JP4121480B2 - Vacuum processing method and vacuum processing apparatus - Google Patents

Description

The present invention relates to a processing method and a processing apparatus that include two or more process processing apparatuses that perform process processing and a transfer processing apparatus that transfers a wafer, and perform processing using at least two or more process processing apparatuses.

For example, in a system in which a processing chamber is connected to a transfer chamber as shown in Patent Documents 1, 2, and 3, conventional apparatuses execute different wafers simultaneously in different processing chambers, or two wafers sequentially. The present invention relates to an apparatus capable of processing via the above processing chamber and its transfer.
JP 63-133532 A JP-A-63-252439 JP-A-63-129641

In the above prior art, when two or more process processes are performed, a wafer is transferred to two or more process chambers via a transfer path in a vacuum atmosphere, and each process chamber has its own process. By applying this method, an apparatus configuration and a transport method for performing a plurality of processes in a vacuum without being exposed to atmospheric conditions have been devised.

By the way, in the prior art, during operation that uses two or more processing chambers as processing paths, when one of the processing chambers cannot be used due to a failure or the like, processing is continued using a normal processing chamber. Driving was not considered.

Further, even when there is a processing chamber that needs to be repaired at the start of operation, a method for operating the apparatus using only a normal processing chamber has not been considered.

In addition, two or more processing chambers are used as processing paths, and the operation is temporarily suspended during operation, and priority is given to interrupt processing using a processing chamber that has not been used as the processing path for the operation until the operation is interrupted. However, the method of driving to continue the process that was temporarily interrupted after the interruption process was completed was not considered.

In addition, a method for instructing operation of equipment in a processing chamber that is not used in the processing path of the operation during operation using two or more processing chambers as a processing path has not been considered. In addition, it has not been considered to ensure operational safety when operating instructions for processing chamber equipment not used in the processing path of the operation are performed by an operating section that is normally operated and an operating section that is located remotely. .

As described above, the conventional technology considers operation when the processing chamber is in a normal state.
About operation when the treatment room cannot be used due to an abnormality, interrupt processing, operation suspension during operation, resume operation from suspended state, operation of the treatment room that is not used for the treatment path during operation, operation, etc. For example, if the same type of processing chamber is connected, the operation method of the device to continue operation using the other normal processing chamber is not considered, and the device has a low operating rate. It was.

The present invention is a vacuum processing apparatus that includes two or more process processing apparatuses that perform process processing and a transfer processing apparatus that transfers a wafer, and performs processing using at least two or more process processing apparatuses.
1) During operation using two or more processing chambers as processing paths, operation can be continued even if any of the processing chambers cannot be used due to a failure, etc.
2) When there is a process processing device that needs to be repaired, it can be operated using only a normal processing chamber as a processing path, and 3) Operation is temporarily interrupted during operation, and resumed operation and operation from an interrupted state. The operation that was interrupted during the operation, interrupt processing using the processing chamber that was not used as the processing path for that operation until the operation was interrupted, and the processing that was temporarily interrupted after the interrupt processing ended 4) During operation using two or more processing chambers as processing paths, operation instructions can be given to equipment in processing chambers that are not used in the processing path of the operation. When operating instructions for equipment in a processing chamber that is not used in the processing path, or when using an operating section that is remote from the operating section that gives normal operating instructions, it is possible to ensure operational safety. You It makes is to provide a vacuum processing apparatus capable of improving the operating rate of the apparatus.

To achieve the above object, a plurality of vacuum processing chambers for vacuum processing of wafers, vacuum transfer means for loading / unloading wafers into / from each vacuum processing chamber, and air for loading / unloading wafers into / from each vacuum processing chamber A chamber that can be switched to an atmosphere or a vacuum atmosphere, a cassette placing means that can place a plurality of cassettes that can store wafers, and a wafer that can be removed from any cassette on the cassette placing means. The wafer in the arbitrary cassette is transferred into the vacuum processing chambers operated in parallel via the transfer means, the switchable chamber, and the vacuum transfer means, and vacuum processed in each vacuum processing chamber. In a vacuum processing apparatus configured with a control unit that performs transfer control for unloading a processed wafer,
At least two cassettes are used, and wafers stored in the cassette are transferred to each of the vacuum processing chambers for each cassette via the transfer means, the switchable chamber, and the vacuum transfer means, and the transferred wafers And parallel processing for performing different processing by applying different recipes to the vacuum processing chambers operated in parallel, and vacuum processing operated in parallel on wafers stored in the cassette using at least two cassettes. Applying a common recipe to the chamber and selectively performing any one of the parallel processes for performing a common process and returning the wafer after the parallel process to the original cassette through the switchable chamber, And all the wafer processing in one cassette is complete | finished, the wafer in the other cassette is carried out and the said process is continued during cassette replacement | exchange.

According to the present invention, when a process processing device cannot be used due to a failure or the like during operation, or when the operation is started with a process processing device that needs repair or maintenance at the start of operation, When the operation of a certain process processing device is interrupted and another process processing device is being used and the process processing device that was previously interrupted is restarted, the operation is continued by taking measures to continue the operation of the device. In a vacuum processing system consisting of multiple process processing devices that perform process processing and transfer processing devices that transfer wafers, one of the multiple processing chambers has failed. Operation can be continued even if it becomes unusable, etc., and even if there is a process processing device that needs to be repaired or maintained at the start of operation, it can be operated using a normal process processing device. It is possible to improve the operating rate of the apparatus.

  An embodiment of the present invention is shown in FIGS.

FIG. 1 shows an embodiment in which a process processing apparatus is connected to a transfer processing apparatus in four chambers, and a cassette for carrying a wafer into the processing apparatus is installed in an atmospheric transfer apparatus installed in front of the processing apparatus main body.
The apparatus block diagram which takes out one by one from this cassette and carries it in to a processing apparatus is shown. Four or more process processing apparatuses may be connected. Reference numeral 1 denotes a transfer processing apparatus that transfers a wafer, and processes the wafers in the load lock chamber in accordance with the wafer transfer schedule.
The wafer transferred to 2-4 and processed by the process processing apparatus is transferred to the next process processing apparatus, and the wafer after completion of all the process processing is transferred to the unload lock chamber. 2-1 to 2
Reference numeral -4 denotes a process processing apparatus that performs process processing. Etching as process treatment,
This includes all wafer processing such as post-processing, film formation, sputtering, CVD, and water washing. 3 is a load lock chamber, a chamber for carrying wafers in the atmospheric transfer device 6 into the transfer processing device, 4 is a chamber for unloading lock chambers and carrying out wafers in the vacuum processing chamber to the atmospheric transfer device 6, and 5 is transfer A vacuum robot installed in the processing apparatus for carrying wafers, 6 is an atmospheric transfer apparatus for installing cassettes containing wafers, and 7 is a cassette containing wafers to be processed. It is the cassette which accommodated the wafer for use. Denoted at 8 is an atmospheric robot for unloading the wafer in the cassette on the atmospheric transfer device from the cassette, loading it into the load lock chamber 3, and returning the wafer in the unload lock chamber 4 to the original cassette.

In normal operation, the operator installs the cassette 7-1 (or 7-2) in the atmospheric transfer device 6. Thereafter, the operation conditions are set using the display means 13 and the input means 14, and then the operation start instruction is given, whereby the wafer transfer starts and the process processing apparatus 2-1 (2-2).
To 2-4), processed, and returned to the original cassette. When all the wafers in the original cassette have been processed, a buzzer (not shown) is sounded to collect the cassette, the operator is notified of the cassette collection request, and the operator removes the cassette. still,
In setting the processing path, which is a part of the operating condition setting, the process processing apparatus used for the processing is set in the processing order of the wafer using a symbol of the process processing apparatus.

以下のこの運転モードの説明ではプロセス処理装置２ー２と２ー３は同一のプロセス処
理を（この実施例ではエッチング処理とする）、プロセス処理装置２ー１と２ー４は同一
のプロセス処理を（この実施例では後処理とする）するものとして説明する。またプロセ
ス処理の実施例としては、プロセス処理装置２ー２または２ー３を使ったエッチング処理
を行った後、プロセス処理装置２ー１と２ー４を使った後処理を行うものとする。またウ
エハの処理条件によってはエッチング処理のみであっても良い。 The wafer processing sequence is shown in Table 1 as operation modes.

In the following description of this operation mode, the process processing apparatuses 2-2 and 2-3 perform the same process processing (in this embodiment, etching process), and the process processing apparatuses 2-1 and 2-4 perform the same process processing. Will be described as post-processing in this embodiment. As an example of the process processing, it is assumed that after the etching process using the process processing apparatus 2-2 or 2-3 is performed, the post-processing using the process processing apparatuses 2-1 and 2-4 is performed. Further, depending on the processing conditions of the wafer, only the etching process may be performed.

1) 1 cassette 1 recipe parallel operation The lowermost or uppermost wafer in the cassette in which the wafers to be processed under the same process processing conditions (hereinafter referred to as recipes) are extracted and transferred from the cassette in order. It is carried into a processing device and processed. The wafer is etched by the process processing apparatus 2-2, then processed by the process processing apparatus 2-1 and then returned to the original cassette (this path A), and etched by the process processing apparatus 2-3. The post-processing apparatus 2-4 performs post-processing and performs processing using both of the paths that return to the original cassette (this path B).

The processing order in this embodiment is as follows: path A: cassette C1 → process processing device 2-2 → process processing device 2-1 →
Set C1
Path B: Cassette C1 → Process processing device 2-3 → Process processing device 2-4 → C
Set C1
The combination of
Path C: Cassette C1 → Process processing device 2-2 → Process processing device 2-4 → C
Set C1
Path D: Cassette C1 → Process processing device 2-3 → Process processing device 2-1 → C
Set C1
It may be a combination of

Wafer processing is route A for the first wafer, route B for the second wafer, route A for the third wafer.
The fourth wafer is processed in the order of path B,... Up to the last wafer in the cassette. When all the processing in the C1 cassette is completed, a buzzer not shown in this figure is sounded to notify the operator of the completion of processing of the C1 cassette and cassette replacement. If the C2 cassette has been installed by this time, the process proceeds to the C2 cassette following the end of the process of the C1 cassette. The C2 cassette is processed in the same order as in the case of the C1 cassette. When all the processing in the C2 cassette is completed, a buzzer not shown in this figure is sounded to notify the operator of the completion of the C2 cassette processing and the cassette replacement. If the C1 cassette has been installed by this time, the process proceeds to the C1 cassette processing after the end of the processing of the C2 cassette. Thereafter, this operation cycle is repeated.

When ending this operation, the operation is ended by inputting an operation end operation from the main control unit 11.

  There are the following five modes as methods for terminating the processing.

A) Wafer supply stop: Stops wafer removal from the cassette being processed.
(If you are operating two cassettes as one lot, whichever cassette you specify?
The wafer removal is stopped. )
B) Stop cassette supply: After all wafers in the cassette currently being processed are processed,
The processing of the cassette that has been installed before the end of the processing is stopped.
(If two cassettes are operated as one lot, after processing all the wafers in the specified cassette, processing of the cassettes installed up to that point is in progress.
Stop. )
C) Cycle stop: End of process processing, exhaust, leak, transfer, etc. currently being executed
Then stop on the spot.
D) Processing chamber pause: Stops the specified processing chamber after the current processing is complete
To do. In this case, restart the operation from the state where it was temporarily stopped by the restart operation.
Can. Only the processing chamber can be manually operated.

    E) Immediate stop: Immediately stop all running operations.

  Any method may be used to terminate the processing.

2) Two-cassette one-recipe parallel operation The lowermost wafer or the uppermost wafer in the cassette containing wafers to be processed under the same process processing conditions (recipe) is sequentially extracted from the cassette and loaded into a transfer processing apparatus for processing. Is.

In this case, the operation for extracting the process from the cassette and carrying it into the transport processing apparatus is different from the above-described “one cassette / one recipe parallel operation”.
In the case of the “one cassette / one recipe parallel operation”, the wafers are sequentially extracted from the same cassette, loaded into the transfer processing apparatus, processed, and after all the wafers in the cassette are finished, the wafers in the next cassette are processed. However, in this “two-cassette / one-recipe parallel operation”, wafers are alternately extracted from the cassette C1 and the cassette C2 and loaded into a transfer processing apparatus to perform process processing. The wafer processing path is the same as in the case of the “one cassette / one recipe parallel operation” described above, the etching process is performed by the process processing apparatus 2-2, the post-processing is performed by the process processing apparatus 2-1, and the original cassette is returned to the original cassette. Processing is performed using both (this path A) and a path (called this path B) that is etched by the process processing apparatus 2-3 and then post-processed by the process processing apparatus 2-4 and returned to the original cassette. .

The processing order routes A and B or routes C and D in this embodiment are the same as those in the case of the “one cassette one recipe parallel operation”.

For wafer processing, the first wafer is route A from the C1 cassette and the second is C2.
The first sheet from the cassette is route B, the third wafer is the second sheet from the C1 cassette, the path A,
For the fourth sheet, the second sheet from the C2 cassette is processed to the last wafer in the cassette in the order of path B,. When all of the C1 or C2 cassette is processed, C1 (or C2
) A buzzer not shown in this figure is sounded to notify the operator of the completion of cassette processing and cassette replacement. Until the completed cassette is removed and a new cassette is installed, only the processing on the other cassette side is continued. When a new cassette is installed, the wafers are alternately extracted from the C1 and C2 cassettes as described above and loaded into the transfer processing apparatus to carry out the process. Thereafter, this operation cycle is repeated. When ending this operation, the operation is ended by inputting an operation end operation from the main control unit 11. The end method is the same as in the case of the “one cassette / one recipe parallel operation”.

3) Two-cassette two-recipe parallel operation This operation is the same as the “two-cassette one-recipe parallel operation” except that the wafer processing recipes of the C1 cassette and the C2 cassette are different.

4) 1 cassette 1 recipe serial operation In this operation, the wafers to be processed under the same process processing conditions (recipe) are sequentially extracted from the lowest or uppermost wafer in the cassette and loaded into the transfer processing device. Process processing is the same as in the case of “one cassette / one recipe parallel operation”. However, the wafer processing path is different from that in the “one cassette / one recipe parallel operation”.

In this “one cassette one recipe serial operation”, the wafer is etched by the process processing device 2-2 (or the process processing device 2-3), and then further processed by the process processing device 2-3 (or the process processing device 2-2). After the etching process, the process processing apparatus 2-1 (or the process processing apparatus 2-4) performs the post-processing and returns to the original cassette (this path E).

The wafer processing is route E for the first wafer, route E for the second wafer, and route E for the third wafer.
The fourth wafer is processed up to the last wafer in the cassette in the order of path E,. When all the processing in the C1 cassette is completed, a buzzer not shown in this figure is sounded to notify the operator of the completion of processing of the C1 cassette and cassette replacement. If the C2 cassette has been installed by this time, the process proceeds to the C2 cassette following the end of the process of the C1 cassette. The C2 cassette is processed in the same order as in the case of the C1 cassette. When all the processing in the C2 cassette is completed, a buzzer not shown in this figure is sounded to notify the operator of the completion of the C2 cassette processing and the cassette replacement. If the C1 cassette has been installed by this time, the process proceeds to the C1 cassette processing after the end of the processing of the C2 cassette. Thereafter, this operation cycle is repeated.

When ending this operation, the operation is ended by inputting an operation end operation from the main control unit 11. The end method is the same as in the case of the “one cassette / one recipe parallel operation”.

Further, when the apparatus is maintained, maintenance can be performed on the machine side of the apparatus using the display means 26 and the input means 25 in the auxiliary operation panel 22. The auxiliary operation panel 22 is a portable operation terminal (for example, a notebook personal computer), which is carried close to the device, and device information (for example, ON / OFF information of input / output bits, etc.) displayed on the display means 26 while visually checking the device state. Error information, etc.) can be utilized for maintenance and maintenance operations, and the operability of maintenance and maintenance is improved. This auxiliary operation panel 22 has the same function as the main control unit 11, but in order to ensure safety for the operator, only one of them can be operated when operating the main control unit 11 and the auxiliary operation panel 22 at the same time. An erroneous operation prevention function is provided to prevent input.

FIG. 2 shows another embodiment. The process processing apparatus is connected to four chambers in the transfer processing apparatus, and a cassette for carrying wafers into the processing apparatus is installed in a load lock chamber in the processing apparatus main body. The apparatus block diagram which carries out one sheet at a time and carries in to a processing apparatus is shown. More process processing devices may be connected. As an apparatus configuration, the atmospheric transfer apparatus 6 and the atmospheric robot 8 for installing a cassette containing wafers are deleted from the configuration shown in FIG. The functions and configurations of each device are the same as those in FIG. 1 except that the wafers are unloaded from the load lock chamber 3 and stored in the cassette is the unload lock chamber 4. In operation mode,
1) 1 cassette 1 recipe parallel operation The lowermost wafer or the uppermost wafer in the cassette containing the wafers to be processed under the same process processing conditions (recipe) is sequentially extracted from the cassette and loaded into the process processing apparatus for processing. Is. The wafer is subjected to an etching process in the process processing apparatus 2-2, followed by a post-process in the process processing apparatus 2-1 and returned to the original cassette (referred to as this path A).
Then, the etching process is performed by the process processing unit 2-3, and the post-processing is performed by the process processing unit 2-4, and the process is performed using both paths (referred to as the path B) for returning to the original cassette.

The processing order in this embodiment is as follows: Path A: Load-lock indoor cassette → Process processing device 2-2 → Process processing device
2-1 → Unload lock indoor cassette Path B: Load lock indoor cassette → Process processing equipment 2-3 → Process processing equipment
Station 2-4 → Unload lock indoor cassette or
Path C: Load lock indoor cassette → Process processing device 2-2 → Process processing device
2-4 → Unload lock indoor cassette Path D: Load lock indoor cassette → Process processing equipment 2-3 → Process processing equipment
A combination of 2-1 → unload lock indoor cassette may be used. In the above processing sequence, the processed wafers are returned to the unload lock chamber cassette, but can be returned to the load lock chamber cassette from which the wafers were taken out.

In the present embodiment, an example of processing in which the wafers extracted from the cassette in the load lock chamber in parallel with the routes A and B is returned to the cassette in the unload lock chamber is shown. Wafer processing is route A for the first wafer, route B for the second wafer, route A for the third wafer, route B for the fourth wafer,...
In this order, processing is performed up to the last wafer in the cassette.

When all processing in the load lock indoor cassette is completed, a buzzer not shown in this figure is sounded to notify the operator of the completion of processing of the load lock indoor cassette and the unload lock indoor cassette and cassette replacement. Next, a cassette containing a new unprocessed wafer is installed in the load lock chamber, and an empty cassette is installed in the unload lock chamber. Thereafter, this operation cycle is repeated. When ending this operation, the operation is ended by inputting an operation end operation from the main control unit 11. The end method is the same as in the case of the “one cassette / one recipe parallel operation”.

2) Two-cassette / one-recipe parallel operation A process of extracting from the cassette in order from the lowest or highest wafer in a cassette containing wafers to be processed under the same process processing conditions (hereinafter referred to as recipes). It is carried into a processing device and processed.

In the case of the “one cassette / one recipe parallel operation”, the wafers are sequentially extracted from the same cassette, loaded into the process processing apparatus, and the process processing is performed. After all the wafers in the cassette are completed, the wafers in the next cassette are processed. However, in this “two-cassette one-recipe parallel operation”, wafers are alternately extracted from the cassettes in the load lock chamber and the cassettes in the unload lock chamber and loaded into the process processing apparatus to perform process processing. The wafer processing path is
As in the case of “one cassette and one recipe parallel operation”, a path (hereinafter referred to as “path A”) for performing an etching process in the process processing device 2-2 and then performing a post-processing in the process processing device 2-1 to return to the original cassette; After the etching process by the process processing apparatus 2-3, the process processing apparatus 2-4 performs the post-processing and uses both of the paths (this path B) to return to the original cassette.

The processing order routes A and B or routes C and D in this embodiment are the same as those in the case of the “one cassette one recipe parallel operation”.

In the wafer processing, the first wafer is route A from the cassette in the load lock chamber.
The second sheet is the path B from the cassette in the unload lock chamber, the third wafer is the path A from the cassette in the load lock chamber, the fourth sheet is the cassette in the unload lock chamber The second wafer is processed up to the last wafer in the cassette in the order of path B,.

When all wafers in the load lock chamber or unload lock chamber cassette have been processed, a buzzer not shown in this figure is used to notify the operator of the completion of the processing in the load lock chamber (or unload lock chamber) and cassette replacement. Sound. Until the completed cassette is removed and a new cassette is installed, only the processing on the other cassette side is continued. When a new cassette is installed, the wafer is alternately extracted from the cassette in the load lock chamber and the unload lock chamber as described above, and is carried into the process processing apparatus to carry out the process processing. Thereafter, this operation cycle is repeated. When ending this operation, the operation is ended by inputting an operation end operation from the main control unit 11. The end method is the same as in the case of the “one cassette / one recipe parallel operation”.

3) Two-cassette / two-recipe parallel operation This operation is the same as the “two-cassette / one-recipe parallel operation” except that the wafer processing recipe differs between the cassette in the load lock chamber and the cassette in the unload lock chamber.

4) 1 cassette 1 recipe serial operation In this operation, the wafers to be processed under the same process processing conditions (hereinafter referred to as “recipes”) are processed in order from the lowest or highest wafer in the cassette. Extracting from the cassette and carrying it in to the process processing apparatus is the same as in the case of “one cassette / one recipe parallel operation”. However, the wafer processing path is different from that in the “one cassette / one recipe parallel operation”. In this “one cassette one recipe serial operation”, the wafer is etched by the process processing device 2-2 (or the process processing device 2-3), and then further processed by the process processing device 2-3 (or the process processing device 2-2). After the etching process, the process processing apparatus 2-1 (or the process processing apparatus 2-4) performs the post-processing and returns to the original cassette (this path E).

In this embodiment, an example of processing for returning the wafer extracted from the cassette in the load lock chamber to the cassette in the unload lock chamber by the path E is shown. The wafer is processed by the path E of the first wafer.
The second wafer is processed by the path E, the third wafer is processed by the path E, the fourth sheet is processed by the path E, and so on until the last wafer in the cassette is processed. When all the processing in the cassette is completed, a buzzer not shown in this figure is sounded to notify the operator of the completion and replacement of the load lock indoor cassette and the unload lock indoor cassette.

Next, a cassette containing a new unprocessed wafer is installed in the load lock chamber, and an empty cassette is installed in the unload lock chamber. Thereafter, this operation cycle is repeated. When ending this operation, the operation is ended by inputting an operation end operation from the main control unit 11. The end method is the same as in the case of the “one cassette / one recipe parallel operation”.

FIG. 3 shows a control configuration diagram. In this embodiment, the main control unit of the entire apparatus is shown mounted on the transport processing apparatus. Note that the main control unit of the entire apparatus may be other than the transport processing apparatus. The display unit 13 and the input unit 14 may be configured as a control unit different from the main control unit. Reference numeral 11 denotes a configuration of a main control unit that controls the entire apparatus. As the control means, only the portions corresponding to the claims of the present invention are extracted and described, and the input / output control portions (DI / O, AI / O) necessary for operating the device are described. Absent. Reference numeral 16 denotes processing order information storage means for storing the processing order of wafers in the processing apparatus. For example, RAM (Rando)
m Access Memory). The wafer processing order stores data input by the operator using the display means 13 and the input means 14 before the start of operation.

Reference numeral 17 denotes an operation information signal storage means for storing an operation information signal indicating that the operation of the process processing devices 18-1 to 18-4 is valid / invalid, for example, a RAM. Reference numeral 13 denotes a display means for displaying the operating state, the setting contents of the operating conditions, and the start instruction / end of the operation.
T. Reference numeral 14 denotes input means for performing setting of operating conditions, input of operation start instructions, process processing conditions, maintenance and maintenance operation input, and the like, for example, a keyboard. 15 determines an operation information signal state indicating that the operation of the process processing devices 18-1 to 18-4 is valid / invalid, and any of the process processing devices 18-1 to 18-4 is in an automatic operation. It is a device control means for storing a processing procedure for continuing operation using another process processing device without using the process processing device even when the operation becomes impossible. For example, ROM (Read Only Memory)
). 12 is a central control means for controlling the above 13 to 17, for example, CPU (C
central Processor Unit). Reference numerals 18-1 to 18-4 denote process processing apparatuses that perform wafer process processing. This processing apparatus may be any processing as long as it performs wafer processing such as etching, post-processing, film formation, sputtering, CVD, and water processing. Reference numerals 19-1 to 19-4 denote operation information signal generating means for generating an operation information signal indicating that the operation of the process processing devices 18-1 to 18-4 is valid / invalid. In this embodiment, it is provided in the process processing apparatus, but may be located anywhere. As means for generating this driving information signal,
1) Use the power supply shut-off signal of the process processing device 2) Use an operation switching signal (for example, a changeover switch) to set whether to enable / disable the use of the process processing device 3) Enable / disable the use of the process processing device Input information set and input by the operator can be used as the operation control signal to be shown.

Reference numerals 20 and 21 denote communication means for connecting the main controller 11 that controls the entire apparatus and the auxiliary operation panel 22. The auxiliary operation panels 22, 25, and 26 are used for the above-described purposes. Reference numeral 24 denotes terminal control means for storing processing procedures for controlling terminal functions on the auxiliary operation panel. 23 is 2 above
Central control means for controlling 1, 24 to 26, for example, CPU (Central P
processor unit).

FIG. 4 is a driving information signal diagram. Information indicating validity / invalidity of operation is stored for each process processing apparatus. In this case, 1 is displayed if it is valid, and 0 is displayed if it is invalid, but it may be a symbol or a number as long as it can be distinguished. This information is the driving information signal generating means 19-
The signal states 1 to 19-4 are reflected and stored in the operation information signal storage means 17.

FIG. 5 is a processing order information diagram. One of the operating condition settings is information in which the operator sets the order in which wafers are processed using the display means 13 and the input means 14 before the operation is started.

This information is stored in the processing order information storage means.

FIG. 6 shows an apparatus operation flowchart. Before starting operation, the operator determines whether there is a process processing apparatus configured as a processing apparatus that cannot be used for operation due to a failure or the like or is not used for maintenance (including plasma cleaning). (30). If there is a process processing apparatus that cannot be used (or is not used), the operation information signal generating means 19 is set so as to be in the state described in FIG. 4 (32). One way to do this is to
1) When using an apparatus power supply cutoff signal for a process processing apparatus, the apparatus power supply electromagnetic switch of the process processing apparatus is turned off. As a result, a shut-off signal is generated, transmitted to the operation information signal storage means 17, and stored as information described in FIG.

2) When using an operation switching signal (for example, a changeover switch) for setting whether or not the process processing device is used, the changeover switch assigned to the process processing device is set to a valid or invalid state. As a result, the switching signal is determined, transmitted to the driving information signal storage means 17, and stored as the information described in FIG.

3) When using the input information set and input by the operator as the operation control signal indicating the validity / invalidity of the use of the process processing apparatus, the operator inputs the setting information assigned to the process processing apparatus from the input unit 14. . As a result, the setting information is finalized, transmitted to the driving information signal storage means 17, and stored as the information described in FIG. After determining the device connection configuration, automatic operation is started (34).

The wafer processing order is set as product processing conditions as follows.

  1) Select a wafer operation mode.

"1 cassette 1 recipe parallel", "2 cassette 1 recipe parallel",
Select either "2 cassette 2 recipe parallel" or "1 cassette 1 recipe serial" 2) Set wafer transfer path.

For each cassette, the wafer processing path is set to parallel or series processing using the symbol of the processing apparatus. A typical setting example is shown below. (Wafer processing paths can be combined as described above)
2-1) For parallel processing:
C1: E1 → A1, C1: E2 → A2
C2: E1 → A1, C2: E2 → A2
E1: Process processing device 2-2, E2: Process processing device 2-3
A1: Process processing device 2-1, A2: Process processing device 2-4
2-2) For series processing:
C1: E1 → E2 → A1
C2: E2 → E1 → A2
3) A process processing condition (also called a process recipe) is set for each process processing chamber.

  After setting the above product processing conditions, start automatic operation start.

FIG. 7 shows an automatic operation flowchart. When the automatic operation is started, it is determined whether all the wafers to be processed have been transferred. If the transfer has been completed, the process ends. If transfer is necessary, the process proceeds to the automatic operation process (40). It is determined whether or not an abnormality or the like has occurred during automatic operation and the operation is temporarily suspended (42). If there is no abnormality, the operation is continued (to 44). If there is a process processing apparatus that cannot be used for operation, the operator determines whether the operation can be continued without using the process processing apparatus (70). If continuation is impossible, the operator performs automatic operation stop processing by setting the automatic operation to be stopped by the operator (90).

Even when continuation is possible, there are cases where a wafer remains in the process processing apparatus, a wafer remains on the hand of the vacuum robot, a wafer remains in the load lock chamber or the unload lock chamber, and the like.

In this way, abnormalities occur during automatic operation, and automatic operation cannot be continued, and automatic operation is resumed from the state where automatic operation was temporarily suspended. Is carried out to the original cassette. This is because the transfer / processing schedule for all wafers in the processing equipment is fixed when an abnormality occurs during automatic operation.
This is because if the wafer in the device in which the abnormality has occurred is not returned to the cassette 7 from which the wafer has been taken out, the wafer transfer / processing schedule will be out of order, and it will not be possible to resume the automatic operation from the temporarily interrupted state and continue the automatic operation. An example of the treatment of the wafer remaining in the processing apparatus is shown below. It is determined whether there is a remaining wafer in the apparatus (72). It is determined whether or not to etch the remaining wafer (74). If an abnormality occurs during the etching process among the wafers remaining in the processing chamber, after performing the remaining etching process (76), the wafer is returned to the original cassette (78). This is done to save the wafer as much as possible. If a wafer remains on the vacuum robot's wafer hand, or if a wafer remains in the load lock chamber / unload lock chamber, perform individual device operations (lock chamber exhaust / leak, wafer transfer). Then, the wafer is returned to the original cassette (78). As described above, the wafer in the apparatus in which an abnormality has occurred is subjected to necessary measures and returned to the original cassette, and then an operation for resuming the automatic operation that has been temporarily suspended is performed. By doing so, the tracking information of the wafer in the device (processing chamber, vacuum robot, etc.) where the abnormality has occurred becomes equivalent to that processed in the normal route, and automatic operation can be resumed. After the treatment of the wafer remaining in the processing apparatus as described above is performed, the operation information signal generating means switching operation same as the content shown in (32) of FIG. 80). The abnormality occurrence information is reset (82), and the automatic operation is continued.

In a normal operation state, the information stored in the processing order information storage unit 16 is read out for the next wafer transfer route (44), and is aligned with the information stored in the operation information signal storage unit 17, and the transfer route is set. Determine (46). The determined transfer route may have transfer route data for each wafer to be unloaded from the cassette. When a processing order information table different from the processing order information storage unit 16 is created and the wafer is transferred, this table You may make it refer to. When the transfer route is determined, the atmospheric robot 8 unloads the wafer from the cassette 7 (48), transfers it to the process processing apparatus registered in the determined transfer route (50), and processes the wafer (52). When an abnormality occurs in this wafer transfer process and process process, in order to continue the automatic operation, the process that can continue the process is executed until the individual process is finished,
Suspend automatic operation. (For example, if the Nth wafer is being etched,
The etching process is continued until the etching process of the Nth wafer is completed, and the automatic operation is temporarily interrupted when the etching process is completed. If an abnormality occurs in other processing during wafer transfer by the vacuum robot 5, the vacuum robot 5 temporarily stops the automatic operation when the wafer transfer to a predetermined place is completed. After the abnormality occurrence information (not shown) indicating that an abnormality has occurred is stored thereafter, the display means 13 displays that the apparatus has been temporarily suspended and the buzzer (not shown) is sounded. Thereafter, the process returns to (42) and processing is performed according to a predetermined flow.

FIG. 8 shows an automatic driving resumption processing diagram after occurrence of an abnormality. In the following, processing up to restarting automatic operation after an abnormality has occurred during automatic operation described in FIG. 7 will be described. Figure A shows the wafer transfer path in the operation mode of “1 cassette 1 recipe parallel operation” in Table 1.
C1: E1 → A1 and E2 → A2
C2: E1 → A1 and E2 → A2 are operated. In E2, the (N) th wafer is in the etching process, and in A1, the (N-1) th wafer is in the post-process, as shown in FIG. If an abnormality occurs at E2, the etching process is terminated, and the automatic operation is temporarily suspended without carrying out the (N−1) -th wafer of A1 after the completion of the post-processing. E
For the (N) th wafer in which an abnormality occurred in step 2, the treatments 76 and 78 in FIG. 7 are performed. Thereafter, for E2 and A2, the operation 1), 2) or 3) described in the description of FIG. 6 is performed as the switching operation by the operation information signal generating means 80 of FIG. 7, and the process processing apparatus as shown in FIG. 3 (E2), the operation information of the process processor 4 (A2) is set to “invalid: 0”. Thereafter, the abnormality occurrence information is reset (80 in FIG. 7), and the automatic operation is resumed. After restarting, the (N−1) -th wafer of A2 is transferred to the unload lock chamber 4 as shown in FIG. C, and thereafter the processing is continued using E1 and A1.

Next, with respect to the process processing device 3 (E2) and the process processing device 4 (A2) in which the operation information is set to “invalid: 0”, the process processing device 3 ( E2) An operation input for performing an apparatus operation on the process processing apparatus 4 (A2) can be performed. For example, a wafer push-up operation (not shown) in the process processing apparatus 3 (E2) is performed to confirm the operation.

By such an operation, the cause of the abnormality can be counteracted, and the process processing apparatus 3 (“invalid: 0”) (
E2) A procedure for returning the process processing apparatus 4 (A2) to the wafer processing path is shown below. Next, the automatic operation can be interrupted during the operation shown in FIG. C, and E2 and A2 separated from the processing path in the operation mode can be set to be valid, and the process can move to FIG.
Wafer transfer path in operation mode
C1: E1 → A1 and E2 → A2
C2: It can be operated in E1 → A1 and E2 → A2.

FIG. 9 shows a processing apparatus operation disconnection processing diagram during automatic operation. Hereinafter, a process of restarting the automatic operation after separating E2 and A2 from the automatic operation processing path during the automatic operation described in FIG. 7 will be described. FIG. A is the same as the operation route of FIG. In the operation mode of “1 cassette 1 recipe parallel operation” in Table 1, the wafer transfer path is
C1: E1 → A1 and E2 → A2
C2: E1 → A1 and E2 → A2 are operated, and in E2, the (N) th wafer is in the etching process, and in A1, the (N-1) th wafer is in the post-process, as shown in FIG. When the stop instruction is issued to E2 and A2 by the operation stop operation, the (N-1) th wafer of A1 is returned to the original cassette after the post-processing is completed, and the etching process of the (N) th wafer is performed. Is completed and conveyed to A2, and after completion of post-processing, it is returned to the original cassette. By the way, E2 and A2
Since the operation is stopped, the (N + 1) th and subsequent wafers continue to operate using E1 and A1.

In the above, separation was performed by issuing a stop instruction by operation stop operation as a means for separating E2 and A2 from the automatic operation processing path during automatic operation, but as another method, the function of the detector incorporated in the processing apparatus A stop instruction can also be issued. As an example, it is detected that the foreign matter measurement monitor value from the foreign matter monitoring device incorporated in the processing device exceeds the set value set before the operation, and with this excess signal, stop instruction is given to E2 and A2 during the automatic operation The same function as the stop operation can be performed by issuing.

The procedure for returning the separated process processing apparatus to the wafer transfer path is the same as the contents shown in FIG.

FIG. 10 shows a pilot cassette processing diagram. This is to perform interrupt express processing during automatic operation, and resume and continue the original processing after the end of the processing. In the automatic operation described below with reference to FIG. 7, a specific processing device (in this case, E2 and A2) is disconnected from the processing path of the current operating mode, and until then, using the disconnected E2 and A2 A process for interrupting and processing a cassette to be processed under a process processing condition different from the process processing condition that has been operated (this cassette is referred to as a pilot cassette) and then restarting and continuing the original automatic operation will be described. FIG. A is the same as the driving route in FIG. In the operation mode of “1 cassette 1 recipe parallel operation” in Table 1, the wafer transfer path is
C1: E1 → A1 and E2 → A2
C2: E1 → A1 and E2 → A2 are operated. In E2, the (N) th wafer in the C1 cassette is being etched, and in A1, the (N-1) th wafer in the C1 cassette is being post-processed. At this time, as shown in FIG. A, the automatic operation interruption operation is performed in order to execute the interrupt express processing using E2 and A2. When the stop instruction is issued to E2 and A2 by the operation stop operation, the (N-1) th wafer of A1 is returned to the original cassette after the post-processing is completed, and the (N) th wafer is etched. After completion of the post-processing, the sheet is returned to the original cassette.

By the way, since E2 and A2 are in an operation stop state, the (N + 1) th and subsequent wafers are E
Operation is continued using 1 and A1 (Figure C). During the operation using E1 and A1, the interrupt express processing cassette using E2 and A2 is placed in C2 (7-2) and the interrupt processing is started (Figure C). After all the wafers extracted from the C1 (7-1) cassette are processed and loaded into the C1 cassette, the operation using the E1 and A1 wafers in the C1 cassette is temporarily suspended, and the interrupt express processing cassette C2 Wafer processing is started (FIG. D). For the wafers in the C2 cassette, the process of E2 → A2 is performed in order and
Load it into the cassette. When the processing of the pilot cassette is finished, the interruption processing is finished and the operation of the temporarily suspended state is resumed, and the wafer processing is resumed from the suspended C1 (7-1) cassette (returns to the state of FIG. C). Next, the automatic operation is interrupted during the operation in the state returned to FIG. C, and E2 and A2 separated from the processing path in the operation mode are set to be valid, so that FIG.
The wafer transfer path can be changed in the operation mode.
C1: E1 → A1 and E2 → A2
C2: It can be operated in E1 → A1 and E2 → A2.

As can be seen from the above description, a process processing apparatus that cannot be used for operation due to a failure or the like or is not used for repair or maintenance (including plasma cleaning) is stored in the operation information signal storage means 17 and is controlled by the apparatus. The means refers to this information and proceeds with the operation, so that the means is not transferred to the process processing apparatus set as invalid. Further, in the process processing apparatus set as invalid, maintenance operations (for example, plasma cleaning processing, gas line exhaust processing, The wafer pusher can be pushed up / down. In this case, the above-described auxiliary operation panel 22 is used as an operation input for repair, maintenance and cause of failure on the machine side with respect to the process processing apparatus set as invalid. Incidentally, in the normal production line, the atmospheric transfer device 6 shown in FIG.
However, the transfer processing device 1 and the process processing devices 2-1 to 2-4 are installed on the maintenance room side, and the clean room side and the maintenance room side are partitioned by a partition, and from one side On the other hand, the field of view may not be sufficient. Auxiliary operation panel 2
2 is also connected to the main control unit 11, but the auxiliary operation panel 22 may be operated by a different person usually at a location away from the main control unit 11. In such a case, if it is possible to operate with either of the operation units, a safety disaster may be caused to the operating operator, particularly when operating with the auxiliary operation panel 22 on the machine side. Therefore, in order to prevent this disaster, when the auxiliary processing panel 22 is used to operate the process processing apparatus (for example, ascending / descending operation of the wafer push-up) on the machine side, the main control unit 11 controls the apparatus. Functionally interlocked to prevent operation.

With the above contents, it is possible to execute processing using a processing chamber not used for the processing and operation to the processing chamber during automatic operation.

It is a top view which shows one Example of the vacuum processing apparatus by this invention. It is a top view which shows the other Example of the vacuum processing apparatus by this invention. It is a control block diagram of the apparatus control means in the vacuum processing apparatus of one Example of FIG. It is a figure which shows the driving | operation information signal of the apparatus control means in the vacuum processing apparatus of one Example of FIG. It is a figure which shows the process order information of the apparatus control means in the vacuum processing apparatus of one Example of FIG. It is a flowchart of the automatic operation | movement of the apparatus control means in the vacuum processing apparatus of one Example of FIG. It is a flowchart which shows the detail of the automatic driving | running | working flow of FIG. It is a figure which shows the operation state at the time of the automatic operation resumption process after abnormality generation in the vacuum processing apparatus of one Example of FIG. It is a figure which shows the operation state of the processing apparatus driving | operation disconnection process in the automatic operation in the vacuum processing apparatus of one Example of FIG. It is a figure which shows the state change at the time of the pilot cassette process in automatic operation in the vacuum processing apparatus of one Example of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Transfer processing apparatus, 2-1, 2, 3, 4 ... Process processing apparatus, 3 ... Load lock chamber, 4
... unload lock chamber, 5 ... vacuum robot, 6 ... atmospheric transfer device, 7 ... cassette, 8 ... atmospheric robot, 11 ... main control unit, 12 ... central control means, 13 ... display means, 14 ... input means, 1
5 ... Device control means, 16 ... Processing order information storage means, 17 ... Driving information signal storage means, 18-
1, 2, 3, 4 ... process processing device, 19-1, 2, 3, 4 ... operation information signal generating means, 2
0, 21 ... communication means, 22 ... auxiliary operation panel, 23 ... central control means, 24 ... terminal control means, 2
5 ... input means, 26 ... display means.

Claims (2)

A plurality of vacuum processing chambers for vacuum processing of wafers, vacuum transfer means for loading / unloading wafers into / from the respective vacuum processing chambers, and switching to an air atmosphere or vacuum atmosphere for loading / unloading wafers into / from each of the vacuum processing chambers A cassette, a cassette mounting means capable of mounting a plurality of cassettes capable of storing wafers, a transfer means configured to extract a wafer from an arbitrary cassette on the cassette mounting means, and the arbitrary cassette For carrying the wafers inside into the vacuum processing chambers operated in parallel via the transfer means, the switchable chamber and the vacuum transfer means, and for carrying out the processed wafers vacuum-processed in the vacuum processing chambers. In a vacuum processing apparatus configured with a control means for carrying control,
At least two cassettes are used, and wafers stored in the cassette are transferred to each of the vacuum processing chambers for each cassette via the transfer means, the switchable chamber, and the vacuum transfer means, and the transferred wafers And parallel processing for performing different processing by applying different recipes to the vacuum processing chambers operated in parallel, and vacuum processing operated in parallel on wafers stored in the cassette using at least two cassettes. Applying a common recipe to the chamber and selectively performing any one of the parallel processes for performing a common process and returning the wafer after the parallel process to the original cassette through the switchable chamber, And all wafer processing in one cassette is finished, and during the cassette exchange, the wafer in the other cassette is unloaded and the processing is continued. That vacuum processing apparatus. A vacuum in which a wafer is extracted from an arbitrary cassette placed on the cassette placing means and transferred to a vacuum processing chamber operated in parallel via a chamber that can be switched to an air atmosphere or a vacuum atmosphere to perform vacuum processing of the wafer. In the processing method,
Using at least two cassettes, the wafer stored in the cassette is transferred via the transfer means, the switchable chamber and the vacuum transfer means, and the wafers transferred are operated in parallel. that vacuum processing chamber parallel processing to perform the application to different processing of different recipes for each, and using at least two cassettes, the wafers housed in the cassette, a common recipe the vacuum processing chamber which is the parallel operation Any one of the parallel processes for applying the common process is selectively applied, and the wafer after the parallel process is returned to the original cassette through the switchable chamber, and any of the cassettes A vacuum processing method characterized in that all of the wafers in the wafer are finished and the wafer in the other cassette is unloaded and the process is continued during the cassette exchange.

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