When there are two elements 2 that have reached the element positioning section 35, the position is corrected by the positioning claw 36 and the positioning is performed precisely, and then the next adhesive application section is indexed and the upper and lower tables 9 are rotated to convey. I do.

When there are two elements 2 that have reached the application of the adhesive, the adhesive is applied to the back surface of the element 2 and then transported to the next element mount in the same manner as described above.

The two elements 2 that have reached the element mounting portion are mounted at a predetermined position and a predetermined direction of the lead frame 4 transported by the driving motor 7. By repeating the above operation four times, the set number of elements 2 are stacked and mounted.

Next, an element cutting section and an element mounting section will be described with reference to FIG. In FIG. 5, reference numeral 8a denotes a pressing spring which is urged to prevent the slip ring 20 from floating above the indexing vertical table 9, and restricts the vertical movement.

Reference numeral 41 denotes a groove. The upper portion is connected to the pipes 19a and 19d via the connection pipe 41a and is provided on the lower surface of the slip ring 20, and the lower portion is a vacuum provided inside the indexing upper and lower table 9. Alternatively, it is connected to a pipe hole 42 serving as an air passage.

Numeral 43 designates a bearing which is inserted into the upper and lower portions of the indexing upper and lower table 9. The central portion of the suction head 18 is inserted to hold the suction head 18 so as to be slidable up and down. One end of the pipe hole 42 and the vacuum suction pins 24, 2 are formed even when the vacuum suction pins 24, 24a slide up and down or in the unlikely event of rotation.
One end of 4a is used as a connection point for sure connection.

Reference numeral 44 denotes a head spring, which is a vacuum suction pin 2
4, 24a, urging the suction head 18 downward,
Reference numeral 48 denotes a guide pin mounted on the lower surface of the indexing upper and lower table 9, and includes vacuum suction pins 24 and 24a, and suction head 1
8 can be moved up and down, but rotation is prevented.

Reference numeral 45 denotes a hoop receiver, which is provided at the center of the element cutting punch 26 and opposed to the element cutting die 25 with the element hoop 1 interposed therebetween, and supports the center of the element hoop 1. Reference numeral 46 denotes a pin, which connects the lever 28 and the element cutting punch 26 in a swingable manner. Also 47
Is a lead frame receiver installed below the element 2 mounted on the lead frame 4, and regulates and guides the lead frame 4.

The vacuum or air is supplied from the pipe 19a or 19d to the connection pipe 41a of the slip ring 20 and the groove 4
1. Each vacuum suction pin 24, 2
4a.

The element lack processing section will be described with reference to FIG. In FIG. 6, reference numeral 49 denotes a knuckle, which is attached to a driving tip of a cylinder 39a and is fitted into an upper portion of the suction head 18, and moves the suction head 18, that is, the vacuum suction pins 24, 24a up and down by driving the cylinder 39a. Reference numeral 50 denotes a vacuum hole, which is provided in the element receiving base 33, the tip of which is on the loading surface of the element 2 and the other tip of which is connected to a vacuum suction pipe 51 through a drive shaft 34a by a drive motor 34. Connected via

Then, the index upper and lower table 9 descends,
When the knuckle 49 descends by driving the cylinder 39a,
The suction head 18 is also lowered, and the tips of the vacuum suction pins 24 and 24a are lowered to a position almost in contact with the upper surface of the element receiving base 33, thereby enabling the transfer of the elements 2 stacked on the upper surface of the element receiving base 33. Conversely, when the knuckle 49 rises, compresses the head spring 44 and raises the suction head 18, a gap is formed between the tips of the vacuum suction pins 24, 24a and the upper surface of the element receiving base 33, and the element 2 is transferred. It is not done.

The element 2 mounted on the upper surface of the element receiving base 33
Is sucked in vacuum at the tip of the vacuum hole 50 to prevent displacement. Further, the element receiving base 33 is rotated by 180 degrees by the driving motor 34, and rotates so as to correspond to the inner vacuum suction pin 24a at one position and correspond to the vacuum suction pin 24 at the other position.

Next, the operation of the adhesive application section will be described with reference to FIG. In FIG. 7, reference numeral 49a denotes a knuckle, which is attached to a driving end of a cylinder 39b and is fitted into an upper portion of the suction head 18, and moves the suction head 18, that is, the vacuum suction pins 24, 24a up and down by driving the cylinder 39b. 37 is an adhesive tray and 37a is a squeegee.
The convex portion 37b is formed by the adhesive in the adhesive receiving tray 37 to be applied to the adhesive applying position.

Then, the indexing upper and lower table 9 descends,
When the knuckle 49a is lowered by driving the cylinder 39b, the suction head 18 is also lowered and the vacuum suction pins 24, 24 are moved.
The element 2 at the end of a is lowered to a position where the element 2 comes into contact with the adhesive convex portion 37b in the adhesive receiving tray 37, and the adhesive is applied to a predetermined position on the back surface of the element 2.

Conversely, when the knuckle 49a rises and compresses the head spring 44 to raise the suction head 18, the element 2 at the tip of the vacuum suction pins 24 and 24a and the adhesive receiving tray 37
A gap is formed between the two adhesives, and the adhesive is not applied to the element 2.

Next, the cutting operation of the element 2 will be described with reference to FIG. First, as shown in FIG.
24a is lowered and the element cutting punch 26 is raised to support the element hoop 1 in a predetermined position. Next, as shown in FIG. 8B, as the vacuum suction pins 24 and 24a are raised, the element cutting punch 26 is further raised in synchronization with the operation of the element cutting die 25 and the element 2 having a predetermined shape and the band portion. Punch and cut to 1b. Then, as shown in FIG. 8C, the vacuum suction pins 24 and 24a are further raised,
The element cutting punch 26 descends to the original position and ends the element cutting operation of the element 2.

Next, the operation of the element lack processing section will be described with reference to FIGS. First, as shown in FIG. 9, when the element 2 is both sucked to the tips of the vacuum suction pins 24, 24a, the vacuum suction pins 24, 24a do not descend and the element lacking operation is unnecessary, and the next step is performed. The element 2 is transported.

FIG. 10 shows a state in which the element 2 is not sucked by the vacuum suction pin 24 and the element 2 is sucked and loaded at a predetermined position on the upper surface of the element receiving base 33.
The vacuum suction pins 24 and 24a are lowered as they are, and the vacuum suction pins 24 suck the element 2 on the element receiving base 33 to be in the state shown in FIG. 9, and the element 2 is transported to the next step.

If the vacuum suction pin 24a is not suctioning the element 2 and the element 2 is suctioned to the vacuum suction pin 24, the element receiving base 33 is rotated by 180 degrees, and then the vacuum suction pin 24a is rotated. 24, 24a are lowered, and the element receiving base 33 is lowered.
Is sucked by the vacuum suction pin 24a.

The lack of the element 2 is performed by the element detectors 23a and 23b as described above, and the operation is controlled by the output signal.

FIG. 11 shows that the element 2 is
Is not sucked, and the element 2 is not loaded on the element receiving base 33.
The elements 4 and 24a descend and mount the element 2 sucked on the vacuum suction pin 24a on the element mounting surface of the element receiving base 33 and deposit it (if the vacuum suction pin 24a sucking the element 2 and the element receiving base 33). When it does not correspond to the element mounting surface, the element receiving base 33 is rotated 180 degrees in advance to make it correspond.) Thereafter, the vacuum suction pins 24 and 24a are raised.

Then, both of the vacuum suction pins 24 and 24a are in an empty state in which the element 2 is not suctioned, and in this state or in the element cutting section in the previous process, there are no two elements 2 and the vacuum suction pins 24 and 24a are also in the same state. If 24a is empty, even if it reaches the mount portion and the vacuum suction pins 24 and 24a descend toward the lead frame 4 by the mounting operation, the drive motor 7 is stopped and the lead frame 4 is transferred at a constant pitch. Is stopped, the lack of the element 2 generated in the lead frame 4 is prevented.

Referring to FIG. 12, the slip ring of the vacuum suction or air supply system will be described. 41b, 41
Reference numerals c, 41d, and 41e denote grooves provided on the lower surface of the slip ring 20, and pipes 19a, 19b, and 19e, respectively.
They are connected by connection pipes 41a (not shown) corresponding to c and 19d.

First, at the element cutting position, the pipe 19d and the groove 4
The device 2 is connected to the suction head 18 via 1e so that the element 2 can be suction-held by vacuum suction.

At the next element missing processing position, vacuum suction is performed via the pipe 19c and the groove 41d. In the case where the element 2 is to be loaded on the element receiving base 33 as described above, the vacuum suction circuit is shut off when the suction head 18 is lowered, and again when the suction head 18 is raised again. A vacuum suction circuit is connected (a disconnection connection mechanism for disconnection or connection is not shown).

The pipe 19b and the groove 41c are connected to the suction head 18 from the element lacking processing position to the element mounting position, and vacuum suction is performed to hold the element 2 at the tips of the vacuum suction pins 24 and 24a.

At the element mounting position, the suction head 18 descends at the element mounting position to terminate the mounting, the suction head 18 rises to the original position, and the vacuum suction circuit is cut off by the cut-off connection mechanism until the operation is completed. Give air pressure,
This prevents the element 2 from being sucked and lifted when the suction head 18 rises again.

In the embodiment of the present invention, the vertical operation is determined by the index handler and the entire upper and lower table is moved up and down. However, only the suction head is moved up and down at a necessary position by using a separate driving source. It may be configured.

In the embodiment of the present invention, an example in which the element is conveyed by an element hoop in which the element direction is fixed in advance has been described. However, if a rotation mechanism is added to each of the two vacuum suction pins, The direction of the element can be freely set.

Furthermore, in the embodiment of the present invention, a configuration has been described in which the cylinder is used to vertically drive the suction head 18 in the element lacking processing section and the adhesive application section, but a driving motor such as a pulse motor is used. If the vertical movement operation is performed using a cam, the timing of the vertical movement operation and the change of acceleration / deceleration can be easily changed.

In the element positioning section, the distance between two elements or the pitch can be changed, or
If a pitch changing mechanism is added to the vacuum suction pin, it is possible to freely change the pitch and the pitch between the elements in the element supply section (element cutting section) without being limited to the pitch between the elements in the element mounting section.

Further, in the embodiment of the present invention, the lack of the element is performed before the element is sucked by the vacuum suction pin. A lack or characteristic inspection mechanism may be provided to remove defective elements before performing the element lack processing.

[0071]

As described above, according to the present invention, suction heads are arranged at the circumferential ends of the indexing upper and lower tables in accordance with the number of indexing heads, and two suction heads can be sucked at the tip of the suction head. Even if elements are supplied in two rows in the element supply section and elements are randomly missing in an element hoop where the elements are provided, an element lacking process provided on the way to the element mount section is provided. The elements are always aligned to two or zero due to the operation of the part, and when two are aligned, they are mounted as they are via the element positioning part and the adhesive application part. By stopping the operation, it is possible to prevent the occurrence of an element lack defect of the mounted product, and it is possible to mount a predetermined number of elements at the same time at a high speed.

Further, since the indexing vertical movement is used for the front-back vertical movement, the reciprocating movement is not required, and there is an effect that a higher-speed element mounting operation can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a two-element mounting device according to an embodiment of the present invention.

FIG. 2 is a perspective view of an element hoop supplied by the element.

FIG. 3 is a perspective view of the element alone.

FIG. 4 is a perspective view of a lead frame of the element mount.

FIG. 5 is a sectional view of an essential part of the device cutting portion and the device mounting portion.

FIG. 6 is a cross-sectional view of a main part of the device absence processing unit.

FIG. 7 is a cross-sectional view of a main part of an adhesive application section of the element.

8 (a), (b), and (c) are schematic process diagrams of the device punching and cutting operation.

FIG. 9 is a sectional view for explaining the operation of the element lacking process.

FIG. 10 is a sectional view for explaining the operation of the element lacking process.

FIG. 11 is a sectional view for explaining the operation of the element lacking process.

FIG. 12 is an explanatory view of the configuration and operation of a slip ring of the vacuum suction.

FIG. 13 is a perspective view of a main part of a conventional element mounting device.

[Explanation of symbols]

 Reference Signs List 1 element hoop 1a feed hole 1b band 2 element 3 missing part 4 lead frame 4a, 4b element mount 4c central band 5 transfer hole 6 press roller 7, 32, 34, 38 drive motor 8 index handler 8a press spring 9 indexing Upper and lower tables 10, 13 Timing pulley 11 Take-up pulley 12 Timing belt 14 Cam shaft 15 Drive roller 16 Bracket 17 Frame 18 Suction head 19a, 19b, 19c, 19d Piping 20 Slip ring 21 Non-rotating 22, 22, Slide bearing 23a, 23b Element Detector 24, 24a Vacuum suction pin 25 Element cutting die 26 Element cutting punch 28 Lever 29 Groove cam 29a Cam groove 30, 40 Pin pulley 31 Holding roller 33 Element holder 34a Inside drive shaft 35 Child positioning part 36 Positioning claw 37 Adhesive tray 37a Squeegee 37b Convex part 39a, 39b Cylinder 40a Pin 41, 41b, 41c, 41d, 41e Groove 41a Connecting pipe 42 Piping hole 43 Bearing 44 Head spring 45 Hoop receiving 46 Pin 47 Lead frame Receiving 48 Guide pin 49, 49a Knuckle 50 Vacuum hole 51 Piping

Continuation of the front page (72) Inventor Hideji Yamashita 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. An indexing table in which an element supply section for continuously supplying elements at a constant pitch, and a suction head for suctioning two elements corresponding to the number of indexing are arranged at a circumferential end;
An element detector that detects the absence of the elements and outputs an output signal;
An element cutting section for processing into an element shape to be mounted, an element lack processing section for controlling the element lack controlled by an output signal of the element detector corresponding to the element lack state, and applying an adhesive to one surface of the element. A two-element mounting apparatus comprising: an adhesive application part to be mounted; and an element mounting part that simultaneously mounts two elements and stops the transfer of the mounted member when both elements are lacking in the suction head.