JPH1165666A - Method for adhering plural members and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain precise adherence by forming more than two alignment marks of plural marks at each place on a member, so that centers between the plural marks are made coincident. SOLUTION: Four monitors 21 of a control system 20 input and display each image data from four cameras 3-6. An image processor 23 extracts an alignment mark from the image data, calculates a position deviation value between a face panel and a jig or a rear panel, and calculates a correction value. Then, a robot controller 24 operates the positioning control of a lower hot plate and the adherence control of an upper hot plate. Moreover, the editing, execution, and teaching operation of the operation program of the controller 24 is operated by a personal computer 22, and the temperature control of the upper hot plate and the lower hot plate is conducted by a temperature controller 25. Thus, exact adherence can be attained without detecting the angle of a member with high precision.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning method and apparatus for heating a plurality of members for bonding.

[0002]

2. Description of the Related Art Conventionally, when bonding a plurality of members,
A male cross-shaped alignment mark and a female dozen-shaped alignment mark are formed at positions facing each other, and by detecting the positions of these alignment marks, the relative position shift amount is calculated. There has been a method in which members are corrected by the amount of the positional deviation and bonded.

Further, alignment marks having different shapes are formed on a plurality of members at positions offset so as not to overlap with each other, and a position correction amount is calculated so that the positional relationship between the alignment marks becomes a predetermined positional relationship. Then, after correction, there was a method of bonding.

[0004]

However, in the method described above, in the former method, when the members are set in the bonding apparatus or when the members expand due to heating during the bonding process, the alignment marks overlap. There is a problem that the position of the center of gravity of each alignment mark cannot be detected with high accuracy.

In the latter case, when the angle of the member with respect to the XY coordinates of the XYθ table is rotated, the positional relationship offset in advance changes in the table coordinate system. Therefore, it has been necessary to accurately detect the angle of the member at any time. Although the alignment marks do not overlap due to the thermal expansion of the members, the alignment marks sometimes overlap when the members are initially set as in the former case.

[0006] In any case, in order to correct the displacement of the plurality of members in the rotation direction, the positional relationship of the visual sensor corresponding to the alignment mark provided at a plurality of locations is grasped with high accuracy, and the alignment provided at the plurality of locations is performed. From the position of the mark,
It was necessary to calculate the rotation correction amount.

[0007]

In order to solve the above-mentioned problems, the present invention has the following arrangement. While heating multiple members, align them at predetermined sampling times,
The method of bonding includes a detecting step of detecting alignment marks formed at least at two or more locations on the member as image data for each sampling time by a visual sensor, and position information of the alignment marks from the detected image data. Calculating a relative displacement amount between a plurality of members from the calculated position information, a position control step of performing a coarse adjustment to correct the relative displacement amount, and rotating the plurality of members in a rotational direction. Fine feed, a position control step of performing fine adjustment so that the positional relationship of the alignment marks at a plurality of positions match, a movement amount until the matching, and a step of comparing the relative deviation amount obtained first,
Calculating a correction coefficient from the result of the comparison.

Alternatively, the position detection mark used for bonding a plurality of members has a different shape for each member.
Each of the members has a plurality at least at two or more places,
When the plurality of members are bonded at regular positions, all of the plurality of marks do not overlap, and the center position of the mark is
They are formed at predetermined positions facing each other. Alternatively, the position detection mark composed of a plurality of marks formed on the plurality of members is formed such that all of the plurality of marks do not overlap at one time in any state.

Preferably, the position information is calculated based on image data of at least two visual sensors. Alternatively, the visual sensor has a function of changing a visual field range according to whether or not the alignment mark can be captured. Alternatively, the apparatus for aligning and bonding a plurality of members at predetermined sampling times while heating and bonding the alignment marks formed at least at two or more positions of the members as image data for each sampling time by a visual sensor. Detecting means for detecting, means for calculating position information of the alignment mark from the detected image data, means for calculating a relative shift amount between a plurality of members from the calculated position information, and the relative shift amount Position control means for performing a coarse adjustment to correct the position, and a position control means for finely feeding the plurality of members in the rotational direction to finely adjust so that the positional relationship between the alignment marks at a plurality of positions coincides with each other. Means for comparing the amount of movement with the relative deviation initially determined, and means for calculating a correction coefficient from the result of the comparison. Provided.

Preferably, the apparatus comprises a first mounting means for mounting the first member, a first positioning means for positioning the first mounting means, and a second mounting means for mounting the second member. Mounting means, second positioning means for positioning the second mounting means, imaging means for imaging respective positioning marks formed on the first member and the second member, and Means for converting image data into position data, position control means for controlling first and second positioning means based on the position data, and heating control for synchronizing and heating the first and second mounting means. Means, the heating control means calculates the position correction amount for each predetermined sampling time while heating the first and second mounting means, and aligns the first and second members. Done, said first member The second member is bonded by adding a constant load.

Alternatively, the first positioning means is driven up and down, and the second positioning means is positioned by translation in two orthogonal directions and driving in a rotating direction. Preferably, the position control means has a force control function.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to the assembly of a panel used for a display will be described below with reference to the accompanying drawings. <Description of Configuration to be Assembled> First, a panel to be assembled will be described with reference to FIGS. FIG. 3 (a), (b)
3 shows a panel (hereinafter, panel unit) 100 after assembling. FIG. 3A is a perspective view of the panel unit 100 in which a frame 130 is partially omitted so that the inside of the panel unit 100 can be seen. FIG. 3 (b) shows the state shown in FIG.
2 shows a cross section of the panel unit 100 at a location indicated by DD. As shown in FIGS. 3A and 3B, the panel unit 100 includes a face panel 105 on which pixels made of RGB phosphors are formed, and a pixel corresponding to the face panel 105 on a one-to-one basis. Spacers 110 are erected between the rear panels 120 on which the same number of surface conduction electron-emitting devices are formed, a frame 130 is sandwiched therearound, and the pixels and the devices are highly accurately positioned one-to-one. Obtained by laminating. This spacer 110
Is to prevent the face panel 105 and the rear panel 120 from breaking when the panel unit 100 is evacuated, and is set up at a position where the pixels are not obstructed. The face panel 105 and the rear panel 120 are formed with a diagonal of 15 to 40 inches and a thickness of about 3 mm, and the spacer 110 has a thickness of 0.1 mm, a width of 40 mm,
The height is about 4 mm.

Next, a face panel, a rear panel, and a jig used in assembling will be described with reference to FIG. FIG. 4A shows a jig 111 for erecting spacers 110 on the black stripe 104 at regular intervals.
4B shows the face panel 105, and FIG. 4C shows the rear panel 120. On the face panel 105,
Alignment marks M1 for detecting positions are formed at four corners of face panel 105. Display screen portion 10 on the same side as the surface on which alignment mark M1 is formed
2 is coated with RGB (red / green / blue) phosphors 103 corresponding to one pixel as shown in the enlarged view.
Glows when hit by an electron. In addition, there is a portion 104 (hereinafter, referred to as a flux stripe) in which no pixel exists, and extends in the horizontal direction of the screen.

On the jig 111, a face panel 105
An alignment mark M2 having a shape different from that of the upper alignment mark M1 is formed. This alignment mark M2 is provided on the face panel 105 by the spacer 110.
Are alignment marks for aligning. The positional relationship between the alignment marks M1 and M2 and the pixels is clear, and therefore, the positional relationship between the alignment marks M1 and M2 after assembly is also clear. Here, the positional relationship of the alignment marks M1 and M2 after assembly is formed so as not to overlap due to thermal expansion during a heating process for bonding.

An alignment mark M2 having the same shape as the jig 111 is also formed on the rear panel 120. Further, on the display screen portion 122 on the same side as the surface on which the alignment mark M2 is formed, conductive lines 123 are stacked in a grid pattern, and an insulating film (not shown) is provided between the vertical lines 123a and the horizontal lines 123b. Is provided. Further, in a portion surrounded by the conductive line 123, there is a light emitting element (not shown) connected to the conductive line 123. When a potential difference occurs, electrons jump out of the light emitting element and the phosphor 1 of the face panel 105
03, the phosphor 103 is illuminated.

FIG. 5A shows alignment marks M1 and M
2 shows an example. M1 and M2 have different shapes that can be distinguished by pattern recognition. Each alignment mark is composed of a plurality of marks having the same shape. The plurality of marks are parallel to the panel so that the angle of the panel can be calculated from the marks.
In addition, the marks are attached so that the center positions of the marks match. Further, as shown in FIG. 5B, even when the alignment marks M1 and M2 overlap, all of the plurality of marks constituting the alignment marks are formed so as not to overlap.

<Schematic Description of Laminating (Assembly) Step> The face panel 105, the spacer 110, and the rear panel 120 have been individually described above. The laminating step will be described. FIG. 6 shows the face panel 10.
FIG. 5 is an enlarged view of a portion where a spacer on 5 is erected.
As shown in FIG.
10 is erected in the black stripe 104 so as not to touch the pixels. That is, in the step of setting the spacer, only the Y-axis accuracy is required, and the X-axis direction accuracy is not important. The adhesive 106 for erecting the spacer 110 is made of a material similar to glass and is not degassed when the inside of the panel unit 100 is evacuated. Note that in this embodiment, an adhesive (hereinafter, referred to as a frit) 106 called a frit which melts at around 400 ° C. and solidifies at around 300 ° C. is used.

Also, when bonding the face panel 105 with the spacer 110 up and the rear panel 120, a frit 106 'similar to the frit 106 but having a different melting point and solidification point is used. This is to prevent the once hardened frit 106 from being deformed when the face panel 105 and the rear panel 120 are bonded together.

<Description of Assembling Apparatus> Next, referring to FIG.
An assembling apparatus for realizing the above-described assembling will be described.
The face panel 105 (FIG. 4B) is attached to the upper hot plate 1. At this time, the face panel 105 is attached to the upper hot plate 1 with the surface on which the alignment mark M1 is formed facing downward in FIG.
Warm to 40 ° C. Further, the upper hot plate 1 is attached to the vertical drive unit 13 and the NC motor 26
(FIG. 1).

The lower hot plate 2 has a spacer 11
In the process of erecting 0 on the face panel 105, the jig 1
11 is attached, and the rear panel 120 is attached in the step of bonding with the rear panel 120. The jig 111 (FIG. 4A) and the rear panel 120 (FIG. 4C) are attached to the lower hot plate 2 such that the surface on which the alignment mark M2 is formed faces upward in FIG. . The temperature of the lower hot plate 2 is controlled in synchronization with the upper hot plate 1, which will be described in detail later.

The lower hot plate 2 is attached to an XYθ table 10 composed of an X table 10a, a Y table 10b, and a θ table 10c.
The face panel 1 is driven in the X, Y, and θ directions by the C motor 26 and attached to the upper hot plate 1.
05 is aligned. This alignment is performed by aligning the alignment mark M1 attached to the face panel 105 with the alignment mark M2 formed on the jig 111 and the rear panel 120.
Detected by four CCD cameras (hereinafter, referred to as cameras) 3, 4, 5, and 6 arranged corresponding to the four corners of 20, and the alignment marks M1 and M2 are corrected so as to have a predetermined positional relationship. You.

Note that the camera 3 is connected to channel 1 (ch).
1), camera 4 side is channel 2 (ch2), camera 5
Side is channel 3 (ch3) and camera 6 side is channel 4 (ch4).
This will be described as ch4. Lights 7 are cameras 3, 4,
Reference numerals 5 and 6 denote transmissive illumination for enabling the alignment marks M1 and M2 to be detected.

A face panel 105 to be attached to the upper hot plate 1 and a spacer jig 111 or a rear panel 120 to be attached to the lower hot plate 2
The displacement sensors 8a and 8b for detecting the height position of the camera are fixed to positions where they are not affected by heat, in this embodiment, a mount for the CCD camera. These sensors 8a, 8
The value read by b is transmitted to the robot controller 24 via the sensor controller 9 (FIG. 1).

<Description of Control System> Next, a control system 20 for controlling the assembling apparatus will be described with reference to FIG. The control system 20 includes four cameras 3, 4,
The four monitor 21 for inputting and displaying each image data from 5 and 6 and the alignment marks M1 and M2 are extracted from the image data, and the face panel 105 and the jig 11
1 or the image processing apparatus 23 which calculates the amount of displacement of the rear panel 120 to obtain the correction amount, and the lower hot plate 2
A robot controller 24 for controlling the positioning of the upper hot plate 1 and controlling the bonding (up and down driving) of the upper hot plate 1;
The robot controller 24 includes a personal computer 22 for editing, executing, and teaching operations of the operation program, and a temperature controller 25 for controlling the temperatures of the upper hot plate 1 and the lower hot plate 2.

The four cameras 3, 4,... Arranged in the assembling apparatus so as to avoid the XYθ table 10 and arranged at four corners from right below the lower hot plate 2 and upward.
Reference numerals 5 and 6 are connected to a monitor 21 for displaying a captured image, respectively, and also to an input terminal of an image processing device 23. The image data taken into the image processing device 23 is converted into an XY coordinate system on the XYθ table 10 by using a coordinate conversion coefficient and a calibration value, and is processed according to an image processing program.

The image processing device 23 includes a serial I / F 20
2, a command is received from the robot controller 24 via the CPU 181, and the CPU 181 performs an arithmetic operation on image data corresponding to the command based on the data on the RAM 183 according to a program written on the ROM 182. Processing from image capture to data processing is performed in response to a processing command sent from the robot controller 24 via serial communication.

The robot control unit 24 is connected to the XYθ table 10 and the NC motors 26 of the vertical drive unit 13, and controls the entire operation procedure.
0 and a temperature control device 2 for controlling the position of the robot in accordance with an instruction from the main control unit 200.
5 comprises a serial I / O board 400 for performing serial I / O communication with the I / O board 500 in the apparatus.

In the main control unit 200, the CPU 201
It executes according to the program written on the OM 210 and controls the operation of the entire system based on the data on the RAM 220. Further, communication of processing commands and processing results with the image processing apparatus 23 is performed via serial communication. In addition,
Details of the contents of the ROM 210 and the RAM 220 will be described later.

Serial I / F 202, 203, 204
Is an interface that communicates with the personal computer 22 that edits an operation program, edits an operation point, and the like, communicates with the image processing device 23, and communicates with the sensor controller 9. Serial I / O 205 is ON / OFF of sensor input, LED, solenoid, etc. in the assembly device
This is an interface for performing communication with the control or temperature control device 25.

The position control unit 300 is connected to the NC motor 26 as a drive unit in the assembling apparatus and the encoder detector 27 of each motor 26, and rotates the motor 26 by a required amount according to an instruction from the main control unit 200. Also, the origin sensor 28 and the overrun sensor (limit switch L
S) Based on the information from the sensors 29 and the like, the process of finding the origin and performing abnormal operation is performed.

The temperature controller 25 includes a heater 25A mounted in the upper and lower hot plates 1 and 2 and a temperature sensor 2
5B is connected, and while maintaining the temperature distribution in the upper and lower hot plates 1 and 2 at ± 5 ° C. or less, from normal temperature to 440 ° C.
The temperature rise / fall control is performed to the vicinity.
The ROM 210 and the RAM 22 provided in the main control unit 200 of the robot controller 24 using (a) and (b).
The contents of 0 will be described.

FIG. 7A is a configuration diagram of a program stored in the ROM 210. Multitask OS21
Reference numeral 1 denotes a multitasking operating system program portion. The operation program interpretation execution unit 212
This is a program part for interpreting and executing an operation program described in a high-level language for the operation of the assembling apparatus. In the present embodiment, a Basic-like robot language is adopted as a high-level language.

The operation program editing unit 213 is a program part for editing the operation program of the assembling apparatus input by the personal computer 22 as an input / output device. The operation point teaching unit 214 is a program part for teaching operation points of the assembly apparatus input by the personal computer 22 and editing point data. The I / O output operation unit 215 includes:
This is a program portion for turning ON / OFF the output of the I / O unit by the personal computer 22.

The I / O input monitor 216 is connected to the personal computer 22
Is a program part for monitoring input information of the I / O unit. The I / O attribute management unit 217 is a part that manages I / O attributes. Each of the program parts is
It is processed by one CPU 201 by the multitask OS 211.

FIG. 7B is a configuration diagram of a program stored in the RAM 220. The table operation program storage area 221 stores an operation program of the assembling apparatus. The table teaching point storage area 222 stores teaching points of the assembling apparatus.

In the time management program storage area 223,
A time management program is stored. The I / O assignment table storage area 224 stores the I / O assignment status. I / O data table storage area 225
Stores an input / output attribute table for selecting and specifying input / output information data and input / output of the I / O unit.

The lead pitch conversion coefficient storage area 226 is
The read hitch conversion coefficient for each of the XYθZ axes is stored. <Description of Assembly Device Calibration Method> Next, a method of calibrating the assembly device will be described with reference to FIGS. Calibration is performed in the following 3
Performs various types of processing.

Calculation of the lead pitch correction coefficient of the XYθ table 10. XY coordinates and XYθ of each of the four cameras 3, 4, 5, and 6
Calculation of a coordinate conversion coefficient with the XY coordinates of the table 10. Calculation of optical axis inclination correction coefficients of cameras 3, 4, 5, and 6. FIG. 8A shows a calibration jig 1 made of glass for performing the above calibration.
32 is shown. As shown in FIG. 8A, the calibration jig 132 has at least three marks, here five marks A1 to A5.
Is provided so as to fall within the visual field range of each of the cameras 3, 4, 5, and 6. The positional relationship between the marks A1 to A5 is separately clarified in a measuring instrument. First, the calibration jig 132 is mounted near the position of the alignment mark on the actual panel of the upper hot plate 1, and the cameras 3, 4, 5, and 6 are adjusted so that the mark A3 is positioned at the center of the field of view. . At this time, the mounting portion of the calibration jig 132 is structured so that the position can be mechanically determined with a certain degree of accuracy. In addition, the calibration jig 132 can be used one time, or four times at the same time.

Next, the calibration jig 132 is mounted on the lower hot plate 2 and the following calibration is performed. Correction of lead pitch of XYθ table 10 As shown in FIG.
The XY table is moved to a position where all of the marks A1 to A5 on the X. 32 are within the field of view. Next, marks A1
The number of pixels (VX0, VY0) between two marks (A2 and A4 on the X axis and A1 and A5 on the Y axis in the figure) of the points A5 parallel to the X axis and the Y axis, respectively, are read by the camera 3, and Known distance data (Xo, Yo) [unit mm] between two points and distance per pixel (Sx, Sy) from the pixel data
Is determined by equation (1). At the same time, the inclination θA of the line connecting the two points A2 and A4 is determined by equation (4).

Next, as shown in FIG. 8C, the moving amounts VXT and VYT [the number of pixels] when the XYθ table 10 is moved by a fixed distance Tx and Ty in the X direction and the Y direction, respectively, are obtained from the image data. The lead pitch conversion coefficient is derived from the ratio with the value by the equations (2) and (3). At the same time, the inclination θT of the movement locus of the mark is obtained by equation (5). The obtained inclination θT of the movement locus of the mark is the inclination of the table X axis, and is stored in the RAM 183 in the image processing device 23.

SX = Xo / VX0, SY = Yo / VY0 (1) LPx = Tx / (VXT · Sx) · LPxo (2) LPY = TY / (VYT · SY) · LPY0 (3) θA = ArcTan (VYA / VxA) (4) θT = ArcTan (VYT / VxT) (5) where LPx and LPY are the current X-axis and Y-axis lead pitch conversion coefficients. , XYθ
The number of pixels of the movement amount when the table 10 is moved by Tx and TY is VXT and VYT. The lead pitch conversion coefficient obtained here is used as a control parameter in the robot controller 24 as the lead pitch conversion coefficient storage area 22 of the RAM 220.
6 is stored. Thereby, the movement amount of the XYθ table 10 thereafter matches the image data (actually measured value).

Further, as shown in FIG. 8D, the angle difference θAT (= θ) between the two angles θA and θT calculated in the middle
A- [theta] T) is converted into position data of the five marks A1 to A5 in the table coordinate system using equations (6) and (7). XTm = XAm · cosθAT−YAm · sinθAT (6) YTm = XAm · sinθAT + YAm · cosθAT (7) where m is an integer of 1 to 5 corresponding to marks A1 to A5.

Calculation of Coordinate Conversion Coefficient The calculation of the coordinate conversion coefficient will be described with reference to FIG. X
Table 10 is moved to a position where all of marks A1 to A5 provided on calibration jig 132 are within the field of view. At that position, image data (Xvm, Yvm) of the marks A1 to A5 is acquired from the camera 3. The position conversion data (XTm, YTm) of the marks A1 to A5 in the table coordinate system obtained with the obtained image data is substituted into an n-th order equation, and the coordinate transformation coefficient of the camera 3 is calculated by a known method of solving the equation. calculate. Repeat the above operation for the other three cameras 4,
In steps 5 and 6, the same operation is performed to obtain coordinate conversion coefficients.
The coordinate conversion coefficient obtained here is the RA in the image processing device 23.
It is stored in M183. Subsequent image data is obtained not by the number of pixels but by position data in the table coordinate system after coordinate conversion.

Correction of Optical Axis Tilt of CCD Camera The correction of the optical axis tilt of the cameras 3 to 6 will be described with reference to FIG. In FIG. 10, only one camera 3 is calibrated, but cameras 3 to 6 for calibrating all four cameras 3 to 6 by the same operation must be mounted vertically to panels 105 and 120. In practice it is very difficult to mount it completely vertically and it is slightly tilted. Calibration jig 1
The upper hot plate 1 to which the nozzle 32 is attached is driven at two or more points in the vertical direction. Image data (Xk1, Yk1) at each point of the position data P1, P2 of the hot plate 1 at that time,
From (Xk2, Yk2) (where k is the channel number), the inclinations θkx and θkY of the camera optical axis are obtained from Expressions (8) and (9), and registered in the RAM 183 as image data correction values.

At the time of execution of bonding, the surface of the member on the lower hot plate 2 at room temperature is used as a reference surface, the height h1 of the face panel 105 from the reference surface, and the rear panel 12
0 or the height h2 of the spacer jig 111 from the reference plane is detected, and the corrected values Xkh and Ykh of the image data are calculated by substituting into the equation (10), and the corrected image data obtained by adding Xkh and Ykh (X, Y) is output.

TanθkX = (Xk1-Xk2) / (P1-P2) (8) tanθkY = (Yk1-Yk2) / (P1-P2) (9) Xkh = hn · tanθkx, Ykh = hn · tanθkY ( 10) In the equation (10), n is the alignment mark shape M
1, M2. Here, the position detection of the hot plate 1 is performed by distance sensors 8a and 8b attached to a member which is independent of the hot plate and is not affected by heat.

The reason why the height of the rear panel 120 or the spacer jig 111 from the reference plane is measured is that the height fluctuates due to thermal expansion. <Description of Assembly Process> The assembly process will be described in detail below.
Here, the description of the actual assembling process will be described with reference to the face panel 10.
The steps of attaching the spacer panel 110 to the rear panel 5 and attaching the face panel 105 to the rear panel 120 will be described with reference to the flowcharts of FIGS.

First, the spacer 1 is attached to the face panel 105.
The step of attaching 10 will be described. Step S1: The face panel 105 is attached to the upper hot plate 1 with the surface on which the alignment mark M1 is formed facing downward. At this point, face panel 10
The frit 106 is applied to the black stripe 104 of No. 5.

Step S2: A jig 111 for holding the spacer 110 with the surface on which the alignment mark M2 is formed facing upward is attached to the lower hot plate 2. Step S3: The upper hot plate 1 is lowered, and the plate 1 is positioned 1 mm above the position where the spacer 110 can be bonded to the face panel 105.

Step S4: Position alignment is performed until the amount of misalignment between the alignment marks M1 and M2 between the face panel 105 and the jig 111 becomes a predetermined value or less. Details of this alignment will be described later with reference to FIG. Step S5: I / O 40 from the robot controller 24
A start command to start temperature control is issued to the temperature control device 25 via the "0".

Step S6: The positional shift amount of the upper and lower panels is corrected for each sampling time. The position correction will be described later in detail with reference to FIG. Step S7: Monitor the temperature of the hot plates 1 and 2,
If the temperature is 360 ° C., the process proceeds to step S8, and if not, the process proceeds to step S9. The temperature of 360 ° C. is a temperature at which the frit 106 used in the present embodiment starts to melt. Here, the method of acquiring the temperature is as follows. The temperature is monitored in the temperature control device 25, and when the temperature reaches 360 ° C., the OUT signal is output, and the robot control device 24 receives the signal by I / O, or , The actual temperature is RS2
Although there is a method of receiving by serial communication such as 32C, etc., in the present embodiment, a method of measuring time in the robot control device 24 and estimating the temperature from the elapsed time from the time when the temperature control device 25 was started. Has been adopted. Hereinafter, the temperature monitoring step is performed by the same method.

Step S8: After lowering the upper hot plate 1 and bonding the spacer 110 to the face panel 105, the process returns to step S6. At this time, a constant load is applied to the upper hot plate 1. Step S9: Monitor the temperature of the hot plates 1 and 2,
If it is 440 ° C., the process proceeds to step S10, and if not, the process returns to step S6. The temperature of 440 ° C. is a temperature at which the frit 106 used in the present embodiment is completely solidified.

Step S10: The upper hot plate 1 is raised to a height at which the spacer 110 comes out of the jig 111, and the position correction is stopped. Next, it moves to step S11. Step S11: The temperature of the hot plates 1 and 2 is monitored, and the temperature at which the panel can be taken out (50 ° C. in this embodiment).
After confirming that it has gone down to the next step.

Step S12: The upper hot plate 1 is raised, and this step ends. Next, the spacer 110
The rear panel 120 is attached to the face panel 105 with the
Will be described with reference to FIG. Step SS1: The face panel 105 is placed on the upper hot plate 1 with the surface on which the spacer 110 is attached facing downward.
Attach to At this point, the spacer 110 is set up on the black stripe 104 of the face panel 105.

Step SS2: Alignment mark M2
The rear panel 120 is attached to the lower hot plate 2 with the face up. The rear panel 120 includes a spacer 110
Is applied with a frit 106 '. Step SS3: Lowering the upper hot plate 1 to attach the face panel 105 and the rear panel 120, more precisely, the spacer 110 and the rear panel 120
Is positioned 1 mm above the position where the contact is made.

Step SS4: Alignment mark M formed on face panel 105 and rear panel 120
Position alignment is performed until the positional deviation amount of M1 and M2 becomes equal to or less than a predetermined value. This positioning will be described later in detail with reference to FIG. Step SS5: I / O4 from the robot controller 24
A start command for starting the temperature control is sent to the temperature control device 25 via 00.

Step SS6: The displacement of the upper and lower panels is corrected for each sampling time. The position correction will be described later in detail with reference to FIG. Step SS7: Monitor the temperatures of the hot plates 1 and 2, and if it is 410 ° C., proceed to step SS8, otherwise proceed to step SS9. The temperature of 410 ° C. is a temperature at which the frit 106 ′ used in the present embodiment starts to melt.

Step SS8: The upper hot plate 1 is lowered, and the rear panel 120 and the spacer 110 are bonded. At this time, a constant load is applied to the upper hot plate 1. Step SS9: The temperatures of the hot plates 1 and 2 are monitored. If the temperature is 360 ° C., the process proceeds to step SS10, and if not, the process returns to step SS6. The temperature of 360 ° C. is such that the frit 106 ′ used in the present embodiment is 410 °.
It is the temperature at which it begins to solidify as it drops from ℃ and completely solidifies.

Step SS10: The position correction is stopped, and the routine goes to step SS11. Step SS11: Monitor the temperature of the hot plates 1 and 2, and take out the temperature at which the panel can be taken out (50 ° C. in this embodiment).
After confirming that it has gone down to the next step. Step SS12: The face panel 105 is released from the holding mechanism of the upper hot plate 1, and the upper hot plate 1 is raised, and this step is completed.

<Description of Alignment Step> Next, in the above two steps, the initial alignment before raising the temperature and the process from the temperature increase to the end of the bonding will be described. First, R in the image processing device 23 shown in FIG.
The storage area of the AM 183 will be described. RAM183
Is the position of the previous alignment mark M1, M2 (Xn
−1, Yn−1) storage area m1, detection area size L
(Illustrated in FIG. 14B, 480 is maximum in this embodiment)
Storage area m2, alignment mark M for temperature
1, M2, a storage area m3 for the displacement coefficients (Xk, Yk), and the current position of the alignment marks M1, M2 (X
(n, Yn) storage areas m4 are provided, and each area stores data of each channel and each alignment mark. Further, a storage area m5 for the previous work temperature Tn-1 and a storage area m6 for the current work temperature Tn are provided as common storage areas.

The initial value of each storage area is the area m1
Are (256, 240), the area m2 is 480, the areas m3 and m4 are (0, 0), and the areas m5 and m6 are 0. Here, the initial value (256, 240) of the area m1 is
Horizontal 512 which is the processing range of the screen acquired from cameras 3 and 4
Pixel, the center coordinates of 480 pixels vertically. In addition, in the initial stage, since the positions of the alignment marks M1 and M2 cannot be predicted at all, the value stored in the area m2 is the maximum value 480 of the processing value range that can be set on the screen.

[Initial Positioning] Initial positioning will be described with reference to FIG. The following processing is basically performed by the CPU 181 of the image processing temperature device 23. Step S21: RAM 18 in image processing temperature device 23
3 are initialized.

Step S22: The current work temperature Tn is
Obtained from the temperature control device 25 via the robot control device 24. Step S23: Previous position data (Xn-1, Yn-1)
From the area m1. Step S24: The size L of the detection range is read from the area m2.

Step S25: The previous position data (Xn
(-1, Yn-1) is set as a detection range in a range of L squares. Step S26: Each channel ch1, ch2, ch
In ch3 and ch4, the positions (pixel data) of the alignment marks M1 and M2 are detected by image correlation. Step S27: Check for a detection error. If there is an error, the process proceeds to step S35, and if there is no error, the process proceeds to step S28.

Step S28: Each detected position data is stored in the storage area m4 of the RAM 183. Step S29: Each position data is coordinate-converted from the image data to the data of the robot coordinate system according to the coordinate conversion coefficient calculated by the calibration of the assembly apparatus. Step S30: A rotation correction amount is calculated in the first step from each position data converted into the robot coordinate system, an XY correction amount is calculated in the second step, and the XYθ table 10 is calculated according to the correction amount. Move. This XY
The movement control of the θ table 10 is performed by the robot controller 24. Details will be described in [Position Correction Method] described later. Here, the rotation correction and the XY correction are performed in the order described above, and both corrections are performed to complete one position correction.

Step S31: The previous position data stored in the area m1 is updated. Step S32: The size L of the detection position stored in the area m2 is set to a value unique to each of the alignment marks M1 and M2. Step S33: If both the correction in the rotation direction and the correction in the XY direction have been completed, the process returns to step S34, and otherwise returns to step S22.

Step S34: Check whether the positional accuracy is within a predetermined value. If it is within the predetermined value, the process of step S36 is performed. If not, the process returns to step S22. Step S35: The size L of the detection range is set to a predetermined size, and the process returns to step S24. Step S36: The area m5 is updated with the current work temperature Tn as the previous work temperature Tn-1. Thus, the initial positioning is completed.

[Position Adjustment During Temperature Elevation] Next, position adjustment during temperature elevation will be described with reference to FIGS.
FIG. 16 is a flowchart of a position correction method during temperature rise / fall, and FIG. 17 is a diagram showing processing contents. This process is also basically performed by the CPU 181 of the image processing device 23.

The frit 106 is once melted and then solidified to form the spacer 1 on the face panel 105.
10 is attached, and the face panel 105 in that state is attached to the rear panel 120. For this purpose, the hot plates 1 and 2 are warmed by the temperature control device 25 and each panel 10 is heated.
5, 120 and the jig 111 are heated. During the process of raising and lowering the temperature, each work (panels 105, 12)
0), the jig 111 and the assembling apparatus are forced to undergo thermal expansion and thermal contraction. Since the directions of thermal expansion and contraction are not uniform, the upper and lower panels 105 and 120 are displaced. Further, the rotation center of the XYθ table 10 is also shifted. Therefore, it is necessary to correct the positional deviation at any time during the assembly process. The position correction method will be described below with reference to FIGS. Here, each process is basically performed by the CPU 181 of the image processing apparatus 23.

Step S41: The processes after step S42 are performed at every predetermined sampling time set in advance. The sampling time is measured in the robot control device 24, and a command as each processing command is transmitted to the image processing device 23. Step S42: The current work temperature Tn is obtained from the temperature control device 25 via the robot control device 24.

Step S43: RA of the image processing device 23
Previous temperature Tn-1 stored in area m5 of M183
Is read. Step S44: Calculate the temperature change amount dT (= Tn-Tn-1). Step S45: Previous alignment mark position (Xn
-1, Yn-1).

Step S46: Work position displacement coefficient (X
k, Yk) is read from the area m3. Step S47: As understood from FIG.
The current position of the alignment mark is estimated from Xc = Xn−1 + Xk · dT and Yc = Yn−1 + Yk · dT. Step S48: The size L of the detection range is read from the area m2.

Step S49: As shown in FIG. 17B, a predetermined range L around the estimated position (Xc, Yc) is set as a detection range. Step S50: In the set detection range, the position of each alignment mark M1, M2 is detected as pixel data by image correlation. Step S51: Check for a detection error. If there is an error, the process proceeds to step S61, and if there is no error, the process proceeds to step S52.

Step S52: Each detected position data is stored in the area m4 of the RAM 183. Step S53: Coordinate conversion of each position data from the image data to data of the robot coordinate system. Step S54: The first step calculates the rotation correction amount from the position data converted into the robot coordinate system, the second step calculates the XY correction amount, and moves the XYθ table 10 according to the correction amount. . This XY
The movement control of the θ table 10 is performed by the robot controller 24. The rotation correction and the XY correction are performed in the above-described order, and both corrections are performed to complete one position correction.

Step S55: The current work temperature Tn is set to the previous work temperature Tn-1, and the area m5 is updated. Step S56: dX = Xn-Xn-1, dY = Yn-Yn
The displacement of the work position is calculated by −1. Step S57: Update the previous position data of the area m1.

Step S58: As understood from FIG. 17C, the displacement coefficient of the alignment mark position is calculated by Xk = dX / dT and Yk = dY / dT. Step S59: Update the displacement coefficient of the alignment mark position in the area m3. Step S60: If both the correction in the rotation direction and the correction in the X and Y directions have been completed, the process returns to step S65; otherwise, the process returns to step S42.

Step S61: As shown in FIG. 17D, the center coordinates (Xc, Yc) of the detection range are set to the previous alignment mark detection position (Xn-1, Yn-1). Step S62: Increase the size L of the detection range (for example, L = LX2). Step S63: If the size L of the detection range exceeds the maximum value 480, it is determined that detection is impossible, and the process proceeds to step S64. If not, the process returns to step S48.

Step S64: The positioning process is interrupted. Step S65: The alignment processing ends. Here, the end of the alignment process is considered to be a plurality of times elapsed from the start of the alignment, or until the temperature becomes equal to or lower than a predetermined temperature and a stop command is issued from the temperature control device 25, or the NC control correction is not effective. Either method may be used.

The work temperature can be obtained by a method of receiving temperature data from the temperature control device 25 or a method of estimating the work temperature from the elapsed time. [Position Correction Method] Next, step S30 in FIG. 15, FIG.
6, the rotation direction and X in the process of step S54.
A specific method of correcting the amount of displacement in the Y direction will be described below with reference to the flowcharts of FIGS.

FIGS. 11A and 11B show rotation correction, and FIG.
3 shows Y correction. Step S71: First, in each of the four channels, the positions (Xknm, Yknm) of the two previously registered alignment marks M1, M2 (where k is a camera channel, and n is the alignment mark shapes M1, M).
2 and m represent numbers sequentially assigned from the upper left to the side of the plurality of marks. The same symbols appearing later have the same meaning). This data is stored in step S2 in FIG.
9 or data obtained in the process up to step 53 in FIG.

Here, when a predetermined number of marks cannot be detected, a moving direction for bringing the marks into a non-overlapping state is estimated from the detected marks, and a half of the mark interval is estimated.
And step S71 is performed again. For example, if they overlap as shown in FIG. 5B, the alignment mark M1
Can be detected and two alignment marks M2 can be detected. Therefore, it can be assumed that two of the alignment marks M1 and two of the alignment marks M2 are overlapped, so that it is only necessary to move M2 upward.

Step S72: Next, face panel 1
05 and the member attached to the lower hot plate 2 (jig 1
11 or the rear panel 120), the distances hk1 and hk2 from the reference surface when the lower hot plate 2 at room temperature is used as the reference surface are detected. Step S73: Correction value Xhk based on inclination of camera optical axis
n and Yhkn are obtained by Expression (13).

Step S74: A value (Xk1m-Xhk1, Yk1m-Yhk1) obtained by subtracting the correction value based on the inclination of the camera optical axis from the previously detected data of M1, (Xk2m-Xhk2, Y
k2m-Yhk2). This storage is performed in the working area of the RAM 183. The same applies to the storage of the following similar processing. Step S75: Change the execution destination according to the correction method. If it is rotation correction, the process proceeds to step S76, and if it is XY correction, the process proceeds to step S79.

Step S76: In the same channel, the inclination of the line connecting the alignment marks M1 and M2 is calculated by equations (11) to (13).
The average value θ0 is obtained by equation (14), and θ1 multiplied by the correction coefficient kθ is calculated and corrected by equation (15). The correction coefficient kθ is initialized to 1 at the start.

Θk1 = ArcTan ((Yk13−Yk11) / (Xk13−Xk11)) (11) θk2 = ArcTan ((Yk22−Yk21) / (Xk22−Xk21)) (12) θk = θk2−θk1 13) θo = (θ1 + θ2 + θ3 + θ4) / 4 (14) θ1 = θo × kθ (15) Here, θk1 and θk2 are XYθ and a line connecting alignment marks (M1 and M2) of the same shape in each channel k. This is the current inclination with respect to the table X axis.

Step S77: As shown in FIG. 19, after the correction in the previous step, the relative angle shift is calculated again,
The XY shift amount of each channel is calculated while rotating slightly, and the correction is repeated until the XY shift amounts of all the channels match. As shown in FIG. 19A, the relative angle shift amount θ by a plurality of marks constituting the alignment mark is calculated, and after the θ correction, the remaining shift amount dθ is corrected (FIG. 19B). After the dθ correction, the positional relationships of the alignment marks at a plurality of locations match (FIG. 19C).

Step S78: The correction coefficient kθ is calculated by the equation (16) from the relative deviation amount θo calculated in step S76 and the amount θ actually moved in step S77. kθ = (θo−θ) / θo (16) Step S79: The same c is obtained from the detected position data.
h Reference alignment mark (left) Difference X between M1 and M2
ex and Yex are calculated.

CXk2 = (Xk21 + Xk22 + Xk23 + Xk24) / 4-Xhk2 (k = 1 to 4) (17) CXk1 = (Xk11 + Xk12 + Xk13 + Xk14) / 4-Xhk1 (k = 1 to 4) ... (18) CYk2 = (Yk21 + Yk22 + 24) -Yhk2 (k = 1 to 4) (19) CYk1 = (Yk11 + Yk12 + Yk13 + Yk14) / 4-Xhk1 (k = 1 to 4) (20) Xek = CXk2-CXk1 (k = 1 to 4) (21) Yek = CYk2−CYk1 (k = 1 to 4) (22) Step S80: In each of the X-direction component and the Y-direction component, the average Xa and Ya of the shift amount are obtained by the formulas (23) and (24).

Xe = (Xe1 + Xe2 + Xe3 + Xe4) / 4 (23) Ye = (Ye1 + Ye2 + Ye3 + Ye4) / 4 (24) Step S81: The correction amount obtained above is transmitted to the serial transmission line. Via the XYθ table 1 by the received correction amount.
Move 0.

Step S82: After moving the determined correction amount, the positions of the alignment marks M1 and M2 are
If it is within the detection range of the D camera, the process ends normally. If it is out of the detection range, the process moves to step S83. Step S83: An error signal is transmitted, and the robot controller 24 activates the alarm device, stops the automatic operation, and switches to the manual mode. Subsequent position corrections
It is up to the operator.

Thereafter, the processing moves to the next step. In the present embodiment, the position detection of the alignment marks M1 and M2 is performed by image correlation with the pattern of the alignment marks registered in advance. However, the present invention is not limited to this, and if the above-described detection range is considered as a binarization center-of-gravity calculation target range, the alignment mark can be detected by the center-of-gravity calculation. In this case, the detection error can be checked by comparing the area of the binarized target with a value registered in advance for each alignment mark.

In calculating the displacement coefficient of the alignment mark position with respect to the temperature rise of the work, it is possible to prevent a sudden displacement by averaging a predetermined number of samplings in the past. <Method of Estimating Alignment Mark with High Convergence> In the above embodiment, the coordinate data of the immediately preceding alignment mark and
Although the latest coordinate data of the alignment mark is calculated based on the first order differential value of the displacement amount related to the temperature change, it may be necessary to repeatedly perform an operation for convergence depending on how to obtain dT.

Such a case can be improved by considering so-called series expansion to a higher order. (25),
Equation (26) is an example of the step of estimating the mark position executed in step S47 of FIG. 16, and is an equation in which a term relating to the second derivative with respect to temperature is added. Xc = Xn-1 + Xk.dT + Xk / dT. (DT.dT) / 2 (25) Yc = Yn-1 + Yk.dT + Yk / dT. (DT.dT) / 2 (26) , Xk = dX / dT, Yk = dY / dT (27) By adding the number of terms in the series expansion as described above, the coordinate values can be approximated with high accuracy, so that coordinate data with better convergence can be estimated. Becomes

[0094]

As described above, at least two or more alignment marks are formed on a member at a plurality of points at each position, and the center of the alignment marks, that is, the center between the plurality of marks, is located at the same position. With such a configuration, accurate bonding can be performed without detecting the angle of the members with high accuracy.

Further, since a plurality of marks forming one alignment mark are arranged so that all the marks do not overlap regardless of the positional relationship between the members, the marks can be detected. It will not go away. Further, by providing a step of calculating a correction coefficient from the angle actually moved by the fine adjustment and the relative shift amount obtained from the plurality of marks, an alignment method with excellent convergence becomes possible.

This eliminates the need for precision management of adjusting the positional relationship between a plurality of visual sensors for detecting alignment marks provided at a plurality of locations with high accuracy.

[0097]

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a control system for controlling an assembly apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view illustrating an assembling apparatus according to the embodiment.

FIG. 3A is a diagram showing the panel unit 100, and is a perspective view of the panel unit 100 in which a frame 130 is partially omitted so that the inside can be seen. FIG. 3 (b)
Is the panel unit 10 at the position indicated by DD in FIG.
0 shows a cross section.

FIG. 4A is a view showing a jig 111 for erecting spacers 110 at regular intervals on a black stripe 104. FIG. FIG. 4B shows the face panel 105. FIG. 4C is a diagram illustrating the rear panel 120.

FIG. 5A shows a positional relationship when the alignment marks M1 and M2 are bonded to regular positions. FIG.
(B) shows a state in which the marks are overlapped among a plurality of marks constituting the alignment mark.

FIG. 6 is an enlarged view of a portion of the face panel 105 where a spacer is erected.

FIG. 7A illustrates a ROM 210 and a RAM 220 provided in a main control unit 200 of the robot controller 24.
FIG. 3 is a diagram for explaining the contents of FIG. 2 and shows a configuration diagram of a program stored in a ROM 210. FIG. 7B shows an RO provided in the main controller 200 of the robot controller 24.
FIG. 8 is a diagram for explaining the contents of M210 and RAM 220;
FIG. 3 is a configuration diagram of a program stored in the AM 220.

FIG. 8A shows a jig 132 used for calibration.

FIG. 8B is an explanatory diagram of a step of calculating a distance per pixel in the calibration method.

FIG. 8C is an explanatory diagram of a step of calculating the lead pitch of the XYθ table in the calibration method.

FIG. 8D is an explanatory diagram of a step of converting the position of a mark on a calibration jig into position data in a robot coordinate system in the calibration method.

FIG. 9 is a diagram illustrating calculation of a coordinate conversion coefficient.

FIG. 10 is a diagram illustrating correction of the inclination of the optical axes of the cameras 3 to 6.

FIG. 11A is a diagram illustrating correction of a rotation direction.

FIG. 11B is a diagram illustrating correction of a rotation direction.

FIG. 11C is a diagram illustrating the correction in the XY directions.

FIG. 12 is a flowchart illustrating a process of mounting the spacer 110 on the face panel 105 by standing.

FIG. 13 is a flowchart showing a process of bonding the face panel 105 to the rear panel 120.

FIG. 14A shows a RAM in an image processing device 23;
183 is a view for explaining a storage area of 183. FIG. FIG. 14B is a diagram for explaining the size L of the detection range, which is one of the data stored in the RAM 183.

FIG. 15 is a flowchart illustrating initial alignment.

FIG. 16 is a flowchart illustrating a position correction method during temperature rise and fall.

FIG. 17A illustrates a process of estimating a current position of an alignment mark. FIG.
(B) illustrates the process of setting a predetermined range L as a detection range around the estimated position. FIG.
FIG. 7 (c) illustrates the processing for calculating the displacement coefficient of the alignment mark position. FIG. 17D illustrates the process of changing the detection range by using the center coordinate of the detection range as the previous alignment mark detection position.

FIG. 18 is a flowchart illustrating a method of correcting a displacement amount.

FIG. 19A is a diagram illustrating calculation of a relative angle shift amount θ by a plurality of marks constituting an alignment mark. FIG. 19B shows the remaining deviation dθ after θ correction.
It is a figure which shows correction of. FIG. 19C is a diagram showing a state in which the positional relationship of the alignment marks at a plurality of locations matches after dθ correction.

[Explanation of symbols]

 3, 4, 5, 6 Video camera 9 Sensor controller 20 Control system 23 Image processing device 24 Robot control device 25 Temperature control device 25A Heater 25B Temperature sensor 26 Motor 105 Face panel 110 Spacer 120 Rear panel 132 Calibration jig

Claims (10)

[Claims] 1. A method of positioning and bonding a plurality of members at predetermined sampling times while heating, and bonding alignment marks formed at least at two or more positions of the members by a visual sensor. A detection step of detecting as each image data; a step of calculating position information of the alignment mark from the detected image data; and a step of calculating a relative shift amount between a plurality of members from the calculated position information. A position control step of performing a coarse adjustment to correct the relative deviation amount; and a position control step of finely feeding the plurality of members in the rotation direction and performing a fine adjustment so that the positional relationship of the alignment marks at a plurality of locations coincide. Comparing the amount of movement up to the coincidence with the relative deviation amount obtained first, and calculating a correction coefficient from the result of the comparison. And a method of bonding a plurality of members. 2. A position detection mark used for bonding a plurality of members, wherein the mark has a different shape for each member, and has a plurality of marks in at least two places of each member. When the members are stuck at regular positions, all of the plurality of marks do not overlap, and the center position of the mark is formed at a predetermined position facing each member. Position detection mark used for bonding. 3. The position detection mark formed of a plurality of marks formed on the plurality of members is formed such that all of the plurality of marks do not overlap at one time in any state. 3. The method according to claim 2, wherein
A position detection mark used for bonding a plurality of members described. 4. The method for bonding a plurality of members according to claim 1, wherein the plurality of members are positioned and bonded by the position detection mark. 5. The method according to claim 1, wherein the position information is calculated based on image data of at least two visual sensors. 6. The method according to claim 1, wherein a visual field range of the visual sensor is variable according to whether or not the alignment mark can be captured. 7. An apparatus for aligning and bonding a plurality of members at predetermined sampling times while heating the members, wherein alignment marks formed at least at two or more positions of the members are sampled by a visual sensor. Detecting means for detecting each time as image data, means for calculating position information of the alignment mark from the detected image data, and means for calculating a relative shift amount between a plurality of members from the calculated position information. A position control means for performing a coarse adjustment for correcting the relative deviation amount; a position control means for finely feeding the plurality of members in a rotational direction and performing a fine adjustment so that a positional relationship between a plurality of alignment marks coincides with each other. Means for comparing the amount of movement up to the coincidence and the relative deviation obtained first, and calculating a correction coefficient from the result of the comparison. A plurality of bonding apparatus member, characterized in that it comprises means for exiting, the. 8. The apparatus comprises: first mounting means for mounting a first member; first positioning means for positioning the first mounting means; and second mounting for mounting a second member. Means, second positioning means for positioning the second mounting means, imaging means for imaging respective positioning marks formed on the first member and the second member, and the imaged image Means for converting data into position data; position control means for controlling first and second positioning means based on the position data; and heating control means for synchronizing and heating the first and second mounting means. The heating control means calculates the position correction amount for each predetermined sampling time while heating the first and second mounting means, and aligns the first and second members. The first member is a The members, bonding apparatus of the plurality of members according to claim 7, wherein the bonding by adding a constant load. 9. The apparatus according to claim 8, wherein said first positioning means is driven up and down, and said second positioning means is positioned by translation in two orthogonal directions and driving in a rotating direction. For bonding a plurality of members. 10. The apparatus according to claim 8, wherein said position control means has a force control function.