JPH1167878A - Replacement apparatus for dummy substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a replacement apparatus which can reduce the burden on an operator, without lowering the throughput of the apparatus, when the transfer pattern of a substrate is changed. SOLUTION: Before a wafer to be treated is transferred to a wafer transfer boat, a CPU 2A judges whether the mounting pattern of a side dummy wafer prescribed by a transfer pattern being set at present is different from the mounting pattern of a side dummy wafer, which is currently mounted on the wafer transfer boat. When it is different, the CPU 2A instructs a conveyance-control- data creation part 6A or the like to replace the side dummy wafer. When the conveyance-control-data creation part 6A or the like receives the instruction, it executes replacement of the side dummy wafer, which is placed on the wafer transfer boat, while it follows the mounting pattern of the side dummy wafer prescribed by the transfer pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a simulated substrate replacing apparatus for replacing a simulated substrate mounted on a substrate transfer boat with a change in a substrate transfer pattern on the substrate transfer boat.

[0002]

2. Description of the Related Art Generally, a semiconductor substrate (hereinafter, referred to as "wafer")
That. ) And vertical CVD (Chemical Vapor Depo) for performing diffusion processing and film formation processing.
In a site apparatus, pseudo wafers (hereinafter, referred to as “side dummy wafers”) are mounted on both upper and lower ends of a wafer transfer boat in order to stabilize the atmosphere in the processing chamber and stabilize the temperature (soaking length). To be placed.

The side dummy wafer is replaced in the same manner as a wafer to be processed such as a product wafer or a test wafer. This replacement includes a discharge for transferring the side dummy wafer from the wafer transfer board to the wafer storage cassette and a charge for transferring the side dummy wafer from the wafer storage cassette to the wafer transfer board.

[0006] The replacement process is usually performed not for each batch of diffusion processing but for every several batches of diffusion processing. This is a vertical diffusion device or vertical CVD
This is for improving the throughput of the apparatus.

In such an operation, the replacement of the side dummy wafers is usually performed not manually but manually (manual operation) (in the following description, the automatic operation is called processing, and the manual operation is performed. .)

[0006]

However, such a configuration has a problem that the operator's burden increases when the transfer pattern of the wafer to be processed is changed.

That is, even in one apparatus, the transfer pattern of the wafer to be processed may be different. For example,
Due to the diffusion process and the film formation process (process), the transfer pattern of the wafer to be processed is different between the case where the wafer to be processed is mounted in each slot of the wafer transfer boat and the case where the wafer is mounted every other slot. different.

When the transfer pattern of the wafer to be processed is different, the mounting pattern (the number of mounted wafers and the mounting position) of the side dummy wafer is also different. Therefore, when the transfer pattern has to be changed because the transfer pattern of the wafer to be processed is different, the replacement of the side dummy wafer must be performed at the same time.

However, this replacement is performed manually as described above. Therefore, when changing the transfer pattern of the wafer to be processed, the operator must also perform the operation of replacing the side dummy wafer in addition to the operation of changing the transfer pattern. Thus, in this case, the burden on the operator increases. In addition, the replacement operation of the side dummy wafer is always conscious of the mounting pattern of the side dummy wafer specified by the changed transfer pattern and the mounting pattern of the side dummy wafer currently mounted on the wafer transfer boat. The burden is very large.

FIG. 5 shows this state. FIG. 5 is a diagram showing a wafer transfer sequence. In the figure, 101
Indicates a wafer transfer boat, 102 indicates a wafer to be processed, and 103 indicates a side dummy wafer.

Further, T1 and T3 indicate periods during which the diffusion process and the film formation process are performed. In other words, it indicates a period during which the charge processing and the discharge processing of the processing target wafer 102 are automatically performed according to the transfer pattern parameter (process recipe). T2 indicates a period during which the operation of changing the transfer pattern and the operation of replacing the side dummy wafer 103 are performed. That is, it indicates a period during which the transfer pattern is changed and the side dummy wafers are replaced manually. Here, the periods T1, T2, T3 proceed in this order.

As shown in the figure, in a period T1, first, a charging process of the wafer to be processed 102 is performed. When the charging process is completed, a diffusion process and a film forming process (process) are performed. When the diffusion process and the film forming process are completed, a discharge process of the wafer to be processed 102 is performed.

In the next period T2, first, a discharge operation of the side dummy wafer 103 is performed by an operator. When the discharge operation is completed, the operator performs a transfer pattern changing operation. When this change operation is completed, a charge operation of the side dummy wafer 103 is performed by the operator. In the next period T3, processing similar to that in the period T1 is performed.

As shown in a period T2, the processing target wafer 1
When the transfer pattern of No. 02 is different, the operator must sequentially execute the operation of discharging the side dummy wafer 103, the operation of changing the transfer pattern, and the operation of charging the side dummy wafer 103. This increases the burden on the operator.

In order to solve this problem, an automatic device capable of automatically changing a transfer pattern may be used as a vertical diffusion device or the like. However, in the current automated equipment, the side dummy wafer 1
In order to perform the replacement of 03 automatically, this replacement process must be performed for each batch of diffusion process or the like, which causes a new problem that the throughput of the apparatus is reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an object to reduce the burden on an operator when changing a substrate transfer pattern without reducing the throughput of the apparatus. The purpose is to provide.

[0017]

In order to achieve the above object, a pseudo-substrate replacement apparatus according to the present invention provides a pseudo-substrate replacement apparatus for a substrate transfer boat when a transfer pattern of a substrate to be processed to the substrate transfer boat is changed. An apparatus for replacing a mounted pseudo substrate is provided with a determination unit and a replacement unit.

Here, before the substrate to be processed is transferred to the substrate transfer boat, the determining means determines whether the pattern of the pseudo substrate specified by the transfer pattern currently being set is currently loaded on the substrate transfer boat. It has a function of determining whether or not the placement pattern of the placed pseudo substrate is different. The replacement means has a function of replacing the pseudo substrate mounted on the substrate transfer board according to the arrangement of the pseudo substrate specified by the transfer pattern when the determination means determines that the placement pattern is different.

In the above configuration, before the substrate to be processed is transferred to the substrate transfer boat, the determination means sets the pseudo-substrate mounting pattern defined by the transfer pattern currently set to the substrate transfer boat. It is determined whether or not the mounting pattern is different from the mounting pattern of the currently mounted pseudo substrate. When it is determined that the placement patterns are different from each other by the determination process, the replacement unit executes the replacement process of the pseudo substrate according to the placement pattern of the pseudo substrate defined by the transfer pattern.

According to such a configuration, when the transfer pattern is changed, the pseudo substrate is automatically replaced instead of manually. Thereby, the burden on the operator when the transfer pattern is changed can be reduced. In addition, it is only necessary to execute the replacement process of the pseudo substrate only when the transfer pattern is changed, and it is not necessary to perform the replacement process for each batch of substrate processing. it can.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a block diagram showing a configuration of an embodiment of a pseudo substrate replacing apparatus according to the present invention. However,
FIG. 1 shows an overall configuration of a substrate processing apparatus provided with the pseudo substrate replacing apparatus. In the following description, for example,
The description will be made on the assumption that the substrate processing apparatus is a vertical diffusion processing apparatus that performs diffusion processing on a wafer, and the pseudo substrate replacement apparatus is a side dummy wafer replacement apparatus that replaces a side dummy wafer.

The illustrated vertical diffusion apparatus 200 has a cassette stage 201 on which a wafer storage cassette loaded from outside the apparatus and a wafer storage cassette unloaded outside the apparatus are mounted, and a cassette stage 201 mounted on the cassette stage 201. It has a cassette loader 202 for transferring the wafer storage cassette to a cassette shelf (not shown) and for transferring the wafer storage cassette stored in the cassette shelf to the cassette stage 201.

The illustrated vertical diffusion device 200 transfers wafers (processed wafers and side dummy wafers) stored in a wafer storage cassette in a cassette shelf to a wafer transfer boat (not shown), A wafer transfer machine 203 for transferring wafers mounted on a transfer boat to a wafer storage cassette; a wafer transfer boat 203 for loading a wafer transfer boat into a processing chamber (reaction chamber) (not shown); And a boat elevator 204 for carrying it out from the inside.

The illustrated vertical diffusion device 200 includes a solenoid 205 for opening and closing an open / close valve for shutting off a supply pipe, an exhaust pipe, and the like (not shown), and a pressure sensor for detecting the pressure inside the processing chamber. And a sensor 206.

The illustrated vertical diffusion apparatus 200 includes a transport system control unit 207 for controlling the transport system of the apparatus 200, an upper computer 208 for controlling the entire apparatus 200, and an operator for operating the apparatus 200. Main operation unit 209
And a main control unit 210 that controls the transport system control unit 207 based on the control of the host computer 208 and the operation of the main operation unit 209.

The transport system control unit 207 includes the main control unit 21
0, a data transmission / reception unit 1A for transmitting / receiving data, a central processing unit (hereinafter referred to as “CPU”) 2A for controlling each unit of the transport system control unit 207, and the CP.
A read-only memory (hereinafter referred to as "ROM") 3A for storing a U2A processing program and the like;
And a random access memory (hereinafter referred to as "RAM") 4A used as a 2A working memory.

The transfer system control unit 207 includes a parameter analysis unit 5A for analyzing various parameters such as transfer pattern parameters (process recipe), and transfer control data (transfer control) for controlling transfer of wafers. And an operation for controlling the operation of the cassette stage 201 and the like based on the transfer control data created by the transfer control data creation unit 6A to create wafers, thereby controlling wafer transfer. Control unit 7
A, and an I / O data input / output unit 8A that controls the operation of the solenoid 205 and the like according to instructions from the CPU 2A.

The operation of the above configuration will be described. First, the outline of the process of replacing the side dummy wafer will be described with reference to FIG.

FIG. 2 is a diagram showing a wafer transfer sequence in the present embodiment. In the figure, 30
1 indicates a wafer transfer boat, 302 indicates a wafer to be processed, and 303 indicates a side dummy wafer.

As shown in the figure, in the wafer transfer sequence, first, a charging process for the wafer 302 to be processed is executed (B1). This charging process is performed by transferring the wafer 302 to be processed stored in the wafer storage cassette in the cassette shelf to the wafer transfer boat 301 by the wafer transfer machine 203.

In this case, the operation of the wafer transfer machine 203 is controlled by the operation control section 7A. The operation control unit 7A controls the operation of the wafer transfer machine 203 based on the transfer control data created by the transfer control data creation unit 6A. The transfer control data creation unit 6A creates transfer control data based on the analysis result of the parameter analysis unit 5A. The parameter analysis unit 5A analyzes transfer pattern parameters and the like in accordance with instructions from the CPU 2A.

The transfer pattern parameters are stored in the main operation unit 20.
9 by the operator. The input transfer pattern parameters are supplied to the CPU 2A via the main control unit 210 and the data transmitting / receiving unit 1A. CPU2A
The transfer pattern parameters supplied to the
After that, if necessary, the parameter analysis unit 5A
Is analyzed by

When the charging process is completed, a diffusion process is performed (B2). This diffusion process is performed on the wafer 30
2, 303 is carried into the processing chamber, and the reaction gas and the like are supplied.

The loading of the wafers 302 and 303 into the processing chamber is performed by loading the wafer transfer boat 301 into the processing chamber by the boat elevator 304.
In this case, the operation of the boat elevator 204 is controlled by the operation control unit 7A. The operation control section 7A controls the operation of the boat elevator 204 based on the transport control data created by the transport control data creating section 6A. The transfer control data creation unit 6A creates transfer control data for controlling the operation of the boat elevator 204 according to an instruction from the CPU 2A.

The supply of the reaction gas and the like is performed by opening the on-off valve by the solenoid 205. Solenoid 2
The operation of 05 is controlled by the I / O data input / output unit 8A. The I / O data input / output unit 8A controls the operation of the solenoid 205 according to an instruction from the CPU 2A.

When the diffusion process is completed, a discharge process for the wafer 302 to be processed is executed (B3).
This discharge process is performed in the wafer transfer boat 301
The wafer 302 to be processed placed on the
In step 03, the wafer is transferred to the wafer storage cassette in the cassette shelf. Wafer transfer machine 3 in this case
Also in the operation of 03, similar to the charging operation, based on the transport control data created by the transport control data creating unit 6A,
It is controlled by the operation control unit 7A.

When the discharge process is completed, the mounting pattern of the side dummy wafer 303 defined by the transfer pattern currently set and the side dummy wafer 30 currently mounted on the wafer transfer boat 301
3 is determined to be different from the placement pattern (B)
5). If different, the replacement process of the side dummy wafer 303 is executed (B61, B62). On the other hand, if they are the same, the charging process of the processing target wafer 303 is executed (B7).

FIG. 2 shows a case where the placement pattern of the side dummy wafer 303 is different. That is, since the transfer pattern changing operation (B4) is performed, the mounting pattern of the side dummy wafer 303 and the wafer specified by the transfer pattern currently being set (the transfer pattern newly set by the changing operation). This shows a case where the placement pattern of the side dummy wafer 303 currently placed on the transfer boat 301 is different.

In this case, the replacement process of the side dummy wafer 303 is executed as described above (B61, B61).
62). In this replacement process, first, a discharge process of the side dummy wafer 303 is executed (B61). This discharge process is performed by the side dummy wafer 303 placed on the wafer transfer boat 301.
Is transferred to a wafer storage cassette in the cassette shelf by the wafer transfer machine 303.

In this case, the operation of the wafer transfer machine 203 is controlled by the operation control unit 7A based on the transfer control data created by the transfer control data creation unit 6A. The transfer control data creation unit 6A includes the parameter analysis unit 5
A, based on the analysis result of FIG.
Create transfer control data for discharging the.

When the discharging process is completed, a charging process for the side dummy wafer 303 is executed (B62). This charging process is performed by transferring the side dummy wafers 303 stored in the wafer storage cassette in the cassette shelf to the wafer transfer boat 301 by the wafer transfer machine 203.

In this case, the operation of the wafer transfer machine 203 is controlled by the operation control unit 7A based on the transfer control data created by the transfer control data creation unit 6A. The transfer control data creation unit 6A includes the parameter analysis unit 5
A, based on the analysis result of FIG.
To create transfer control data for charging.

When the charging process is completed, a charging process of the wafer 303 to be processed is executed (B7). When the charging process is completed, the wafers 302 and 303
Is performed (B8). After the completion of the diffusion process, a discharge process of the processing target wafer 302 is performed (B9). When the discharge process ends, the above-described determination process is executed.

Similarly, before the charge processing of the wafer 302 to be processed is performed, the mounting pattern of the side dummy wafer 303 defined by the transfer pattern currently being set and the wafer A process is performed to determine whether or not the placement pattern of the side dummy wafer 303 is different.

As a result of this determination, if the placement pattern is different, after the replacement process of the side dummy wafer 303 is performed, the charging process of the wafer 302 to be processed is performed. On the other hand, if they are the same, the charging process of the wafer to be processed 302 is performed without performing the replacement process of the side dummy wafer 303.

The transfer pattern changing operation described above is performed using the main operation unit 209. That is, the operator uses the main operation unit 209 to input a new transfer pattern parameter. The input transfer pattern parameters are supplied from the main control unit 210 to the CPU 2A via the data transmission / reception unit 1A. The transfer pattern parameters supplied to the CPU 2A are stored in the RAM 4A as new transfer pattern parameters.

The above is the outline of the process of replacing the side dummy wafer 303. Next, control of the CPU 2A in this process will be described with reference to FIG. FIG.
It is a flowchart which shows wafer transfer control by CPU2A.

In this transfer control, first, a process of receiving communication data sent from the host computer 208 is executed (step S11). When the receiving process is completed, a receiving process of the transfer control command sent from the host computer 208 is executed (step S1).
2). When the receiving process is completed, a transfer condition check process is executed (step S13). Thus, it is checked whether the charge processing of the wafer 302 to be processed or the discharge processing is to be performed.

When the charge process is to be executed, the side dummy wafer 30 placed on the wafer transfer boat 301 is sent to the parameter analysis unit 5A.
3 is executed (step S1).
4). Thus, the mounting pattern of the side dummy wafer 303 currently mounted on the wafer transfer boat 301 is analyzed. This analysis is performed based on the board map. Here, the board map refers to the wafers 302, 30 currently mounted on the wafer transfer board 301.
3 is a map showing a placement pattern of No. 3; Data indicating the board map is stored in the RAM 4A.

When this analysis processing is completed, processing for instructing the parameter analysis unit 5A to analyze the transfer pattern parameters is executed (step S15). Thereby, the processed wafer 3 defined by the transfer pattern
02 and the mounting pattern of the side dummy wafer 303 are analyzed.

When the analysis process is completed, a new boat map creation process is executed based on the analysis result of the transfer pattern parameters (step S16). Data indicating the created boat map is stored in the RAM 4A.

When the creation process is completed, a process for instructing the transfer control data creation unit 6A to create transfer parameters (transport control data) for charging the wafer 302 to be processed is executed (step S17). . As a result, the transfer parameters of the wafer 302 to be processed are created by the transfer control data creation unit 6A. This creation
This is performed based on the analysis result of the parameter analysis unit 5A.

In this preparation process, the mounting pattern of the side dummy wafer 303 specified by the transfer pattern is different from the mounting pattern of the side dummy wafer 303 currently mounted on the wafer transfer boat 301. A process is performed to determine whether or not this is the case.

If it is determined by this determination process that the placement pattern is different, in addition to the transfer parameters for charging the wafer 302 to be processed, the side dummy wafer 3
A transfer parameter (transport control data) for replacement of 03 is also created. On the other hand, if it is determined that the placement patterns are the same, only the transfer parameters for charging the processing target wafer 302 are generated. These parameters are stored in the RAM 4A as wafer arrangement parameters.

When the preparation process is completed, the wafer 30
2, 303 transfer processing is executed (step S1).
8). In this transfer processing, the wafer to be processed 302
If transfer parameters for replacement of the side dummy wafer 303 have been created in addition to the transfer parameters for the charge of the above, the replacement processing of the side dummy wafer 303 and the charge processing of the wafer 302 to be processed are executed. . On the other hand, when only the transfer parameters for charging the processing target wafer 302 have been created, only the charging processing of the processing target wafer 302 is performed. The above is the operation when the charge processing of the processing target wafer 302 is going to be performed.

On the other hand, when the discharge process of the wafer 302 to be processed is to be executed, a process of instructing the parameter analysis unit 5A to analyze the transfer pattern parameters is executed (step S19).

When this analysis processing is completed, the transfer control data creating section 6A creates transfer parameters (transfer control data) for discharging the wafer 302 to be processed based on the analysis result of the transfer pattern parameters. The instructing process is executed (step S20). As a result, the transfer control data creation unit 6A creates transfer parameters for discharging the processing target wafer 302.

When this forming process is completed, a discharging process of the wafer 302 to be processed is executed (step S18). The above is the operation when the discharge processing of the wafer to be processed 302 is going to be executed.

FIG. 4 shows the wafer 3 to be processed described with reference to FIG.
13 is a flowchart illustrating details of processing when a charge process is going to be performed.

In this process, first, a process of receiving a transfer command instructing charging of the wafer 302 to be processed is executed (step S31). This transfer command is sent from the host computer 208. This process corresponds to the process of step S12 in FIG.

When this process is completed, a process of checking whether or not the charging process of the wafer 302 to be processed can be executed is executed (step S32). This process
This corresponds to the process of step S13 in FIG. If it cannot be executed, it waits until it becomes executable.

If it can be executed, a process for analyzing the wafer arrangement parameters and the state of the wafer storage cassette in the cassette shelf is executed (step S3).
3). This processing corresponds to the processing of steps S14 and S15 in FIG. When the analysis process is completed, a process of creating a transfer image as boat map data is executed based on the analysis result (step S34). This processing corresponds to the processing in step S16 in FIG.

When the preparation process is completed, the mounting pattern of the side dummy wafer 303 currently set on the wafer transfer boat 301 and the mounting pattern of the side dummy wafer 303 specified by the transfer pattern parameter currently set. A process of determining whether or not the placement pattern is different is executed (step S35).

When it is determined that the placement patterns are different from each other, a process for creating transfer parameters for discharging the side dummy wafer 303 is executed (step S36). When this creation process is completed, a process for creating a transfer parameter for charging the side dummy wafer 303 is executed (step S37).

When the creation process is completed, a process of creating transfer parameters for charging the wafer to be processed (product or test wafer) 302 is executed (step S38). When the creation process ends, a transfer process is executed (step S39). That is, the replacement processing of the side dummy wafer 303 and the processing of the
2 is executed.

On the other hand, if it is determined in step S35 that the placement patterns are not different, the flow shifts to step S38 to create transfer parameters for the wafer 302 to be processed (step S38) and transfer processing (step S38). S39) are sequentially executed.

The processing in steps S35 to S38 described above corresponds to the processing in step S17 in FIG. Further, the processing in step S39 described above corresponds to the processing in step S18 in FIG.

According to the present embodiment described above, before the wafer 302 to be processed is transferred to the wafer transfer boat 301, the side dummy wafer 303 specified by the transfer pattern currently set is placed. It is determined whether or not the pattern is different from the mounting pattern of the side dummy wafer 303 currently mounted on the wafer transfer boat 301. If the pattern is different, the mounting pattern of the side dummy wafer 303 specified by the transfer pattern is determined. , The side dummy wafer 303 placed on the wafer transfer board 301 is automatically replaced. Therefore, when changing the transfer pattern, the operator only has to perform the operation of changing the transfer pattern. As a result, the burden on the operator when changing the transfer pattern can be reduced.

Further, only when the transfer pattern is changed, the replacement process of the side dummy wafer 303 may be performed, and it is not necessary to perform the replacement process for each batch diffusion process. A decrease in the throughput of 200 can also be prevented.

Further, by automating the replacement of the side dummy wafers 303, the replacement can be performed more reliably than when the replacement is performed manually. Thus, it is possible to eliminate the occurrence of an error when transferring the wafer 302 to be processed.

As described above, one embodiment of the present invention has been described in detail, but the present invention is not limited to the above-described embodiment.

For example, in the above embodiment, the case where the present invention is applied to the side dummy wafer replacement device of the vertical diffusion device has been described. However, the present invention can also be applied to a side dummy wafer replacement device of a wafer processing device other than the vertical diffusion device. Further, in the above embodiment, the case where the present invention is applied to a wafer, that is, a device for replacing a pseudo substrate made of a semiconductor substrate has been described. However, the present invention can also be applied to a device for replacing a pseudo substrate made of an insulating substrate such as a glass substrate. In addition, it goes without saying that the present invention can be variously modified and implemented without departing from the gist thereof.

[0074]

As described above in detail, according to the present invention, before a substrate is transferred to the substrate transfer boat, the placement pattern of the pseudo substrate defined by the transfer pattern currently set is changed. It is determined whether or not the pattern is different from the mounting pattern of the pseudo board currently mounted on the mounting boat, and if not, the board is mounted on the board transfer board according to the mounting pattern of the pseudo board specified by the transfer pattern. Since the replacement of the pseudo substrate is performed, the burden on the operator when changing the transfer pattern can be reduced, and a decrease in the throughput of the substrate processing apparatus can be prevented.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an embodiment of a pseudo substrate replacing apparatus according to the present invention.

FIG. 2 is a sequence diagram for explaining an operation of the pseudo substrate replacing apparatus according to one embodiment of the present invention.

FIG. 3 is a flowchart for explaining the operation of the embodiment of the pseudo substrate replacing apparatus according to the present invention.

FIG. 4 is a flowchart for explaining the operation of the pseudo substrate replacing apparatus according to one embodiment of the present invention.

FIG. 5 is a sequence diagram for explaining the operation of the conventional pseudo substrate replacing apparatus.

[Explanation of symbols]

200: vertical diffusion device, 201: cassette stage, 2
02: cassette loader, 203: wafer transfer machine, 20
4: boat elevator, 205: solenoid, 206:
Sensors, 207: transport system control unit, 208: host computer, 209: main operation unit, 210: main control unit.

Claims (1)

[Claims] 1. A pseudo-substrate replacement device that replaces a pseudo-substrate mounted on a substrate transfer boat when a transfer pattern of a substrate to be processed with respect to the substrate transfer boat is changed. Before transferring the substrate to be processed,
Determining means for determining whether the placement pattern of the pseudo substrate defined by the transfer pattern currently being set is different from the placement pattern of the pseudo substrate currently mounted on the substrate transfer boat; When the determination unit determines that the placement pattern is different, the dummy substrate mounted on the substrate transfer boat is replaced according to the placement pattern of the pseudo substrate defined by the transfer pattern. A pseudo substrate exchanging device, comprising: exchanging means.