JPH1164688A - Optical semiconductor element-housing packaging - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor element-housing package capable of exactly disposing an optical fiber and an optical semiconductor element opposite to each other, enhancing the efficiency of the transfer and receipt of light between the optical fiber and the optical semiconductor element and normally and stably operating the internally housed optical semiconductor element for a long period. SOLUTION: This package has an optical semiconductor element loading part 1a in the central part of its front surface and consists of a resin base body 1 which is provided with a frame part 2 enclosing the loading part on its outer peripheral part, an optical fiber fixing member 6 which is mounted to penetrate the frame part 2 and a cap 3 which is mounted atop the frame part 2 and closes the inner side of the frame part 2. In such a case, the base body 1 having the frame part 2 is formed of a transfer mold and the optical fiber fixing member 6 is integrally mounted at the frame part 2. The coefft. of thermal expansion of the base body 1 having the frame part 2 is larger by 0.8×10<-5> to 6.8×10<-5> / deg.C than the coefft. of thermal expansion of the optical fiber fixing member 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor element housing package for housing an optical semiconductor element such as a laser diode for converting an electric signal used for optical communication into an optical signal and a photodiode for converting an optical signal into an electric signal. As shown in FIG. 2, is made of an electrically insulating material such as an aluminum oxide sintered body, and has a mounting portion 21a for mounting the optical semiconductor element S at substantially the center of the upper surface thereof. A base 21 having a frame portion 22 provided with a through hole 23 in an outer peripheral portion;
A substantially cylindrical optical fiber fixing member 25 which is inserted through a through hole 23 provided in the frame portion 22 and is fixedly attached thereto via an adhesive 24 such as glass or resin;
A plurality of external lead terminals 26 attached at both ends thereof to the inside and outside of the frame portion 22 and having one ends protruding outside the frame portion 22 connected to an external electric circuit;
And a lid 27 which is attached to the upper surface of the frame portion 22 via a sealing material and hermetically seals the inside of the frame portion 22. The optical fiber 2 is placed inside the cylindrical optical fiber fixing member 25.
8 and fixed via an adhesive, and then the optical semiconductor element S mounted on the optical transmission module substrate 29 made of silicon is mounted and fixed on the mounting portion 21a of the base 21. Each electrode of S is connected to the external lead terminal 22 by an electrical connection means 30 such as a bonding wire.
Then, a lid 27 is joined to the upper surface of the frame 22 via a sealing material, and the optical semiconductor is placed inside the container including the base 21 having the frame 22 and the lid 27. The optical semiconductor device is completed as a product by housing the element S in an airtight manner.

In such an optical semiconductor device, an electric signal supplied from an external electric circuit is applied to the optical semiconductor element S through an external lead terminal 26 to excite the optical semiconductor element S with light and to transmit the excited light to an optical fiber 28. Or by irradiating the optical semiconductor element S with light transmitted through the optical fiber 28 and generating an electric signal corresponding to the light irradiated on the optical semiconductor element S, and transmitting the generated electric signal to an external lead terminal. Used for optical communication by withdrawing via 26.

A substrate 21 having a frame portion 22 provided with a through hole 23 in the outer peripheral portion of the upper surface made of the aluminum oxide sintered body is used for forming a ceramic raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide or the like. An organic binder, a solvent, etc. are added and mixed to produce a slurry, and the slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like to obtain a ceramic green sheet. Punching and stacking multiple sheets, about 150
It is manufactured by firing at a high temperature of 0 ° C.

[0005]

However, in this optical semiconductor element housing package, the fixing of the optical fiber fixing member 25 to the base 21 is performed by fixing the optical fiber fixing member 25 to the frame 22 formed on the outer peripheral portion of the upper surface of the base 21. Member 2
5. A through hole 23 having an inner diameter slightly larger than the outer dimension of the through hole 5 is provided in advance, and the optical fiber fixing member 25 is inserted into the through hole 23 and the through hole 2 is formed.
3 is bonded to the outer surface of the optical fiber fixing member 25 via an adhesive made of glass, resin, or the like. The fixing position of the optical fiber fixing member 25 in the through hole 23 is Since a slight clearance is provided between the inner diameter and the outer shape of the optical fiber fixing member 25, the optical fiber has a deviation of about 0.05 mm to 1.0 mm from a predetermined position. Therefore, when the optical fiber 28 is fixed inside the optical fiber fixing member 25, the fixing position of the optical fiber 28 is slightly shifted from a predetermined position. As a result, the optical fiber 28 and the optical semiconductor element S do not face each other accurately,
There is a disadvantage that the efficiency of transmitting and receiving light between the optical fiber 28 and the optical semiconductor element S is greatly reduced.

In this conventional package for housing an optical semiconductor element, the base 21 having a frame portion 22 on the outer peripheral portion of the upper surface is formed of an aluminum oxide sintered body that is fragile and has low mechanical strength. When an external impact force is applied to the portion 22, cracks and cracks occur in the base 21 and the frame portion 22. When cracks and cracks occur in the base 21 and the frame portion 22, the base 21 having the frame portion 22 and the lid There is also a disadvantage that the hermetic sealing of the container comprising the body 27 is broken, and the optical semiconductor element S contained in the container cannot be operated normally and stably for a long period of time.

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to accurately oppose an optical fiber and an optical semiconductor element to increase the efficiency of light transmission and reception between the optical fiber and the optical semiconductor element. It is an object of the present invention to provide an optical semiconductor element housing package that can normally and stably operate an optical semiconductor element housed therein for a long period of time.

[0008]

According to the present invention, there is provided a resin base in which a mounting portion for an optical semiconductor element is provided at a central portion of an upper surface and a frame surrounding the mounting portion is provided at an outer peripheral portion. An optical semiconductor element housing package comprising: an optical fiber fixing member attached so as to penetrate the frame; and a lid attached to an upper surface of the frame and closing an inside of the frame. Is formed by transfer molding, the optical fiber fixing member is integrally attached to the frame, and the coefficient of thermal expansion of the optical fiber fixing member is smaller than the coefficient of thermal expansion of the substrate having the frame. 0.8 × 10 ^-5 /
C. to 6.8.times.10.sup.- ⁵ / .degree. C. smaller.

Further, the present invention is characterized in that the resin substrate contains 1 to 50% by weight of a hygroscopic material having pores having a radius of 10 to 100 angstroms on the surface.

According to the package for housing an optical semiconductor element of the present invention, the optical fiber fixing member is integrally attached to a predetermined position of the frame at the same time when the base having the frame is formed by transfer molding. The fixing position of the fixing member with respect to the frame portion is an accurate position without variation. As a result, when the optical fiber is fixed inside the optical fiber fixing member, the fixing position of the optical fiber is also accurate, and the optical fiber and the optical semiconductor element are separated. It is possible to accurately oppose each other and improve the efficiency of light transmission and reception between the optical fiber and the optical semiconductor element.

According to the package for housing an optical semiconductor element of the present invention, the thermal expansion coefficient of the optical fiber fixing member is 0.8 × 10 ⁻⁵ / ° C. higher than the thermal expansion coefficient of the base having the frame portion.
6.8 × 10 ⁻⁵ / ° C., the base having the frame portion is pressed against the optical fiber fixing member by an appropriate force, whereby the frame portion of the base and the optical fiber fixing member are firmly connected to each other. The optical semiconductor element can be hermetically accommodated in a container which is attached and formed of a base having a frame portion and a lid, and the optical semiconductor element can be operated normally and stably for a long period of time. it can.

Further, according to the package for housing an optical semiconductor element of the present invention, since the base having the frame portion is formed of an organic resin having excellent mechanical strength, an externally applied impact force is applied to the base having the frame portion. No cracks, cracks, etc. occur, and as a result, the reliability of hermetic sealing of the container consisting of the base having the frame portion and the lid is greatly improved, and the optical semiconductor element accommodated in the container can be used for a long time. It can be operated normally and stably for a long time.

Further, according to the package for housing an optical semiconductor element of the present invention, a base material having a frame portion contains 1 to 50% by weight of a hygroscopic material having pores having a radius of 10 to 100 angstroms on the surface. And the moisture contained in the atmosphere tries to penetrate into the interior through the base having the frame portion, the penetration is effectively prevented by the hygroscopic material. Oxidation corrosion does not occur in the electrical connection means such as the above or the external lead terminal, and the optical semiconductor element can always be operated normally and stably.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of the package for housing an optical semiconductor element according to the present invention. The base 1 having the frame 2 and the lid 3 constitute a container for housing the optical semiconductor element S inside.

The base 1 functions as a support member for supporting the optical semiconductor element S, and has a mounting portion 1a for mounting the optical semiconductor element S at substantially the center of the upper surface thereof.
An optical semiconductor element S mounted on an optical transmission module substrate L made of silicon or the like is mounted and fixed on the mounting portion 1a.

A frame 2 is formed around the upper surface of the base 1 so as to surround a mounting section 1a on which the optical semiconductor element S is mounted. This serves to form a space for accommodating the optical semiconductor element S.

A base 1 having a frame 2 on the outer periphery of the upper surface
Is made of, for example, an organic resin such as an epoxy resin. By adopting a transfer molding method, specifically, an epoxy resin such as a bisphenol A type or an O-cresol novolac type, silica, alumina or the like is placed in a predetermined mold. Of a tablet-like epoxy resin raw material comprising a filler, and other curing agents, flexibilizing agents, flame-retardant aids, coloring agents, release agents, etc. It is manufactured by thermosetting at a temperature of from 200C to 200C.

The base 1 having the frame 2 on the outer periphery of the upper surface is made of an organic resin such as an epoxy resin and has excellent impact resistance, so that an externally applied impact force is applied to the base 1 having the frame 2. However, no cracks, cracks, or the like occur in the base 1 having the frame 2, and as a result, the reliability of hermetic sealing of the container including the base 1 having the frame 2 and the lid 3 is greatly improved. In addition, the optical semiconductor element S housed in the container can be normally and stably operated for a long period of time.

The base 1 having the frame portion 2 on the outer peripheral portion of the upper surface contains 1.0 to 50% by weight of a hygroscopic material having pores with a radius of 10 to 100 angstroms on its surface. Of moisture contained in the substrate 1 through the base 1 having the frame portion 2 is effectively prevented by the moisture absorbing material. Oxidation corrosion does not occur in the electrical connection means 5 such as a bonding wire or the external lead terminal 4, and the optical semiconductor element S
Can always be operated normally and stably.
Therefore, it is preferable that the base 1 having the frame portion 2 contains 1 to 50% by weight of a hygroscopic material having pores having a radius of 10 to 100 angstroms on its surface.

When the base material 1 having the frame portion 2 contains a hygroscopic material, when the base material 1 having the frame portion 2 is formed by transfer molding the raw material powder of the epoxy resin, By containing a predetermined amount of a hygroscopic material composed of spherical silica particles or the like in advance, the hygroscopic material is contained in the base 1 having the frame portion 2.

When a hygroscopic material is contained in the substrate 1 having the frame portion 2, the pore radius of the surface of the hygroscopic material is 1
If the thickness is less than 0 Å, it is difficult to completely adsorb the moisture that has invaded the substrate 1 to the moisture absorbing material.
If it exceeds 00 angstroms, the specific gravity of the hygroscopic material becomes light, and it becomes difficult to disperse and contain the hygroscopic material in the entire substrate 1 having the frame portion 2. Therefore, when a moisture absorbing material is contained in the substrate 1 having the frame portion 2, it is preferable that the pore radius of the surface of the moisture absorbing material is set in a range of 10 Å to 100 Å.

Further, when a moisture absorbing material is contained inside the base 1 having the frame portion 2, the content of the moisture absorbing material is 1% by weight.
If it is less than 50%, the passage of moisture through the substrate 1 having the frame portion 2 is not effectively prevented. If it exceeds 50% by weight, the base material 1 having the frame portion 2 is formed by transfer molding the raw material powder of the epoxy resin. In this case, the flowability of the epoxy resin deteriorates and the base 1 having the frame 2 of a desired shape is formed.
There is a risk of not being able to obtain. Therefore, when a moisture absorbing material is contained in the substrate 1 having the frame portion 2, the content of the moisture absorbing material is preferably set in the range of 1 to 50% by weight.

Both ends of the frame 2 of the base 1 are frame 2
A plurality of external lead terminals 4 projecting inward and outward are attached, and each electrode of the optical semiconductor element S is electrically connected to an area of the external lead terminal 4 projecting inside the frame portion 2 by means of a bonding wire or the like. 5, the electrodes of the optical semiconductor element S are electrically connected to the external electric circuit via the external lead terminals 4 by electrically connecting the region protruding outside the frame portion 2 to the external electric circuit. Will be done.

The external lead terminal 4 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy.
For example, the ingot is formed to a predetermined shape by subjecting an ingot made of an iron-nickel-cobalt alloy or the like to a conventionally known metal working method such as a rolling method or a punching method.

The external lead terminals 4 are attached to the frame 2 in advance when the base 1 having the frame 2 is formed by transfer molding at a predetermined position in a mold.
Is set, the two ends are integrally attached to a predetermined position of the frame portion 2 with both ends protruding inside and outside of the frame portion 2.

The external lead terminal 4 is coated on its exposed outer surface with a metal (eg, nickel or gold) having good conductivity and excellent corrosion resistance and good wettability with a brazing material by plating to a predetermined thickness (1 to 20 μm). ) Can prevent oxidation corrosion of the external lead terminal 4 effectively, connect the external lead terminal 4 to the electrical connection means 5 such as a bonding wire, and connect the external lead terminal 4 to the external electrical terminal. The connection with the circuit can be made highly reliable. Accordingly, the external lead terminal 4 is formed by depositing a metal such as nickel or gold having good conductivity, excellent corrosion resistance, and good wettability with the brazing material on the exposed outer surface to a thickness of 1 to 20 μm by plating. Preferably.

A cylindrical optical fiber fixing member 6 is integrally attached to the frame portion 2 of the base 1 with one end protruding inside the frame portion 2 and the other end protruding outside the frame portion 2. Have been.

The cylindrical optical fiber fixing member 6 functions to fix the optical fiber 7 in a state where the tip of the optical fiber 7 faces the optical semiconductor element S, and the optical fiber 7 has the tip of the optical fiber 7 therein. Then, the protective member 8 attached to the outer surface of the optical fiber 7 and the outer end of the optical fiber fixing member 6 are bonded to each other through an adhesive 9 made of resin or the like. Numeral 7 is fixed to the cylindrical optical fiber fixing member 6 with its tip facing the optical semiconductor element S.

The cylindrical optical fiber fixing member 6 comprises:
For example, it is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. The outer diameter is φ2.
It is manufactured in a cylindrical shape of about 0 mm.

The cylindrical optical fiber fixing member 6 is attached to the frame portion 2 when the base member 1 having the frame portion 2 is formed by the transfer molding method. It is done by setting. In this case, the optical fiber fixing member 6 is integrally attached to a predetermined position of the frame portion when the base having the frame portion is formed by transfer molding, so that the outer surface of the optical fiber fixing member 6 and the frame portion 2 are formed. There is no clearance between them and they come into direct contact,
The fixing position of the optical fiber fixing member 6 with respect to the frame portion 2 is an accurate position without variation. When the optical fiber 7 is fixed inside the optical fiber fixing member 6, the fixing position of the optical fiber 7 is also accurate, and the optical fiber 7 and the optical fiber 7 are fixed. The optical semiconductor element S faces exactly, and the efficiency of light transmission and reception between the optical fiber 7 and the optical semiconductor element S can be improved.

The cylindrical optical fiber fixing member 6
Yes should be less 0.8 × 10 ^-5 /℃~6.8×10 ^-5 / ℃ than the thermal expansion coefficient of the base body 1, the thermal expansion coefficient has a frame part 2, whereby a predetermined position of the frame 2 When the base 1 having the frame 2 is formed by the transfer molding method so that the optical fiber fixing member 6 is integrally attached to the optical fiber fixing member 6, the base 1 having the frame 2 with respect to the optical fiber fixing member 6 has an appropriate degree. As a result, the frame 2 of the base 1 and the optical fiber fixing member 6 are firmly attached to each other, so that the inside of the container constituted by the base 1 having the frame 2 and the lid 3 is placed. It becomes possible to house the optical semiconductor element S in an airtight manner,
The optical semiconductor element S can be operated normally and stably for a long time.

The coefficient of thermal expansion of the optical fiber fixing member 6 is set to be 0.1 mm greater than the coefficient of thermal expansion of the base 1 having the frame 2.
8 × To 10 ^-5 /℃~6.8×10 smaller ^-5 / ° C., the
For example, a base 1 having a frame 2 made of an organic resin such as an epoxy resin contains about 70 to 90% by weight of a filler made of alumina or silica. 0.8 × than the thermal expansion coefficient of the optical fiber fixing member 6 10 ^-5 /℃~6.8×10 ^-5 / ℃
This is done by adjusting it to be higher.

The difference between the coefficient of thermal expansion of the optical fiber fixing member 6 and the coefficient of thermal expansion of the substrate 1 having the frame portion 2 is equal to 0.
If it is less than 8 × 10 ⁻⁵ / ° C., the attachment strength between the frame portion 2 of the substrate 1 and the optical fiber fixing member 6 becomes weak, and 6.8.
If the temperature exceeds × 10 ⁻⁵ / ° C., cracks and the like occur in the substrate 1 having the frame portion 2, and the hermetic sealing of the optical semiconductor element is broken. Therefore, the difference between the coefficient of thermal expansion of the optical fiber fixing member 6 and the coefficient of thermal expansion of the base 1 having the frame 2 is 0.8 ×
It is limited to the range of 10 ^-5 /℃~6.8×10 ^-5 / ℃.

Further, the above-mentioned optical fiber fixing member 6 is formed by coating a metal such as nickel or gold having excellent corrosion resistance to a thickness of 1 to 20 μm on the exposed outer surface by plating. Oxidative corrosion can be effectively prevented. Therefore, in order to effectively prevent the occurrence of poor appearance due to oxidative corrosion, the optical fiber fixing member 6 is coated with a metal such as nickel or gold having excellent corrosion resistance on its exposed outer surface to a thickness of 1 to 20 μm by plating. It is preferable that it is adhered.

An optical fiber 7 is inserted and fixed inside the cylindrical optical fiber fixing member 6. The optical fiber 7 transmits light emitted from the optical semiconductor element S to the outside, or transmits light from the outside to the optical semiconductor. It functions as a light transmission path for transmitting to the element S.

On the other hand, a lid 3 is joined to a frame 2 provided on the outer peripheral portion of the upper surface of the base 1 via a sealing material made of an organic resin or the like. The optical semiconductor element S is hermetically accommodated in a container constituted by the base 1 having the frame portion 2 and the lid 3 by closing the container.

The lid 2 is made of an organic resin such as an epoxy resin or a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, and is formed in a predetermined plate shape by a conventionally well-known forming method.

Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element S mounted on the optical transmission module substrate L is mounted and fixed on the mounting portion 1a of the base 1 and each of the optical semiconductor elements S The electrode is electrically connected to a predetermined external lead terminal 4 via an electrical connection means 5 such as a bonding wire, and then the optical fiber 7 is inserted into the cylindrical optical fiber fixing member 6, and the tip is The semiconductor device S is fixed so as to face the semiconductor element S. Thereafter, the lid 3 is joined to the upper surface of the frame 2 via a sealing material.
The optical semiconductor device S as a product is completed by hermetically housing the optical semiconductor element S in a container including the base 1 and the lid 3 having the above.

In this optical semiconductor device, an electric signal supplied from an external electric circuit is applied to the optical semiconductor element S via the external lead terminal 4 to excite the optical semiconductor element S and to transmit the excited light to the optical fiber 7. Or by irradiating the optical semiconductor element S with light transmitted through the optical fiber 7 to generate an electric signal corresponding to the light irradiated on the optical semiconductor element S and transmitting the generated electric signal to the external lead terminal 4. Used for optical communication by extracting through

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

[0041]

According to the package for housing an optical semiconductor element of the present invention, the optical fiber fixing member is integrally attached to a predetermined position of the frame at the same time when the base having the frame is formed by transfer molding. From this, the fixing position of the optical fiber fixing member to the frame portion becomes an accurate position without variation, and as a result, when the optical fiber is fixed inside the optical fiber fixing member, the fixing position of the optical fiber also becomes accurate, and the optical fiber and the optical semiconductor element are fixed. Are accurately opposed to each other, and the efficiency of light transmission and reception between the optical fiber and the optical semiconductor element can be improved.

Further, according to the package for housing an optical semiconductor element of the present invention, the thermal expansion coefficient of the optical fiber fixing member is 0.8 × 10 ⁻⁵ / ° C. more than the thermal expansion coefficient of the base having the frame portion.
6.8 × 10 ⁻⁵ / ° C., the base having the frame portion is pressed against the optical fiber fixing member by an appropriate force, whereby the frame portion of the base and the optical fiber fixing member are firmly connected to each other. The optical semiconductor element can be hermetically accommodated in a container which is attached and formed of a base having a frame portion and a lid, and the optical semiconductor element can be operated normally and stably for a long period of time. it can.

Further, according to the package for housing an optical semiconductor element of the present invention, since the base having the frame is formed of an organic resin having excellent mechanical strength, an externally applied impact force is applied to the base having the frame. No cracks, cracks, etc. occur, and as a result, the reliability of hermetic sealing of the container consisting of the base having the frame portion and the lid is greatly improved, and the optical semiconductor element accommodated in the container can be used for a long time. It can be operated normally and stably for a long time.

Further, according to the package for housing an optical semiconductor element of the present invention, the base having the frame portion contains 1 to 50% by weight of a hygroscopic material having pores having a radius of 10 to 100 Å on the surface. And the moisture contained in the air attempts to enter the interior through the base having the frame, and the penetration is effectively prevented by the moisture absorbing material. Oxidation corrosion does not occur in the electrical connection means such as the above or the external lead terminal, and the optical semiconductor element can always be operated normally and stably.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing an optical semiconductor element of the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of a conventional package for housing an optical semiconductor element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Resin base 1a ... Mounting part 2 ... Frame part 3 ... Lid 4 ... External lead terminal 6 ... Optical fiber fixing member 7 ... Optical fiber S ... Light Semiconductor element

Claims (2)

[Claims] A mounting portion for an optical semiconductor element is mounted at a central portion of an upper surface, and is mounted so as to penetrate the resin base having a frame portion surrounding the mounting portion at an outer peripheral portion. An optical semiconductor element housing package comprising: an optical fiber fixing member; and a lid attached to an upper surface of the frame portion and closing the inside of the frame portion, wherein a base having the frame portion is formed by transfer molding. The optical fiber fixing member is integrally attached to the frame, and the coefficient of thermal expansion of the optical fiber fixing member is 0.8 × 10 ^{−5 /0.8×10 −5} / mm less than that of the base having the frame. A package for housing an optical semiconductor element, characterized in that the temperature is lower by from ℃ to 6.8 × 10 ^-5 / ° C. 2. A resin having a radius of 1 inside the resin base.
2. The package for housing an optical semiconductor device according to claim 1, wherein the package contains 1 to 50% by weight of a hygroscopic material having pores of 0 to 100 angstroms.