JPH1154988A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow the device to surely extract electronic components from a component tape. SOLUTION: A control means 8 drives a tape drive means to carry a component tape in a component supply device 118 by one pitch, and to set an electronic component in the tape at a component etract position at a tip of the component supply device 118. The control means 8 starts a head drive means next to allow a mounting head 146 to adsorb the electronic component at the component extract position. The electronic component adsorbed by the mounting head 146 is carried to a mounting position of a printed circuit board 153. The control means 8 checks a pneumatic pressure denoted by an output signal of a pressure sensor 10, and discriminates it that no component is adsorbed by the mounting head 146 when the pneumatic pressure exceeds a reference value. Then, the control means 8 starts again the head drive means to allow the mounting head 146 to adsorb and extract a component again. In this case, the control means 8 does not start the tape drive means not to carry the component tape.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for automatically mounting, for example, chip-type electronic components on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, component mounting apparatuses have been widely used for automatically mounting, for example, chip-type electronic components on a printed circuit board. This component mounting apparatus is configured such that an electronic component supplied by a component supply device is sucked by a mounting head, moved to a component mounting position on a printed board, and mounted on the printed board. Here, the electronic component is obtained by forming a resistor, a capacitor, a transistor, and the like into a chip, and is hereinafter also referred to as a chip-type electronic component.

A large number of chip-type electronic components are provided to a user in a state of being stored in a large number of component tapes and wound on reels.
FIG. 6 is a perspective view showing an example of a component tape mounted on the component supply device. As shown in FIG. 6, a large number of chip-type electronic components 102 used in the component mounting device are stored in a component tape 104 and wound around a reel 106. That is, the component tape 104 has a bottom tape 112 on the lower surface of the carrier tape 110 in which the square hole 108 is formed.
Is attached, and the chip-type electronic component 102 is housed thereon, and further, the top tape 114 is attached on the upper surface thereof, and is wound around the reel 106. Also,
On the side of the component tape 104, feed holes 116 for driving and transporting the component tape 104 are formed at regular intervals in the extending direction of the component tape 104. This type of component tape 104 is called a square hole punched carrier tape type component tape. 1 for one component tape 104
Types of chip-type electronic components 102 are stored, and when mounting the chip-type electronic components 102 on a printed circuit board,
A plurality of component tapes 104 each containing a different chip-type electronic component 102 are used.

FIG. 7 is a perspective view showing a conventional component supply device.
FIG. 8 is a perspective view showing the component supply device of FIG. The component supply device 118 includes a main chassis 120, a tape cover 122, and a component tape 10.
Take-up reel 12 for winding top tape 114 of No. 4
4. It comprises a reel holder 126 for setting the reel 106 around which the component tape 104 is wound, a pressing plate 128 for fixing the reel 106, and the like.

[0005] The reel shaft 130 is mounted on the reel holder 12.
6 is screwed and fixed substantially at the center. Also, presser plate 1
One end 28 is swingably attached to the main chassis 120, and the other end is engaged with and fixed to the reel shaft 130. Reel 106
When mounting is performed, first, the presser plate 128 is swung to release the engagement with the reel shaft 130, and is moved to a position outside the reel area. Thereafter, the reel shaft 130 is inserted into the hole in the center of the reel 106, and the reel 106 is mounted on the reel holder 126. Thereafter, the holding plate 128 is swung in the opposite direction to engage the end portion 134 with the reel shaft 130 and fix it. I do.

Thus, the reel 106 is mounted on the reel holder 1.
26, the component supply device 118 in this state, the component tape 1 wound around the reel 106
The top tape 114 is unwound, and the top tape 114 is peeled off from the component tape 104 through a cut provided at a predetermined position of the tape cover 122, and is wound on a take-up reel 124. The component supply device 118 further includes the top tape 11
4 is peeled off to expose the chip-type electronic component 102 to the tape 104 and the main chassis 12.
The paper is sequentially conveyed from a gap between the two. An opening is formed in the tape cover 122 to form a component take-out position 136. The chip-type electronic component 102 exposed through the opening at the component take-out position 136 is sucked by a mounting head described later and taken out from the component tape 104. .

FIG. 9 is a side view showing the component supply device 118 of FIG. 7 viewed from the opposite side. As shown in FIG. 9, a feed gear 13 is provided at the tip of the main chassis 120.
8 is rotatably disposed. The feed gear 138 is formed on the outer peripheral surface of the disk-shaped main body by projecting a large number of projections at regular intervals in the radial direction.
The component tape 104 is conveyed by rotating the feed gear 138 while meshing with the fourth feed hole 116.

At the tip of the main chassis 120,
A drive lever 140 for driving the feed gear 138 is provided so as to be swingable in a plane parallel to the rotation surface of the feed gear 138. 138 is rotated by a fixed angle in conjunction with it, and the component tape 104 is transported by a distance corresponding to the rotation angle. When the component supply device 118 is mounted on the component mounting device, a rod of an air cylinder (not shown) provided on the main body side of the component mounting device is driven by the drive lever 14.
0, and the drive lever 140 is driven in the direction of arrow A by this air cylinder. The drive lever 14
0 is urged by a predetermined spring in the direction opposite to the arrow A, and returns to its original position each time one drive by the air cylinder is completed. The drive lever 140
Is returned, the interlock between the feed gear 138 and the drive lever 140 is cancelled. Therefore, at this time, the feed gear 138 does not rotate and the component tape 104 is not conveyed in the opposite direction. Absent.

A plurality of such component supply devices are provided for the component mounting device, and different chip-type electronic components 102 are supplied from each component supply device. FIG. 10 is a perspective view showing an example of a conventional component mounting apparatus. As shown in FIG. 10, the component mounting device 142 mainly includes a component cassette 14 in which a plurality of component supply devices 118 are arranged.
4. The mounting head 146 includes a fixed rail 148 and a movable rail 150 that movably support the mounting head 146.

The two fixed rails 148 are respectively provided on the left and right sides of the main body 152 in parallel with each other and horizontally as bases of the component mounting device 142.
Are mounted on these fixed rails 148 at right angles to the fixed rails 148 and in a horizontal state, and are supported at both ends by the fixed rails 148.
The upper part is movable in the extending direction of the fixed rail 148 (the direction of arrow X). The head holding means 154 is attached to the movable rail 150 so as to be movable in the direction in which the movable rail 150 extends (the direction of arrow Y), and the main body 154A is moved vertically (in the direction of arrow Z) with respect to the base 154B. Direction).

Each of the movable rail 150 and the head holding means 154 is provided with a driving means (not shown) including a servomotor, a ball screw, a female screw screwed to the ball screw, and the like. , The movable rail 150 moves in the direction of arrow X, the head holding means 154 moves in the direction of arrow Y, and the mounting head 146 moves in the direction of arrow Z.

The printed circuit board 153 on which components are to be mounted is
The table 15 of the main body 152 facing the mounting head 146
6 is arranged and fixed with the plate surface horizontal. The parts cassette 144 is arranged such that the tip of the main chassis 120 of each of the parts supply devices 118 faces the printed circuit board 153, and the parts take-out position 136 (see FIG. 11) is located close to the printed circuit board 153. 152.

The parts cassette 14 in the main body 152
At the lower part of 4, the above-described air cylinder and a solenoid valve for controlling the air cylinder are arranged to drive the drive lever 140 of the component supply device 118. The component mounting device 142 also includes a suction device 158, and is configured to suction from the mounting head 146 through piping (not shown). The suction device 158 includes an electromagnetic valve, and the suction through the mounting head 146 can be controlled by controlling the electromagnetic valve.

The component mounting device 142 has a built-in control means 160 composed of a microcomputer. When the microcomputer operates based on a program loaded in its memory, the control means 160 is controlled by the movable rail 150 and the head holding mechanism. The driving means of the means 154, the air cylinder for driving the component supply device 118, and the suction device 158 are controlled to mount the chip-type electronic component 102 on the printed circuit board 153. Specifically, the control means 160 first activates the air cylinder via the electromagnetic valve, and swings the drive lever 140 of the component supply device 118 shown in FIG. As a result, the feed gear 138 rotates by a fixed angle, the component tape 104 is transported by one pitch corresponding to the arrangement interval of the chip-type electronic components 102, and the chip-type electronic component 102 to be mounted is arranged at the component take-out position 136. Is done.

Next, the control means 160 controls the movable rail 150
By controlling the driving unit of the head holding unit 154, the head holding unit 146 holds the head so that the mounting head 146 is located directly above the component pick-up position 136 of the component supply device 118 that supplies the chip-type electronic component 102 to be mounted on the printed board 153. The means 154 is moved, and then the mounting head 146 is lowered to a position where the tip of the mounting head 146 contacts the upper surface of the chip-shaped electronic component 102, and the suction device 158
Is controlled through the solenoid valve to cause the mounting head 146 to attract the chip-type electronic component 102. Then, the control means 1
60 raises the mounting head 146, controls the head holding means 154 and the movable rail 150, and conveys the chip-type electronic component 102 sucked by the mounting head 146 to a mounting position on the printed circuit board 153.
The electronic component is arranged on the mounting position by eliminating the suction caused by the above.

FIG. 11 shows a component supply device 118 for electronic components.
It is a schematic diagram which shows conveyance and adsorption | suction above easily.
As shown in FIG. 11A, the component tape 104 is first conveyed by one pitch on the main chassis 120 of the component supply device 118 by the rotation of the feed gear 138 (FIG. 9), and then to be mounted. The electronic component 162 moves to the component extraction position 136. Subsequently, the mounting head 146 is disposed above the component take-out position 136, descends to suck the electronic component 162, and then ascends, as shown in FIG. As a result, as shown in FIG. 11C, the electronic component 162 located at the component take-out position 136 is removed from the component tape 104, and when the next electronic component is sucked, the next electronic component is sucked. 164 are transported to the component take-out position 136, and each electronic component stored in the component tape 104 is printed by the printed circuit board 1 in the same procedure.
53.

[0017]

However, the removal of the chip-type electronic component 102 from the component tape 104 is not always smooth. For some reason, the suction of the electronic component by the mounting head 146 fails. May be. FIG. 12 is a schematic view showing a case where the chip-type electronic component 102 is not correctly removed from the component tape 104. FIG. 12A corresponds to FIG. 11A and shows a state in which the electronic component 162 to be mounted on the printed circuit board 153 has been transported to the component extraction position 136. Subsequently, as in the case described above, the mounting head 146 is disposed above the component take-out position 136, and FIG.
As shown in the figure, the electronic component 162 descends and is sucked, but if the sucking fails for any reason,
As shown in FIG. 12C, only the mounting head 146 moves up while the electronic component 162 remains on the component tape 104.

Thereafter, the mounting head 146 is controlled by the control means 16.
Under the control by the control unit 0, the electronic component 162 is placed on the printed board 153 on the assumption that the electronic component 162 is being sucked, but the electronic component 162 is not sucked by the mounting head 146, and the printed board 153 Electronic components 16 on top
2 is not placed, an error occurs, and the component tape 104
The control means 160 moves the mounting head 146 to the position of the component take-out position 136 in order to take out the electronic component from the device.

However, in the conventional component mounting device 142,
Since the control means 160 always carries out the movement of the component tape 104 on the component supply device 118 and the movement of the mounting head 146 to the component removal position 136, first, as shown in FIG. Then, the component tape 104 is conveyed by one pitch, and the mounting head 146 sucks the electronic component 164 arranged next at the component take-out position 136. Therefore, the component take-out position 13
The electronic component 162 arranged in 6 is sent out without being taken out from the component tape 104. Since the component tape 104 from which all the electronic components have been taken out is generally cut or discarded, the electronic components remaining in the component tape 104 without being taken out are also discarded together with the component tape 104.

Accordingly, an object of the present invention is to provide a component mounting apparatus in which, in order to eliminate such waste, when the mounting head fails to suck an electronic component, the electronic component is sucked again. Is to do.

[0021]

In order to solve the above-mentioned problems, the present invention holds a component tape in which a large number of components are arranged and stored, conveys the component tape, and supplies each component to a predetermined component take-out position. When a first control signal is input to a component mounting apparatus including a component supply device and a mounting head that sucks the component supplied to the component removal position and transports the component to a mounting position of the component, the component A tape driving means for driving the component tape held by the supply device to convey the component tape by a distance corresponding to the arrangement interval of the component, and supplying the component stored in the component tape to the component take-out position; When a control signal is input, the mounting head is driven to move toward the component supplied to the component removal position, and the component is sucked to the mounting head, A head driving means for taking out an article from the component take-out position, a pressure sensor for detecting an air pressure in the mounting head and outputting an electric signal representing the detected air pressure, and outputting the first control signal at intervals Activating the tape driving means, outputting the second control signal each time the first control signal is output, activating the head driving means, and outputting the second control signal, Check the air pressure represented by the output signal of the pressure sensor, and if the air pressure exceeds a reference value,
And a control unit for outputting the second control signal again before outputting the control signal.

In the component mounting apparatus of the present invention, when the component is taken out from the component tape, the control means first outputs a first control signal to activate the tape driving means, and the component tape is held by the component supply device. Are conveyed by a distance corresponding to the arrangement interval of the components, and the components stored in the component tape are supplied to the component take-out position. Next, the control unit outputs the second control signal to activate the head driving unit, and moves the mounting head to contact or approach the component supplied to the component pick-up position. Separate from the parts removal position. As a result, the component at the component take-out position is sucked by the mounting head, taken out of the component tape, and conveyed to, for example, the mounting position of the printed circuit board.

Here, the control means checks the air pressure indicated by the output signal of the pressure sensor, and if the air pressure exceeds the reference value, determines that the component is not sucked by the mounting head, and The control signal is output again to cause the mounting head to perform the operation of sucking and removing the component again through the head driving means. Then, the output signal of the pressure sensor is checked, and if the air pressure is equal to or lower than the reference value, it is determined that the component is sucked by the mounting head. Thereafter, after the component adsorbed by the mounting head is mounted on the printed circuit board, the first control signal is output again to remove the next component from the component tape, and the same operation is repeated thereafter.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described based on embodiments with reference to the drawings. FIG. 1 is a perspective view showing an example of a component mounting apparatus according to the present invention, and FIG. 2 is a functional block diagram for explaining control by a control means constituting the component mounting apparatus of FIG. In the figure, the same elements as those in FIG. 10 are denoted by the same reference numerals, and a detailed description thereof will be omitted here.

The component mounting device 2 is particularly equipped with a control unit 8
However, this is different from the conventional component mounting apparatus 142 in that the tape driving unit 4 and the head driving unit 6 (FIG. 2) are controlled based on the detection result of the air pressure by the pressure sensor 10 provided in the mounting head 146. The tape driving means 4 is shown in FIG.
, A driving lever 140, an air cylinder (not shown) for driving the driving lever 140, and a solenoid valve (not shown) for controlling the air cylinder. The electromagnetic valve is controlled by a first control signal output from the control means 8, and when the first control signal is input, the component tape 104 held by the component supply device 118 is driven to arrange the electronic components. The electronic component stored in the component tape 104 is transported by a distance corresponding to the interval, and is supplied to the component extracting position 136 (FIG. 7).

The head driving means 6 includes a fixed rail 148,
A movable rail 150 and a head holding means 154;
4 driving means. Each drive means of the movable rail 150 and the head holding means 154 includes a servo motor (not shown), a ball screw, a female screw screwed to the ball screw,
The movable rails 150 are respectively moved in the direction of arrow X, and the head holding means 154 is moved by the mounting head 146 in the direction of arrow Y.
Moves in the direction of arrow Z. When the second control signal is input from the control unit 8 to the head driving unit 6, the controller controls each driving unit of the movable rail 150 and the head holding unit 154, and is supplied to the component take-out position 136. The mounting head 146 is moved to contact or approach the mounted electronic component, and then the mounting head 146 is moved to the component removal position 13.
Separated from 6. The pressure sensor 10 is a mounting head 146
And outputs an electric signal indicating the detected air pressure in the mounting head 146.

The control means 8 is constituted by a microcomputer having a memory loaded with a predetermined program.
The tape driving unit 4 and the head driving unit 6 are controlled based on the electric signal from the pressure sensor 10. Specifically, the control means 8 outputs the first control signal at intervals, activates the tape driving means 4, and outputs the second control signal every time the first control signal is output. Each time the head driving means 6 is activated and the second control signal is output, the air pressure indicated by the output signal of the pressure sensor 10 is checked. Then, as a result of checking the air pressure, if the air pressure exceeds the reference value, the second control signal is output again before the next output of the first control signal.

Next, the operation of the component mounting apparatus 2 configured as described above will be described. FIG. 3 is a flowchart showing the operation of the component mounting apparatus 2, and FIG. 4 is a schematic diagram showing the transport and suction of the electronic component on the component supply device 118 for easy understanding. Hereinafter, these drawings will be referred to as appropriate. The control means 8 first selects the component supply device 118 holding the chip-type electronic component 102 to be mounted, and sends a first control signal to the tape drive means 4 to transport the component tape 104 in the component supply device 118. Output (Step S1 in FIG. 3). As a result, the electromagnetic valve constituting the head driving means 6 is operated, and as a result, the air cylinder is activated and the driving lever 1 of the component supply device 118 shown in FIG.
40 swings. As a result, the feed gear 138 rotates by a fixed angle, and as shown in FIG. 4A, the component tape 104 is conveyed by one pitch (a distance corresponding to the arrangement interval of the electronic components). At the removal position 136,
An electronic component 162 to be mounted on the printed board 153 is arranged.

Next, the control means 8 outputs a second control signal to the head driving means 6 to attract the electronic component 162 (step S2). Thus, the controller constituting the head driving unit 6 controls each driving unit of the movable rail 150 and the head holding unit 154, and attaches the mounting head 146 to the electronic component supplied to the component extracting position 136.
The mounting head 146 is moved so as to make contact or approach. More specifically, the head driving means 6 first arranges the mounting head 146 right above the component take-out position 136, and then, as shown in FIG.
The electronic component 162 arranged at the component extraction position 136
Lower toward. Then, the control means 8 controls the suction device 1
The electronic component 162 is attracted to the mounting head 146 by controlling the device 58 through the solenoid valve (step S3). Thereafter, the head driving means 6 raises the mounting head 146,
It is separated from the component take-out position 136. Here, when the electronic component 162 is correctly sucked, the mounting head 1
46 rises with the electronic component 162 being sucked. Then, as shown in FIG.
The electronic component is taken out from 36.

Subsequently, the control means 8 controls the pressure sensor 10
Then, the air pressure represented by the output signal is checked (step S4). In this case, since the electronic component 162 is adsorbed on the mounting head 146, the air pressure is sufficiently low and becomes equal to or less than the reference value (Yes in step S4), and the control unit 8 determines that the electronic component is correctly adsorbed. Then, the head driving means 6 is controlled to operate as usual, and the mounting head 146 having sucked the electronic component 162 is moved, so that the printed board 153 is moved.
The electronic component 162 is transported to the upper mounting position. Then, the control unit 8 controls the suction device 158 to stop the suction of the electronic component 162 by the mounting head 146, and arranges the electronic component 162 at the mounting position on the printed board 153 (step S5). Thereafter, the control means 8 outputs the first control signal to the tape driving means 4 again to mount the next electronic component on the printed circuit board 153 (step S1), and the same operation is repeated thereafter.

On the other hand, the operation in the case where the electronic components are not correctly sucked is as follows. FIG. 5 is a schematic diagram showing a case where the chip-type electronic component 102 is not correctly taken out from the component tape 104. Hereinafter, this drawing will be referred to as appropriate. The control means 8 first selects the component supply device 118 holding the chip-type electronic component 102 to be mounted, as in the above-described case, and controls the component supply device 118 to carry the first control signal so as to transport the component tape 104. Is output to the tape driving means 4 (step S1). As a result, the head driving means 6 transports the component tape 104 by one pitch, and as shown in FIG. 5A, the electronic component 1 to be mounted on the printed circuit board 153 at the component take-out position 136.
62 is arranged.

Next, the control means 8 outputs a second control signal to the head driving means 6 to attract the electronic component 162 (step S2). Thereby, the head driving means 6
As shown in FIG. 5A, first, the mounting head 146 is disposed immediately above the component take-out position 136, and then, as shown in FIG.
As shown in (B), the mounting head 146 is lowered toward the electronic component 162 arranged at the component removal position 136. Then, the control means 8 controls the suction device 158 through the electromagnetic valve, and causes the mounting head 146 to perform the suction operation of the chip-type electronic component 102. Thereafter, the head driving means 6 raises the mounting head 146 and separates it from the component take-out position 136 (step S3).

Here, as shown in FIG. 5C, when the electronic component 162 is not properly sucked, the mounting head 146 rises without sucking the electronic component 162. Subsequently, the control means 8 controls the pressure sensor 1
The air pressure indicated by the 0 output signal is checked (step S4).
In this case, the electronic component 162 is not attracted to the mounting head 146, the air pressure is high, and exceeds the reference value. Therefore, the control unit 8 determines that the electronic component is not properly attracted (No in step S4). Then, the second control signal is output to the head driving means 6 again, and the operation for removing the electronic component is performed again (step S2). Assuming that the suction of the electronic component has succeeded, the mounting head 146 moves upward while sucking the electronic component 162 as shown in FIG. 5D.

Thereafter, the control means 8 checks the air pressure indicated by the output signal of the pressure sensor 10 (step S4). In this case, since the electronic component 162 is attracted to the mounting head 146, the air pressure is sufficiently low. It is equal to or less than the reference value (Yes in step S4). Therefore, the control unit 8 determines that the electronic component is correctly sucked, and controls the head driving unit 6 to transport the mounting head to the mounting position of the electronic component. Accordingly, the head driving unit 6 operates in the same manner as described above, moves the mounting head 146 that has sucked the electronic component 162, and transports the electronic component 162 to the mounting position on the printed board 153. Then, the control means 8 controls the suction device 158 to stop the suction of the electronic component 162 by the mounting head 146, and arranges the electronic component 162 at the mounting position on the printed board 153 (step S).
5).

As described above, in the component mounting apparatus 2 of the present embodiment, the control means 8 outputs the second control signal and causes the mounting head 146 to perform the operation of sucking the electronic component.
The air pressure indicated by the output signal of the pressure sensor 10 is checked, and if the electronic component is not properly sucked and the air pressure exceeds the reference value, before the next output of the first control signal, that is, the component tape 104 Before transporting the electronic component, the second control signal is output again, and the mounting operation of the electronic component by the mounting head 146 is performed again. Therefore, even when the removal of the electronic component from the component tape 104 fails, the suction operation by the mounting head 146 is repeated, and the electronic component is reliably removed from the component tape 104. Therefore, unlike the conventional case, the electronic component that has not been sucked is replaced with the component tape 10.
4 and is discarded together with the component tape 104.

As the component tape 104, in addition to the square hole punch carrier type component tape, an embossed carrier type component tape having an embossed mounting hole for accommodating the chip type electronic component 102 formed in the carrier tape is used. However, the present invention is of course effective.

[0037]

As described above, in the component mounting apparatus according to the present invention, when the component is taken out from the component tape, the control means first outputs the first control signal to activate the tape driving means, and the component supply device is activated. Is transported by a distance corresponding to the arrangement interval of the components, and the components stored in the component tape are supplied to the component removal position. Next, the control unit outputs the second control signal to activate the head driving unit, and moves the mounting head to contact or approach the component supplied to the component pick-up position. Separate from the parts removal position. As a result, the component at the component take-out position is sucked by the mounting head, taken out of the component tape, and conveyed to, for example, the mounting position of the printed circuit board. However, here, the control means checks the air pressure represented by the output signal of the pressure sensor,
If the air pressure exceeds the reference value, it is determined that the component is not adsorbed to the mounting head, the second control signal is output again, and the component is suctioned again to the mounting head through the head driving means and taken out. Perform the operation. Then, check the output signal of the pressure sensor, and if the air pressure is lower than the reference value,
It is determined that the component has been attracted to the mounting head. Thereafter, after the component adsorbed by the mounting head is mounted on the printed circuit board, the first control signal is output again to remove the next component from the component tape, and the same operation is repeated thereafter. Therefore, even if the removal of the component from the component tape fails, the suction operation by the mounting head is repeated before the component tape is transported, and the component is reliably removed from the component tape. For this reason, it is possible to eliminate the waste that the component that has not been sucked remains housed in the component tape and is discarded together with the component tape as in the related art.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a component mounting apparatus according to the present invention.

FIG. 2 is a functional block diagram illustrating control by control means constituting the component mounting apparatus of FIG. 1;

FIG. 3 is a flowchart illustrating an operation of the component mounting apparatus.

FIG. 4 is a schematic diagram illustrating the conveyance and suction of an electronic component on a component supply device.

FIG. 5 is a schematic diagram showing a case where an electronic component is not correctly taken out from a component tape.

FIG. 6 is a perspective view showing an example of a component tape mounted on the component supply device.

FIG. 7 is a perspective view showing a conventional component supply device.

FIG. 8 is a perspective view showing the component supply device of FIG. 7 with a reel mounted.

FIG. 9 is a side view showing a state where the component supply device of FIG. 7 is viewed from the opposite side.

FIG. 10 is a perspective view showing an example of a conventional component mounting apparatus.

FIG. 11 is a schematic diagram illustrating the conveyance and suction of an electronic component on a component supply device.

FIG. 12 is a schematic diagram showing a case where an electronic component is not correctly taken out from a component tape.

[Explanation of symbols]

2 ... component mounting device, 4 ... tape driving means, 6 ... head driving means, 8 ... control means, 10 ... pressure sensor,
102: chip-type electronic component, 104: component tape,
110 ... carrier tape, 116 ... perforated hole, 118
... parts supply device, 120 ... main chassis, 122
... Tape cover, 136 ... Component take-out position, 13
Reference numeral 8: feed gear, 140: drive lever, 142: component mounting device, 146: mounting head, 148: fixed rail, 150: movable rail, 154: head holding means, 158: suction device, 160 Control means.

Claims (6)

[Claims] 1. A component supply device for holding a component tape in which a large number of components are arranged and stored, transporting the component tape and supplying each component to a predetermined component removal position, and a component supply device supplied to the component removal position. And a mounting head for picking up a component and transporting the component to a mounting position of the component. When a first control signal is inputted, the component tape is driven by driving the component tape held by the component supply device. A tape driving unit that conveys the component stored in the component tape to the component pick-up position by conveying the component tape by a distance corresponding to the arrangement interval of the component tape, and drives the mounting head when a second control signal is input. Moving the head toward the component supplied to the component take-out position, sucking the component to the mounting head, and taking out the component from the component take-out position. A pressure sensor for detecting an air pressure in the mounting head and outputting an electric signal representing the detected air pressure; outputting the first control signal at intervals to activate the tape driving means; Each time the first control signal is output, the second control signal is output to activate the head driving unit, and each time the second control signal is output, the air pressure represented by the output signal of the pressure sensor is calculated. Checking, when the air pressure exceeds a reference value, a control means for outputting the second control signal again before outputting the first control signal next time. Component mounting device. 2. A head driving means comprising: two fixed rails fixedly installed in parallel at intervals on a base; and a head driving means which is orthogonal to the fixed rails and movable along the fixed rails. A movable rail mounted on the fixed rail; and a movable rail attached to the movable rail, movable along the movable rail, and movable in a direction orthogonal to the fixed rail and the movable rail. The component mounting apparatus according to claim 1, further comprising: a holding unit; and a driving unit for driving the movable rail and the holding unit. 3. The component mounting apparatus according to claim 1, wherein said control means is constituted by a computer loaded with a predetermined program. 4. The component mounting according to claim 1, wherein said component tape is wound around a reel, and said tape drive means conveys said component tape by feeding out said component tape from said reel. apparatus. 5. The component mounting apparatus according to claim 1, wherein the component tape is a square hole punch carrier type component tape or an embossed carrier type component tape. 6. The component mounting apparatus according to claim 1, wherein said component is a chip-type electronic component.