CN110429045A - A kind of management method and system of wafer monitoring piece - Google Patents
A kind of management method and system of wafer monitoring piece Download PDFInfo
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- CN110429045A CN110429045A CN201910497663.1A CN201910497663A CN110429045A CN 110429045 A CN110429045 A CN 110429045A CN 201910497663 A CN201910497663 A CN 201910497663A CN 110429045 A CN110429045 A CN 110429045A
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- monitoring piece
- wafer monitoring
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- piece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
Abstract
The present invention relates to monitoring piece administrative skill field, in particular to a kind of the management method and system of wafer monitoring piece.A kind of management method of the wafer monitoring piece, comprising steps of it is whether qualified according to preset rules detection wafer monitoring piece, if the wafer monitoring piece is qualified, the wafer monitoring piece is carried out carving code and is stored to qualified piece storage warehouse；If the wafer monitoring piece is unqualified, stored to scrapping piece storage warehouse.The problems such as whole process is the program circuit of an automation, is not necessarily to any artificial participation in the process, not only efficiency is greatly improved, and avoids human error that may be present during artificial detection.
Description
Technical field
The present invention relates to monitoring piece administrative skill field, in particular to a kind of the management method and system of wafer monitoring piece.
Background technique
Wafer monitoring piece is a kind of method for realizing that some process data is measured and monitored instead of product.In the prior art,
The existing management means of monitoring piece is mostly manual operation, naked eyes identification, artificial statistics and control, this way to manage not only efficiency
The risks such as omission of making an inventory that is low and be easy to causeing monitoring piece, monitoring misalignment, wafer contamination, wafer loss.
Summary of the invention
For this reason, it may be necessary to a kind of management method of wafer monitoring piece be provided, to solve labor management wafer in the prior art
The problems such as monitoring piece inefficiency and improper easy mistake management.Specific technical solution is as follows:
A kind of management method of wafer monitoring piece, comprising steps of it is whether qualified according to preset rules detection wafer monitoring piece,
If the wafer monitoring piece is qualified, the wafer monitoring piece is carried out carving code and is stored to qualified piece storage warehouse；If described
Wafer monitoring piece is unqualified, is stored to scrapping piece storage warehouse.
Further, described " whether qualified detecting wafer monitoring piece according to preset rules ", further comprises the steps of: and supervises to wafer
Control wafer is surface-treated；Granularity, edge unfilled corner and flatness detection are carried out to the wafer monitoring piece after surface treatment；According to
The fair receipts rule preset, which permit to wafer monitoring piece, receives grade classification.
Further, it further comprises the steps of: record wafer monitoring piece and the event on wafer monitoring piece occurs from after carving code, and
The related data of upload event is to data processing centre；The related data of the event includes: wafer monitoring piece essential information and
The wafer monitoring piece record of production.
Further, further comprise the steps of: by identification wafer monitoring piece on quarter code to wafer monitoring piece carry out using, and
Relevant information is uploaded to data processing centre；Data processing centre obtains different upload data, carries out to the upload data
Analysis processing, generates inventory data, and the inventory data includes: line stock amount and in Kuku storage.
Further, it further comprises the steps of: and recycling detection is carried out to the wafer monitoring piece of recycling, judge the wafer prison
Whether control wafer meets the standard of recycling, if the wafer monitoring piece meets the standard of recycling, supervises to the wafer
Control wafer continues to use, and uploads corresponding data to data processing centre；If the wafer monitoring piece does not meet the mark of recycling
Standard then scrap processing to the wafer monitoring piece, and uploads and scrap the related data of processing to data processing centre.
In order to solve the above technical problems, additionally providing a kind of management system of wafer monitoring piece, specific technical solution is as follows:
A kind of management system of wafer monitoring piece, comprising: transmission track, detection module, carves code module, closes transmission arm
Lattice piece storage warehouse and scrap piece storage warehouse；The transmission arm is set on transmission track, and the transmission arm is used for: transmission is brilliant
Justify monitoring piece to different zones position；Whether the detection module: it is qualified to detect wafer monitoring piece according to preset rules if being used for；Institute
It states quarter code module to be used for: if the wafer monitoring piece is qualified, quarter code being carried out to the wafer monitoring piece；The qualification piece storage warehouse
For: store qualified wafer monitoring piece；The piece storage warehouse of scrapping is used for: storing underproof wafer monitoring piece.
Further, the detection module includes: surface treatment mould group, granule detecting mould group, flatness detection mould group
With fair receipts rule module；Each mould group is provided with wafer monitoring piece in-out end；The surface treatment mould group is used for: being monitored to wafer
Piece is surface-treated；The granule detecting mould group is used for: carrying out granularity and side to the wafer monitoring piece after surface treatment
The detection of edge unfilled corner；The flatness detection mould group is used for: being carried out to the wafer monitoring piece that granularity and edge unfilled corner detect smooth
Degree detection；The fair receipts rule module is used for: permit to wafer monitoring piece according to the fair receipts rule preset and is received grade classification.
Further, further includes: record of production mould group and data processing centre；The record of production mould group is used for: record
Event on wafer monitoring piece occurs from after carving code for wafer monitoring piece, and uploads the related data of event to Data processing
The heart；The related data of the event includes: wafer monitoring piece essential information and the wafer monitoring piece record of production.
Further, further includes: control wafer code identifies mould group and data processing centre；The control wafer code identification mould group is used
In: wafer monitoring piece is carried out using and uploading relevant information to Data processing by the quarter code on identification wafer monitoring piece
The heart；The data processing centre is used for: obtaining different upload data, is analyzed and processed to the upload data, generates library
Data on stock, the inventory data include: line stock amount and in Kuku storage.
Further, further includes: recycling detection mould group；The recycling detection mould group is used for: being supervised to the wafer of recycling
Control wafer carries out recycling detection, judges whether the wafer monitoring piece meets the standard of recycling, if the wafer monitoring piece accords with
The standard being recycled is closed, then the wafer monitoring piece is continued to use, and upload corresponding data to data processing centre；If institute
The standard that wafer monitoring piece does not meet recycling is stated, then the wafer monitoring piece is carried out scrapping processing, and upload and scrap place
The related data of reason is to data processing centre.
The beneficial effects of the present invention are: detecting wafer monitoring piece automatically according to preset rules is by setting preset rules
No qualification carries out the wafer monitoring piece to carve code and stored to qualified piece storing up automatically if the wafer monitoring piece is qualified
Storage；If the wafer monitoring piece is unqualified, stored to scrapping piece storage warehouse.Whole process is the program of an automation
Process is not necessarily to any artificial participation in the process, not only efficiency is greatly improved, and avoids and may deposit during artificial detection
Human error the problems such as.
Further, after wafer monitoring piece qualification and by quarter code, hereafter the thing on the wafer monitoring piece occurs for record
Part, and the related data of event is uploaded to data processing centre, allow user to pass through the event to data processing centre
Related data access and then obtain the service conditions etc. of different wafer monitoring pieces.
Further, use of the code realization that can be engraved on wafer monitoring piece by identification to wafer monitoring piece, and on
Relevant use information is passed to data processing centre, data processing centre obtains different upload data, uploads data to these
It is analyzed and processed, produces inventory data, user can may know that wafer monitors by accessing to inventory data
The service condition of piece, convenient for wafer monitoring piece is managed and is distributed.
Further, recycling detection can be carried out automatically to the wafer monitoring piece of recycling, so that standard compliant wafer
Monitoring piece continues to use, and non-compliant wafer monitoring piece carries out scrapping processing, maximumlly uses the longevity of wafer monitoring piece
Life.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the management method of wafer monitoring piece described in specific embodiment；
Fig. 2 is a kind of structural schematic diagram of the management system of wafer monitoring piece described in specific embodiment；
Fig. 3 is the flow chart for detecting wafer monitoring piece described in specific embodiment according to preset rules；
Fig. 4 is that the detection table of pan feeding described in specific embodiment and recycling detection indicate intention；
Fig. 5 is barcode scanning operation process chart described in specific embodiment；
Fig. 6 is wafer monitoring piece essential information and wafer monitoring piece record of production schematic diagram described in specific embodiment；
Fig. 7 is inventory data schematic diagram described in specific embodiment；
Fig. 8 is to scrap information bank schematic diagram described in specific embodiment；
Fig. 9 is the module diagram one of wafer monitoring piece management system described in specific embodiment；
Figure 10 is the module diagram two of wafer monitoring piece management system described in specific embodiment.
Description of symbols:
1, transmission track,
2, arm is transmitted,
3, board entering bit end,
4, board slice-feeding end,
5, it is surface-treated mould group,
6, granule detecting mould group,
7, flatness detection mould group,
8, radium-shine quarter code mould group,
9, qualified piece storage warehouse,
10, piece storage warehouse is scrapped,
900, the management system of wafer monitoring piece,
901, transmission track,
902, arm is transmitted,
903, detection module,
904, code module is carved,
905, qualified piece storage warehouse,
906, piece storage warehouse is scrapped,
9031, it is surface-treated mould group,
9032, granule detecting mould group,
9033, flatness detection mould group,
9034, permit and receive rule module.
Specific embodiment
Technology contents, construction feature, the objects and the effects for detailed description technical solution, below in conjunction with specific reality
It applies example and attached drawing is cooperated to be explained in detail.
Fig. 1 to Fig. 8 is please referred to, in the present embodiment, a kind of management method of wafer monitoring piece can be applicable to a kind of crystalline substance
In the management system of circle monitoring piece, as shown in Fig. 2, a kind of management system of wafer monitoring piece includes: transmission track 1, passes
Send arm 2, board entering bit end 3, board slice-feeding end 4, surface treatment mould group 5, granule detecting mould group 6, flatness detection mould group
7, radium-shine quarter code mould group 8, qualified piece storage warehouse 9 and piece storage warehouse 10 is scrapped, wherein transmission track 1 and transmission arm 2 have been used for
At transmission of the wafer monitoring piece between board, whole flow process automation participates in and monitoring without artificial.
A kind of embodiment expansion of the management method of wafer monitoring piece is illustrated below:
Step S101: it is whether qualified that wafer monitoring piece is detected according to preset rules.
If the wafer monitoring piece is qualified, S102 is thened follow the steps: the wafer monitoring piece is carried out carving code and be deposited
It puts to qualified piece storage warehouse.
If the wafer monitoring piece is unqualified, S103 is thened follow the steps: being stored to scrapping piece storage warehouse.
Referring to Fig. 3, above-mentioned steps S101 is further comprised the steps of:
Step S301: wafer monitoring piece is surface-treated.
Step S302: granularity, edge unfilled corner and flatness detection are carried out to the wafer monitoring piece after surface treatment.
Step S303: wafer monitoring piece permit according to the fair receipts rule preset and receives grade classification.
In the present embodiment, the devices such as cleaning, etching are built-in in surface treatment mould group, convenient for wafer monitoring piece
Surface is handled.Wafer monitoring piece after surface treatment is transferred into granule detecting mould group and carries out granularity and side
Edge unfilled corner detection, it should be noted that in the present embodiment, referring to Fig. 4, the data detected will be transferred to pan feeding inspection
It surveys in table/recycling detection table, granularity and edge unfilled corner detect wafer monitoring piece up to standard and continue to be sent to flatness detection mould
Group detection flatness, equally, the data detected will be transferred in pan feeding detection table/recycling detection table, in the above process, be appointed
Wafer monitoring piece not up to standard of anticipating, which can be sent to, to be scrapped in piece storage warehouse.Pass through granularity, edge unfilled corner to wafer monitoring piece
After flatness detection, wafer monitoring piece permit according to the fair receipts rule preset and receives grade classification.In this embodiment, permit
The gear of A/B/C/D tetra- can be divided by receiving grade, and so that different production areas uses, wherein D grades are unqualified shelves.
By the way that preset rules are arranged, whether qualified wafer monitoring piece is detected automatically according to preset rules, if the wafer is supervised
Control wafer is qualified, carries out carving code automatically to the wafer monitoring piece and be stored to qualified piece storage warehouse；If the wafer monitoring
Piece is unqualified, is stored to scrapping piece storage warehouse.Whole process is the program circuit of an automation, in the process without any
It is artificial to participate in, the problems such as not only efficiency being greatly improved, and avoids human error that may be present during artificial detection.
Further, after wafer monitoring piece is qualified and is carried out quarter code, record wafer monitoring piece is further comprised the steps of: from quarter
Event on wafer monitoring piece occurs after code, and uploads the related data of event to data processing centre；The phase of the event
Closing data includes: wafer monitoring piece essential information and the wafer monitoring piece record of production.It specifically can be as follows: in the present embodiment,
Quarter code is carried out to qualified wafer monitoring piece by radium-shine quarter code mould group, which is engraved in the dead space of the wafer monitoring piece back side, can
For two dimensional code, three-dimension code or other bar codes etc., any one of program is done after entering producing line all will carry out barcode scanning work to its back side
The data of the wafer monitoring piece event of acquisition are uploaded to data processing centre by industry (wherein barcode scanning work flow sees Fig. 5),
Wherein wafer monitoring piece essential information and the wafer monitoring piece record of production see Fig. 6.User can be by Data processing
The related data of the event of the heart accesses and then obtains the service condition etc. of different wafer monitoring pieces.
Therefore it is further, wafer monitoring piece can be carried out using and uploading phase by the quarter code on identification wafer monitoring piece
Information is closed to data processing centre；Data processing centre obtains different upload data, carries out at analysis to the upload data
Reason generates inventory data, and the inventory data includes: line stock amount and Kuku storage (please referring to Fig. 7), wherein
Line inventory is control wafer quantity in stock in the production line, is deposited in Kuku as the control wafer quantity in stock in warehouse.User can by pair
Inventory data accesses, inquire wafer monitoring piece quantity, in line position, using data such as durations, that is, may know that wafer
The service condition of monitoring piece can also set inventory's alarm in short supply etc. convenient for wafer monitoring piece is managed and is distributed.
Further, in the present embodiment, it further comprises the steps of: and recycling inspection is carried out to the wafer monitoring piece of recycling
It surveys, judges whether the wafer monitoring piece meets the standard of recycling, if the wafer monitoring piece meets the mark of recycling
Standard then continues to use the wafer monitoring piece, and uploads corresponding data to data processing centre and (detect in table in recycling
View cycle-index)；If the wafer monitoring piece does not meet the standard of recycling, the wafer monitoring piece is reported
Useless processing, and upload and scrap related data to the data processing centre of processing and (wherein scrap information bank and see Fig. 8).
Further, in the present embodiment, above-mentioned all related datas can be uploaded to data processing centre, data
Processing center can carry out integration processing to these data, and formation one can be inquired, be can be traced, statistics available and analyzable access collects
At terminal.By the Access Integration terminal, the data of any needs can be obtained, it is further convenient for being carried out to wafer monitoring piece
Deeply management.
Referring to Fig. 9, in the present embodiment, a kind of specific embodiment of the management system 900 of wafer monitoring piece is such as
Under:
A kind of management system 900 of wafer monitoring piece, comprising: transmission track 901, transmission arm 902, detection module 903,
It carves code module 904, qualified piece storage warehouse 905 and scraps piece storage warehouse 906；The transmission arm 902 is set to transmission track 901
On, the transmission arm 902 is used for: transmission wafer monitoring piece to different zones position；The detection module 903 is used for: according to
Whether preset rules detect wafer monitoring piece qualified；The quarter code module 904 is used for: if the wafer monitoring piece is qualified, to institute
It states wafer monitoring piece and carries out quarter code；The qualification piece storage warehouse 905 is used for: storing qualified wafer monitoring piece；It is described to scrap piece
Storage warehouse 906 is used for: storing underproof wafer monitoring piece.
By the way that preset rules are arranged, wafer monitoring piece is sent to the position of different zones, detection module by transmission arm 902
Whether 903 is qualified for detecting wafer monitoring piece automatically according to preset rules, carves code module 904 and is used for: if the wafer monitors
Piece is qualified, carries out carving code automatically to the wafer monitoring piece and be stored to qualified piece storage warehouse 905；If the wafer monitoring
Piece is unqualified, is stored to scrapping piece storage warehouse 906.Whole system automation, is not necessarily to any artificial participation, not only in the process
So that efficiency greatly improves, and the problems such as avoid human error that may be present during artificial detection.
Referring to Fig. 10, further, the detection module 903 includes: surface treatment mould group 9031, granule detecting mould
Group 9032, flatness detection mould group 9033 and fair receipts rule module 9034；Each mould group is provided with wafer monitoring piece in-out end；Institute
It states surface treatment mould group 9031 to be used for: wafer monitoring piece is surface-treated；The granule detecting mould group 9032 is used for: right
Wafer monitoring piece after surface treatment carries out granularity and the detection of edge unfilled corner；The flatness detection mould group 9033 is used for: right
Granularity and the wafer monitoring piece of edge unfilled corner detection carry out flatness detection；The fair receipts rule module 9034 is used for: according to
The fair receipts rule preset, which permit to wafer monitoring piece, receives grade classification.
In the present embodiment, the devices such as cleaning, etching are built-in in surface treatment mould group 9031, convenient for monitoring to wafer
The surface of piece is handled.Wafer monitoring piece after surface treatment is transferred into the progress of granule detecting mould group 9032
Granularity and the detection of edge unfilled corner, it should be noted that in the present embodiment, referring to Fig. 4, the data detected will be transmitted
To pan feeding detection table/recycling detection table, granularity and edge unfilled corner detect wafer monitoring piece up to standard continue to be sent to it is smooth
Degree detection mould group 9033 detects flatness, and equally, the data detected will be transferred in pan feeding detection table/recycling detection table,
In the above process, wafer monitoring piece arbitrarily not up to standard, which can be sent to, to be scrapped in piece storage warehouse 906.Pass through to wafer monitoring piece
After granularity, edge unfilled corner and flatness detection, wafer monitoring piece permit according to the fair receipts rule preset and receives grade stroke
Point.In this embodiment, permit receipts grade that can be divided into the gear of A/B/C/D tetra-, so that different production areas uses, wherein D grades are not conform to
Lattice shelves.
Further, further includes: record of production mould group and data processing centre；The record of production mould group is used for: record
Event on wafer monitoring piece occurs from after carving code for wafer monitoring piece, and uploads the related data of event to Data processing
The heart；The related data of the event includes: wafer monitoring piece essential information and the wafer monitoring piece record of production.It specifically can be as follows:
In the present embodiment, quarter code is carried out to qualified wafer monitoring piece by radium-shine quarter code mould group, which is engraved in wafer monitoring piece
It can be two dimensional code, three-dimension code or other bar codes etc., any one of program is done after entering producing line all will be to it in the dead space of the back side
The back side carries out barcode scanning operation (wherein barcode scanning work flow sees Fig. 5), and the data of the wafer monitoring piece event of acquisition are uploaded
To data processing centre, wherein wafer monitoring piece essential information and the wafer monitoring piece record of production see Fig. 6.User can lead to
Cross the service condition etc. that different wafer monitoring pieces are accessed and then obtained to the related data of the event of data processing centre.
Further, further includes: control wafer code identifies mould group and data processing centre；The control wafer code identification mould group is used
In: wafer monitoring piece is carried out using and uploading relevant information to Data processing by the quarter code on identification wafer monitoring piece
The heart；The data processing centre is used for: obtaining different upload data, is analyzed and processed to the upload data, generates library
Data on stock, the inventory data include: line stock amount and Kuku storage (please referring to Fig. 7), and wherein line stock is
Control wafer quantity in stock in the production line is deposited in Kuku as the control wafer quantity in stock in warehouse.User can be by quantity in stock number
According to accessing, inquire the quantity of wafer monitoring piece, in line position, using data such as durations, that is, may know that wafer monitoring piece
Service condition can also set inventory's alarm in short supply etc. convenient for wafer monitoring piece is managed and is distributed.
Further, further includes: recycling detection mould group；The recycling detection mould group is used for: being supervised to the wafer of recycling
Control wafer carries out recycling detection, judges whether the wafer monitoring piece meets the standard of recycling, if the wafer monitoring piece accords with
The standard being recycled is closed, then the wafer monitoring piece is continued to use, and uploads corresponding data to data processing centre and (is returning
Cycle-index can be viewed by receiving in detection table)；If the wafer monitoring piece does not meet the standard of recycling, to the crystalline substance
Circle monitoring piece scrap processing, and upload scraps the related data of processing (wherein scrapping information bank can to data processing centre
Refering to Fig. 8).
Further, in the present embodiment, above-mentioned all related datas can be uploaded to data processing centre, data
Processing center can carry out integration processing to these data, and formation one can be inquired, be can be traced, statistics available and analyzable access collects
At terminal.By the Access Integration terminal, the data of any needs can be obtained, it is further convenient for being carried out to wafer monitoring piece
Deeply management.
It should be noted that being not intended to limit although the various embodiments described above have been described herein
Scope of patent protection of the invention.Therefore, it based on innovative idea of the invention, change that embodiment described herein is carried out and is repaired
Change, or using equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it directly or indirectly will be with
Upper technical solution is used in other related technical areas, is included within scope of patent protection of the invention.
Claims (10)
1. a kind of management method of wafer monitoring piece, which is characterized in that comprising steps of
It is whether qualified according to preset rules detection wafer monitoring piece, if the wafer monitoring piece is qualified, to the wafer monitoring piece
It carries out carving code and be stored to qualified piece storage warehouse；If the wafer monitoring piece is unqualified, stored to scrap piece storage
Storehouse.
2. a kind of management method of wafer monitoring piece according to claim 1, which is characterized in that
Described " whether qualified detecting wafer monitoring piece according to preset rules ", further comprises the steps of:
Wafer monitoring piece is surface-treated；
Granularity, edge unfilled corner and flatness detection are carried out to the wafer monitoring piece after surface treatment；
Wafer monitoring piece permit according to the fair receipts rule preset and receives grade classification.
3. a kind of management method of wafer monitoring piece according to claim 1, which is characterized in that further comprise the steps of:
Wafer monitoring piece event on wafer monitoring piece of generation from after carving code is recorded, and uploads the related data of event to data
Processing center；
The related data of the event includes: wafer monitoring piece essential information and the wafer monitoring piece record of production.
4. a kind of management method of wafer monitoring piece according to claim 1, which is characterized in that further comprise the steps of:
Wafer monitoring piece is carried out using and uploading relevant information to Data processing by the quarter code on identification wafer monitoring piece
The heart；
Data processing centre obtains different upload data, is analyzed and processed to the upload data, generates inventory data,
The inventory data includes: line stock amount and in Kuku storage.
5. a kind of management method of wafer monitoring piece according to claim 1, which is characterized in that further comprise the steps of:
Recycling detection is carried out to the wafer monitoring piece of recycling, judges whether the wafer monitoring piece meets the mark of recycling
Standard continues to use the wafer monitoring piece, and upload corresponding number if the wafer monitoring piece meets the standard of recycling
According to data processing centre；
If the wafer monitoring piece does not meet the standard of recycling, scrap processing to the wafer monitoring piece, and on
It passes and scraps the related data of processing to data processing centre.
6. a kind of management system of wafer monitoring piece characterized by comprising transmission track, transmission arm, detection module, quarter
Code module, qualified piece storage warehouse and scrap piece storage warehouse；
The transmission arm is set on transmission track, and the transmission arm is used for: transmission wafer monitoring piece to different zones position
It sets；
Whether the detection module: it is qualified to detect wafer monitoring piece according to preset rules if being used for；
The quarter code module is used for: if the wafer monitoring piece is qualified, carrying out quarter code to the wafer monitoring piece；
The qualification piece storage warehouse is used for: storing qualified wafer monitoring piece；
The piece storage warehouse of scrapping is used for: storing underproof wafer monitoring piece.
7. a kind of management system of wafer monitoring piece according to claim 6, which is characterized in that
The detection module includes: surface treatment mould group, granule detecting mould group, flatness detection mould group and permits the regular mould of receipts
Block；
Each mould group is provided with wafer monitoring piece in-out end；
The surface treatment mould group is used for: being surface-treated to wafer monitoring piece.
The granule detecting mould group is used for: carrying out granularity to the wafer monitoring piece after surface treatment and edge unfilled corner detects；
The flatness detection mould group is used for: the wafer monitoring piece detected to granularity and edge unfilled corner carries out flatness detection；
The fair receipts rule module is used for: permit to wafer monitoring piece according to the fair receipts rule preset and is received grade classification.
8. a kind of management system of wafer monitoring piece according to claim 6, which is characterized in that further include: the record of production
Mould group and data processing centre；
The record of production mould group is used for: the record wafer monitoring piece event of generation on wafer monitoring piece from after carving code, and on
The related data of biography event is to data processing centre；The related data of the event includes: wafer monitoring piece essential information and crystalline substance
The circle monitoring piece record of production.
9. a kind of management system of wafer monitoring piece according to claim 6, which is characterized in that further include: control wafer code
Identify mould group and data processing centre；
Control wafer code identification mould group is used for: by identification wafer monitoring piece quarter code to wafer monitoring piece carry out using,
And relevant information is uploaded to data processing centre；
The data processing centre is used for: obtaining different upload data, is analyzed and processed to the upload data, generates library
Data on stock, the inventory data include: line stock amount and in Kuku storage.
10. a kind of management system of wafer monitoring piece according to claim 6, which is characterized in that further include: recycling detection
Mould group；
The recycling detection mould group is used for: being carried out recycling detection to the wafer monitoring piece of recycling, is judged the wafer monitoring
Whether piece meets the standard of recycling, if the wafer monitoring piece meets the standard of recycling, monitors to the wafer
Piece continues to use, and uploads corresponding data to data processing centre；If the wafer monitoring piece does not meet the standard of recycling,
Then scrap processing to the wafer monitoring piece, and uploads and scrap the related data of processing to data processing centre.
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| CN201910497663.1A CN110429045B (en) | 2019-06-10 | 2019-06-10 | Management method and system for wafer monitoring wafer |
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| CN201910497663.1A CN110429045B (en) | 2019-06-10 | 2019-06-10 | Management method and system for wafer monitoring wafer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114464547A (en) * | 2021-12-29 | 2022-05-10 | 上海赛美特软件科技有限公司 | Wafer inspection method, device, equipment and storage medium |
| US11442440B1 (en) | 2021-03-24 | 2022-09-13 | Changxin Memory Technologies, Inc. | Method and apparatus of handling control wafer, method of testing by using control wafer |
| WO2022198954A1 (en) * | 2021-03-24 | 2022-09-29 | 长鑫存储技术有限公司 | Control wafer control method and apparatus, control wafer test method, medium, and device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321486A (en) * | 1997-05-21 | 1998-12-04 | Nec Kyushu Ltd | Defective wafer control device |
| JPH1167878A (en) * | 1997-08-14 | 1999-03-09 | Kokusai Electric Co Ltd | Replacement apparatus for dummy substrate |
| US5940300A (en) * | 1996-12-12 | 1999-08-17 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for analyzing a fabrication line |
| CN1378235A (en) * | 2001-03-30 | 2002-11-06 | 华邦电子股份有限公司 | Cleaning method for reclaimed chip |
| TW594843B (en) * | 2003-07-30 | 2004-06-21 | Powerchip Semiconductor Corp | Management system of monitor wafers |
| CN1534529A (en) * | 2003-03-31 | 2004-10-06 | ̨������·����ɷ�����˾ | Stock management method of control sheet |
| CN101556898A (en) * | 2008-04-10 | 2009-10-14 | 中芯国际集成电路制造(上海)有限公司 | Detection method of separation blade recovery in chip manufacturing process |
| CN101894763A (en) * | 2009-05-19 | 2010-11-24 | 中芯国际集成电路制造(上海)有限公司 | Chip assembling method |
-
2019
- 2019-06-10 CN CN201910497663.1A patent/CN110429045B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940300A (en) * | 1996-12-12 | 1999-08-17 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for analyzing a fabrication line |
| JPH10321486A (en) * | 1997-05-21 | 1998-12-04 | Nec Kyushu Ltd | Defective wafer control device |
| JPH1167878A (en) * | 1997-08-14 | 1999-03-09 | Kokusai Electric Co Ltd | Replacement apparatus for dummy substrate |
| CN1378235A (en) * | 2001-03-30 | 2002-11-06 | 华邦电子股份有限公司 | Cleaning method for reclaimed chip |
| CN1534529A (en) * | 2003-03-31 | 2004-10-06 | ̨������·����ɷ�����˾ | Stock management method of control sheet |
| TW594843B (en) * | 2003-07-30 | 2004-06-21 | Powerchip Semiconductor Corp | Management system of monitor wafers |
| CN101556898A (en) * | 2008-04-10 | 2009-10-14 | 中芯国际集成电路制造(上海)有限公司 | Detection method of separation blade recovery in chip manufacturing process |
| CN101894763A (en) * | 2009-05-19 | 2010-11-24 | 中芯国际集成电路制造(上海)有限公司 | Chip assembling method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11442440B1 (en) | 2021-03-24 | 2022-09-13 | Changxin Memory Technologies, Inc. | Method and apparatus of handling control wafer, method of testing by using control wafer |
| WO2022198954A1 (en) * | 2021-03-24 | 2022-09-29 | 长鑫存储技术有限公司 | Control wafer control method and apparatus, control wafer test method, medium, and device |
| CN114464547A (en) * | 2021-12-29 | 2022-05-10 | 上海赛美特软件科技有限公司 | Wafer inspection method, device, equipment and storage medium |
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