JP3406482B2 - Composite electronic component, method of manufacturing the same, and chip-shaped electronic component - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component including a plurality of chip-shaped electronic components such as multilayer capacitors and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a chip-shaped electronic component such as a multilayer capacitor is provided with terminal electrodes at both ends thereof. When the chip-shaped electronic component is mounted on a circuit board, the terminal electrode is mounted on the circuit board. It was mounted on the land provided on the surface by solder reflow.

[0003]

However, when mounting this chip-shaped electronic component on a circuit board, a solder fillet is formed around the terminal electrode, so that a plurality of chip-shaped electronic components are mounted. In order to prevent a short circuit between the terminal electrodes due to solder, it is necessary to increase the distance between the electronic components, which makes it difficult to improve the mounting density.

Further, in order to improve the mounting density, the electrode pattern or the like inside the electronic component is configured to have a plurality of functions such as a resistance, a capacitor, and an inductor.
Composite electronic components such as capacitor arrays and chip resistor networks with improved packaging density of electronic components are being considered. However, this composite electronic component is manufactured through the steps of drying, laminating, pressure bonding, binder removal, and firing of a green sheet on which an electrode pattern is printed according to the type of component to be incorporated and its performance, etc. In order to meet the requirement, it is necessary to design and manufacture for each requirement, resulting in high cost, and it is also difficult to respond to the design change.

The present invention has been made in view of the above circumstances, and an object of the present invention is to improve the mounting density and to manufacture a variety of products at low cost, a method of manufacturing the same, and a method of manufacturing the same. It is to provide a chip-shaped electronic component.

[0006]

In order to achieve the above object, the invention of claim 1 comprises a plurality of chip-shaped electronic components provided with terminal electrodes and a holding member for integrally holding these chip-shaped electronic components. In the composite electronic component whose bottom surface is mounted facing the circuit board, the chip-shaped electronic component is provided with a terminal electrode only on one surface thereof, and the holding member is a grid of predetermined intervals on the bottom surface of the composite electronic component. Close the side face or end face so that the terminal electrode is placed on the intersection.
It is characterized in that the chip-shaped electronic components are integrally held by being attached.

According to the present invention, the bottom surface of the composite electronic component is such that the terminal electrodes of the chip-shaped electronic component are arranged on the intersections of the grids at the predetermined intervals.

According to a second aspect of the present invention, there is provided a plurality of chip-shaped electronic parts having terminal electrodes and a holding member for integrally holding these chip-shaped electronic parts, the bottom surface of which is mounted facing the circuit board. In the composite electronic component, the chip-shaped electronic component is provided with a terminal electrode only on one surface thereof, and the holding member is provided with a first electrode on the surface thereof so as to be arranged at intersections of lattices at predetermined intervals and a back surface thereof. A terminal electrode of the chip-shaped electronic component and a first electrode corresponding to the terminal electrode, the substrate being provided with a second electrode electrically connected to the first electrode.
The chip-shaped electronic component is held integrally by being electrically connected to the electrode.

According to the present invention, the second electrode of the holding member is disposed on the bottom surface of the composite electronic component on the intersection of the lattices at the predetermined intervals, and the first electrode is electrically connected to the second electrode.
The terminal electrode of the chip-shaped electronic component is conductively connected to the electrode of and is held integrally.

Further, in the third aspect of the present invention, in the composite electronic component according to the first or second aspect, terminal electrodes are provided on the bottom surface of the rectangular parallelepiped chip-shaped electronic component at an interval that is an integral multiple of the predetermined interval, The holding member is characterized in that the chip-shaped electronic components are integrally held with their side faces or end faces in close contact with each other.

According to the present invention, the distance between the chip-shaped electronic components can be minimized.

Further, the invention of claim 4 comprises a plurality of chip-shaped electronic components having terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, the bottom surface of which is mounted facing the circuit board. In the method of manufacturing a composite electronic component, a chip-shaped electronic component provided with a terminal electrode only on one surface, the terminal electrode is collected by closely contacting the side surface or the end face so that the terminal electrode is arranged on the intersection of the lattice at a predetermined interval, A holding member is attached to the upper surface of the chip-shaped electronic component to integrally hold the chip-shaped electronic component.

According to the present invention, the chip-shaped electronic components provided with the terminal electrodes only on one surface are assembled so as to be arranged on the intersections of the lattices at the predetermined intervals, and are integrated by the holding member provided on the upper surface. Retained. As a result, the bottom surface of the composite electronic component is such that the terminal electrodes of the chip-shaped electronic component are arranged on the intersections of the grids at the predetermined intervals.

Further, the invention of claim 5 comprises a plurality of chip-shaped electronic components having terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, the bottom surface of which is mounted facing the circuit board. In the method of manufacturing a composite electronic component, chip-shaped electronic components provided with terminal electrodes only on one surface are assembled so that the terminal electrodes are arranged on the intersections of lattices with a predetermined spacing, and the surface has a predetermined spacing. The first electrode and the terminal of the chip-shaped electronic component are provided by a holding member made of a substrate, the first electrode being provided on the intersection of the grids and the second electrode being electrically connected to the first electrode on the back surface. It is characterized in that the electrodes are electrically connected and the chip-shaped electronic component is held integrally.

According to the present invention, the chip-shaped electronic components having the terminal electrodes only on one surface are assembled so as to be arranged on the intersections of the lattices at the predetermined intervals. Further, the first electrode and the above-mentioned electrode are provided by a holding member made of a substrate having a first electrode provided on the front surface on the intersection of lattices with a predetermined interval and a second electrode provided on the back surface to be conductively connected to the first electrode. The terminal electrodes of the chip-shaped electronic component are electrically connected and the chip-shaped electronic component is held integrally. As a result, on the bottom of the composite electronic component,
The second electrode of the holding member is arranged on the intersection of the grids at a predetermined interval, and the terminal electrode of the chip-shaped electronic component is conductively connected to the first electrode that is conductively connected to the second electrode to be integrated. Retained.

Further, the invention of claim 6 is the method of manufacturing a composite electronic component according to claim 4 or 5, wherein the terminal electrodes are arranged on the bottom surface of the rectangular parallelepiped chip-shaped electronic component at an interval which is an integral multiple of the predetermined interval. Is provided, and the chip-shaped electronic components are assembled with their side faces or end faces in close contact with each other.

According to the present invention, it is possible to manufacture a composite electronic component in which the distance between chip-shaped electronic components is minimized.

Further, the invention of claim 7 is the same as claim 1.
The chip-shaped electronic component constituting the composite electronic component according to claim 6, wherein the bottom surface of the rectangular parallelepiped chip-shaped electronic component has a width and a length that are integral multiples of the predetermined interval, and the bottom surface is the same as the predetermined interval. It is characterized in that the terminal electrode is provided at the center position of the square area when the square area is divided into a plurality of square areas each having one side.

According to the present invention, by assembling the side surfaces and the end surfaces so as to be in close contact with each other, the terminal electrodes are surely arranged on the bottom surface of the composite electronic component on the intersections of the grids at the predetermined intervals.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION A composite electronic component and a method for manufacturing the same according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a composite electronic component, and FIG.
Is a side view of a chip-shaped electronic component that constitutes a composite electronic component,
FIG. 3 is a bottom view of a chip-shaped electronic component forming the composite electronic component. In the figure, 1 is a composite electronic component, 2 is a chip-shaped electronic component, 2a is a terminal electrode, 3 is a holding substrate, 10 is a circuit substrate, Reference numeral 11 is a land attached to the surface of the circuit board.

In the composite electronic component 1, fifteen chip-shaped electronic components 2 having a pair of terminal electrodes 2a on the bottom surface are assembled so that their side surfaces or end faces are in close contact with each other as shown in FIG. The upper surface of the electronic component 2 is held by the holding substrate 3 in such a gathered state, and 5 × 6 = 30 terminal electrodes 2a are arranged on the bottom of the composite electronic component 1 on the intersections of the lattices having the interval of the length L. To be done. The terminal electrode 2a is
When mounting the composite electronic component 1 on the circuit board 10, the tip end portions of the terminal electrodes 2a are arranged on the same plane so that they can be mounted on the lands 11 of the circuit board 10. Where length L
Is, for example, 0.5 mm.

As shown in FIGS. 2 and 3, the chip-shaped electronic component 2 has a height of 0.5 mm and a length of 1.0 mm, for example.
It has a rectangular parallelepiped shape in which the width and the length are integral multiples of the length L such that the width is 0.5 mm and the ratio of the width and the length is 1: 2. A pair of external electrodes 2b that are electrically connected to a resistive element, an internal electrode, and the like that are formed on the bottom surface, and the circuit board 10 is provided below the external electrodes 2b.
The pair of terminal electrodes 2a which can be electrically connected to the land 11 of FIG. Further, the terminal electrodes 2a are formed so as not to be exposed on the side surface and the end surface so that they are not electrically connected to each other even if the chip-shaped electronic component 2 is closely attached on the side surface or the end surface.

The pair of terminal electrodes 2a are separated from each other on the longitudinal axis of the chip-shaped electronic component 2 in the length direction of 1: 2: 1, and the distance between both terminal electrodes 2a is the length L. Formed of a bump having a diameter of 0.3 mm and made of silver / palladium alloy, copper, nickel, gold, solder, or these plated with nickel, solder, or the like.

The holding substrate 3 is for collectively holding a plurality of chip-shaped electronic components integrally and has the same length and width as the composite electronic component 1 and a glass epoxy having a thickness of about 0.05 to 0.3 mm. , BT resin, metal, ceramic or the like, and is a member in which the chip-shaped electronic components 2 are assembled and adhered and fixed over the upper surface thereof using the adhesive 3a. As the adhesive 3a, for example, a viscosity of 30
A thermosetting epoxy adhesive of 0 to 400 Pa · s,
Acrylic and silicone high viscosity adhesives are used. When the holding substrate 3 is made of metal, it has a function as a heat radiating plate for radiating heat to the chip-shaped electronic component 2, and is effective when the chip-shaped electronic component 2 generates a large amount of heat.

Here, a chip-shaped resistor 2 as a chip-shaped electronic component 2 which constitutes the composite electronic component 1 of the present embodiment.
Examples of -R, chip-shaped multilayer capacitor 2-C, and chip-shaped multilayer inductor 2-L will be described with reference to the side sectional views of FIGS.

As an example of the chip-shaped resistor 2-R, a resistor element R is provided on the upper surface and an electrode 2c-R is provided at the end thereof, and this electrode 2c-R is formed as a through hole H with an external electrode 2b-R on the bottom surface.
Connected to (see FIG. 4A), a resistance element R on the upper surface
And the external electrode 2b-R extending from the end of the resistance element R to the end face and the bottom face of the chip resistor 2-R.
After forming the external electrode 2b-R on the end face with the insulating layer Z-R (see FIG. 4B), the resistive element R is provided on the upper side of the insulating layer Z-R provided on the bottom surface, An external electrode 2b-R is provided from the end of the resistance element R to the bottom surface of the insulating layer Z-R (see FIG. 4C).

Further, as an example of the chip-shaped multilayer capacitor 2-C, the internal electrodes P-C having the lead-out portions Pa-C exposed on the bottom surface are laterally laminated, and the internal electrodes P-C are provided on the bottom surface.
The external electrode 2b-C that is electrically connected to the lead-out portion Pa-C of C (see FIG. 5A) is formed, and the lead-out portion P is formed on the end face.
After laminating the internal electrodes P-C such that a-C is exposed in the lateral direction and providing the external electrodes 2b-C electrically connected to the lead-out portion Pa-C on the end face of the chip-shaped multilayer capacitor 2-C, , The external electrode 2b-C on the end face is covered with an insulating layer Z-C (see FIG. 5B).

Further, as an example of the chip-shaped multilayer inductor 2-L, similarly to the example of the chip-shaped multilayer capacitor 2-C, an internal electrode P-L having a lead-out portion Pa-L exposed on the bottom surface is laterally disposed. In which the external electrodes 2b are formed by stacking in the direction, and the conductive portions are connected to the drawn-out portion Pa-L (see FIG. 6A), and the internal electrode P-L whose exposed portion Pa-C is exposed is formed on the end face. After the external electrodes 2b-L which are laminated in the lateral direction and which are electrically connected to the lead-out portion Pa-L are provided on the end surface of the chip-shaped laminated inductor 2-L, the external electrode 2 on the end surface is formed.
Covering b-C with insulating layer Z-C (see FIG. 6 (b))
Etc.

Next, a method of manufacturing the composite electronic component 1 of the present embodiment will be described with reference to FIGS.

First, an L-shaped fixed supporting member 30 slightly higher than the chip-shaped electronic component 2 having an L-shaped inner side surface length of at least the width and length of the composite electronic component 1 is selected. Fifteen chip-shaped electronic components 2 are arranged inside the L-shape of the fixed support member 30 with the terminal electrodes 2a facing down. Here, the chip-shaped electronic component 2 has its length direction or width direction parallel to the L-shaped inner side surface of the fixed support member 30, and the terminal electrode 2a is a 5 × 6 grid on the bottom surface of the composite electronic component 1. So as to form a shape (FIG. 7A).

Next, the rectangular parallelepiped movable pressing members 31a and 31b having the same width and length as the composite electronic component 1 and the same height as the fixed supporting member 30.
L of the fixed support member 30 with the chip-shaped electronic component 2 interposed therebetween.
The movable pressing members 31a and 31b are arranged so as to face the inner side surface of the character, and are moved toward the fixed support member 30 to bring the chip-shaped electronic components 2 into close contact with each other on the side surface and the end surface (FIG. 7 (b)). )reference). Here, the chip-shaped electronic components 2 are closely assembled so that the width and the length of the composite electronic component 1 are 5: 6.

Finally, as shown in FIG. 8, with the fixed supporting member 30 and the movable pressing members 31a and 31b in close contact with each other, the chip-shaped electronic component 2 is brought into close contact with the adhesive 3 on the surface thereof.
The holding substrate 3 coated with a is attached to the upper surface of the chip-shaped electronic component 2 to manufacture the composite electronic component 1.

According to the composite electronic component 1, since the chip-shaped electronic components 2 are held in close contact with each other without any gap, the packaging density is high, and a plurality of chip-shaped electronic components can be mounted once. Since it can be mounted on the circuit board 10, the mounting cost can be reduced. Also,
Since the terminal electrodes 2a are exposed on the bottom surface of the composite electronic component 1 at predetermined intervals in a grid pattern, the terminal electrodes 2a can be handled similarly to a semiconductor package such as CSP or BGA, and the circuit board 10 can be easily designed and the like. The mounting cost can be reduced. Further, since resistors, capacitors, inductors, etc. having various constants can be mixed as the chip-shaped electronic component 2, the composite electronic component 1 and the circuit board 10 can be easily designed, and the design can be easily and inexpensively changed. Can correspond to.

In the present embodiment, the composite electronic component 1 and the circuit board 10 are electrically connected by using the terminal electrodes 2a made of bumps. However, as shown in FIG. 9, the external electrodes 2b are not used. You may use only.

Further, in the present embodiment, all the chip-shaped electronic components 2 having the same size are used, but even if the chip-shaped electronic components of various sizes are mixed, the variation is the width direction or the length direction. 10 shows, as shown in FIG. 10, the chip-shaped electronic components 2 and the spacers 4 are mixed and brought into close contact with each other, and when chip-shaped electronic components having different heights are mixed, as shown in FIG. By filling the gap by increasing the amount of the adhesive 3a applied to the substrate 3,
Chip-shaped electronic components 2 having various sizes can be used. Further, as shown in FIG. 10, the number of chip-shaped electronic components 2 of the composite electronic component 1 can be adjusted by the spacer 4.

Further, the holding substrate 3 is used as the chip-shaped electronic component 2
By using a foam-peelable adhesive as the adhesive 3a that adheres to the circuit board 10, heat is applied when the composite electronic component 1 is mounted on the circuit board 10 and mounted by bonding or the like, and is retained after mounting on the circuit board 10. The substrate 3 may be separated from the chip-shaped electronic component 2. In this case, it is particularly effective when the height of the components mounted on the circuit board 10 is limited.

Further, in the present embodiment, the chip-shaped electronic component 2 is held by the holding substrate 3, but FIG.
As shown in (a), the holding substrate 3 is not used, the above-mentioned high-viscosity adhesive 3a is placed on the chip-shaped electronic component 2, the excess adhesive 3a is removed by the squeegee 32, and this is dried and cured. By doing so, the composite electronic component 1 shown in FIG. 12B can also be manufactured.

Further, in the present embodiment, the fixed support member 30 and the movable pressing members 31a and 31b are used as a method of closely gathering the chip-shaped electronic component 2 on the end face and the side face (see FIG. 7). Also by the method shown, the chip-shaped electronic components 2 can be assembled so that the terminal electrodes 2a are arranged in a grid pattern. That is, as shown in FIG. 13, by using the electrode position regulating member 40 provided with the electrode position regulating holes 41 arranged in a grid pattern, the electrode position regulating holes 4 are formed.
1, the chip-shaped electronic component 2 is arranged so that the terminal electrode 2a of the chip-shaped electronic component 2 is held, and then the holding substrate 3 is attached to the upper surface. According to this method, the terminal electrodes 2a can be arranged in a grid pattern with high accuracy even if the dimensions of the chip-shaped electronic component 2 vary.

Next, a composite electronic component and a method of manufacturing the same according to the second embodiment will be described with reference to FIGS. 14 and 15. In the figure, 21 is a composite electronic component, 22 is a chip-shaped electronic component, 22a is a terminal electrode, 22b is an external electrode, 23 is a holding substrate, 23a is a first electrode, 23b is a second electrode, and 23c is a connecting electrode. Is.

The difference between the composite electronic component 21 according to the present embodiment and the composite electronic component 1 according to the first embodiment is that the holding substrate 23 is provided on the side of the chip-shaped electronic component 22 where the terminal electrode 22a is located. The holding substrate 23 integrally holds the chip-shaped electronic components 22 in a state where they are closely attached to each other, and the second electrode 23b provided on the back surface of the holding substrate 30 is used as an electrode of the composite electronic component 1. .

The method of manufacturing the composite electronic component 21 will be described. First, similarly to the first embodiment, the fixed support member 30 and the movable pressing members 31a and 3 are used.
The chip-shaped electronic components 22 are brought into close contact with each other by using 1b, but here, the terminal electrodes 22a are turned up and brought into close contact. Here, the chip-shaped electronic component 22 is the same as that used in the first embodiment.

Next, the first electrodes 23a are provided on one surface at intervals of 0.5 mm, and the second electrodes 23b which are conductively connected to the first electrodes 23a through the connecting electrodes 23c and through holes are provided on the opposite surface. The holding substrate 23 provided is pressure-bonded so that the terminal electrode 22a of the chip-shaped electronic component 22 and the first electrode 23a of the holding substrate 23 are electrically connected. By this connection, the chip-shaped electronic component 22 and the holding substrate 23 are electrically connected by the terminal electrode 22a '.

As a result, as shown in FIG. 15, the chip-shaped electronic component 22 has the first terminal electrode 23a of the holding substrate 23.
The second electrode 23b, which is held integrally while being conductively connected via the terminal electrode 22a 'and is conductively connected to the first electrode 23a of the holding substrate 23, is the bottom surface of the composite electronic component 21 and has a grid at a predetermined interval. It will be exposed on the intersection of.

According to the composite electronic component 21, even if the dimensions of the chip-shaped electronic component 22 vary, the variation is absorbed by the holding substrate 23, and the composite electronic component 21.
The second electrode 23b exposed on the bottom surface of the can be accurately arranged on the same plane and at the intersections of the lattices at predetermined intervals. Other functions and effects are similar to those of the composite electronic component 1 according to the first embodiment.

As shown in FIG. 16, in the same manner as the composite electronic component 1 according to the first embodiment, a chip-shaped electronic component 22 provided with a holding member on the upper surface thereof is used in the present embodiment. The holding substrate 23 used may be attached. In this case, the composite electronic component 21 has further improved adhesion strength.

[0046]

As described in detail above, according to the invention of claim 1, the terminal electrode of the chip-shaped electronic component is provided only on one surface, and the terminal electrode is arranged on the bottom surface of the composite electronic component. As described above, since they are integrally held, it is possible to reduce the interval between these chip-shaped electronic components and improve the packaging density. Moreover, since a plurality of chip-shaped electronic components can be mounted on the circuit board at once, the mounting cost can be reduced. Further, since the terminal electrodes are arranged on the intersections of the lattices at the predetermined intervals on the bottom surface of the composite electronic component, they can be handled like semiconductor packages such as CSP and BGA, and the design of the circuit board and the like can be facilitated.
Also, the mounting cost can be reduced. Furthermore, as chip-shaped electronic parts, various constant resistors, capacitors,
Since the inductors and the like can be mixed, the composite electronic component and the circuit board can be easily designed, and the design change can be easily and inexpensively dealt with.

According to the second aspect of the invention, the terminal electrode of the chip-shaped electronic component is provided on the surface of the holding member.
The second electrode, which is conductively connected to the first electrode and is integrally held, and the second electrode, which is conductively connected to the first electrode, is provided on the back surface of the holding member and on the intersection of the grids at the predetermined intervals. The second electrode can be accurately arranged on the bottom surface of the composite electronic component without being affected by the dimensions of the component. The other effects are the same as those of the invention of claim 1.

Further, according to the third aspect of the invention, the chip-shaped electronic component is a rectangular parallelepiped having the terminal electrodes arranged on the bottom face at a predetermined interval, and the side faces or the end faces thereof are adhered and held integrally. Therefore, the composite electronic component has improved packaging density. Other effects are similar to those of the inventions of claims 1 and 2.

Furthermore, according to the inventions of claims 4 to 6, the composite electronic component according to the inventions of claims 1 to 3 can be easily and reliably manufactured.

Further, according to the invention of claim 7, by assembling the side surfaces and the end surfaces so as to be in close contact with each other,
The terminal electrodes are reliably arranged on the intersections of the grids at the predetermined intervals on the bottom surface of the composite electronic component. Claim 1 by this
Therefore, the composite electronic component according to claim 6 can be easily manufactured.

[Brief description of drawings]

FIG. 1 is a perspective view of a composite electronic component according to a first embodiment.

FIG. 2 is an external side view of a chip-shaped electronic component that constitutes a composite electronic component.

FIG. 3 is an external bottom view of a chip-shaped electronic component forming the composite electronic component.

FIG. 4 is a side sectional view of a chip resistor that constitutes a composite electronic component.

FIG. 5 is a side sectional view of a chip-shaped multilayer capacitor that constitutes a composite electronic component.

FIG. 6 is a side sectional view of a chip-shaped laminated inductor which constitutes a composite electronic component.

FIG. 7 is a diagram illustrating a manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 8 is a diagram illustrating a manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 9 is an external side view and a bottom view of a chip-shaped electronic component that constitutes a composite electronic component.

FIG. 10 is a view explaining another manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 11 is another composite electronic component according to the first embodiment.

FIG. 12 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 13 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.

FIG. 14 is a diagram illustrating a manufacturing procedure of the composite electronic component according to the second embodiment.

FIG. 15 is a side sectional view of the composite electronic component according to the second embodiment.

FIG. 16 is a side sectional view of another composite electronic component according to the second embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Composite electronic component, 2 ... Chip electronic component, 2a ... Terminal electrode, 3 ... Holding substrate, 3a ... Adhesive agent, 10 ... Circuit board,
11 ... Land, 21 ... Composite electronic component, 22 ... Chip electronic component, 22a ... Terminal electrode, 23 ... Holding substrate, 23a ...
1st electrode, 23b ... 2nd electrode, 30 ... Fixed support member, 31 ... Movable pressing member, 40 ... Electrode position control member.

Continuation of front page (56) Reference JP-A-7-37757 (JP, A) Actual development Sho 63-112367 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 4 / 00-4/10 H01G 4/14-4/42 H01G 13/00-13/06

Claims (7)

(57) [Claims] 1. A composite electronic component comprising a plurality of chip-shaped electronic components provided with terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, the bottom surface of which is mounted facing a circuit board, wherein the chip is provided. The electronic component is provided with a terminal electrode only on one surface thereof, and the holding member is a side surface so that the terminal electrode is arranged on an intersection of lattices at predetermined intervals on the bottom surface of the composite electronic component.
Alternatively , the composite electronic component is characterized in that the chip-shaped electronic components are integrally held by bringing the end faces into close contact with each other. 2. A composite electronic component comprising a plurality of chip-shaped electronic components provided with terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, the bottom surface of which is mounted facing a circuit board. The electronic component is provided with a terminal electrode only on one surface thereof, and the holding member is provided with a first electrode on the front surface so as to be disposed on an intersection of lattices with a predetermined interval, and is electrically connected to the first electrode on the back surface. Consisting of a substrate with a second electrode to connect to,
A composite electronic component, characterized in that a terminal electrode of the chip-shaped electronic component and a first electrode corresponding to the terminal electrode are conductively connected to hold the chip-shaped electronic component integrally. 3. A chip-shaped electronic component having a rectangular parallelepiped shape is provided with terminal electrodes on a bottom surface thereof at an interval that is an integral multiple of the predetermined interval, and the holding member integrally integrates the chip-shaped electronic components with their side surfaces or end faces in close contact with each other. The composite electronic component according to claim 1 or 2, which is held. 4. A method for manufacturing a composite electronic component, comprising: a plurality of chip-shaped electronic components provided with terminal electrodes; and a holding member for integrally holding these chip-shaped electronic components, the bottom surface of which is mounted facing a circuit board. , The chip-shaped electronic component equipped with the terminal electrode only on one surface is assembled by adhering the side surface or the end face so that the terminal electrode is arranged on the intersection of the grid at the predetermined intervals. A method of manufacturing a composite electronic component, wherein a chip-shaped electronic component is integrally held by additionally attaching a holding member. 5. A method for manufacturing a composite electronic component, comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding these chip-shaped electronic components, the bottom surface of which is mounted facing a circuit board. , The chip-shaped electronic components having terminal electrodes only on one surface are assembled so that the terminal electrodes are arranged on the intersections of the grids with a predetermined interval, and the chip-shaped electronic components are arranged on the surface with the intersections of the grids with the predetermined interval. The first electrode is electrically connected to the terminal electrode of the chip-shaped electronic component by the holding member made of a substrate provided with the first electrode and the second electrode provided on the back surface to electrically connect with the first electrode. A method for manufacturing a composite electronic component, characterized in that a chip-shaped electronic component is held integrally. 6. A chip-shaped electronic component in the shape of a rectangular parallelepiped is provided with terminal electrodes on the bottom surface at an interval which is an integral multiple of the predetermined interval, and the chip-shaped electronic components are assembled with their side surfaces or end faces in close contact with each other. 6. The method for manufacturing the composite electronic component according to claim 4 or 5. 7. The chip-shaped electronic component constituting the composite electronic component according to claim 1, wherein the bottom surface of the rectangular parallelepiped chip-shaped electronic component has a width and a length that are integral multiples of the predetermined interval. A chip-shaped electronic component, wherein a terminal electrode is provided at a central position of the square area when the bottom surface is divided into a plurality of square areas each having a length equal to the predetermined interval.