JPH1154367A - Composite electronic component, its manufacture and chip-like electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve packaging density and inexpensively manufacture various products. SOLUTION: Terminal electrodes 2a are provided on the bottom surfaces of a plurality of chip-like electronic components 2 constituting a composite electronic component 1, and the chip-like electronic components 2 are integrally held by a holding substrate 3 with the lateral surfaces and end surfaces tightly contacting with one another, so that the terminal electrodes 2a are located on points of intersection of a lattice having spacings of a predetermined length L. Thus, the spacing between the adjacent chip-like electronic components 2 is reduced, and the packaging density is increased. Also, since a plurality of components are mounted in one shot, the packaging cost can be restrained. Moreover, since various chip-like electronic components 2 can be combined, designing and design changes can be easily carried out and various products can be manufactured inexpensively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component comprising a plurality of chip-like electronic components such as multilayer capacitors and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, for example, a chip-shaped electronic component such as a multilayer capacitor has terminal electrodes provided at both ends thereof. When mounting the chip-shaped electronic component on a circuit board, the terminal electrodes are connected to the circuit board. They were mounted on lands provided on the surface and mounted by reflow soldering.

[0003]

However, when this chip-shaped electronic component is mounted on a circuit board, a solder fillet is formed around the terminal electrode. In order to prevent short-circuiting between terminal electrodes due to soldering, it is necessary to increase the interval between electronic components, and it has been difficult to improve the mounting density.

Further, in order to improve the mounting density, an electrode pattern or the like inside an electronic component is configured to have a plurality of functions such as a resistor, a capacitor, and an inductor.
Composite electronic components, such as a capacitor array and a chip resistor network, in which the mounting density of electronic components has been improved have been considered. However, this composite electronic component is manufactured through a process of drying, laminating, pressing, debinding, and firing a green sheet on which an electrode pattern is printed in accordance with the type of component to be incorporated and its performance. In order to meet the demands, it is necessary to design and manufacture each of the demands, so that the cost is high, and it is also difficult to respond to design changes.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a composite electronic component capable of increasing the mounting density and manufacturing various products at low cost, a method of manufacturing the same, and a method of manufacturing the same. It is to provide a chip-shaped electronic component.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor device comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding the chip-shaped electronic components. A composite electronic component having a bottom surface opposed to a circuit board, wherein the chip-shaped electronic component includes a terminal electrode only on one surface thereof, and the holding member has a grid formed at a predetermined interval on the bottom surface of the composite electronic component. A chip-shaped electronic component is integrally held so that the terminal electrode is arranged on the intersection.

According to the present invention, on the bottom surface of the composite electronic component, the terminal electrodes of the chip-shaped electronic component are arranged on the intersections of the lattice at predetermined intervals.

According to a second aspect of the present invention, there are provided a plurality of chip-shaped electronic components having terminal electrodes, and a holding member for integrally holding the chip-shaped electronic components. In the composite electronic component, the chip-shaped electronic component has a terminal electrode only on one surface thereof, and the holding member has a first electrode provided on the front surface so as to be arranged on an intersection of a grid at a predetermined interval, and a back surface. And a substrate provided with a second electrode electrically connected to the first electrode, and a terminal electrode of the chip-shaped electronic component and a first electrode corresponding to the terminal electrode.
And the chip-shaped electronic component is integrally held by electrically connecting the electrodes.

According to the present invention, the second electrode of the holding member is arranged on the bottom surface of the composite electronic component at the intersection of the grid at a predetermined interval, and further, the first electrode electrically connected to the second electrode.
The terminal electrodes of the chip-shaped electronic component are conductively connected to these electrodes and are integrally held.

Further, according to a third aspect of the present invention, in the composite electronic component according to the first or second aspect, terminal electrodes are provided on the bottom surface of the rectangular parallelepiped chip-shaped electronic component at an integer multiple of the predetermined interval. The holding member is characterized in that the chip-shaped electronic components are integrally held by closely contacting the side surfaces or end surfaces thereof.

According to the present invention, the interval between the chip-shaped electronic components can be minimized.

Further, the invention according to claim 4 comprises a plurality of chip-shaped electronic components having terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, and the bottom surface thereof is mounted facing the circuit board. In the method of manufacturing a composite electronic component, chip-like electronic components having terminal electrodes only on one surface are assembled such that the terminal electrodes are arranged on intersections of lattices at predetermined intervals, and the chip-like electronic components are arranged on the upper surface of the chip-like electronic component. The chip-shaped electronic component is integrally held by attaching a holding member throughout.

According to the present invention, chip-like electronic components having terminal electrodes only on one surface are assembled so as to be arranged on intersections of grids at predetermined intervals, and are integrally formed by holding members provided on the upper surface. Will be retained. Thus, the bottom surface of the composite electronic component has the terminal electrodes of the chip-like electronic component arranged on the intersections of the lattice at predetermined intervals.

Further, the invention according to claim 5 comprises a plurality of chip-shaped electronic components having terminal electrodes, and a holding member for integrally holding these chip-shaped electronic components, and the bottom surface thereof is mounted facing the circuit board. In the method of manufacturing a composite electronic component, chip-shaped electronic components each having a terminal electrode only on one surface are assembled such that the terminal electrodes are arranged on intersections of lattices having a predetermined interval, and the surface is arranged at a predetermined interval. The first electrode and the terminal of the chip-shaped electronic component are provided by a holding member composed of a substrate having a first electrode provided on the intersection of the lattices of the first and second electrodes provided on the back surface with a second electrode electrically connected to the first electrode. The chip-shaped electronic component is integrally held by being electrically connected to the electrode.

According to the present invention, the chip-like electronic components having the terminal electrodes only on one surface are assembled so as to be arranged on the intersections of the lattice at predetermined intervals. Further, the first electrode and the first electrode are provided by a holding member formed of a substrate having a first electrode provided on the intersection of the grid at a predetermined interval on the front surface and a second electrode provided on the back surface to be electrically connected to the first electrode. The terminal electrodes of the chip-shaped electronic component are conductively connected, and the chip-shaped electronic component is held integrally. Thereby, on the bottom of the composite electronic component,
The second electrode of the holding member is arranged on the intersection of the lattice at a predetermined interval, and further, the terminal electrode of the chip-shaped electronic component is conductively connected to the first electrode conductively connected to the second electrode. Will be retained.

According to a sixth aspect of the present invention, in the method for manufacturing a composite electronic component according to the fourth or fifth aspect, the terminal electrode is provided on the bottom surface of the rectangular parallelepiped chip-shaped electronic component at an interval which is an integral multiple of the predetermined interval. And the chip-shaped electronic components are assembled with their side surfaces or end surfaces in close contact with each other.

According to the present invention, it is possible to manufacture a composite electronic component in which the interval between chip-shaped electronic components is minimized.

Further, the invention of claim 7 is the invention according to claim 1.
7. The chip-shaped electronic component constituting the composite electronic component according to claim 6, wherein the bottom surface of the rectangular parallelepiped chip-shaped electronic component has an integral multiple of the width and the length of the predetermined interval, and the bottom surface is the same as the predetermined interval. A terminal electrode is provided at a center position of the square area when divided into a plurality of square areas each having a length of one side.

According to the present invention, by assembling the side and end surfaces so as to be in close contact with each other, the terminal electrodes are reliably arranged at the intersections of the lattices at the predetermined intervals on the bottom surface of the composite electronic component.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A composite electronic component and a method of manufacturing the same according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view of a composite electronic component, FIG.
Is a side view of a chip-shaped electronic component constituting a composite electronic component,
FIG. 3 is a bottom view of the chip-shaped electronic component constituting the composite electronic component. In the figure, reference numeral 1 denotes a composite electronic component, 2 denotes a chip-shaped electronic component, 2a denotes a terminal electrode, 3 denotes a holding substrate, 10 denotes a circuit board, Reference numeral 11 denotes a land provided on the surface of the circuit board.

The composite electronic component 1 is formed by assembling fifteen chip-shaped electronic components 2 having a pair of terminal electrodes 2a on the bottom surface so that the side surfaces or end surfaces are in close contact with each other as shown in FIG. The upper surface of the electronic component 2 is held by the holding substrate 3 in such an assembled state, and 5 × 6 = 30 terminal electrodes 2 a are arranged on the intersection of a grid having a length L interval on the bottom surface of the composite electronic component 1. Is done. The terminal electrode 2a
At the time of mounting the composite electronic component 1 on the circuit board 10, the distal ends of the terminal electrodes 2a are arranged on the same plane so that they can be mounted on the lands 11 of the circuit board 10. Where the length L
Is 0.5 mm, for example.

As shown in FIGS. 2 and 3, the chip-shaped electronic component 2 has, for example, a height of 0.5 mm, a length of 1.0 mm,
It has a rectangular parallelepiped shape having a width and length of an integral multiple of the length L and a width-to-length ratio of 1: 2, such as a width of 0.5 mm, and is embedded in the chip-shaped electronic component 2. A pair of external electrodes 2b, which are electrically connected to a resistive element, an internal electrode, and the like, provided on the bottom surface, and a circuit board 10
And a pair of terminal electrodes 2a that can be electrically connected to the land 11. Also, the terminal electrodes 2a are formed so as not to be exposed on the side surfaces and the end surfaces so that even if the chip-shaped electronic components 2 are brought into close contact with the side surfaces or the end surfaces, they are not electrically connected to each other.

The pair of terminal electrodes 2a are divided on the longitudinal axis of the chip-shaped electronic component 2 in a lengthwise direction of 1: 2: 1, and the distance between the two terminal electrodes 2a is equal to the length L. The bumps are formed of 0.3 mm diameter, and are made of silver / palladium alloy, copper, nickel, gold, solder, or plated with nickel, solder, or the like.

The holding substrate 3 is for collectively holding a plurality of chip-shaped electronic components, and has the same length and width as the composite electronic component 1 and has a thickness of about 0.05 to 0.3 mm. , BT resin, metal, ceramic, or the like, which is bonded and fixed over the upper surface of the chip-shaped electronic components 2 using an adhesive 3a in a state of being assembled. The adhesive 3a has, for example, a viscosity of 30.
A thermosetting epoxy adhesive of about 0 to 400 Pa · s,
Acrylic or silicone high viscosity adhesives are used. When a metal is used as the holding substrate 3, it has a function as a heat radiating plate for radiating heat to the chip-shaped electronic component 2, and is effective when the chip-shaped electronic component 2 generates a large amount of heat.

Here, a chip-shaped resistor 2 as a chip-shaped electronic component 2 constituting the composite electronic component 1 of the present embodiment.
-R, the chip-shaped multilayer capacitor 2-C, and the chip-shaped multilayer inductor 2-L will be described with reference to the side sectional views of FIGS.

As an example of the chip-shaped resistor 2-R, a resistance element R is provided on the upper surface and an electrode 2c-R is provided at an end thereof, and this electrode 2c-R is connected to the external electrode 2b-R on the bottom by a through hole H.
(See FIG. 4A), and a resistor R
And external electrodes 2b-R extending from the end of the resistance element R to the end face and the bottom face of the chip resistor 2-R.
Is formed, the external electrodes 2b-R on the end faces are covered with an insulating layer ZR (see FIG. 4B), and a resistance element R is provided above the insulating layer ZR provided on the bottom surface. One in which an external electrode 2b-R is provided from the end of the resistance element R to the bottom surface of the insulating layer ZR (see FIG. 4C) is exemplified.

Further, as an example of the chip-shaped multilayer capacitor 2-C, an internal electrode PC such that the lead-out portion Pa-C is exposed is laterally laminated on the bottom surface, and the internal electrode PC-
An external electrode 2b-C electrically connected to the lead-out portion Pa-C of C is formed (see FIG. 5A), and the lead-out portion P is formed on the end face.
After laminating the internal electrodes PC such that aC is exposed in the lateral direction, and providing the external electrodes 2b-C that are electrically connected to the lead portions Pa-C on the end faces of the chip-shaped multilayer capacitor 2-C. And an external electrode 2b-C on the end face covered with an insulating layer ZC (see FIG. 5B).

Further, as an example of the chip-shaped multilayer inductor 2-L, similar to the example of the chip-shaped multilayer capacitor 2-C, the internal electrode PL whose lateral portion Pa-L is exposed on the bottom surface is horizontally arranged. (See FIG. 6 (a)), and an internal electrode PL such that the lead Pa-C is exposed on the end face. After the external electrodes 2b-L that are stacked in the lateral direction and are electrically connected to the lead portions Pa-L on the end faces of the chip-shaped laminated inductor 2-L, the external electrodes 2b on the end faces are provided.
bC covered with an insulating layer ZC (see FIG. 6B)
And the like.

Next, a method of manufacturing the composite electronic component 1 according to the present embodiment will be described with reference to FIGS.

First, an L-shaped fixed support member 30 slightly higher than the chip-shaped electronic component 2 and having an L-shaped inner surface having a length at least equal to or greater than the width and length of the composite electronic component 1 is assumed. The fifteen chip-shaped electronic components 2 are arranged on a flat surface inside the L-shape of the fixed support member 30 with the terminal electrodes 2a facing down. Here, the chip-shaped electronic component 2 has its length direction or width direction parallel to the L-shaped inner surface of the fixed support member 30, and the terminal electrode 2 a has a 5 × 6 grid on the bottom surface of the composite electronic component 1. (FIG. 7A).

Next, rectangular parallelepiped movable pressing members 31a and 31b having a length substantially equal to the width and length of the composite electronic component 1 and having the same height as the fixed support member 30.
Of the fixed support member 30 with the chip-shaped electronic component 2 interposed therebetween.
The movable pressing members 31a and 31b are moved in the direction of the fixed support member 30 so that the chip-shaped electronic components 2 are brought into close contact with each other at the side surfaces and the end surfaces to be assembled (FIG. 7 (b)). )reference). Here, the chip-shaped electronic components 2 are closely assembled so that the width and the length of the composite electronic component 1 have a ratio of 5: 6.

Finally, as shown in FIG. 8, the chip-like electronic component 2 is tightly assembled by the fixed support member 30 and the movable pressing members 31a and 31b, and the adhesive 3
The composite electronic component 1 is manufactured by attaching the holding substrate 3 coated with a to the upper surface of the chip-shaped electronic component 2.

According to the composite electronic component 1, the chip-shaped electronic components 2 are held in close contact with each other without any gap, so that the mounting density is high, and a plurality of chip-shaped electronic components can be used once. Since it can be mounted on the circuit board 10, the mounting cost can be reduced. Also,
Since the terminal electrodes 2a are exposed in a lattice pattern at predetermined intervals on the bottom surface of the composite electronic component 1, it can be handled in the same manner as a semiconductor package such as a CSP or a BGA, and the design of the circuit board 10 becomes easy. The mounting cost can be reduced. Further, since various constant resistors, capacitors, inductors, and the like can be mixed as the chip-shaped electronic component 2, the design of the composite electronic component 1 and the circuit board 10 is easy, and the design change is easy and inexpensive. Can be handled.

In the present embodiment, the composite electronic component 1 and the circuit board 10 are electrically connected by using the terminal electrodes 2a made of bumps. However, as shown in FIG. Only one may be used.

In this embodiment, the chip-shaped electronic components 2 all have the same dimensions. However, even if the chip-shaped electronic components of various dimensions are mixed, the variation is in the width direction or the length direction. In the case of, as shown in FIG. 10, the chip-shaped electronic components 2 and the spacers 4 are mixed and closely assembled, and when the chip-shaped electronic components with different heights are mixed, as shown in FIG. By increasing the amount of the adhesive 3a applied to the substrate 3 to fill the gap,
Chip-shaped electronic components 2 of various dimensions can be used. Further, as shown in FIG. 10, the number of chip-shaped electronic components 2 of the composite electronic component 1 can be adjusted by the spacer 4.

Further, the holding substrate 3 is connected to the chip-like electronic component 2.
The composite electronic component 1 is held on the circuit board 10 after mounting on the circuit board 10 by using heat generated when the composite electronic component 1 is mounted on the circuit board 10 and mounted by bonding, etc. The substrate 3 may be peeled from the chip-shaped electronic component 2. This is particularly effective when there is a limit on the height of components mounted on the circuit board 10.

Further, in the present embodiment, the chip-shaped electronic component 2 is held by the holding substrate 3, but FIG.
As shown in FIG. 3A, the above-mentioned high-viscosity adhesive 3a is placed on the chip-shaped electronic component 2 without using the holding substrate 3, and the excess adhesive 3a is removed by a squeegee 32, and this is dried and cured. By doing so, the composite electronic component 1 shown in FIG. 12B can also be manufactured.

Further, in the present embodiment, the fixed support member 30 and the movable pressing members 31a and 31b are used as a method of bringing the chip-shaped electronic component 2 into close contact at the end face and side face (see FIG. 7). The chip-shaped electronic components 2 can also be assembled such that the terminal electrodes 2a are arranged in a lattice by the method shown. That is, as shown in FIG. 13, the electrode position regulating holes 4 are formed by using an electrode position regulating member 40 having electrode position regulating holes 41 arranged in a lattice.
1, the chip-shaped electronic component 2 is arranged so that the terminal electrodes 2a of the chip-shaped electronic component 2 are held, and thereafter, a holding substrate 3 is attached to the upper surface. According to this method, even when the dimensions of the chip-shaped electronic component 2 vary, the terminal electrodes 2a can be accurately arranged in a lattice.

Next, a composite electronic component and a method of manufacturing the same according to the second embodiment will be described with reference to FIGS. In the figure, 21 is a composite electronic component, 22 is a chip-shaped electronic component, 22a is a terminal electrode, 22b is an external electrode, 23 is a holding substrate, 23a is a first electrode, 23b is a second electrode, and 23c is a connection electrode. It is.

The composite electronic component 21 according to the present embodiment is different from the composite electronic component 1 according to the first embodiment in that a holding substrate 23 is provided on the side of the chip-shaped electronic component 22 where the terminal electrode 22a is located. That is, the chip-shaped electronic component 22 is integrally held by the holding substrate 23 in a state where the chip-shaped electronic component 22 is brought into close contact with each other, and the second electrode 23 b provided on the back surface of the holding substrate 30 is used as an electrode of the composite electronic component 1. .

The composite electronic component 21 will be described in terms of its manufacturing method. First, similarly to the first embodiment, the fixed support member 30 and the movable pressing members 31a and 31a are used.
The chip-shaped electronic components 22 are tightly assembled using 1b, but here, the terminal electrodes 22a are closely assembled with the terminal electrodes 22a facing upward. Here, the chip-shaped electronic component 22 is the same as that used in the first embodiment.

Next, the first electrodes 23a are provided on one surface at an interval of 0.5 mm, and the second electrodes 23b electrically connected to the first electrodes 23a through the connection electrodes 23c and the through holes are provided on the opposite surface. The provided holding substrate 23 is crimp-connected so that the terminal electrode 22a of the chip-shaped electronic component 22 and the first electrode 23a of the holding substrate 23 conduct. With this connection, the chip-shaped electronic component 22 and the holding substrate 23 are electrically connected by the terminal electrode 22a '.

Thus, as shown in FIG. 15, the chip-shaped electronic component 22 is connected to the first terminal electrode 23a of the holding substrate 23.
The second electrode 23b, which is conductively connected to the first electrode 23a of the holding substrate 23 via the terminal electrode 22a 'and is electrically connected to the first electrode 23a of the holding substrate 23, is a bottom surface of the composite electronic component 21 and has a predetermined spacing. Will be exposed on the intersection of

According to the composite electronic component 21, even if the dimensions of the chip-shaped electronic component 22 vary, the variation is absorbed by the holding substrate 23 and the composite electronic component 21
Of the second electrode 23b exposed on the bottom surface can be accurately arranged on the same plane and at the intersections of grids at predetermined intervals. Other operations and effects are the same as those of the composite electronic component 1 according to the first embodiment.

As shown in FIG. 16, in the same manner as the composite electronic component 1 according to the first embodiment, in the present embodiment, a chip-shaped electronic component 22 provided with a holding member on the upper surface is provided. The used holding substrate 23 may be provided. In this case, the composite electronic component 21 has further improved adhesion strength.

[0046]

As described above in detail, according to the first aspect of the present invention, the terminal electrodes of the chip-shaped electronic component are provided only on one surface, and the terminal electrodes are arranged on the bottom surface of the composite electronic component. As a result, the space between these chip-shaped electronic components can be reduced, and the mounting density can be improved. Further, since a plurality of chip-shaped electronic components can be mounted on the circuit board at one time, the mounting cost can be reduced. Further, since the terminal electrodes are arranged on the intersections of the grids at predetermined intervals on the bottom surface of the composite electronic component, it can be handled in the same manner as a semiconductor package such as CSP or BGA, and the design of the circuit board becomes easy,
Further, mounting cost can be reduced. Furthermore, various constant resistors, capacitors,
Since the inductors and the like can be mixed, the design of the composite electronic component and the circuit board is easy, and the design change can be easily and inexpensively dealt with.

According to the second aspect of the present invention, the terminal electrodes of the chip-shaped electronic component are provided on the first surface of the holding member.
Since the second electrode electrically connected to the first electrode is electrically connected to the first electrode and the second electrode electrically connected to the first electrode, the second electrode is provided on the back surface of the holding member at the intersection of the grid at a predetermined interval. The second electrode can be accurately arranged on the bottom surface of the composite electronic component without being affected by the dimensions of the component. Other effects are the same as those of the first aspect.

Further, according to the third aspect of the present invention, the chip-shaped electronic component has a rectangular parallelepiped shape having terminal electrodes arranged at predetermined intervals on the bottom surface, and the side surface or the end surface of the chip-shaped electronic component is held tightly together. Therefore, the composite electronic component has an improved mounting density. Other effects are the same as those of the first and second aspects of the invention.

Further, according to the invention of claims 4 to 6, the composite electronic component according to the invention of claims 1 to 3 can be easily and reliably manufactured.

Further, according to the invention of claim 7, by assembling such that the side surfaces and the end surfaces are in close contact with each other,
Terminal electrodes are reliably arranged on intersections of the grids at the predetermined intervals on the bottom surface of the composite electronic component. Thereby, claim 1
Further, the composite electronic component according to the sixth aspect can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view of a composite electronic component according to a first embodiment.

FIG. 2 is an external side view of a chip-shaped electronic component constituting the composite electronic component.

FIG. 3 is an external bottom view of a chip-shaped electronic component constituting the composite electronic component.

FIG. 4 is a side cross-sectional view of a chip-shaped resistor constituting a composite electronic component.

FIG. 5 is a side cross-sectional view of a chip-shaped multilayer capacitor constituting a composite electronic component.

FIG. 6 is a side cross-sectional view of a chip-shaped multilayer inductor constituting a composite electronic component.

FIG. 7 is a view for explaining a manufacturing procedure of the composite electronic component according to the first embodiment;

FIG. 8 is a view for explaining a manufacturing procedure of the composite electronic component according to the first embodiment;

FIG. 9 is a side view and a bottom view of an external appearance of a chip-shaped electronic component constituting a composite electronic component.

FIG. 10 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 11 is another composite electronic component according to the first embodiment.

FIG. 12 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 13 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 14 is a view for explaining a manufacturing procedure of the composite electronic component according to the second embodiment.

FIG. 15 is a side sectional view of the composite electronic component according to the second embodiment;

FIG. 16 is a side sectional view of another composite electronic component according to the second embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Composite electronic component, 2 ... Chip-shaped electronic component, 2a ... Terminal electrode, 3 ... Holding board, 3a ... Adhesive, 10 ... Circuit board,
11 land, 21 composite electronic component, 22 chip electronic component, 22a terminal electrode, 23 holding substrate, 23a
1st electrode, 23b ... 2nd electrode, 30 ... fixed support member, 31 ... movable pressing member, 40 ... electrode position regulating member.

Claims (7)

[Claims] 1. A composite electronic component comprising a plurality of chip-shaped electronic components provided with terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, wherein a bottom surface thereof is mounted to face a circuit board. The electronic component is provided with terminal electrodes only on one surface thereof, and the holding member integrally integrates the chip-shaped electronic component such that the terminal electrodes are arranged on intersections of grids at predetermined intervals on the bottom surface of the composite electronic component. A composite electronic component characterized by being held. 2. A composite electronic component comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding the chip-shaped electronic components, wherein a bottom surface thereof is mounted to face a circuit board. The electronic component is provided with terminal electrodes only on one surface thereof, and the holding member is provided with first electrodes on the front surface so as to be arranged on intersections of lattices at predetermined intervals, and is electrically connected to the first electrodes on the back surface. A substrate provided with a second electrode to be connected;
A composite electronic component, wherein a terminal electrode of the chip-shaped electronic component and a first electrode corresponding to the terminal electrode are electrically connected to hold the chip-shaped electronic component integrally. 3. A chip-shaped electronic component having a rectangular parallelepiped shape and terminal electrodes provided on the bottom surface at an integer multiple of the predetermined interval, wherein the holding member integrally contacts the chip-shaped electronic component with its side surfaces or end surfaces in close contact with each other. The composite electronic component according to claim 1, wherein the composite electronic component is held. 4. A composite electronic component manufacturing method comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding the chip-shaped electronic components, wherein a bottom surface thereof is mounted to face a circuit board. A chip-like electronic component having terminal electrodes only on one surface is assembled so that the terminal electrodes are arranged on intersections of a grid at predetermined intervals, and a holding member is provided over the upper surface of the chip-like electronic component. A method of manufacturing a composite electronic component, wherein a chip-shaped electronic component is integrally held by using the same. 5. A method of manufacturing a composite electronic component, comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for holding the chip-shaped electronic components integrally, the bottom surface of which is mounted to face a circuit board. A chip-shaped electronic component provided with terminal electrodes only on one surface is assembled so that the terminal electrodes are arranged on intersections of grids at a predetermined interval, and a chip-like electronic component is placed on the intersection of grids at a predetermined interval on the surface. A first electrode and a terminal electrode of the chip-shaped electronic component are electrically connected by a holding member formed of a substrate provided with a first electrode and a second electrode provided on the back surface and electrically connected to the first electrode. A method for manufacturing a composite electronic component, wherein a chip-shaped electronic component is integrally held. 6. A chip-shaped electronic component having a rectangular parallelepiped shape, wherein terminal electrodes are provided on the bottom surface of the chip-shaped electronic component at intervals of an integral multiple of the predetermined interval, and the chip-shaped electronic components are assembled with their side faces or end faces in close contact with each other. The method for manufacturing a composite electronic component according to claim 4. 7. The chip-shaped electronic component constituting the composite electronic component according to claim 1, wherein a bottom surface of the rectangular parallelepiped chip-shaped electronic component has a width and a length that are integral multiples of the predetermined interval. A chip-shaped electronic component, wherein a terminal electrode is provided at a center position of the square area when the bottom surface is divided into a plurality of square areas each having the same length as the predetermined interval.