KR100492261B1 - Vacuum processing system and operating method of vacuum processing system - Google Patents

Abstract

The present invention relates to a vacuum processing apparatus comprising two or more process processing apparatuses for carrying out a process process and a conveying processing apparatus for carrying wafers, which can be operated even when any one of the two or more processing chambers cannot be used due to a failure or the like. In addition, when repair or maintenance is necessary at the start of operation, even if there is a process processing device, a single operation can be performed that can be operated using a normal process processing device without harming the operator by an incorrect operation. In addition, it is possible to improve the operation rate of the apparatus and at the same time ensure the safety of the operator. In addition, the cleaning dummy wafer is conveyed into the process processing apparatus by using the transfer processing apparatus, the cleaning processing in the process processing apparatus is performed, and after the cleaning process is completed, the dummy wafer is collected into a cassette and the wafer processing is continued with the process processing apparatus. Can be done.

Description

Vacuum processing system and operating method of vacuum processing system}

The present invention comprises two or more process processing apparatuses for carrying out process processing, and a conveying processing apparatus for conveying wafers, and an operating method and a vacuum processing apparatus of a vacuum processing apparatus for wafer processing using at least two or more process processing apparatuses. It is about.

The conventional apparatus is, for example, in a system in which a processing chamber is connected to a transfer chamber as in Japanese Patent Laid-Open No. 63-133532, when sample processing is performed in a normal operating state, separate wafers are simultaneously executed in separate processing chambers. The present invention relates to an apparatus capable of processing a wafer via two or more processing chambers sequentially, and a transfer thereof.

Another conventional apparatus is an operation that simultaneously performs two paths of process processing, such as Japanese Patent Laid-Open No. 3-274746. When maintenance work is performed on a processing chamber included in one path, the processing chamber of another path is transiently transitioned. It was about operating a device common to two-path process processing.

In the prior art, when two or more process processes are performed, wafers are conveyed to two or more process chambers through a conveyance path in a vacuum atmosphere, and each process chamber is exposed to an atmospheric state by performing a unique process of the process chamber. Instead, the apparatus configuration, conveying method and maintenance work for carrying out a plurality of process treatments in vacuum were performed in parallel with normal wafer processing.

However, in the former prior art, when an operation in which two or more processing chambers are used as a processing path and one of the processing chambers becomes unavailable due to a failure, the operation and recovery processing to continue the processing using the normal processing chamber is considered. It wasn't.

In addition, even when there is a processing chamber that needs to be repaired at the start of operation, no consideration has been given to the method and procedure for operating the apparatus using only the normal processing chamber.

In addition, by using two or more processing chambers as processing paths, the operation is temporarily suspended during operation, and interrupt processing using the processing chambers not used in the processing path of the operation until the interruption is used as the processing path is executed first, and the interrupt processing is performed. The operation method and procedure for continuing the process which was suspended after the completion of the process were not considered.

In addition, no consideration has been given to the method of operation instruction for the equipment of the processing chamber which uses two or more processing chambers as the processing path and is not used in the processing path of the operation during operation. Moreover, no consideration has been given to ensuring operational safety when the operation instruction for the equipment of the processing chamber that is not used in the processing route of the operation is performed by the operation unit that is separated from the operation unit that normally operates.

In the latter conventional technique, an example of a case in which the operation of maintaining the apparatus and the apparatus and the operation of the normal wafer processing in parallel with the operation of the apparatus standing on the apparatus side of the apparatus operated by the operator, such as the maintenance operation of the target exchange, is performed. For example, no treatment or method has been considered for securing safety that the processing gas or the power supply for discharging is turned on by "incorrect operation".

As described above, the prior art considers the following operation except for the state in which the processing chamber is normal and only the processing chamber to be repaired before operation start, but the operation when the processing chamber cannot be used abnormally during the operation, interrupt processing, temporary suspension of the operation during the operation. And the operation and operation of the processing chamber which is not used in the processing path during the resumption operation or the operation in the suspended state is not considered, for example, when the same type of processing chamber is connected, The operation rate of the device to continue the operation was not considered.

In addition, it was an apparatus that did not consider the safety of the worker in the case of performing the maintenance work which restores abnormal process chambers or performs regularly in parallel with normal operation which processes a wafer normally.

The present invention comprises two or more process processing apparatuses for carrying out process processing and a conveying processing apparatus for conveying wafers, wherein the vacuum processing apparatus for processing using at least two or more process processing apparatuses,

1) If two or more processing chambers are used as the processing route, the operation can be continued even if any one of the processing chambers cannot be used due to a failure during operation.

2) When there is a process processing apparatus that needs to be repaired, only a normal processing chamber can be used as the processing route, and

3) Suspend and Resume Operation in Operation Suspend and Resume in Interrupted State Interrupt processing that uses the processing chamber that was not used in the operation path of the operation until the operation is suspended and stops is executed as the processing path. After the interrupt processing ends, the operation to continue the suspended processing can be performed.

4) By using two or more processing chambers as processing paths, operation instructions for devices in the processing chambers not being used in the processing paths of the operation during operation can be given, and the equipments in the processing chambers not being used in the processing paths of the operation. The operational safety in the case of giving an operation instruction with respect to the operation instruction or in the case where the operation instruction is performed at an operation portion that is separated from the operation portion which gives a normal operation instruction,

5) It is possible to improve the operation rate of the device by ensuring the safety of the operator in case of repairing abnormal processing chambers or performing maintenance work on a regular basis in parallel with the normal operation of normal wafer processing. The present invention provides a method of operating a vacuum processing apparatus and a vacuum processing apparatus.

In order to achieve the above object, operation information signal generating means for generating each operation information signal indicative of the operation valid or invalid operation of each process processing apparatus is provided for each process processing apparatus, and the operation information for storing each operation information signal. It is provided with a device storage means for providing signal storage means and continuing the operation using another process valid process operation apparatus without using the process processing apparatus invalid for operation based on each operation information signal.

In the operation of the device, if the process processing device in the middle of operation becomes unusable due to failure, etc., the operation of the device is suspended, and the operator is urged to judge the operation to be continued or to stop the operation. By doing so, it is possible to continue driving.

In addition, when the operation is started while there is a process processing device that needs to be repaired or repaired at the start of operation, effective process processing is performed without using a process processing device that needs to be repaired or repaired before starting operation. By operating the device using the device, the operation is made possible.

In addition, when repairing abnormal processing chambers or performing maintenance on a regular basis in parallel with normal operation of normal wafer processing, the air operation valve driving air line of the gas line should be operated so that the processing gas does not flow even if an incorrect operation is performed. Install a function to shut off (for example, a manual opening / closing valve for each gas line) and a function to cut off the power supply to the power supply unit for discharging so that the electric power for discharging is not accidentally turned on. For example, by installing a breaker that can be turned on and off for each power line, the safety of the operator can be ensured, thereby increasing the operation rate of the apparatus and ensuring safety. An operating method and a vacuum processing apparatus are provided.

Hereinafter, one embodiment of the present invention is shown in Figs.

Fig. 1 shows, as one embodiment, four process processing apparatuses connected to a transfer processing apparatus, and cassettes for carrying wafers into the processing apparatus are installed in an atmospheric transfer apparatus installed in front of the processing apparatus main body, and taken out one by one from the cassette. The device configuration diagram which carries in to a processing apparatus and processes it is shown. Four or more process processors may be connected. 1 to 1 are conveying apparatuses for conveying wafers, wafers in the load lock chamber being conveyed to the process processing apparatuses 2-1 to 2-4 according to the conveying schedule of wafers, and finished at the process processing apparatuses. Is transferred to the next process processing apparatus, and the wafer on which all the process processing is completed is broadcasted to the unload lock chamber. 2-1 to 2-4 are process processing apparatuses which perform process processing. Process processing includes the entire wafer processing such as etching, post-processing, film formation, spatter, CVD, and water washing. 3 is a load lock chamber, a chamber for carrying wafers in the atmospheric transfer apparatus 6 into the transfer processing apparatus, 4 is an unload lock chamber, a chamber for carrying wafers in the vacuum processing chamber to the atmospheric transfer apparatus 6, 5 is a transfer processing apparatus. A vacuum robot installed inside to carry wafers, 6 a standby conveying apparatus for installing a cassette containing wafers, 7 a cassette containing wafers to be processed, and a cassette containing a product wafer or a cleaning wafer Cassette. 8 shows an atmospheric robot which takes out the wafer in the cassette on the atmospheric conveying apparatus from the cassette, carries it into the load lock chamber 3 and returns the wafer of the unload lock chamber 4 to the original cassette.

In normal operation, the operator installs the cassette 7-1 (or 7-2) containing the product wafer and the cassette 7-3 containing the cleaning wafer in the air conveying apparatus 6. After setting the operating conditions using the display means 13 and the input means 14, an instruction to start operation is performed. When the operation is started, the conveyance of the wafer is started and conveyed to the process processing apparatus 21- (2-2 to 2-4), and the process is performed to return to the original cassette. When all the wafers in the original cassette have been processed, a buzzer (not shown) is issued to recover the cassette, and the operator is notified of the cassette recovery request, and the operator removes the cassette. When the processing of the cassette containing the product wafer is finished, the cleaning wafer is taken out from the cassette 7-3 to the process processing apparatus 2-1, 2-2, 2-3, 2-4, and the cleaning process is performed. To return to the cassette 7-3. In this case, it is also possible to carry out to a process processing apparatus 2-1-2-4 using a single dummy wafer for cleaning, and to perform a cleaning process. As another method, the process processing apparatus 2-1-is carried out. It is also possible to carry out one by one in 2-4) and perform the cleaning process at the same time. In the above cleaning process, when the processing of the cassette containing the product wafer is completed, the cleaning dummy wafer is conveyed from the cassette 7-3 to the process processing apparatuses 2-1 to 2-4, and the cleaning processing is performed. However, it is also possible to perform the cleaning process without conveying the cleaning dummy wafer to the process processing apparatuses 2-1 to 2-4. As described above, in addition to performing a cleaning process after the completion of the processing of one cassette of product wafers, the cleaning for each of the number of product wafers processed as a cleaning cycle (this number can be appropriately set) is performed from the cassette 7-3. It is also possible to carry out a dummy wafer to process processing apparatuses 2-1 to 2-4, and to perform a cleaning process. Also, the cleaning process is not carried out from the cassette 7-3 to the process processing apparatuses 2-1 to 2-4 for each number of product wafers processed as a cleaning cycle (this number can be set appropriately). It is also possible to do this. In addition, after the cassettes carrying the product wafers have been subjected to a preset number of cassettes, the cleaning dummy wafers are conveyed from the cassettes 7-3 to the process processing apparatuses 2-1 to 2-4, and cleaning is performed. It is possible.

Next, it is also possible to perform the above wafer processing after the edging process without transferring the dummy wafer from the cassette 7-3 to the process processing apparatuses 2-1 to 2-4 before the start of processing the cassette containing the product wafer. In addition, the dummy wafer is conveyed from the cassette 7-3 to the process processing apparatuses 2-1 to 2-4 before the processing of the cassette containing the product wafers, and subjected to edging, and then the dummy wafer is transferred to the cassette 7-3. ), The wafer treatment may be carried out after the wafer sheet treatment in which the edging treatment is set in advance.

The cleaning process described above is a process performed to remove foreign substances in the process processing apparatus, and the edging process is a process performed to bring the process processing apparatus into the wafer processing state before performing the wafer processing.

In the process path setting which is a part of the operation condition setting, the process processor used for the process is set using the symbol of the process processor in order to process the wafer.

The processing sequence of this wafer is shown in Table 1 as an operation mode.

In the following description of this operation mode, the process processing apparatuses 2-2 and 2-3 perform the same process processing (called an etching process in this embodiment), and the process processing apparatuses 2-1 and 2-4 are the same. The process processing (referred to as post-processing in this embodiment) will be described. Moreover, as an Example of a process process, after performing the etching process using the process processing apparatuses 2-2 and 2-3, it is assumed that the process is performed after performing the process processing apparatuses 2-1 and 2-4. After the processing of one cassette of product wafers, the cleaning wafer from the cassette 7-3 is transferred from the process processor [2-3 or (2-2)] to the process processor [2-4 or (2-1). ), And the operation of carrying out the cleaning process will be described. Moreover, depending on the processing conditions of a wafer, only an etching process may be sufficient.

1) 1 cassette 1 recipe parallel operation

The wafers processed under the same process processing conditions (hereinafter referred to as recipes) are sequentially picked from the cassettes from the lowermost or uppermost wafers in the cassette containing the wafers, and brought into the transfer processing apparatus for processing. After the wafer is etched in the process processor 2-2, the wafer is post-processed in the process processor 2-1 to return to the original cassette (this is called path A), and the process processor 2 After the etching treatment in -3), the process is carried out by using both of the paths (referred to as path B) which are post-processed in the process processing apparatus 2-4 and returned to the original cassette.

The processing sequence in this embodiment is

Path A: Cassette 7-1 → Process Processing Unit 2-2 → Process Processing Unit 2-1 → Cassette 7-1

Path B: Cassette (7-1) → Process Processing Unit (2-3) → Process Processing Unit (2-4) → Cassette (7-1)

But in combination

Path C: Cassette 7-1 → Process Processing Unit 2-2 → Process Processing Unit 2-4 → Cassette 7-1

Path D: Cassette (7-1) → Process Processing Unit (2-3) → Process Processing Unit (2-1) → Cassette (7-1)

It may be a combination of.

The wafer is processed by the first wafer as the path A, the second as the path B, the third as the path A, the fourth as the path B. The process is performed up to the final wafer in the cassette in the following order. When the final wafer is taken out from the cassette 7-1 (Fig. 3-A), the cleaning wafer is transferred from the cassette 7-3 to the process processor 2-3, and the cleaning process is started (Fig. 3). -B). Moreover, if the last wafer in the process processing apparatus 2-2 is conveyed to the process processing apparatus 2-1, the cleaning wafer will be conveyed from the cassette 7-3 to the process processing apparatus 2-2, The cleaning process is started. When the cleaning process in the process processing apparatus 2-3 is complete | finished, a cleaning wafer is conveyed from the process processing apparatus 2-3 to the process processing apparatus 2-4, and a cleaning process is performed. If the product cassette 7-2 is provided up to this time, the processing of the cassette 7-2 is continued following the end of the processing of the cassette 7-1, and the product wafer is then released from the cassette 7-2. The first sheet of the sample is returned to the process processing apparatus 2-3, and the process is performed (Fig. 3-C). When the cleaning process in the process processing apparatus 2-4 ends, the cleaning wafer is returned to the cassette 7-3. Moreover, when the cleaning process by the process processing apparatus 2-2 is complete | finished until this time, the cleaning wafer is conveyed from the process processing apparatus 2-2 to the process processing apparatus 2-1, and a cleaning process is performed. Thereafter, the second sheet of the wafer for the product is transferred from the C2 cassette to the process processor 2-2, and the process is performed (Fig. 3-D). When all wafers in the cassette 7-1 have finished processing, a buzzer (not shown) is sounded to notify the operator of the completion of the processing of the cassette 7-1 and the cassette replacement. As described above, the cassette 7-2 is also processed in the same order as in the cassette 7-1, and when all the cassettes 7-2 are finished, the processing of the cassette 7-2 is terminated. The buzzer sounds to notify the operator of the cassette change. Then, this operation cycle is repeated. When the operation is terminated, the operation is terminated by performing operation input of operation termination from the main controller 11.

There are five modes as a method of ending the process.

(A) Wafer supply stop: Stops taking out the wafer from the cassette under processing. (If the two cassettes are operated as one lot, stop taking out the wafer from the designated cassette.)

B) Cassette supply stop: After all wafers in the cassette currently being processed have been processed, processing of the cassette which has been installed until the end of the processing is stopped. After all the wafers have been processed, the processing of the cassettes installed up to that time is stopped.)

C) Cycle stop: Stops at the end of the currently executing process processing, exhaust, leak, conveyance, etc.

D) Temporary stop of processing room: The processing room stops after finishing processing of the current processing. In this case, operation can be resumed in the state which paused by resumption of operation. In addition, manual operation is possible only in the processing chamber.

E) Immediate Stop: Immediately stops all running operations.

It does not matter which method it uses in the completion of a process.

2) 2 cassettes 1 recipe parallel operation

The wafers processed under the same process conditions (recipe) are picked out in order from the lowermost or uppermost wafers in the cassette in which the wafers are stored and brought into the transfer processing apparatus for processing. In this case, the operation of picking out from the cassette and bringing it into the transfer processing device to perform the process processing differs from the case of the " 1 cassette 1 recipe parallel operation ".

In the case of the "one cassette one recipe parallel operation", the wafers were sequentially picked from the same cassette, brought into the transfer processing apparatus, the process was performed, and after the wafers of the cassette were all finished, the process proceeded to the wafer processing of the next cassette. In the original " two cassette one recipe parallel operation ", wafers are alternately selected from the cassette 7-1 and the cassette 7-2, and carried in to a transfer processing apparatus to perform a process process. As in the case of the "1 cassette 1 recipe parallel operation", the wafer processing path is etched in the process processing apparatus 2-2, and then subjected to post-processing in the process processing apparatus 2-1 to return to the original cassette. A path to be turned (called this path A) and a path to be etched by the process processing apparatus 2-3 and then post-processed by the process processing apparatus 2-4 to return to the original cassette (this path B). To both sides.

The paths A, B, or paths C and D in the processing procedure in this embodiment are the same as in the case of " one cassette 1 recipe parallel operation ".

The wafer processing was performed by the first wafer from the cassette 7-1, the first sheet from the path A, the second from the cassette 7-2, and the first from the path B, and the third wafer from the cassette 7-1. The second sheet is route A, and the fourth sheet is route B, ... from the cassette 7-2. The process is performed up to the final wafer in the cassette in the following order. When the processing of all the wafers in the cassette 7-1 or the cassette 7-2 is finished, a buzzer (not shown) is shown to notify the operator of the completion of the processing of the cassette 7-1 (or 7-2) and the cassette replacement. It rings. Until the finished cassette is removed and a new cassette is installed, only the processing on the other cassette side is continued. When a new cassette is installed, the wafers are alternately picked out from the cassettes 7-1 and 7-2 as described above and brought into the transfer processing apparatus to carry out the process processing. This operation cycle is then repeated. When this operation is terminated, the operation is terminated by performing operation input of operation termination from the main controller 11. The termination method is the same as in the case of " one cassette 1 recipe parallel operation ". The cleaning process is the same as in 1) above.

3) 2 cassettes 2 recipe parallel operation

In this operation, the wafer processing recipes of the cassette 7-1 and the cassette 7-2 are different, so that the processing time in the process processing apparatus may be different. In this case, the wafer unloading from the cassette 7-1 and the cassette 7-2 is not alternating, but the processing in the process processing apparatus is finished and the wafer is transferred to another process processing apparatus, and then the next wafer is processed in the above process. The processing other than the conveyance to the apparatus is the same as the above "2 cassette 1 recipe parallel operation". The cleaning of the wafer is the same as in 1) above.

4) 1 cassette 1 recipe serial operation

In this operation, the wafers processed under the same process processing conditions (recipe) are sequentially picked from the cassettes from the lowermost or uppermost wafers in the cassette containing the wafers and brought into the transfer processing apparatus for processing. Is the same as the case of By the way, the process path of a wafer differs from the case of "1 cassette 1 recipe parallel operation" mentioned above. In the present " 1 cassette 1 recipe series operation ", the wafer is etched by the process processing apparatus [2-2 (or process processing apparatus 2-3)], and then the process processing apparatus [2-3 (or process processing apparatus) is again processed. (2-2))], followed by post-treatment in the process processor (2-1 (or process processor 2-4)) to return to the original cassette (this path E). ).

The wafer is processed by the first wafer as the path E, the second as the path E, the third as the path E, the fourth as the path E,... The process is performed up to the final wafer in the cassette in the following order. When all the processing in the cassette 7-1 is finished, a buzzer sounds to notify the operator of the completion of the processing of the cassette 7-1 and the cassette replacement. If the cassette 7-2 is provided up to this time, the processing of the cassette 7-2 is shifted to the end of the processing of the cassette 7-1. The cassette 7-2 is also processed in the same order as in the cassette 7-1, and when all wafers in the cassette 7-2 are finished, the processing of the cassette 7-2 is terminated and the cassette is replaced. The buzzer sounds to notify the operator. If the cassette 7-1 is provided up to this point, the processing of the cassette 7-1 is shifted to the end of the processing of the cassette 7-2. This operation cycle is then repeated. When the operation is terminated, the operation is terminated by performing operation input of the operation termination from the main controller 11. The termination method is the same as in the case of " one cassette 1 recipe parallel operation ". The cleaning process is the same as in 1) above.

The above-mentioned 1) to 4) operation methods have been described with respect to representative cases, and other driving methods can be considered by a combination of a cassette, a recipe, and parallel / serial operation, and the present invention is limited to the driving methods of 1) to 4). It doesn't happen.

When the device is to be repaired or maintained, the display device 26 and the input device 25 in the auxiliary operation panel 22 can be used to operate the device. The auxiliary operation panel 22 is a transportable operation terminal (for example, a notebook computer), and the device information (for example, input / output bit) displayed on the display means 26 while being transported to the vicinity of the device and visually viewing the device state. On / off information, error information, etc.) can be used for maintenance and maintenance operations, and the operability of maintenance and maintenance is improved. This auxiliary operation panel 22 has the same function as the main control unit 11, but in order to ensure safety for the operator, when the operation is performed simultaneously by the main control unit 11 and the auxiliary operation panel 22, only one side can be input. In order to prevent this from happening, it is equipped with a tamper proof function.

FIG. 2 shows, as another embodiment, four process processing apparatuses connected to a transfer processing apparatus, and cassettes for carrying wafers into the processing apparatus are installed in the load lock chamber 3A in the processing apparatus main body, and are withdrawn one by one from the cassette. The apparatus block diagram which carries in to a processing apparatus and processes it is shown. The process processor may be connected more than this. As the apparatus configuration, the standby conveyance apparatus 6 and the atmospheric robot 8 for installing the cassette which accommodated the wafer were removed from the structure shown in FIG. The functions and configurations of the respective devices are the same as those in Fig. 1 except that the wafer is taken out from the cassette by the load lock chamber 3A, and the storage in the cassette is the unload lock chamber 4A. Moreover, as a cleaning process, the cassette which accommodated the cleaning wafer is provided in the load lock chamber 3A (or unload lock chamber 4A), and the cleaning wafer is processed into the process processing apparatus 2-1, 2-2, 2-3, 2 -4), and the cleaning is carried out to return to the original cassette. In the operation mode,

1) 1 cassette 1 recipe parallel operation

The wafers processed under the same process processing conditions (recipe) are picked out from the cassettes in order from the lowermost or uppermost wafer in the cassette, and brought into the process processing apparatus for processing. After the wafer is etched in the process processing apparatus 2-2, the wafer is post-processed in the process processing apparatus 2-1 to return to the original cassette (this is referred to as path A), and the process processing apparatus 2 After the etching treatment at -3), the processing is performed by using both of the paths (called path B) which are post-processed in the process processing apparatus 2-4 and returned to the original cassette.

The processing sequence in this embodiment is

Path A: Cassette 7-1A in the load lock chamber 3A → Process processor 2-2 → Process processor 2-1 → Cassette 7-2A in the unload lock 4A

Path B: Cassette (7-1A) in the load lock chamber 3A → process processor (2-3) → process processor (2-4) → cassette (7-2A) in unload lock chamber 4A

or

Path C: Cassette 7-1A in the load lock chamber 3A → Process processor 2-2 → Process processor 2-4 → Cassette 7-2A in the unload lock 4A

Path D: Cassette (7-1A) in the load lock chamber 3A → process processor (2-3) → process processor (2-1) → cassette (7-2A) in unload lock chamber 4A

It may be a combination of. In the above processing sequence, the processed wafer is returned to the cassette 7-2A in the unload lock chamber 4A, but may be returned to the cassette 7-1A in the load lock chamber 3A from which the wafer is taken out.

In this embodiment, the wafer picked out from the cassette 7-1A in the load lock chamber 3A in parallel with the path A and the path B shows an example of a process of returning the cassette to the cassette 7-2A in the unload lock chamber 4A. The wafer is processed by the first wafer as path A, the second as path B, the third wafer as path A, the fourth as path B,... The process is performed up to the final wafer in the cassette in the following order. When the processing in the cassette 7-1A in the load lock chamber 3A is finished, the buzzer is notified to notify the operator of the completion of the processing and the cassette replacement of the cassette in the load lock chamber and the cassette 7-2A in the unload lock chamber 4A. It rings. Next, a cassette containing a new unprocessed wafer is placed in the load lock chamber 3A, and an empty cassette is placed in the unload lock chamber 4A. Then, this operation cycle is repeated. When the operation is terminated, the operation is terminated by inputting the operation termination operation from the main controller 11. The termination method is the same as in the case of "1 cassette 1 recipe parallel operation" above.

2) 2 cassettes 1 recipe parallel operation

The wafers processed under the same process processing conditions (hereinafter, referred to as recipes) are sequentially picked from the cassettes from the lowermost or uppermost wafers in the cassette containing the wafers and brought into the process processing apparatus for processing.

In the case of "1 cassette 1 recipe parallel operation", the wafers were sequentially selected from the same cassette, brought into the process processing apparatus, and the process was performed. After the wafers of the cassettes were all finished, the process proceeded to the wafer processing of the next cassette. In this " 2 cassette 1 recipe parallel operation ", wafers are alternately picked from the cassette 7-1A in the load lock chamber 3A and the cassette 7-2A in the unload lock chamber 4A, and brought into the process processing apparatus. Perform process processing. As in the case of "1 cassette 1 recipe parallel operation", the wafer processing path is etched in the process processing apparatus 2-2, and then subjected to post-processing in the process processing apparatus 2-1 to return to the original cassette. The path to be turned (this path is called A), and the process is etched in the process processor (2-3), followed by post-processing in the process processor (2-4) to return to the original cassette (this path is Process using both sides.

The paths A, B, or paths C and D in the processing procedure in this embodiment are the same as in the case of " one cassette 1 recipe parallel operation ".

The wafer is processed by the first wafer from the cassette 7-1A in the load lock chamber 3A, the path A, the second from the cassette in the unloadlock chamber, the path B, and the third wafer from the loadlock chamber 3A. Path A, the second sheet from the cassette 7-1A in (3A), the second sheet from the cassette 7-2A in the unloading chamber 4A, and the second sheet from the cassette 7-1A. The process is performed up to the final wafer in the cassette in the following order. When all wafers in the load lock chamber 3A or the unload lock chamber 4A cassette 7-2A have been processed, the end of the cassette processing in the load lock chamber 3A (or the unload lock chamber 4A) and the cassette exchange are performed. Rings the buzzer to notify. Until the finished cassette is removed and a new cassette is installed, only the processing on the other cassette side is continued. When a new cassette is installed, the wafers are alternately picked from the cassettes in the load lock chamber 3A and the unload lock chamber 4A as described above, brought into the process processing apparatus, and subjected to process processing. This operation cycle is then repeated. When this operation is terminated, the operation is terminated by performing operation input of operation termination from the main controller 11. The termination method is the same as in the case of " one cassette 1 recipe parallel operation ".

3) 2 cassettes 2 recipe parallel operation

In this operation, the wafer processing recipe of the cassette 7-1A in the load lock chamber 3A and the cassette 7-2A in the unload lock chamber 4A may be different. In this case, the wafer unloading from the cassette 7-1 and the cassette 7-2 is not alternating, but the processing in the process processing apparatus ends, the wafer is transferred to another process processing apparatus, and the next wafer is processed in the above process. The processing other than the conveyance to the apparatus is the same as the above "2 cassette 1 recipe parallel operation". The cleaning process of the wafer is the same as in 1) above.

4) 1 cassette 1 recipe serial operation

In this operation, the wafers processed under the same process processing conditions (hereinafter, referred to as recipes) are sequentially picked from the cassettes from the lowermost or uppermost wafer in the cassette containing the wafers and brought into the process processing apparatus for processing. It is the same as the case of "1 cassette 1 recipe parallel operation" mentioned above. By the way, the process path of a wafer differs from the case of "1 cassette 1 recipe parallel operation" mentioned above. In the present " 1 cassette 1 recipe series operation ", the wafer is etched in the process processing apparatus 2-2 (or process processing apparatus 2-3), and then the process processing apparatus 2-3 (or process processing) again. Device 2-2], and then a post-treatment process in the process processing device 2-1 (or the process processing device 2-4) to return to the original cassette (this path is E). Processing).

In this embodiment, the wafer picked out from the cassette 7-1A in the load lock chamber 3A by the path E is shown as an example of a process for returning to the cassette 7-2A in the unload lock chamber 4A. The wafer is processed by the first wafer as the path E, the second as the path E, the third as the path E, the fourth as the path E,... The process is performed up to the final wafer in the cassette in the following order. When the processing in all the cassettes is finished, a buzzer sounds to notify the operator of the completion of processing and replacement of the cassette 7-1A in the load lock chamber 3A and the cassette 7-2A in the unload lock chamber 4A. Next, a cassette containing the new unprocessed wafer is installed in the load lock chamber 3A, and an empty cassette is installed in the unload lock chamber 4A, and the operation cycle is repeated thereafter. When this operation is terminated, the operation is terminated by inputting operation termination operation from the main controller 11. The termination method is the same as in the case of " one cassette one recipe parallel operation ".

4 shows a control configuration diagram. In this embodiment, the main control part of the whole apparatus is shown in the case where it is mounted in the conveyance processing apparatus 1. As shown in FIG. In addition, the main control part of the whole apparatus may be other than a conveyance processing apparatus. In addition, the display means 13 and the input means 14 may be comprised as a control unit different from a main control part. 11 shows the configuration of the main controller which controls the whole apparatus. As the control means, only parts corresponding to the claims of the present invention are selected and described, and no input / output control parts (DI / O, AI / O) necessary for moving the device are described. 16 is processing sequence information storage means for storing the processing sequence of the wafer in the vacuum processing apparatus, for example, RAM (Random Access Memory). In the processing sequence of the wafer, data input by the operator using the display means 13 and the input means 14 before the start of operation is stored. 17 is operation information signal storage means for storing an operation information signal indicating that the operation processing of the process processing apparatuses 2-1 to 2-4 is enabled / disabled, for example, RAM. Numeral 13 denotes display means for displaying the operation state, the setting contents of the operation condition, and the indication of start / end of operation, for example, CRT. Reference numeral 14 denotes input means for setting the operating conditions, inputting the start of operation, inputting the process processing conditions, operation input of maintenance or maintenance, and the like, for example, a keyboard. 15 determines an operation information signal state indicating that operation of the process processing apparatuses 2-1 to 2-4 is enabled / disabled, and any of the process processing apparatuses 2-1 to 2-4 operate during automatic operation. Even if it is disabled, it is apparatus control means which memorize | stores the process sequence which continues operation using another process processing apparatus, without using the said process processing apparatus, for example, ROM (Read Oniy Memory). 12 is a central control means for controlling the 13 to 17, for example a CPU (Central Processor Unit). 2-1 to 2-4 are process processing apparatuses which process a wafer. As this processing apparatus, any may be used as long as it is a process for processing a wafer such as etching, post-processing, film formation, sputtering, CVD, and water treatment. 19-1 to 19-4 are operation information signal generation means for generating an operation information signal indicating that operation of the process processing apparatuses 2-1 to 2-4 is valid / invalid. In this embodiment, although provided in the process processing apparatus, it may be anywhere. As a means for generating this driving information signal

1) By using the interrupt signal of the power of the process processor unit

2) using an operation switching signal (e.g., a switching switch) that sets whether the process processor is used or not;

3) The input information set and input by the operator can be used as an operation control signal indicating whether the process processor is used or not.

20 and 21 are communication means for connecting the main control part 11 which controls the whole apparatus, and the auxiliary operation panel 22. As shown in FIG. The auxiliary operation panels 22, 25, and 26 are used for the above-mentioned purposes. 24 is terminal control means which memorize | stores the process sequence which controls terminal function in an auxiliary operation panel. 23 is a central control means for controlling the 21 to 24 to 26, for example, a CPU (Central Processor Unit).

5 is a driving information signal diagram. Information indicating the validity / invalidity of the operation is stored for each process processing apparatus. In this case, 1 is shown as valid, and 0 as it is invalid, but may be a symbol or a number as long as it is distinguishable. This information reflects the signal state of the driving information signal generating means 19-1 to 19-4, and is stored in the driving information signal storing means 17.

6 is a processing sequence information diagram. One of the operation condition settings is information in which an operator sets a procedure for processing a wafer using the display means 13 and the input means 14 before the start of operation. This information is stored in the processing order information storage means.

7 shows an apparatus operation flow diagram. The operator determines whether there is a process processing device which cannot be used for operation due to a breakdown or the like that is not used for maintenance (including plasma cleaning) among the process processing devices configured as the processing device before the operation starts (30). . If there is a process processing apparatus that cannot be used (or not used), it is set so as to be in the state described in Fig. 4 by using the operation information signal generating means 19 (32). As a way of setting this up

1) When the interrupt signal of the apparatus power supply of the process processing apparatus is used, the electronic switch for supplying apparatus power of the process processing apparatus is turned off. As a result, a cutoff signal is generated and transmitted to the driving information signal storage unit 17, and stored as the information shown in FIG.

2) In the case of using an operation switching signal (e.g., a changeover switch) for setting the use of the process processor, the changeover switch assigned to the process processor is set to a valid or invalid state. In this way, the changeover signal is determined and transmitted to the driving information signal storage unit 17 and stored as the information shown in FIG. 5.

3) In the case of using input information set by the operator as an operation control signal indicating whether the process processing apparatus is used or not, the operator inputs the setting information allocated to the process processing apparatus in the input means 14. Thus, the setting information is determined, transferred to the driving information signal storing means 17, and stored as the information shown in FIG. After determining the device connection configuration, automatic operation is started (34). In addition, the process of processing a wafer is set as product processing conditions as follows.

1) Select the operating mode of the wafer.

Select one of "1 Cassette 1 Recipe Parallel", "2 Cassette 1 Recipe Parallel", "2 Cassette 2 Recipe Parallel", and "1 Cassette 1 Recipe Parallel"

2) The transfer path of the wafer is set.

The processing route of the wafer for each cassette is set in parallel or serial processing using the symbol of the process processor. A typical setting example is shown below. (The wafer processing paths can be combined as described above.)

2-1) For parallel processing:

Cassette 7-1: E1 → A1, Cassette 7-1: E2 → A2

Cassette 7-2: E1 → A1, Cassette 7-2: E2 → A2

E1: process processor 2-2, E2: process processor 2-3

A1: process processor 2-1, A2: process processor 2-4

2-2) For serial processing:

Cassette 7-1: E1 → E2 → A1

Cassette 7-2: E2 → E1 → A2

3) Process process conditions (also called process recipes) are set for each process process.

After setting the above-mentioned product processing conditions, the start of automatic operation start is started.

8 shows an automatic operation flow diagram. When autonomous operation is started, it is determined whether all wafers to be processed have been conveyed, and when the transfer is completed, the process ends, and when transfer is required, the process proceeds to the autonomous operation (40). It is determined whether an abnormality or the like occurs during the automatic operation and the operation is in the suspended state (42). If there is no abnormality, driving continues (at 44). If there is a process processing device that cannot be used for operation, the operator determines whether operation can be continued without using the process processing device (70). If it is impossible to continue, the operator performs automatic driving stop processing by setting the operator to stop the automatic driving (90). Even if it is possible to continue, there are wafers left in the process processor, wafers left on the hand of the vacuum robot, and wafers left in the load lock chamber or unload lock chamber. In this way, an abnormality occurs during the automatic operation, the automatic operation cannot be continued and the original cassette is stored in the wafer in which the abnormality remains in order to resume the automatic operation from the state in which the automatic operation was suspended. The carrying out process is performed. This is because when the abnormality occurs during the automatic operation, the transfer and processing schedule of all the wafers in the processing apparatus are determined. This is because a schedule error occurs and resumes from the suspension of automatic operation and resumes automatic operation.

As yet another embodiment, the wafer remaining in the abnormal device is not carried out to the original cassette, and resumes from the suspended state and resumes automatic operation with respect to the intermediate wafer while leaving the wafer in the abnormal device. It is also possible to return the original cassette to the original cassette after the batch processing is terminated and the automatic operation is finished. As another embodiment, it is also possible to change the wafer information to carry the wafer out to the original cassette. For example, the wafer remaining in the processing apparatus is left unchanged due to an abnormal occurrence, and the wafer information is changed as the wafer is exported to the original cassette. Is used when the batch (one lot) process is finished, the automatic operation is finished, and the remaining wafer is returned to the original cassette. The processing example of the wafer which remains in a processing apparatus is shown below.

It is determined whether there is a residual wafer in the device (72). It is determined whether the operation is to be continued with the wafer remaining in the apparatus as it is (73). When the operation is continued while the remaining aper is left in the apparatus, the wafer information is changed to carry the wafer out to the original cassette (77). If the wafer remains in the apparatus and operation is not continued, it is judged whether or not etching is performed among the remaining wafers (74). If an abnormality occurs during the etching process among the wafers remaining in the processing chamber, after the remaining etching process is performed (76), the wafer is returned to the original cassette (78). This is done to save the wafer as much as possible. In the case where the wafer remains on the wafer hand of the vacuum robot or when the wafer remains in the load lock chamber unload lock chamber, the individual operation (exhaust / leak of the lock chamber, transfer of the wafer) is performed to return the wafer to the original cassette. (78). As described above, the wafer in the apparatus in which the abnormality has occurred is subjected to necessary measures and returned to the original cassette, and then the operation of resuming the suspended automatic operation is performed. By doing in this way, the tracking information of the wafer in the device (processing chamber, vacuum robot, etc.) in which the abnormality has occurred becomes equivalent to that processed in the normal path, so that automatic operation can be resumed. After the wafers remaining in the processing apparatus as described above are treated, the switching operation 80 of the operation information signal generating means in the same manner as shown in FIG. The abnormality occurrence information is reset (82), and automatic operation is continued.

In the normal operation state, the conveyance path of the next wafer is read 44 of information stored in the process order information storage means 16, and matched with the information stored in the operation information signal storage means 17, thereby carrying the conveyance sequence. Determine (46). The determined conveying order may have the conveying order data for each wafer to be taken out of the cassette, and a process order information table different from the process order information storing means 16 may be created, and the table may be referred to when the wafer is conveyed. . When the transfer route is determined, the standby robot 8 takes out the wafer from the cassette 7 (48), transfers it to the process processing apparatus registered in the determined transfer route (50), and processes the wafer (52). ). If an abnormality occurs in the wafer transfer process and the process process, in order to continue the automatic operation, the process can be continued until the end of the individual process, and then the automatic operation is suspended. (For example, if the N-th wafer is being etched, the etching process is continued until the etching process of the N-th wafer is completed, and automatic operation is suspended at the end of the N-th wafer. If an abnormality occurs in another process during conveyance, the vacuum robot 5 suspends automatic operation at the end of wafer conveyance to a predetermined place.) Thereafter, abnormality occurrence information (not shown) indicating an abnormality is stored. After that, the display means 13 indicates that the apparatus has been suspended by the operator in a suspended state, and at the same time, a buzzer sounds. Thereafter, the process returns to 42 and the process proceeds to the predetermined flow.

9 shows an automatic operation resumption processing diagram after an error has occurred. Hereinafter, a description will be given of a process from the occurrence of the abnormality during the automatic operation described in FIG. 8 to the resumption of the automatic operation. Fig. A shows the wafer transfer path in the operation mode of " 1 cassette 1 recipe parallel operation "

Cassette 7-1: E1 → A1 and E2 → A2

Cassette 7-2: E1 → A1 and E2 → A2, the (N) th wafer is being etched at E2, and the (N-1) th wafer is post-processed at A1 as shown in FIG. If an abnormality occurs in E2, the etching process ends and the wafer of (N-1) sheets of A1 is not taken out to the unload lock chamber 4 after the post-processing end, and the automatic operation is suspended. Regarding the (N) th wafer in which an abnormality occurred at E2, the treatment of 76 and 78 of FIG. 7 is performed. Subsequently, with respect to E2 and A2, the operation of 1) or 2) or 3) described in the description of FIG. 7 is performed as the switching operation by the operation information signal generating means of 80 of FIG. 8, and the process processing apparatus as shown in FIG. The operation information of 3 (E2) and process processor 4 (A2) is set to "invalid: 0". Thereafter, the abnormality occurrence information is reset (80 in FIG. 8), and automatic operation is resumed. After the resumption, as shown in Fig. C, the (N-1) th wafer of A2 is transferred to the unload lock chamber 4, and then the processing is continued using E1 and A1.

Next, with respect to the process processor 3 (E2) and the process processor 4 (A2) whose operation information is set to "invalid: 0", the process processor 3 (E2) is used to determine the cause of the abnormality by using the auxiliary operating panel 22. ), Operation input for performing the device operation can be performed to the process processing apparatus 4 (A2). For example, a wafer pushing up operation not shown in the process processor 3 (E2) is performed to confirm the operation.

By the above operation, the cause of an abnormality can be countermeasured and the procedure which returns the process processing apparatus 3 (E2) and process processing apparatus 4 (A2) which made it "invalid: 0" to the processing path of a wafer is shown below. Next, the operation can be shifted to FIG. A by performing an interruption operation of the automatic operation during the operation of FIG. C and setting E2 and A2 separated from the processing path of the operation mode to be valid.

In operation mode, the wafer transfer path

Cassette 7-1: E1 → A1 and E2 → A2

Cassette 7-2: E1-> A1 and E2-> A2 can be operated.

10 shows a processing unit operation separation processing diagram during automatic operation. Hereinafter, a process of resuming automatic operation after separating E2 and A2 from the automatic driving process path during the automatic driving described in FIG. 8 will be described. FIG. A is identical to the driving route of FIG. A of FIG. 9. In Table 1, the wafer transfer path in the operation mode of "1 cassette 1 recipe parallel operation"

Cassette 7-1: E1 → A1 and E2 → A2

Cassette 7-2: E1 → A1 and E2 → A2, the (N) th wafer is being etched at E2, and the (N-1) th wafer is post-processed at A1 as shown in FIG. When the stop instruction is issued to the E2 and the A2 by the operation stop operation, the (N-1) th wafer of A1 is returned to the original cassette after the post-processing is finished, and the etching process of the (N) th wafer is completed and the A2 is finished. It is conveyed and returned to the original cassette after finishing the post-processing. By the way, since E2 and A2 are in the stop state, the wafers after the (N + 1) th are operated using E1 and A1.

In the above, the separation was performed by giving a stop instruction by an operation stop operation as a means of separating E2 and A2 from the automatic operation processing path during the automatic operation, but alternatively, a stop instruction is issued by the function of a detector built into the processing apparatus. It may be. As an example, the foreign material measurement monitor value from the foreign material monitoring device assembled in the processing device detects that the set value set before the operation is exceeded, and the stop signal is given to the E2 and A2 during the automatic operation with this exceeded signal, which is the same as the operation stop operation. Function can be performed.

The procedure for returning the separated process processing apparatus to the wafer transfer path is the same as that shown in the description of FIG. 9.

11 shows a pilot cassette processing diagram. This executes interrupt express processing during automatic operation, and resumes the original processing after the completion of the processing. The processing device (in this case, E2 and A2) specified during the automatic operation described below in FIG. 8 is separated from the processing path of the current operation mode, and the process that has been operated until then using the separated E2 and A2. A process of interrupting a cassette (called a pilot cassette for this cassette) which is processed under a process processing condition different from the processing condition and resuming the original automatic operation after the processing will be described. FIG. A is identical to the driving route in FIG. 9. In Table 1, the wafer transfer path in the operation mode of "1 cassette 1 recipe parallel operation"

Cassette 7-1: E1 → A1 and E2 → A2

Cassette 7-2: E1 → A1 and E2 → A2, and in E2, the (N) th wafer of cassette 7-1 is being etched, and the (N-1) th wafer of cassette 7-1 in A1 When is post-processing, as shown in Fig. A, an interruption operation of automatic operation is performed to perform interrupt express processing using E2 and A2. When the stop instruction is issued to the E2 and the A2 by the operation stop operation, the (N-1) th wafer of A1 is returned to the original cassette after the post-processing is finished, and the (N) th wafer is etched and returned to A2. After the end of the post processing, the original cassette is returned. By the way, since E2 and A2 are in the stop state of operation, the wafers after (N + 1) th are operated using E1 and A1 (Fig. C). If the cassette of interrupt express processing using E2 and A2 is placed in cassette 7-2 during the operation using E1 and A1 and the start operation of allocation processing is started (Fig. C), all the wafers selected from cassette 7-1 are processed until then. After the transfer into the cassette 7-1, the operation using E1 and A1 of the wafer in the cassette 7-1 is suspended, and the processing of the wafer in the cassette 7-2 for interrupt express processing is started (Fig. D). About the wafer of cassette 7-2, the process of E2-> A2 is performed sequentially, and it carries in to cassette 7-2. When the processing of the pilot cassette is finished, the interrupt processing is terminated and the operation of the suspended state is set again, and the wafer processing is resumed from the interrupted cassette 7-1 (return to the state of FIG. C). Then, the operation of stopping the automatic operation during the operation in the state of returning to Fig. C can be performed, and the process can be transferred to Fig. A by setting E2 and A2 separated from the processing path of the operation mode to be valid.

In operation mode, the wafer's return path

Cassette 7-1: E1 → A1 and E2 → A2

Cassette 7-2: E1-> A1 and E2-> A2 can be operated.

12 shows a configuration diagram for separating a processing apparatus from a vacuum processing apparatus. The process processing apparatuses 2-1 to 2-4 have a structure capable of blocking the air operation valve driving air line for each processing gas line, and are provided with a manual opening / closing valve. Moreover, the structure which can cut off the power supply to the discharge power supply unit, and the breaker which can turn on / off for each power supply line is provided. In this figure, in performing "one cassette 1 recipe parallel operation", the wafer replacement process is performed by the maintenance operation of the electrode exchange in the process processing apparatus 2-2 and the process processing apparatuses 2-3 and 2-4. The operation performed in parallel with the normal operation to be processed will be described. In addition, illustration of the said correspondence content to the process processing apparatus which was not specifically demonstrated in embodiment description is abbreviate | omitted.

As the device operation route, operation using the path A and the path B is performed (refer to the description of the embodiment of FIG. 1), but in the process processing apparatus 2-2, the process processing apparatus 2-2 also performs the maintenance work. Air operation valve of the gas line The valve for manual opening and closing of the air line for driving is closed, and the breaker for every power supply line supplied to the power supply unit for discharge is turned off, and the apparatus shown in FIG. 7 is performed. Therefore, even if an operation to flow the processing gas by mistake in the process processing apparatus during maintenance is performed, since the air operation valve driving air line of the gas line is shut off, the processing gas does not flow. The electric power supplied to the power supply unit for the discharge is cut off even when the power supply for the discharge is turned on by mistake. In this way, even when the operator stands on the apparatus side of the apparatus in which the operator is operating, the apparatus and the apparatus are operated in parallel with the maintenance work and the normal wafer processing, so that the processing gas is flowed or the discharge power is turned on by the “misoperation”. This can prevent the worker from harming the electric shock, and can ensure safety for the worker.

Fig. 13 shows a flow chart of the operational interlock between the casting operation unit and the auxiliary operation panel. In the apparatus configuration shown in FIG. 1, an operation interlock is shown when an operation is performed on the process processing apparatus 2-2 using the auxiliary operation panel 22 while the casting operation unit 11 is operating the apparatus.

When the operating right of the process processing apparatus 2-2 is passed from the casting operation unit 11 to the auxiliary operating panel 22 before the apparatus operation of the process processing apparatus 2-2 is performed by the auxiliary operating panel 110, the operating right thereof. Until it is received from the auxiliary operating panel 22, only the operation to the process processing apparatus 2-2 cannot be performed from the casting operation part 11 (116). When the auxiliary operation panel 22 receives the operation right of the process processing apparatus 2-2 (104), the operation of the process processing apparatus 2-2 is enabled in the auxiliary operating panel 22 (108). When the operation of the process processing apparatus 2-2 on the auxiliary operating panel 22 is finished (110), the operation right of the process processing apparatus 2-2 is passed from the auxiliary operating unit 22 to the casting operation unit 11. (112), the operation from the auxiliary operation panel 22 to the process processing apparatus 2-2 cannot be performed (114). The casting operation part 11 can operate the process processing apparatus 2-2 (118), and the main control part 11 can operate all the process processing apparatuses (120).

As can be seen from the above description, a process processing apparatus that cannot be used for operation due to a failure or that is not used for repair or maintenance (including plasma cleaning) is stored in the operation information signal storage means 17. Since the control means proceeds with reference to this information, it does not return to the process processing apparatus set as invalid. In addition, in the process processing apparatus set to this invalid state, the operator is separated from the apparatus other than the apparatus side of the apparatus as a maintenance operation in parallel with the wafer processing during the automatic operation which is continued to perform repair, maintenance, and inadequate cause. The device operation (e.g., plasma cleaning treatment, gas line exhaust treatment, pushing up / down operation of the wafer pusher) can be performed. In addition, the auxiliary operation panel 22 is used when an operation is input to the process processing apparatus that has been set to invalid due to the cause of repair, maintenance, and shortcoming on the apparatus side of the apparatus. By the way, in the normal production line, the air conveying apparatus 6 shown in FIG. 1 is provided to the clean room side, and the conveyance processing apparatus 1 and the process processing apparatuses 2-1 to 2-4 are provided in the maintenance room side, There is a partition between the maintenance room and the clock from one side to the other. The auxiliary operation panel 22 is also connected to the main control unit 11, but the auxiliary operation panel 22 is a place which is usually separated from the main control unit 11, and may be operated by each other. In such a case, if the operation can be performed from either of the operation units, in particular, when the operation is performed using the auxiliary operation panel 22 on the apparatus side, the occurrence of a safety hazard can be considered for the operator operating the disaster. In order to prevent damage to the main control unit 11, the main control unit 11 cannot operate the device when the operation is performed by the process processing device (for example, the lift up / down operation) on the device side using the auxiliary operation panel 22. The operational interlock shown in FIG. 13 is suspended.

With the above-mentioned contents, the process using the process chamber which is not used for the process during automatic operation, and operation to the process chamber can be performed, and a single-close operation can be performed.

According to the present invention, when the operation is started during the operation or when the process processing apparatus becomes unusable due to a failure or the like and when there is a process processing apparatus that needs to be repaired or repaired at the start of operation, or during the operation or during the process processing In the case where the operation of the process is resumed by stopping the operation of the apparatus and using the other valid process processing apparatus, the process may be resumed. In the vacuum processing apparatus composed of the processing apparatus and the conveying processing apparatus for conveying wafers, the operation can be continued even when any of the plurality or the processing chambers cannot be used due to a failure or the like, and it is necessary to repair or repair at the start of the operation. With process handler Even in the case of using a normal process processing apparatus can be operated, the operation rate of the apparatus can be improved. In addition to the normal operation of normal wafer processing, when an abnormal operation chamber is repaired or maintenance is performed regularly on the apparatus side of the apparatus, misoperation causes flow of processing gas or electric shock due to misoperation. It is possible to provide a vacuum processing apparatus which can secure safety for the worker by preventing the worker from being harmless.

1 is a plan view showing an embodiment of a vacuum processing apparatus according to the present invention,

2 is a plan view showing another embodiment of a vacuum processing apparatus according to the present invention;

3 is a flowchart of a cleaning operation according to the present invention;

4 is a control block diagram of the device control means in the vacuum processing apparatus of the embodiment of FIG.

5 is a view showing an operation information signal of the apparatus control means in the vacuum processing apparatus of the embodiment of FIG.

6 is a view showing processing sequence information of the device control means in the vacuum processing apparatus of the embodiment of FIG.

7 is a flow chart of automatic operation of the device control means in the vacuum processing apparatus of the embodiment of FIG.

FIG. 8 is a flow diagram showing details of the autonomous driving flow of FIG. 7; FIG.

FIG. 9 is a view showing an operating state at the time of automatic operation resume processing after an abnormality occurs in the vacuum processing apparatus of the embodiment of FIG. 1;

FIG. 10 is a view showing an operating state of a processing apparatus operation separation process during automatic operation in the vacuum processing apparatus of the embodiment of FIG. 1;

11 is a view showing a state change during pilot cassette processing during automatic operation in the vacuum processing apparatus of the embodiment of FIG. 1;

12 is a block diagram for separating a processing apparatus from a vacuum processing apparatus;

13 shows a flow chart of an operational interlock of a casting operation part and an auxiliary operation part.

Claims (4)

A plurality of process processing apparatuses for carrying out process processing, a conveying apparatus for conveying wafers to the process processing apparatus, a conveying apparatus installed in the conveying processing apparatus for conveying wafers, and a plurality of wafers capable of storing a plurality of wafers A large base conveying apparatus for mounting a cassette in the air, another conveying apparatus configured to extract the wafer from any of the cassettes of the large conveying apparatus, and a lock chamber provided between the conveying processing apparatus and another conveying apparatus. And a control device for carrying out a transfer control for transferring a wafer between the cassette and the other transfer device, lock chamber, transfer processing device, and process processing device, and a plurality of process processes connected to the transfer processing device. In the vacuum processing apparatus which performs a wafer process using an apparatus, At least two cassettes are used, and the wafers stored for each cassette are transferred to any one of the processing apparatuses through another conveying apparatus, lock chamber and the conveying apparatus, and different recipes are applied to the conveyed wafers for different cassettes. Returning the wafer to the original cassette via the lock chamber after one of the parallel processing to perform the processing or the parallel processing to apply the common recipe to the wafers stored in each cassette. Vacuum processing apparatus. The method of claim 1, And the lock chamber comprises a load lock chamber and an unload lock chamber, and returns the wafer subjected to any one of the parallel processing from the unload lock chamber to the original cassette. In the vacuum processing method, a wafer in each cassette mounted on a large base conveying apparatus is conveyed from another conveying apparatus to a process processing apparatus through a lock chamber and a conveying processing apparatus in the air, and the wafer is processed by at least two process processing apparatuses. In Parallel to which at least two cassettes are used and conveyed through another conveying apparatus, a lock chamber, and a conveying apparatus configured to pull out the wafers stored for each cassette, and apply different recipes for the cassettes to the conveyed wafer to perform different processing. A vacuum processing method comprising returning a wafer after a lock processing and a parallel processing in which a common recipe is applied to a wafer stored in each cassette to perform a common processing, and then return to the original cassette through a lock chamber. The method of claim 3, wherein And the wafers are alternately withdrawn from two cassettes for parallel processing.