JPH1167869A - Operation method of vacuum treatment device and vacuum treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve operation rate of a device by continuing operation even when a treatment chamber can not be used because of troubles, etc., not by using inoperative process treatment device by turning an operation information signal as before but by using another operative process treatment. SOLUTION: Process devices 2-1, 2-2, 2-3, 2-4 are provided with operation signal generation means 19-1, 19-2, 19-3, 19-4 which generate each operation information signal showing operativity or inoperativity of process treatment devices 2-1, 2-2, 2-3, 2-4, respectively. Operation information signal stored in an operation information signal storing means 17 is turned as before and a device control means 15 which controls continuation of the operation not by using an inoperative process treatment device but by using another operative process treatment device is provided. In operation of a device, when a process treatment during operation can not be used because of troubles, etc., operation of a device is discontinued for some time and an operator is directed to judge the presence or absence of operation to enable operation to be continued.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises two or more processing apparatuses for performing a processing operation and a transfer processing apparatus for transferring a wafer, and performs wafer processing using at least two or more processing apparatuses. The present invention relates to an operation method of a vacuum processing apparatus and a vacuum processing apparatus.

[0002]

2. Description of the Related Art A conventional apparatus is disclosed in, for example,
In a system in which a processing chamber is connected to a transfer chamber as in JP-A-33532, when sample processing is performed in a normal operation state, different wafers are simultaneously executed in different processing chambers, or two wafers are sequentially processed. The present invention relates to an apparatus capable of performing processing via the above-described processing chamber and transport thereof.

Another conventional apparatus is disclosed in Japanese Patent Application Laid-Open No. Hei 3-2747.
When performing maintenance work in a processing chamber included in one path in an operation in which two paths of process processing are performed simultaneously as in Japanese Patent Publication No. 46, the processing chambers in other paths are transiently
The present invention relates to an operation method of an apparatus shared for two-path process processing.

[0004]

In the prior art, when performing two or more process treatments, a wafer is transferred to two or more processing chambers through a transfer path in a vacuum atmosphere, and each of the processing chambers has By performing the unique processing of the processing chamber, the apparatus configuration, transfer method, and maintenance work for performing a plurality of process processing in a vacuum without exposing to the atmospheric state are performed in parallel with the normal wafer processing. Was something.

By the way, in the former prior art, during operation in which two or more processing chambers are used as processing paths, when one of the processing chambers becomes unusable due to a failure or the like, a normal processing chamber is removed. Operation and recovery measures to continue processing using were not considered.

Further, even when there is a processing room that needs to be repaired at the start of operation, no method or procedure for operating the apparatus using only a normal processing room has been considered.

Further, the operation is temporarily stopped during operation using two or more processing chambers as processing paths, and an interrupt using a processing chamber not used as a processing path for the operation before the interruption is used as a processing path. No consideration has been given to a method or procedure for operating such that the processing is executed with priority and the interrupted processing is continued after the interruption processing is completed.

In addition, there has been no consideration on a method of instructing a device in a processing room that is not used in a processing route of the operation during operation using two or more processing rooms as a processing route. Also, no consideration has been given to ensuring operational safety when an operation instruction for a device in a processing room not used in the processing path of the operation is performed by an operation unit at a distance from an operation unit normally operated. .

In the latter prior art, as in the maintenance work for replacing the target, the worker stands on the side of the apparatus in which the apparatus is operating, and performs the maintenance work on the apparatus and the apparatus and the normal wafer processing in parallel. In the case of operation with no operation, for example, measures or methods for ensuring safety such as flowing a processing gas due to "erroneous operation" or turning on a discharge power supply to cause electric shock have not been considered.

As described above, the prior art considers the operation of the processing chamber after the processing chamber is in a normal state and excluding only the processing chamber which is to be repaired before starting the operation. When the operation cannot be used, the operation is not considered because the operation is not taken into consideration, such as the operation when interrupted, the interruption of the operation during operation, the operation resumed from the interrupted state, the operation of the processing room not used for the processing path during the operation, etc. For example, when the same type of processing chamber is connected, the operation method of the apparatus in which the operation is continued using the other normal processing chamber during operation is not considered, and the operation rate is low.

In addition, in parallel with the normal operation for processing wafers normally, consideration has been given to ensuring the safety of workers when recovering from an abnormal processing chamber or performing maintenance work that is periodically performed. There was no equipment.

According to the present invention, there is provided a vacuum processing apparatus comprising at least two processing apparatuses for performing a process processing and a transfer processing apparatus for transferring a wafer, wherein the processing is performed using at least two or more processing apparatuses. 1) During operation using two or more processing chambers as processing paths, even if one of the processing chambers becomes unusable due to a failure or the like, the operation can be continued, and 2) a process processing apparatus that needs to be repaired If there is, operation can be performed using only the normal processing chamber as a processing path. 3) Temporarily suspend operation during operation, resume operation from suspended state, and suspend operation during operation, and suspend operation. Interrupt processing using the processing room that was not used as the processing path for the operation as a processing path until then, and after the interrupt processing has been completed, the processing that has been temporarily interrupted is continued. 4) During operation using two or more processing chambers as processing paths, an operation instruction can be given to a device in a processing chamber not used in the processing path of the operation, and the operation can be performed in the processing path of the operation. Operational safety can be ensured when an operation instruction is given to a device in a processing room that is not in operation, or when an operation instruction is given from an operation unit that is located away from an operation unit that gives a normal operation instruction. 5) In parallel with the normal operation for normal wafer processing, by recovering an abnormal processing chamber or ensuring the safety for workers when performing maintenance work that is periodically performed, It is an object of the present invention to provide a method of operating a vacuum processing apparatus and a vacuum processing apparatus capable of improving the operation rate of the apparatus and ensuring safety.

[0013]

In order to achieve the above object, an operation information signal generating means for generating each operation information signal indicating that the operation of each process processing device is valid or invalid is provided for each process processing device. And operation information signal storage means for storing the respective operation information signals is provided, and the other operation-effective process processing apparatus is used without using the operation-ineffective process processing apparatus based on each operation information signal. The apparatus is provided with device control means for continuing operation.

[0014] In the operation of the apparatus, if a process processing apparatus in the middle of operation becomes unusable due to a failure or the like,
The operation of the apparatus is temporarily interrupted, and the operator is prompted to determine whether to continue the operation or to stop the operation. When the operation is to be continued, the operation can be continued by performing an operation continuation treatment on the apparatus.

When the operation is started in a state where there is a process processing device that needs to be repaired or maintained at the start of the operation, the process processing device that needs to be repaired or maintained before the operation is started is not used. The operation is enabled by performing a treatment for operating the apparatus using an effective process processing apparatus.

In addition, when performing an operation of recovering an abnormal processing chamber or performing a maintenance operation that is periodically performed in parallel with the normal operation of performing normal wafer processing, the processing gas flows even if the operation is performed erroneously. A function to shut off the air line for driving the air operation valve of the gas line (for example, providing a valve for manual opening / closing for each gas line) is provided so that the electric power for discharge is not accidentally turned on and electric shock is prevented. By providing a function that can shut off the power supplied to the discharge power supply unit (for example, providing a breaker that can be turned on / off for each power supply line) as described above, it is possible to ensure safety for workers. It is an object of the present invention to provide a method of operating a vacuum processing apparatus and a vacuum processing apparatus capable of improving the operation rate of the apparatus and ensuring safety.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will now be described with reference to FIGS.
As shown in FIG.

FIG. 1 shows an embodiment, in which four processing units are connected to a transfer unit, and a cassette for loading a wafer into the processing unit is installed in an atmospheric transfer unit installed in front of the main unit of the processing unit. Then, an apparatus configuration diagram for taking out one sheet at a time from the cassette and carrying it into the processing apparatus for processing is shown. Four or more process processing devices may be connected. In FIG. 1, reference numeral 1 denotes a transfer processing device that transfers a wafer, transfers a wafer in a load lock chamber to the processing devices 2-1 to 2-4 according to a wafer transfer schedule, and removes a wafer that has been processed by the processing device. The wafer is transferred to the next processing apparatus, and the wafer on which all the processing has been completed is transferred to the unload lock chamber. Reference numerals 2-1 to 2-4 denote processing devices for performing the process processing. The process includes all processes of the wafer, such as etching, post-processing, film formation, sputtering, CVD, and water washing. Reference numeral 3 denotes a load lock chamber for loading a wafer in the atmospheric transfer device 6 into the transfer processing device. Reference numeral 4 denotes an unload lock chamber for transferring a wafer from the vacuum processing chamber to the atmospheric transfer device 6. A vacuum robot installed in the processing apparatus for transferring wafers, 6 is an atmospheric transfer apparatus for installing a cassette containing wafers, 7 is a cassette containing wafers to be processed, and a cassette containing product wafers and cleaning. Is a cassette containing wafers for use. Reference numeral 8 denotes an atmospheric robot which unloads the wafer in the cassette on the atmospheric transfer device from the cassette, loads the wafer into the load lock chamber 3, and returns the wafer in the unload lock chamber 4 to the original cassette.

In normal operation, the operator
Cassette 7-1 (or 7-2) containing product wafers
And a cassette 7-3 containing the cleaning wafer are set in the atmospheric transfer device 6. Display means 13, input means 14
After the operation conditions are set using and, the operation start instruction is issued. When the operation is started, the transfer of the wafer is started, and the wafer is transferred to the processing apparatus 2-1 (including 2-2 to 2-4) where the wafer is processed and returned to the original cassette. When all the wafers in the original cassette have been processed, a beer (not shown) is sounded to recover the cassette, a cassette recovery request is sent to the operator, and the operator removes the cassette. When the processing of the cassette containing the product wafers is completed, the cleaning wafers are transferred from the cassette 7-3 to the processing devices 2-1, 2-2, 2-
Then, the sheet is carried out to 3, 2-4, cleaned, and returned to the cassette 7-3. In this case, the processing apparatuses 2-1 and 2-
It is also possible to carry out the cleaning process to each of the processing devices 2-1, 2-3, and 2-4, and to carry out the cleaning process as another method. Transport,
The cleaning process can be performed simultaneously. In the above-described cleaning process, when the processing of the cassette containing the product wafer is completed, the cleaning dummy wafer is removed from the cassette 7-3 to the processing apparatus 2-1 or 2-.
The cleaning process is carried out without carrying out the cleaning wafers to the process processing units 2-1, 2-2, 2-3, and 2-4. It is also possible. As described above, in addition to performing the cleaning process after the processing of the product wafers for one cassette, the cassette 7-3 is moved for each number of processed product wafers (this number can be set as appropriate) as a cleaning cycle. It is also possible to carry out the cleaning process by carrying out the cleaning dummy wafer to the processing devices 2-1, 2-2, 2-3, and 2-4. Further, a dummy wafer for cleaning is loaded from the cassette 7-3 into the processing units 2-1 and 2 for each number of product wafers processed as a cleaning cycle (this number can be set as appropriate).
It is also possible to perform a cleaning process without carrying out to -2, 2-3 and 2-4. After the processing of the cassettes containing the product wafers has been performed for a predetermined number of cassettes, the cleaning dummy wafers are unloaded from the cassettes 7-3 to the processing devices 2-1, 2-2, 2-3, and 2-4. Alternatively, a cleaning process can be performed.

Next, before starting the processing of the cassette containing the product wafer, the dummy wafer is not carried out of the cassette 7-3 to the processing apparatus 2-1, 2-2, 2-3, 2-4, and after the aging processing, the dummy wafer is processed. Processing can also be performed. Before the processing of the cassette storing the product wafers is started, the dummy wafers are unloaded from the cassette 7-3 to the processing devices 2-1, 2-2, 2-3, and 2-4, and after the aging process, the dummy wafers are transferred to the cassette 7. It is also possible to return to -3 and to perform the above-mentioned wafer processing after performing this aging processing for a preset number of wafers. The cleaning process described above is a process performed to remove foreign matter in the processing apparatus, and the aging process is a process performed to bring the inside of the processing apparatus into a wafer processing state before performing the wafer processing. is there.

In the setting of the processing path, which is a part of the operation condition setting, the processing apparatus used for the processing is set in the order of processing the wafers by using the symbols of the processing apparatuses.

The order of processing the wafers is shown in Table 1 as an operation mode.

[0023]

[Table 1]

In the following description of the operation mode, the processing apparatuses 2-2 and 2-3 perform the same processing (etching processing in this embodiment), and the processing apparatuses 2-1 and 2-4 perform the same processing. This process will be described as being post-processed in this embodiment. Further, as an example of the process processing, after performing the etching processing using the processing apparatus 2-2 or 2-3, the post-processing using the processing apparatus 2-1 or 2-4 is performed. After processing the product wafer for one cassette, the cleaning wafer is transferred from the cassette 7-3 to the processing device 2-4 (or 2-1) from the processing device 2-3 (or 2-2). The operation for performing the cleaning process for performing the cleaning process will be described. Depending on the processing conditions of the wafer, only the etching process may be performed.

1) Parallel operation of one cassette and one recipe In the cassette in which wafers to be processed under the same process processing conditions (hereinafter, the process processing conditions are referred to as recipes) are stored in the cassette from the lowermost or uppermost wafer in the cassette. From the transfer processing device. The wafer is subjected to an etching process in the processing device 2-2, and then subjected to post-processing in the processing device 2-1 and returned to the original cassette (this route A).
After that, the etching is performed by the process processing device 2-3, and the post-processing is performed by the process processing device 2-4 and the path is returned to the original cassette (this path is referred to as path B).

The processing order in this embodiment is as follows: path A: cassette 7-1 → process processor 2-2 → process processor 2-1 → cassette 7-1 path B: cassette 7-1 → process processor 2 Path C: cassette 7-1 → process processing apparatus 2-2 → process processing apparatus 2-4 → cassette 7-1 Path D: cassette 7 -1 → Processing device 2-3 → Processing device 2-1 → Cassette 7-1.

In the processing of the wafers, the first wafer is route A, the second wafer is route B, the third wafer is route A, the fourth wafer is route B,. Processing is performed up to the wafer. When the final wafer is unloaded from the cassette 7-1 (FIG. 3A), the cleaning wafer is transferred from the cassette 7-3 to the processing device 2-3 to start the cleaning process (FIG. 3B). Also, the final wafer in the processing apparatus 2-2 is changed to the processing apparatus 2-
If the cleaning wafer has been transferred, the cleaning wafer is transferred from the cassette 7-3 to the processing device 2-2, and the cleaning process is started. When the cleaning processing in the processing apparatus 2-3 is completed, the cleaning wafer is transferred from the processing apparatus 2-3 to the processing apparatus 2-4, and the cleaning processing is performed. If the product cassette 7-2 has been installed by this time, the processing of the cassette 7-2 is continued following the completion of the processing of the cassette 7-1, and thereafter, the first wafer of the product wafer is removed from the cassette 7-2. It is transported to the process processing device 2-3 to perform a process process (FIG. 3C). When the cleaning processing in the processing device 2-4 is completed, the cleaning wafer is returned to the cassette 7-3. When the cleaning process in the processing device 2-2 is completed by this time, the cleaning wafer is transferred from the processing device 2-2 to the processing device 2-1 to perform the cleaning process. After that, the second product wafer is transferred from the C2 cassette to the processing device 2-2 to perform the processing (FIG. 3D). When processing of all wafers in the cassette 7-1 is completed, the cassette 7-
A buzzer (not shown) is sounded to notify the operator of the end of the process 1 and the cassette replacement. As described above, processing is performed on the cassette 7-2 in the same order as in the case of the cassette 7-1, and when all the processing in the cassette 7-2 is completed, the processing completion of the cassette 7-2 and the cassette replacement are notified to the operator. For this purpose, a buzzer not shown in this figure sounds. Thereafter, this operation cycle is repeated. When the operation is to be terminated, the operation is terminated by performing an operation termination operation input from the main control unit 11.

There are the following five modes for ending the processing.

A) Suspension of wafer supply: The wafer removal from the cassette being processed is stopped. (If two cassettes are operated as one lot, the removal of wafers from the designated cassette is stopped.) A) Cassette supply stop: after processing all wafers in the cassette currently being processed, The processing of the cassette that has been set up by the end of the processing is stopped. (If two cassettes are operated as one lot, after processing all wafers in the designated cassette, processing of the cassettes installed up to that time is stopped.) C) Cycle stop: Currently running process, exhaust,
It stops immediately after the operation such as leakage and conveyance is completed. D) Temporary stop of processing room: The specified processing room is stopped after the end of the currently processed process. In this case, the operation can be resumed from the state of being temporarily stopped by the operation of resuming the operation. Manual operation is possible only in the processing chamber. E) Immediate stop: All running operations are immediately stopped. Any method may be used to end the processing.

2) Parallel operation of two cassettes and one recipe In the cassette in which wafers to be processed under the same process conditions (recipe) are stored, the wafers are sequentially extracted from the lowermost or uppermost wafer and loaded into the transfer processing device to perform the process processing. Is what you do. In this case, the operation of removing the cassette from the cassette and carrying it into the transfer processing device to perform the process processing is different from the case of the above-described “one cassette / one recipe parallel operation”. In the case of the "one cassette one recipe parallel operation" described above, wafers are sequentially extracted from the same cassette, loaded into the transfer processing device, and the process is performed. After all the wafers in the cassette are completed, the wafer is processed in the next cassette. It moved, but this book "2
In the "cassette 1 recipe parallel operation", wafers are alternately extracted from the cassettes 7-1 and 7-2 and loaded into the transfer processing device to perform the process. As in the case of the above-mentioned "one cassette one recipe parallel operation", the wafer processing path is a path in which the etching processing is performed by the processing apparatus 2-2, the post processing is performed by the processing apparatus 2-1 and the original cassette is returned. The processing is performed using both a path (referred to as path A) and a path (referred to as path B) in which the post-processing is performed in the processing apparatus 2-3 and the post-processing is performed to return the cassette to the original cassette. .

The routes A and B or the routes C and D in the processing order in this embodiment are the same as those in the above-mentioned "1 cassette 1 recipe parallel operation".

In the processing of the wafer, the first wafer is route A from the cassette 7-1 and the second wafer is the cassette 7-
The first wafer from path 2 is route B, and the third wafer is cassette 7
The second wafer from -1 is processed in the path A, the second wafer is processed from the cassette 7-2 in the order of path B, and so on until the last wafer in the cassette is processed. When all the wafers in the cassette 7-1 or 7-2 have been processed, a buzzer (not shown) sounds to notify the operator of the completion of the processing of the cassette 7-1 (or 7-2) and the replacement of the cassette to the operator. . Until the completed cassette is removed and a new cassette is installed, only the processing on the other cassette is continued. When a new cassette is installed, the wafers are alternately extracted from the cassettes 7-1 and 7-2 and loaded into the transfer processing device to perform the process as described above.
Thereafter, this operation cycle is repeated. When the operation is to be terminated, the operation is terminated by performing an operation input for terminating the operation from the main control unit 11. The termination method is described in the above “1 cassette 1
This is the same as the case of “recipe parallel operation”. The cleaning process is the same as 1).

3) Parallel operation of two cassettes and two recipes In this operation, the processing time in the processing apparatus may be different due to different wafer processing recipes of the cassette 7-1 and the cassette 7-2. In this case, the cassette 7-
1 and the unloading of wafers from the cassette 7-2 are not alternate,
The process is the same as the above-described "two-cassette one-recipe parallel operation" except that the processing in the processing apparatus is completed, and the wafer is transferred to another processing apparatus and then the next wafer is transferred to the processing apparatus. The cleaning process for the wafer is the same as the above 1).

4) One-cassette / one-recipe serial operation In this operation, the wafers to be processed under the same process conditions (recipe) are sequentially taken out of the cassette from the lowermost or uppermost wafer in the cassette in which the wafers are stored. Carrying in and carrying out the process is the same as in the case of the "one cassette one recipe parallel operation". However, the processing path of the wafer is different from the case of the “one cassette one recipe parallel operation”. In this “one cassette one recipe series operation”, the wafer is etched by the processing device 2-2 (or the processing device 2-3), and then is further processed by the processing device 2-3 (or the processing device 2-2). Process processing device 2
-1 (or the processing device 2-4) to perform post-processing and return to the original cassette (path E).

In the processing of the wafers, the first wafer is route E, the second wafer is route E, the third wafer is route E, the fourth wafer is route E,. Processing is performed up to the wafer. When all the processing in the cassette 7-1 is completed, a buzzer (not shown) is sounded to notify the operator of the completion of the processing of the cassette 7-1 and the replacement of the cassette to the operator. If the cassette 7-2 has been installed by this time, the process proceeds to the processing of the cassette 7-2 following the end of the processing of the cassette 7-1. The cassette 7-2 is also processed in the same order as in the case of the cassette 7-1, and when all the wafers in the cassette 7-2 have been processed, this processing is performed to notify the operator of the completion of the processing of the cassette 7-2 and the replacement of the cassette to the operator. Sounds a buzzer not shown. If the cassette 7-1 has been installed by this time, the process proceeds to the cassette 7-1 following the end of the process of the cassette 7-2. Thereafter, this operation cycle is repeated. When ending this operation, the main control unit 1
The operation is terminated by performing an operation input for terminating the operation from Step 1.
The termination method is the same as in the case of the "one cassette one recipe parallel operation". The cleaning process is the same as 1).

The operation methods 1) to 4) described above are representative examples, and other operation methods are conceivable depending on the combination of the cassette, the recipe, and the parallel / serial operation. However, the present invention is not limited to the driving methods described in 4) to 4).

When the apparatus is to be maintained, the display means 26 and the input means 25 in the auxiliary operation panel 22 are provided.
And can be operated on the machine side of the device. The auxiliary operation panel 22 is a portable operation terminal (for example, a notebook computer), is carried near the device, and device information (for example, ON / OFF information of input / output bits, Error information, etc.) can be used for maintenance and maintenance operations, thereby improving the operability of maintenance and maintenance. The auxiliary operation panel 22 has the same function as the main control unit 11,
Main control unit 11 to ensure safety for the operator
In the case where the operation is performed simultaneously with the control panel 22 and the auxiliary operation panel 22, an erroneous operation prevention function is provided so that only one of them can be operated.

FIG. 2 shows another embodiment, in which four processing units are connected to a transfer processing unit, and a cassette for loading a wafer into the processing unit is set in a load lock chamber 3A in the main body of the processing unit. FIG. 2 is a configuration diagram of an apparatus for taking out one sheet at a time from a cassette and carrying it into a processing apparatus for processing. More processing devices may be connected. The apparatus configuration is different from the configuration shown in FIG. 1 in that the atmospheric transfer device 6 and the atmospheric robot 8 for installing a cassette containing wafers are omitted. The functions and configuration of each device are the same as those in FIG. 1 except that the wafer is unloaded from the cassette in the load lock chamber 3A and the storage in the cassette is in the unload lock chamber 4A. In the cleaning process, the cassette containing the cleaning wafer is loaded into the load lock chamber 3.
A (or the unload lock chamber 4A), and the cleaning wafer is placed in the processing apparatus 2-1, 2-2, 2-
Then, it is carried out to 3, 2-4, cleaned, and returned to the original cassette. Also, in the operation mode, 1) parallel operation of one cassette and one recipe The wafers to be processed under the same process processing condition (recipe) are sequentially extracted from the cassette in the lowermost or uppermost wafer in the cassette in which the wafers are stored, and are processed by the processing apparatus. It is carried in and processed. The wafer is etched by the processing device 2-2, then post-processed by the processing device 2-1 and returned to the original cassette (this route A), and etched by the processing device 2-3. Post-processing is performed by the post-processing device 2-4, and processing is performed using both paths (referred to as path B) for returning to the original cassette.

The processing order in this embodiment is as follows: path A: cassette 7-1A in load lock chamber 3A → process processor 2-2 → process processor 2-1 → cassette 7-2A in unload lock chamber 4A path B : Cassette 7-1A in load lock chamber 3A → process processing device 2-3 → process processing device 2-4 → cassette 7-2A in unload lock chamber 4A or route C: cassette 7-1A in load lock chamber 3A → Process processing device 2-2 → Process processing device 2-4 → Cassette 7-2A in unload lock chamber 4A Path D: Cassette 7-1A in load lock chamber 3A → Process processing device 2-3 → Process processing device 2-1 → It may be a combination of the cassette 7-2A in the unload lock chamber 4A. In the above processing order, the processed wafers are stored in the cassette 7- in the unload lock chamber 4A.
Load lock chamber 3A returned to 2A but with wafers removed
It can be returned to the inner cassette 7-1A.

In this embodiment, the wafer extracted from the cassette 7-1A in the load lock chamber 3A in parallel with the path A and the path B is transferred to the cassette 7-2A in the unload lock chamber 4A.
An example of the process of returning to the above will be described. The first wafer is processed in the path A, the second wafer is in the path B, the third wafer is processed in the path A, the fourth wafer is processed in the path B, and so on until the last wafer in the cassette. I do. When all the processing in the cassette 7-1A in the load lock chamber 3A is completed, the load lock indoor cassette and the unload lock 4A indoor cassette 7-2A are completed.
A buzzer (not shown) is sounded to notify the operator of the end of the process and the replacement of the cassette. Next, a cassette containing a new unprocessed wafer is installed in the load lock chamber 3A, and an empty cassette is installed in the unload lock chamber 4A. Thereafter, this operation cycle is repeated. When the operation is to be terminated, the operation is terminated by performing an operation input for terminating the operation from the main control unit 11. The termination method is the same as in the case of the "one cassette one recipe parallel operation".

2) Parallel operation of two cassettes and one recipe In the cassettes in which the wafers to be processed under the same process processing conditions (hereinafter, the process processing conditions are referred to as recipes) are stored in the cassette from the lowest or highest wafer in the cassette. And carried into a processing device for processing.

In the case of the "one cassette one recipe parallel operation" described above, wafers are sequentially extracted from the same cassette, loaded into the processing device, and the process is performed. After all the wafers in the cassette are completed, the wafer in the next cassette is processed. However, in this "two cassette one recipe parallel operation", wafers are alternately extracted from the cassette 7-1A in the load lock chamber 3A and the cassette 7-2A in the unload lock chamber 4A and sent to the processing apparatus. Carry in and process. As in the case of the above-mentioned "one cassette one recipe parallel operation", the wafer processing path is a path in which the etching processing is performed by the processing apparatus 2-2, the post processing is performed by the processing apparatus 2-1 and the original cassette is returned. (Path A) and a path after the etching processing by the processing apparatus 2-3 and post-processing by the processing apparatus 2-4 and returning to the original cassette (path B). I do.

The routes A and B or the routes C and D in the processing order in this embodiment are the same as those in the above-mentioned "1 cassette 1 recipe parallel operation".

In the wafer processing, the first wafer passes through the first wafer from the cassette 7-1A in the load lock chamber 3A through the path A, and the second wafer receives the first wafer from the cassette in the unload lock chamber 3A.
The third wafer is the path B, the third wafer is the second wafer from the cassette 7-1A in the load lock chamber 3A, and the fourth wafer is the second wafer from the cassette 7-2A in the unload lock chamber 4A. The processing is performed up to the last wafer in the cassette in the order of eyes B,. When all the wafers in the load lock chamber 3A or the unload lock chamber 4A cassette 7-2A have been processed, the operator is notified of the end of the processing of the cassette in the load lock chamber 3A (or the unload lock chamber 4A) and the replacement of the cassette. For this purpose, a buzzer not shown in this figure sounds. Until the completed cassette is removed and a new cassette is installed, only the processing on the other cassette is continued. When a new cassette is installed, the wafers are alternately extracted from the cassettes in the load lock chamber 3A and the unload lock chamber 4A and loaded into the processing device to perform the process as described above. Thereafter, this operation cycle is repeated. When the operation is to be terminated, the operation is terminated by performing an operation input for terminating the operation from the main control unit 11. The termination method is the same as in the case of the "one cassette one recipe parallel operation".

3) Parallel operation of two cassettes and two recipes In this operation, the cassette 7-1 in the load lock chamber 3A is operated.
A and the cassette 7-2A in the unload lock chamber 4A may have different wafer processing recipes. In this case, the unloading of the wafers from the cassette 7-1 and the cassette 7-2 is not alternate, and the processing in the processing apparatus ends, and after the wafer is transferred to another processing apparatus, the next wafer is transferred to the processing apparatus. Except for the process of transporting, the operation is the same as the above-mentioned "two cassettes one recipe parallel operation". The cleaning process for the wafer is the same as the above 1).

4) One-cassette / one-recipe series operation In this operation, the lowermost or uppermost wafer in a cassette in which wafers to be processed under the same processing conditions (hereinafter, the processing conditions are referred to as recipes) is stored. The process of extracting from the cassette in order from the beginning and carrying it into the process apparatus to perform the process is the same as in the case of the "one cassette one recipe parallel operation". However, the processing path of the wafer is different from the case of the “one cassette one recipe parallel operation”. In this “one cassette one recipe series operation”, the wafer is etched by the processing device 2-2 (or the processing device 2-3), and then is further processed by the processing device 2-3 (or the processing device 2-2). After that, the post-processing is performed by the process processing device 2-1 (or the process processing device 2-4), and the process is performed on a path for returning to the original cassette (referred to as a path E).

In this embodiment, the load lock chamber 3A is connected to the path E
This shows an example of processing for returning a wafer extracted from the cassette 7-1A in the cassette 7-2A in the unload lock chamber 4A. The first wafer is processed in the path E, the second wafer is the path E, the third wafer is the path E, the fourth wafer is the path E,... I do. When all the processing in the cassette is completed, the cassette 7-1A in the load lock chamber 3A and the unload lock chamber 4A
A buzzer (not shown) is sounded to notify the operator of the completion and replacement of the inner cassette 7-2A. Next, a cassette containing a new unprocessed wafer is set in the load lock chamber 3A, and an empty cassette is set in the unload lock chamber 4A. Thereafter, the operation cycle is repeated. When the operation is to be terminated, the operation is terminated by performing an operation input for terminating the operation from the main control unit 11. The termination method is the same as in the case of the "one cassette one recipe parallel operation".

FIG. 4 shows a control configuration diagram. In the present embodiment, a case where the main control unit of the entire apparatus is mounted on the transport processing apparatus 1 is shown. Note that the main control unit of the entire apparatus may be other than the transport processing apparatus. The display unit 13 and the input unit 14 may be configured as a control unit different from the main control unit. Reference numeral 11 denotes a configuration of a main control unit that controls the entire apparatus. As the control means, only portions corresponding to the claims of the present invention are extracted and described, and input / output control portions (DI / O, AI / O) necessary for operating the apparatus are described. Absent. A processing order information storage unit 16 stores a processing order of wafers in the vacuum processing apparatus. For example, a RAM (Random Access Me) is provided.
memory). In the processing order of the wafers, data input by the operator using the display means 13 and the input means 14 before the operation is started is stored. An operation information signal storage unit 17 stores an operation information signal indicating that the operation of the process devices 2-1 to 2-4 is valid / invalid, and is, for example, a RAM. Reference numeral 13 denotes display means for displaying the operation state, the setting contents of the operation conditions, and the start / end of the operation, and is, for example, a CRT. Reference numeral 14 denotes input means for setting operation conditions, inputting an instruction to start operation, inputting process processing conditions, inputting operations for maintenance and maintenance, and the like.
For example, a keyport. 15 judges an operation information signal state indicating that the operation of the above-mentioned process devices 2-1 to 2-4 is valid / invalid, and any one of the process devices 2-1 to 2-4 during the automatic operation. A device control unit that stores a processing procedure for continuing operation using another process processing device without using the process processing device even when the operation is disabled. For example, a ROM (Read Only Memory) is used.
ry). Reference numeral 12 denotes a central control unit for controlling the above 13 to 17, for example, a CPU (Central P
processor Unit). 2-1 to 2-4
Is a processing apparatus for performing a wafer processing. The processing apparatus may be any processing apparatus that performs processing of a wafer, such as etching, post-processing, film formation, sputtering, CVD, and water treatment. 19-1
Reference numeral 19-4 denotes an operation information signal generating means for generating an operation information signal indicating that the operation of the process apparatuses 2-1 to 2-4 is valid / invalid. In this embodiment, it is provided in the processing apparatus, but it may be located anywhere. As means for generating the operation information signal, 1) use a cut-off signal of the apparatus power of the processing apparatus 2) use an operation switching signal (for example, a changeover switch) for setting valid / invalid use of the processing apparatus 3). Input information set and input by an operator can be used as the operation control signal indicating the validity / invalidity of use of the process processing device.

Reference numerals 20 and 21 denote communication means for connecting the main control section 11 for controlling the entire apparatus and the auxiliary operation panel 22.
The auxiliary operation panels 22, 25, and 26 are used for the above-described applications. Reference numeral 24 denotes a terminal control unit that stores a processing procedure for controlling a terminal function of the auxiliary operation panel. 23 is the above 2
1, 24 to 26, for example, a central control unit (CPU).
nit).

FIG. 5 is a driving information signal diagram. Information indicating the validity / invalidity of the operation is stored for each process processing device. In this case, when valid, 1 is indicated, and when invalid, 0 is indicated. However, a symbol or number may be used as long as the contents can be distinguished. This information is supplied to the driving information signal generating means 19.
This reflects the signal states of -1 to 19-4 and is stored in the driving information signal storage means 17.

FIG. 6 is a processing order information diagram. One of the operation condition settings is information in which the operator sets the order of processing wafers using the display unit 13 and the input unit 14 before the start of operation. This information is stored in the processing order information storage means.

FIG. 7 shows a flow chart of the operation of the apparatus. Before starting the operation, the operator determines whether or not there is a process processing device configured as a processing device that cannot be used for operation due to a failure or that is not used for maintenance (including a cleaning machine). (3
0). If there is a processing apparatus which cannot be used (or is not used), the operation information signal generating means 19 is used to execute the processing shown in FIG.
(32). One of the methods for this setting is as follows: 1) In the case of using a cut-off signal of the power supply of the processing apparatus, the electromagnetic switch for supplying power to the processing apparatus is turned off. As a result, a cutoff signal is generated, transmitted to the driving information signal storage means 17, and stored as the information described in FIG.

2) When using an operation switching signal (for example, a changeover switch) for setting whether or not to use the processing device, the changeover switch assigned to the processing device is set to a valid or invalid state. Thereby, the switching signal is determined, transmitted to the driving information signal storage means 17, and stored as the information described in FIG.

3) When the input information set by the operator is used as the operation control signal indicating the validity / invalidity of the use of the processing device, the operator inputs the setting information assigned to the processing device into the input means 14. Enter more. Thereby, the setting information is determined, transmitted to the driving information signal storage means 17, and stored as the information described in FIG. After determining the device connection configuration, automatic operation is started (34). The order of processing wafers is set as product processing conditions as follows.

1) Select a wafer operation mode.

"1 cassette 1 recipe parallel", "2 cassette 1 recipe parallel", "2 cassette 2 recipe parallel", "1
2) Set the wafer transfer path.

Parallel or series processing is set for the processing path of the wafer for each cassette using the symbol of the processing apparatus. A typical setting example is shown below. (The wafer processing paths can be combined as described above.) 2-1) In the case of parallel processing: Cassette 7-1: E1 → A1, cassette 7-1: E2 →
A2 Cassette 7-2: E1 → A1, Cassette 7-2: E2 →
A2 E1: Process processing device 2-2, E2: Process processing device 2-3 A1: Process processing device 2-1 and A2: Process processing device 2-4 2-2) For series processing: Cassette 7-1: E1 → E2 → A1 Cassette 7-2: E2 → E1 → A2 3) Set processing conditions (also called process recipe) for each processing chamber.

After setting the above-mentioned product processing conditions, the automatic operation start is started.

FIG. 8 shows a flow chart of the automatic operation. When the automatic operation is started, it is determined whether or not all the wafers to be processed have been transported. If the wafer has been transported, the process ends. If the transport is necessary, the process proceeds to the automatic operation process (40). It is determined whether or not an abnormality has occurred during the automatic operation and the operation is temporarily suspended (42). If there is no abnormality, continue driving (4
4). If there is a process processing device that cannot be used for the operation, the operator determines whether or not the operation can be continued without using the process processing device (70). If continuation is not possible, the operator performs an automatic operation stop process, and the apparatus performs an automatic operation stop process (90). Even when continuation is possible, there may be a case where a wafer remains in the processing apparatus, a case where a wafer remains on the hunt of the vacuum robot, a case where a wafer remains in the funnel lock chamber or the unroof lock chamber, and the like.

As described above, an abnormality occurs during the automatic operation, the automatic operation cannot be continued, and the automatic operation is resumed from the state where the automatic operation is temporarily interrupted. To carry out the loaded wafer to the original cassette. This is because when the abnormality occurs during the automatic operation, the schedule for transporting and processing all the wafers in the processing apparatus has been determined. Therefore, the wafer must be returned to the cassette 7 from which the wafer in the equipment in which the abnormality has occurred is taken out. This is because the schedule of conveyance and processing is deviated, and it becomes impossible to resume the automatic operation from the temporary suspension state and continue the automatic operation. Further, as another embodiment, a wafer remaining in the abnormal equipment is not carried out to the original cassette, and the in-process wafer is left in the abnormal equipment while the wafer in process is temporarily suspended. It is also possible to continue the automatic operation and to terminate the group of processes, and after the automatic operation is terminated, the remaining wafers can be returned to the original cassette. In another embodiment, it is possible to change the wafer information as if the wafer were carried out to the original cassette. For example, leaving the wafer remaining in the processing equipment due to the occurrence of an abnormality,
After the wafer information is changed as if the wafer had been unloaded to the original cassette, the in-process wafer was resumed from the temporary suspension state, the automatic operation was continued, and the processing (one lot) was completed. It is used when returning the remaining wafers to the original cassette after the operation is completed. An example of treatment of a wafer remaining in the processing apparatus will be described below.

It is determined whether there is a remaining wafer in the apparatus (72). It is determined whether or not to continue the operation while leaving the wafer remaining in the apparatus as it is (73). When the operation is continued with the wafer remaining in the apparatus as it is, the wafer information is changed as if the wafer had been unloaded to the original cassette (77). If the operation is not continued with the remaining wafers in the apparatus as they are, it is determined whether or not to perform etching processing on the remaining wafers (74). If an abnormality occurs during the etching process among the wafers remaining in the processing chamber, the remaining etching process is performed (7).
6) Return the wafer to the original cassette (78). This is done to save the wafer as much as possible.
If a wafer remains on the wafer hunt of the vacuum robot or remains in the funnel / lock / unload / lock chamber, perform the individual operation of the equipment (exhaust / leak of the lock chamber, transfer of wafer). Then, the wafer is returned to the original cassette (78). As described above, after performing the necessary treatment for the wafer in the device in which the abnormality has occurred, returning the wafer to the original cassette, an operation for restarting the temporarily stopped automatic operation is performed. By doing so, the tracking information of the wafer in the device (the processing chamber, the vacuum robot, or the like) in which the abnormality has occurred becomes equivalent to that processed in the normal path, and the automatic operation can be restarted. After the treatment of the wafer remaining in the processing apparatus as described above, the processing processing apparatus which is not used is subjected to (3) in FIG.
The same operation (80) of switching the operation information signal generation means as shown in 2) is performed. The abnormality occurrence information is reset (82), and the automatic operation is continued.

In the normal operation state, the information stored in the processing order information storage means 16 is read out from the transfer path of the next wafer (44), and the transfer path is matched with the information stored in the operation information signal storage means 17. Determine the transport route (4
6). The determined transfer route may have a transfer route data for each wafer carried out of the cassette, or a process sequence information table different from the process sequence information storage means 16 may be created. May be referred to. When the transfer route is determined, the atmospheric robot 8 unloads the wafer from the cassette 7 (48), transfers the wafer to the processing apparatus registered in the determined transfer route (50), and processes the wafer (52). If an error occurs during the wafer transfer process and the process process,
After the processing that can be continued to continue the automatic operation is executed until the individual processing is completed, the automatic operation is temporarily suspended. (For example, if the etching processing of the Nth wafer is being performed, the etching processing is continued until the etching processing of the Nth wafer is completed.
At the end of the operation, automatic operation is suspended. If an abnormality occurs in another process while the wafer is being transferred by the vacuum robot 5, the vacuum robot 5 temporarily suspends the automatic operation when the transfer of the wafer to a predetermined place is completed. After that, after the abnormality occurrence information (not shown) indicating that an abnormality has occurred is stored, the operator is temporarily suspended and the operator is notified of the interruption on the display means 13 and a fuser (not shown) is sounded. Thereafter, the process returns to (42) and the processing is performed according to a predetermined flow.

FIG. 9 is a diagram showing a process of restarting automatic operation after occurrence of an abnormality. Hereinafter, processing until restart of automatic operation after an abnormality occurs during automatic operation described in FIG. 8 will be described. FIG. A shows the wafer transfer route in the operation mode of “1 cassette 1 recipe parallel operation” in Table 1 when the cassette 7-1: E1 → A1 and E2 → A2 Cassette 7-2: E1 → A1 and E2 → A2 In operation E2, the (N) th wafer is in the etching process, and in A1, the (N-1) th wafer is in the post-processing.
As shown in (2), when an abnormality occurs in E2, the etching process is terminated, and after the post-processing of the (N-1) th wafer of A1 is completed, the automatic operation is temporarily suspended without being carried out to the unload lock chamber 4. For the (N) th wafer in which the abnormality has occurred in E2, the processing of 76 and 78 in FIG. 7 is performed. Thereafter, E2 and A2 are described as the switching operation by the driving information signal generation means 80 in FIG.
Alternatively, the operation of 3) is performed, and the operation information of the processing apparatus 3 (E2) and the processing apparatus 4 (A2) is set to “invalid: 0” as shown in FIG. Thereafter, the abnormality occurrence information is reset (80 in FIG. 8), and the automatic operation is restarted. After the restart, the (N-1) th wafer of A2 is transferred to the unload lock chamber 4 as shown in FIG. C, and thereafter the processing is continued using E1 and A1.

Next, the processing device 3 (E2) and the processing device 4 (A2) whose operation information is set to "invalid: 0"
With respect to the above, the operation input for performing the device operation to the process processing device 3 (E2) and the process processing device 4 (A2) can be performed in order to investigate the cause of the abnormality using the auxiliary operation panel 22. For example, a wafer lifting operation (not shown) in the processing apparatus 3 (E2) is performed to confirm the operation.

With such an operation, the cause of the abnormality can be dealt with, and the process processing apparatus 3 (E2) which sets "invalid: 0"
A procedure for returning the processing apparatus 4 (A2) to the wafer processing path will be described below. Next, during the operation shown in FIG. C, the automatic operation is interrupted, and by setting E2 and A2 which are separated from the processing path in the operation mode to be valid, it is possible to shift to FIG. The route can be operated by cassette 7-1: E1 → A1 and E2 → A2 Cassette 7-2: E1 → A1 and E2 → A2.

FIG. 10 shows a processing diagram of the processing device operation disconnection during automatic operation. During the automatic operation described below with reference to FIG.
The process of restarting automatic operation after disconnecting A2 and A2 from the automatic operation processing path will be described. FIG. A is the same as the driving route in FIG. In the operation mode of “1 cassette 1 recipe parallel operation” in Table 1, the wafer transfer path is changed to cassette 7-1: E1 → A1 and E2 → A2 Cassette 7-2: operated by E1 → A1 and E2 → A2, In E2, the (N) th wafer is being etched and in A1, the (N-1) th wafer is in post-processing.
As shown in (1), when a stop instruction is issued to E2 and A2 by the operation stop operation, the (N-1) th wafer of A1 is returned to the original cassette after the post-processing is completed, and the (N) th wafer is returned. Is completed, the wafer is conveyed to A2, and is returned to the original cassette after the post-processing. By the way, since E2 and A2 are in the operation stop state, the (N + 1) th and subsequent wafers are
The operation is continued using E1 and A1.

In the above description, E2 and A2 are separated from each other by issuing a stop instruction by an operation stop operation as a means for separating E2 and A2 from the automatic operation processing path during automatic operation. The stop instruction can be issued by the function of. As an example, it is detected that a monitor value of a foreign substance measured from a foreign substance monitor device incorporated in a processing apparatus has exceeded a set value set before operation, and the excess signal is used to instruct E2 and A2 to stop during automatic operation. Can perform the same function as the operation stop operation.

The procedure for returning the separated processing apparatus to the wafer transfer path is the same as that described with reference to FIG.

FIG. 11 shows a pilot cassette processing diagram. This is to execute an interrupt express process during the automatic operation, and after the process is completed, resume the original process and continue. During the automatic operation described below with reference to FIG.
And A2) A cassette that separates the processing device from the processing path of the operation mode that is currently operating and uses the separated E2 and A2 to perform processing under processing conditions different from those that have been operating up to that time. A description will be given of a process of interrupting and processing (this cassette is called a pilot cassette), restarting the original automatic operation, and continuing. FIG. A is the same as the driving route in FIG. In the operation mode of “1 cassette 1 recipe parallel operation” in Table 1, the wafer transfer path is changed to cassette 7-1: E1 → A1 and E2 → A2 Cassette 7-2: operated by E1 → A1 and E2 → A2, At E2, when the (N) th wafer of the cassette 7-1 is undergoing the etching process, and when the (N-1) th wafer of the cassette 7-1 at A1 is undergoing the post-processing, as shown in FIG.
In order to perform the interrupt express process using A2 and A2, an interruption operation of the automatic operation is performed. When a stop instruction is issued to E2 and A2 by the operation stop operation, the (N-1) th wafer of A1 is returned to the original cassette after the post-processing is completed, and the (N) th wafer is subjected to the etching process. The processing is completed, transported to A2, and returned to the original cassette after the post-processing. By the way, since the operation of E2 and A2 is stopped, the operation of the (N + 1) th and subsequent wafers is continued by using E1 and A1 (FIG. C). During the operation using E1 and A1, the cassette for the interrupt express processing using E2 and A2 is placed in the cassette 7-2, and the starting operation of the interrupt processing is started (FIG. C).
And all the wafers extracted from the cassette 7-1 by that time are processed and loaded into the cassette 7-1.
The operation using the internal wafers E1 and A1 is temporarily suspended, and the processing of the wafers in the cassette 7-2 for the interrupt express processing is started (FIG. D). The wafers in the cassette 7-2 are sequentially processed from E2 to A2, and the cassette 7-
Carry in 2 When the processing of the pilot cassette is completed, the interrupt processing is terminated and the operation of the temporarily suspended state is set to be resumed, and the processing of the wafer is resumed from the interrupted cassette 7-1 (return to the state of FIG. C). Next, returning to FIG. C, the operation of interrupting the automatic operation is performed during the operation, and the setting of E2 and A2 separated from the processing path of the operation mode is set to be valid. Then, the wafer transfer path can be operated by cassette 7-1: E1 → A1 and E2 → A2 Cassette 7-2: E1 → A1 and E2 → A2.

FIG. 12 is a configuration diagram for disconnecting the processing apparatus in the vacuum processing apparatus. Process processing device 2-1
Nos. 2-4 have a structure in which the air line for driving the air operation valve can be shut off for each processing gas line, and a valve for manual opening and closing is provided. In addition, the power supply to the discharge power supply unit can be cut off, and a breaker that can be turned on / off for each power supply line is provided. In this figure, the description will be made of the operation of "one cassette and one recipe.
The illustration of the corresponding contents for the processing apparatus which is not particularly described in the description of the embodiment is omitted.

The apparatus operation route is an operation using the route A and the route B (see the description of the embodiment of FIG. 1). The maintenance process is performed in the process processing device 2-2. In FIG. 7, after the valve for manually opening and closing the air line for driving the air operation valve of the gas line is closed and the breaker for each power supply line supplied to the power supply unit for discharge is turned off, the apparatus shown in FIG. Driving. Therefore, even if the processing gas is erroneously supplied to the processing apparatus during maintenance, the processing gas does not flow because the air line for driving the air operation valve of the gas line is shut off. Even if the discharge power supply is turned on by mistake, the power supply to the discharge power supply unit is cut off, so that there is no electric shock. In this way, even when the operator stands on the side of the operating apparatus and performs the maintenance work on the apparatus and the apparatus and the normal wafer processing in parallel, the processing gas flows or discharge occurs due to “erroneous operation”. It is possible to prevent harm to the worker such as turning on the power supply for electric shock and to ensure safety for the worker.

FIG. 13 is a flowchart showing an interlock in operation between the main operation unit and the auxiliary operation panel. 1 shows an operational interlock when an operation is performed on the process processing device 2-2 using the auxiliary operation panel 22 while the device operation is being performed by the main operation unit 11 in the device configuration shown in FIG. .

Before the operation of the process processor 2-2 is performed by the auxiliary operation panel, the main operation section 11 to the auxiliary operation panel 22
When the operation right of the process processing device 2-2 is passed to the user (110), only the operation of the process processing device 2-2 can be performed from the main operation unit 11 until the operation right is received from the auxiliary operation panel 22 (116). When the auxiliary operation panel 22 receives the operation right of the processing device 2-2 (104), the auxiliary operation panel 2
2 enables the operation of the process apparatus 2-2 (1).
08). When the operation of the process processor 2-2 on the auxiliary operation panel 22 is completed (110), the operation right of the process processor 2-2 is transferred from the auxiliary console 22 to the main console 11 (1).
12) and the auxiliary operation panel 22 from the processing device 2-2.
Cannot be operated (114). When the main operation unit 11 receives the operation right of the process processing device 2-2 (116), the operation of the process processing device 2-2 can be performed on the main operation unit 11 (118). The operation for all the processing apparatuses is enabled (120).

As can be seen from the above description, the process processing apparatus which cannot be used for the operation due to a failure or the like and which is not used for the repair or maintenance (including the flawless machine cleaning) is stored in the operation information signal storage means 17. Since the apparatus control means proceeds with the operation by referring to this information, the apparatus control means does not carry the apparatus to the process processing apparatus set to be invalid. In addition, in the process processing apparatus set to be invalid, in order to perform repair, maintenance, and cause of a defect, an operator performs a maintenance operation in parallel with the ongoing wafer processing during the automatic operation from the apparatus instead of the machine side of the apparatus. The apparatus can be operated in a remote state (for example, a flat-screen cleaning process, a gas-line exhaust process, and a push-up / down operation of a wafer flasher). In addition, when the operation input for the repair, maintenance, and the cause of the trouble is performed on the process processing apparatus set to be invalid on the apparatus side, the above-mentioned auxiliary operation panel 22 is used.
Will be used. By the way, in a normal production line, the atmospheric transfer device 6 shown in FIG. 1 is provided on the transfer processing device 1 on the clean room side, and the process processing devices 2-1 to 2-4 are installed on the maintenance room side. Is separated by a rotation,
From one side to the other, visibility may not be sufficient. The auxiliary operation panel 22 is also connected to the main control unit 11, but the auxiliary operation panel 22 is usually separated from the main control unit 11 and may be operated by a different person. In such a case, if the operation can be performed by either operation unit, a safety hazard may occur to the operator who operates, especially when the operation is performed using the auxiliary operation panel 22 on the machine side. since it is considered, when performing an operation to process treatment unit in the machine side using the auxiliary operation panel 22 in order to prevent the accidents (e.g. up / down operation of the wafer push-up) is the equipment in the main control unit 11 The operation interlock shown in FIG. 13 is applied so that the above operation cannot be performed.

With the above contents, it is possible to perform processing using a processing chamber not used for the processing during the automatic operation and to operate the processing chamber, thereby performing the single lung operation.

[0076]

As described above, according to the present invention,
When a certain process processing unit becomes unusable during operation due to a failure or the like, or when starting operation with a process processing unit that needs repair or maintenance at the start of operation,
When the operation of a certain processing unit is interrupted during operation and the operation of the previously interrupted processing unit is resumed during operation with another valid processing unit, the operation of the unit is continued. By making it possible to continue the operation, in a vacuum processing apparatus composed of a plurality of process processing apparatuses for performing a process processing and a transfer processing apparatus for transferring a wafer, any one of a plurality of processing chambers is used. Even if it becomes unusable due to a failure or the like, operation can be continued, and even if there is a process processing device that needs to be repaired or maintained at the start of operation, operation can be performed using a normal process processing device, improving the operation rate of the device can do. In addition, when the abnormal processing chamber is restored in parallel with the normal operation for normal wafer processing, or when the maintenance work that is periodically performed is performed on the machine side, the processing gas is incorrectly operated and the processing gas is removed. It is an object of the present invention to provide a vacuum processing apparatus that can ensure the safety of an operator by preventing harm to the operator so as not to cause an electric shock due to flowing or accidental turning on of a discharge power supply.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a vacuum processing apparatus according to the present invention.

FIG. 2 is a plan view showing another embodiment of the vacuum processing apparatus according to the present invention.

FIG. 3 is a flowchart of a cleaning operation according to the present invention.

FIG. 4 is a control configuration diagram of an apparatus control unit in the vacuum processing apparatus of the embodiment of FIG. 1;

FIG. 5 is a diagram showing an operation information signal of a device control unit in the vacuum processing device of the embodiment of FIG. 1;

FIG. 6 is a diagram showing processing order information of an apparatus control unit in the vacuum processing apparatus of the embodiment of FIG. 1;

FIG. 7 is a flowchart of an automatic operation of an apparatus control unit in the vacuum processing apparatus according to the embodiment of FIG. 1;

FIG. 8 is a flowchart showing details of the automatic operation flow of FIG. 7;

9 is a diagram showing an operation state of the vacuum processing apparatus of the embodiment of FIG. 1 at the time of automatic operation restart processing after occurrence of an abnormality.

FIG. 10 is a diagram showing an operation state of a processing device operation disconnection process during automatic operation in the vacuum processing device of the embodiment of FIG. 1;

11 is a diagram showing a state change at the time of pilot cassette processing during automatic operation in the vacuum processing apparatus of the embodiment of FIG. 1;

FIG. 12 is a configuration diagram for separating a processing apparatus in a vacuum processing apparatus.

FIG. 13 is a flowchart showing an interlock in operation between the main operation unit and the auxiliary operation unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Conveyance processing apparatus, 2-1, 2,3,4 ... Process processing apparatus, 3,3A ... Route lock chamber, 4,4A ... Unroto lock chamber, 5 ... Vacuum robot, 6 ... Atmosphere transfer apparatus, 7 ... Cassette, 8 atmospheric robot, 11 main control unit, 12 central control unit, 13 display unit, 14 input unit, 15 unit control unit, 16 processing order information storage unit, 17 operation information signal storage unit , 19-1, 2, 3,
4 ... operation information signal generating means, 20, 21 ... communication means, 2
2 ... Auxiliary operation panel, 23 ... Central control means, 24 ... Terminal control means, 25 ... Input means, 26 ... Display means, 27, 28 ...
Breaker, 29, 30 ... manual valve.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuhiro Jio 794, Higashi-Toyoi, Kazamatsu City, Yamaguchi Prefecture Hitachi Techno Engineering Co., Ltd. 794 Hitachi Techno Engineering Co., Ltd. Kasado Office (72) Inventor Tetsuya Tahara 794 Kazamatsu, Kudamatsu City, Yamaguchi Prefecture Hitachi Techno Engineering Co., Ltd. Kasado Office (72) Inventor Shoji Okiguchi Yamaguchi Prefecture Kadamatsu City, 794 Higashi-Toyoi, Hitachi Techno Engineering Co., Ltd.

Claims (27)

[Claims] 1. A transport processing apparatus comprising: a plurality of process processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling the transport processing apparatus. A method of operating a vacuum processing apparatus which is attached and performs wafer processing using the two or more processing apparatuses, wherein each of the processing apparatuses performs a state determination of whether the operation is enabled or disabled, and a process in which the operation is disabled based on the determination. A method for operating a vacuum processing apparatus, comprising: disconnecting a processing apparatus, transferring a wafer to an operation-enabled processing apparatus using the transfer processing apparatus, and performing wafer processing using only the operation-enabled processing apparatus. . 2. The method according to claim 1, wherein an operation instruction can be given to a process processing apparatus which is inoperative during continuous operation in which a process processing apparatus which is operationally effective is incorporated in a processing path. Method of operating a vacuum processing apparatus. 3. A method for operating a vacuum processing apparatus according to claim 1, wherein the apparatus is operated from two or more operation units. 4. An apparatus according to claim 3, wherein the operation unit for operating the apparatus is operated from one or more locations on each of a maintenance side of the apparatus and a non-maintenance side of the apparatus. Method of operating a vacuum processing apparatus. 5. An apparatus according to claim 4, wherein when the operation section on the maintenance side of the apparatus is operated as an operation section capable of operating the apparatus, the apparatus is operated on the operation section on the non-maintenance side of the apparatus. An operation method of a vacuum processing apparatus, wherein the operation is not performed. 6. A transport processing apparatus comprising: a plurality of process processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling these wafers. A method of operating a vacuum processing apparatus mounted and processing a wafer using the two or more processing apparatuses, comprising: a processing apparatus that processes the wafer according to a processing mode of the wafer and a state of each processing apparatus. Maintaining selected and unselected process processing devices, performing maintenance, transferring the wafers to the selected process processing device using the transfer processing device, and performing wafer processing with the selected process processing device. Operating method of vacuum processing equipment. 7. A transport processing apparatus comprising a plurality of processing apparatuses for performing a process processing, a transport processing apparatus for transporting a wafer, and a control device for controlling these wafers. A method of operating a vacuum processing apparatus which is attached and performs wafer processing using the two or more processing apparatuses, wherein each of the processing apparatuses performs a state determination of whether the operation is enabled or disabled, and a process in which the operation is disabled based on the determination. The processing apparatus is cut off, the wafer is transferred to the operation-enabled processing apparatus using the transfer processing apparatus, and the wafer processing is automatically operated using only the operation-enabled processing apparatus. An operation method of a vacuum processing apparatus, wherein a maintenance operation is performed by interlocking a process processing apparatus from outside. 8. A transport processing apparatus comprising: a plurality of process processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling the wafers. A method of operating a vacuum processing apparatus, which is attached and performs wafer processing using the two or more processing apparatuses, collects a processed wafer after completion of wafer processing in each of the processing apparatuses into a cassette, and uses the transfer processing apparatus. Transferring the cleaning dummy wafer into the processing apparatus, performing a cleaning process in the processing apparatus, collecting the dummy wafer into a cassette after the cleaning processing, and performing wafer processing in the processing apparatus. Method of operating a vacuum processing apparatus. 9. A transport processing apparatus comprising: a plurality of process processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling these wafers. A method of operating a vacuum processing apparatus mounted and processing a wafer using the two or more processing apparatuses, wherein each of the processing apparatuses collects a processed wafer after completion of the wafer processing into a cassette, and a cleaning dummy. A method of operating a vacuum processing apparatus, comprising: performing a cleaning process in the processing apparatus without using a wafer; and performing a wafer process in the processing apparatus. 10. A transport processing apparatus comprising: a plurality of process processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling the transport processing apparatus. Attached, said 2
A method of operating a vacuum processing apparatus that performs wafer processing using one or more processing apparatuses, wherein the number of wafers processed in each of the processing apparatuses is set to a preset number every time the processing is completed, and the cleaning is performed using the transfer processing apparatus. Transferring the dummy wafer for use into the processing apparatus, performing a cleaning process in the processing apparatus, collecting the dummy wafer after the cleaning processing into a cassette, and performing wafer processing in the processing apparatus. Operating method of vacuum processing equipment. 11. A transport processing apparatus comprising: a plurality of processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling the plurality of processing apparatuses. Attached, said 2
A method of operating a vacuum processing apparatus for performing wafer processing using one or more processing apparatuses, wherein each of the processing apparatuses sets a predetermined number of wafers to be processed, and does not use a cleaning dummy wafer every time the processing is completed. Performing a cleaning process in the processing apparatus, and performing a wafer process in the processing apparatus. 12. A transport processing apparatus comprising: a plurality of processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling the plurality of processing apparatuses. Attached, said 2
A method of operating a vacuum processing apparatus for processing a wafer using one or more processing apparatuses, wherein the processed wafers are collected in a cassette after the wafer processing is completed in each of the processing apparatuses, and the number of cassettes is equal to a preset number of cassettes. Each time the processing is completed, the cleaning dummy wafer is transported into the processing apparatus using the transport processing apparatus, the cleaning processing in the processing apparatus is performed, and the dummy wafer after the cleaning processing is collected in a cassette. An operation method of a vacuum processing apparatus, wherein wafer processing is performed by the processing apparatus. 13. A transport processing apparatus comprising: a plurality of processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling the transport processing apparatus. Attached, said 2
A method of operating a vacuum processing apparatus for processing a wafer using one or more processing apparatuses, wherein aging processing is performed without using a dummy wafer in the processing apparatus before starting wafer processing in the cassette. After that, a wafer processing is performed by the process processing apparatus. 14. A transport processing apparatus comprising a plurality of processing apparatuses for performing a process, a transport processing apparatus for transporting a wafer, and a control device for controlling the plurality of processing apparatuses. Attached, said 2
A method of operating a vacuum processing apparatus for processing a wafer using one or more processing apparatuses, comprising: transferring a dummy wafer into the processing apparatus using the transfer processing apparatus before starting wafer processing of the cassette. Performing aging processing in the processing apparatus, collecting the dummy wafers after the aging processing in a cassette, performing the aging processing for a predetermined number of sheets, and then performing wafer processing in the processing apparatus. Method of operating a vacuum processing apparatus. 15. A transport processing apparatus comprising: a plurality of process processing apparatuses for performing a process processing; a transport processing apparatus for transporting a wafer; and a control device for controlling them. Attached, said 2
In a vacuum processing apparatus for processing a wafer using one or more processing apparatuses, processing order information storage means for storing a processing order of wafers in the vacuum processing apparatus, and operation of each processing apparatus is enabled or disabled. Operation information signal generating means for generating an operation information signal indicating that the operation is in progress, operation information signal storage means for storing an operation information signal indicating that the operation of each process processing device is enabled or disabled, processing order information and each operation A vacuum processing apparatus comprising: an apparatus control unit that performs a matching process on an information signal, disconnects a process processing apparatus that is inoperative, and continues operation using only the process processing apparatus that is active. 16. An apparatus according to claim 15, wherein the operation information signal generating means for generating each operation information signal indicating that the operation of each process processing apparatus is valid or invalid is provided by an apparatus power supply of each process processing apparatus. A vacuum processing apparatus using a shutoff signal. 17. An apparatus according to claim 15, wherein said operation information signal generating means for generating each operation information signal indicating that the operation of each process processing device is valid or invalid is provided as an operation enable or disable operation of each process processing device. A vacuum processing apparatus using an operation switching signal for setting operation invalidation. 18. An apparatus according to claim 15, wherein the operation information signal generating means for generating each operation information signal indicating that the operation of each process processing apparatus is valid or invalid is provided as an operation enable or disable operation of each process processing apparatus. A vacuum processing apparatus using an operation control signal indicating operation invalidation. 19. The apparatus according to claim 15, wherein each operation information signal indicating that the operation of each process processing apparatus is valid or invalid is set before the apparatus starts operation. Vacuum processing equipment. 20. The vacuum apparatus according to claim 15, wherein the operation information signal indicating that the operation of each of the process processing apparatuses is valid or invalid is set during the operation of the apparatus. Processing equipment. 21. The apparatus according to claim 20, wherein each operation information signal indicating that the operation of each process processing apparatus is valid or invalid is set during the operation of the apparatus, and the time is set during the operation of the apparatus. A vacuum processing apparatus wherein the operation is interrupted, and after the recovery, the process processing apparatus which has been disabled is set to be operation enabled, so that the processing apparatus is incorporated into a processing path and wafer processing is continued. 22. The apparatus according to claim 20, wherein each of the operation information signals indicating that the operation of each process processing apparatus is valid or invalid is set during the operation of the apparatus. The operation is interrupted, and another process or the same process as the process performed before the interruption is performed by using the process processing apparatus used for the wafer processing,
After the other or the same processing is completed, the vacuum processing apparatus restarts the interrupted wafer processing and continues the wafer processing. 23. The apparatus according to claim 15, wherein an operation instruction can be given to a process processing apparatus which is inoperative during continuous operation in which a process processing apparatus which is operationally effective is incorporated in a processing path. Vacuum processing equipment. 24. The vacuum processing apparatus according to claim 15, further comprising two or more operation units capable of operating the apparatus. 25. The vacuum processing apparatus according to claim 24, wherein at least one operation unit capable of operating the apparatus is provided on each of a maintenance side of the apparatus and a non-maintenance side of the apparatus. 26. An apparatus according to claim 25, wherein when the operation section for operating the apparatus is operated by the operation section on the maintenance side of the apparatus, the device is operated by the operation section on the non-maintenance side of the apparatus. A vacuum processing apparatus characterized in that it is configured so as not to be able to do so. 27. The method according to claim 15, wherein during a continuous operation in which a process processing device that is operationally effective is incorporated in the processing path and maintenance is performed on the process processing device that is operationally ineffective, A vacuum processing apparatus characterized in that work can be performed on the machine side of the apparatus.