JPH1154357A - Electronic component with safety function and its manufacture - Google Patents
Electronic component with safety function and its manufactureInfo
- Publication number
- JPH1154357A JPH1154357A JP9220784A JP22078497A JPH1154357A JP H1154357 A JPH1154357 A JP H1154357A JP 9220784 A JP9220784 A JP 9220784A JP 22078497 A JP22078497 A JP 22078497A JP H1154357 A JPH1154357 A JP H1154357A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- external
- external electrode
- layer
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011521 glass Substances 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 239000002131 composite material Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000007772 electrode material Substances 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 abstract description 17
- 239000003985 ceramic capacitor Substances 0.000 description 9
- 239000011810 insulating material Substances 0.000 description 8
- 239000000779 smoke Substances 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、セラミックコンデ
ンサやセラミックバリスタ等の電子部品及びその製造方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a ceramic capacitor and a ceramic varistor and a method for manufacturing the same.
【0002】[0002]
【従来の技術】電子回路基板に表面実装される電子部品
には、例えばセラミックコンデンサ、セラミックバリス
タなどがある。これらの電子部品には、積層形、1枚の
板状のもの、又は板状のものを複数枚重ね合わせて使用
するものなどがあり、これらを回路基板に実装するため
に、板状の側面に形成された外部電極に金属製のキャッ
プを嵌め込み、このキャップの下部を回路基板にはんだ
付けする構成からなるものがある。図4に従来使用され
ているキャップ付きセラミックコンデンサの構成を示
す。すなわち、2個のセラミックコンデンサ素子11の
両側面には外部電極12が形成されており、この2個の
コンデンサ素子11の下面と上面間にエポキシ樹脂から
なる接着剤13を塗布して平面接着するか、又は外部電
極部に塗布した電極材料を焼き付けて2個の電子部品素
子を一体化してコンデンサ素子群を構成し、このコンデ
ンサ素子11群に予めクリームはんだを内面に塗布した
キャップ14を嵌め合せ、乾燥・加熱して、クリームは
んだが溶融することによって、コンデンサ素子11の外
部電極12をキャップ14に接続していた。なお、15
は回路基板である。2. Description of the Related Art Electronic components surface-mounted on electronic circuit boards include, for example, ceramic capacitors and ceramic varistors. These electronic components include a laminate type, a single plate-like component, and a component in which a plurality of plate-like components are used by laminating them. There is a configuration in which a metal cap is fitted into the external electrode formed in the above, and a lower portion of the cap is soldered to a circuit board. FIG. 4 shows a configuration of a conventionally used ceramic capacitor with a cap. That is, external electrodes 12 are formed on both side surfaces of the two ceramic capacitor elements 11, and an adhesive 13 made of epoxy resin is applied between the lower and upper surfaces of the two capacitor elements 11 to be bonded in a plane. Alternatively, two electronic component elements are integrated by baking the electrode material applied to the external electrode portion to form a capacitor element group, and a cap 14 previously coated with cream solder on its inner surface is fitted to the capacitor element 11 group. The external electrode 12 of the capacitor element 11 was connected to the cap 14 by drying and heating to melt the cream solder. Note that 15
Is a circuit board.
【0003】しかしながら、このようなキャップ付きセ
ラミックコンデンサは、コンデンサ素子11の外部電極
12と金属のキャップ14とが接続された構成からなる
ため、コンデンサ素子11に定格電圧以上の電圧が印加
されたり、直撃雷や誘導雷などによる過電圧が印加され
たりすると、絶縁特性が劣化して漏れ電流が増加し、そ
のまま継続して使用すると自己発熱による熱暴走で発煙
・発火し、該コンデンサのみならず周辺の電子部品をも
汚損・焼損するなどの問題があった。However, such a ceramic capacitor with a cap has a configuration in which the external electrode 12 of the capacitor element 11 and the metal cap 14 are connected, so that a voltage higher than the rated voltage is applied to the capacitor element 11 or the like. If an overvoltage due to direct lightning or induced lightning is applied, the insulation characteristics will deteriorate and the leakage current will increase.If the device is used continuously, smoke and fire will occur due to thermal runaway due to self-heating, and the There have been problems such as fouling and burning of electronic components.
【0004】また、このようなキャップ付きセラミック
コンデンサは、コンデンサ素子11自体の不具合によっ
て電気的に短絡状態となる場合もあり、この場合は短絡
電流が流れて発熱し、発熱による電流暴走を生じて発煙
・発火することもある。In some cases, such a ceramic capacitor with a cap is electrically short-circuited due to a malfunction of the capacitor element 11 itself. In this case, a short-circuit current flows and heat is generated, causing a current runaway due to the heat generation. May emit smoke or fire.
【0005】[0005]
【発明が解決しようとする課題】以上述べたように、従
来のキャップ付き電子部品では、コンデンサ素子等の電
子部品素子と金属キャップの接続にクリームはんだを使
用して一体化して電子部品とするため、電子部品の定格
電圧以上の電圧が印加されたり、雷サージのような衝撃
電圧が加わって電子部品素子が劣化したり、また電子部
品素子自体の劣化などによって電流が継続して流れてコ
ンデンサ素子が発熱し、発熱による熱暴走によって発煙
・発火に至り、該電子部品のみならず周辺の電子部品群
にも損傷を与えるなどの問題があった。As described above, in a conventional electronic component with a cap, an electronic component such as a capacitor element is integrated with a metal cap by using cream solder to form an electronic component. When a voltage higher than the rated voltage of the electronic component is applied, an impact voltage such as a lightning surge is applied, the electronic component element is deteriorated, and the current continues to flow due to the deterioration of the electronic component element itself. However, there is a problem in that heat is generated and heat runaway causes smoke and ignition, thereby damaging not only the electronic components but also a group of surrounding electronic components.
【0006】前記の過大電流や熱暴走による発煙・発火
から電子回路を保護するために、電子部品に電流ヒュー
ズや温度ヒューズを組み込んだものもあるが、この構成
は電子部品素子の外部電極と金属キャップとの間に絶縁
材を配置し、この金属キャップと外部電極とをヒューズ
で接続したものからなる。この構成においては、絶縁材
の形成に1工程要し、かつ、絶縁材のずれ、絶縁材の絶
縁劣化→導電化→ヒューズ不動作などの問題点があっ
た。In order to protect an electronic circuit from smoke or ignition due to the above-mentioned excessive current or thermal runaway, there is a type in which a current fuse or a temperature fuse is incorporated in an electronic component. An insulating material is disposed between the metal cap and the cap, and the metal cap and the external electrode are connected by a fuse. In this configuration, one process is required for forming the insulating material, and there are problems such as displacement of the insulating material, deterioration of the insulating material of the insulating material → conductivity → inactivation of the fuse.
【0007】本発明は、このような欠点を解決するもの
で、電子部品に過電圧が流れたり、電子部品自体が劣化
して熱暴走を生じたりしても、電子部品素子の外部電極
と外部端子との接続の一部に設けたヒューズによって回
路を遮断し、発煙や発火のない電子部品を提供すること
を目的としたものである。The present invention solves such a drawback. Even if an overvoltage flows through the electronic component or the electronic component itself deteriorates to cause thermal runaway, the external electrodes and the external terminals of the electronic component element can be used. The purpose of the present invention is to provide an electronic component which does not emit smoke or fire by interrupting a circuit by a fuse provided in a part of the connection with the electronic device.
【0008】また、外部電極と外部端子との間に形成す
るガラス、セラミック又はこれらの複合材料を外部電極
と同時に形成し、工程増加のない電子部品の製造方法を
提供するものである。It is another object of the present invention to provide a method of manufacturing an electronic component, in which glass, ceramic or a composite material thereof formed between an external electrode and an external terminal is formed at the same time as the external electrode, so that the number of steps is not increased.
【0009】[0009]
【課題を解決するための手段】上記の課題を解決するた
めに、請求項1に記載の発明は、対の外部電極を有する
電子部品素子の一方の外部電極にガラス層、絶縁性セラ
ミック層又はこれらの複合層を介して外部端子を固定
し、この外部端子と前記外部電極との間にヒューズを接
続し、他方の外部電極には外部端子を接続した保安機能
付き電子部品である。In order to solve the above-mentioned problems, the invention according to claim 1 is directed to an electronic component element having a pair of external electrodes, wherein one of the external electrodes has a glass layer, an insulative ceramic layer, or the like. An electronic component with a security function in which an external terminal is fixed via these composite layers, a fuse is connected between the external terminal and the external electrode, and the external terminal is connected to the other external electrode.
【0010】このような請求項1記載の保安機能付き電
子部品では、一方の外部電極にガラス層、絶縁性セラミ
ック層又はこれらの複合層を介して外部端子を固定し、
この外部端子と外部電極間をヒューズで接続したもので
あるが、外部端子はガラス層、絶縁性セラミック層又は
これらの複合層の上に固定するという構成なので作業が
簡易である。電子部品にヒューズを設ける場合、外部端
子を外部電極から離しておく必要があることから、外部
端子を外部電極から離れた箇所に固定し、この両者の間
をヒューズで接続しておくことも考えられるが、このよ
うな構成では、電子部品という小さな物品であるために
外部端子と外部電極とが接触したり、作業が困難である
等の問題点がある。In the electronic component with a security function according to the first aspect, an external terminal is fixed to one external electrode via a glass layer, an insulating ceramic layer, or a composite layer thereof.
Although the external terminals and the external electrodes are connected by a fuse, the operation is simple because the external terminals are fixed on a glass layer, an insulating ceramic layer, or a composite layer thereof. When a fuse is provided in an electronic component, it is necessary to keep the external terminal away from the external electrode.Therefore, it is conceivable that the external terminal is fixed to a place away from the external electrode and both are connected by a fuse. However, in such a configuration, there are problems such as contact between the external terminals and the external electrodes and difficulty in work because the electronic components are small articles.
【0011】本発明になる電子部品が接続された電子回
路に定格電圧以上の電圧が印加され、これによって電子
部品の電気的特性が劣化し過電流が継続して流れても、
外部端子と外部電極を接続している電流ヒューズが溶断
するため、該電子部品は電子回路から切り離れる状態と
なり、該電子部品以外の電子回路部品への損傷を避ける
ことができる。[0011] Even if a voltage higher than the rated voltage is applied to the electronic circuit to which the electronic component according to the present invention is connected, thereby deteriorating the electrical characteristics of the electronic component and continuing the overcurrent,
Since the current fuse connecting the external terminal and the external electrode is blown, the electronic component is cut off from the electronic circuit, and damage to electronic circuit components other than the electronic component can be avoided.
【0012】また、ヒューズとして温度ヒューズを使用
した場合は、該電子部品が接続された電子回路に定格以
上の電圧が印加されたり、或いは電子部品自体の劣化な
どによって過電流が継続して流れて発熱し、この発熱に
よる熱暴走によって電子部品の発熱が上昇しても温度ヒ
ューズが溶断するため、該電子部品は電子回路から切り
離れる状態となり、該電子部品以外の電子回路部品への
損傷を避けることができる。When a thermal fuse is used as a fuse, a voltage higher than a rated voltage is applied to an electronic circuit to which the electronic component is connected, or an overcurrent continues to flow due to deterioration of the electronic component itself. Even if heat is generated and the heat of the electronic component rises due to thermal runaway due to the generated heat, the thermal fuse is blown, so that the electronic component is cut off from the electronic circuit, and damage to electronic circuit components other than the electronic component is avoided. be able to.
【0013】そして、ガラスや絶縁性セラミックは、絶
縁特性の劣化から導電化することはないので、外部電極
と外部端子とが導通して保安機能が動作しないという不
具合を生ずることはない。Since the glass and the insulating ceramic do not become conductive due to the deterioration of the insulating properties, there is no problem that the external electrode and the external terminal are conducted and the security function does not operate.
【0014】また、請求項2に記載の発明は、請求項1
記載の保安機能付き電子部品において、一方の外部端子
がコ字状、又は箱状の一部に切り欠き部を設けた構成か
らなり、他方の外部端子がコ字状又は箱状であることを
特徴とする。[0014] The invention described in claim 2 is the first invention.
In the electronic component with security function described, one external terminal has a U-shape or a configuration in which a notch is provided in a part of a box shape, and the other external terminal has a U-shape or a box shape. Features.
【0015】そして、外部端子との間でヒューズを接続
する外部電極の接続面は、外部電極の5面の中のどこで
もよい。このヒューズを接続する一方の外部端子の形状
として、コ字状、又は箱状の一部に切り欠き部を設けた
もので、この切り欠き部から露出している外部電極部分
でヒューズを接続することもできる。The connection surface of the external electrode for connecting the fuse to the external terminal may be any of the five surfaces of the external electrode. One of the external terminals for connecting the fuse has a U-shape or a box-like portion provided with a notch, and the fuse is connected at an external electrode portion exposed from the notch. You can also.
【0016】請求項3に記載の発明は、請求項1又は請
求項2の保安機能付き電子部品において、一方の外部端
子が内面に予めガラス層、絶縁性セラミック層又はこれ
らの複合層を形成してあることを特徴とする。このよう
な外部端子を使用することにより、予めガラス層、絶縁
性セラミック層又はこれらの複合層を形成してある外部
端子を電子部品素子の外部電極に接着するという簡易な
作業により固定することができる。According to a third aspect of the present invention, in the electronic component with a security function according to the first or second aspect, one of the external terminals has a glass layer, an insulative ceramic layer, or a composite layer thereof formed in advance on the inner surface. It is characterized by having. By using such an external terminal, it is possible to fix the external terminal on which a glass layer, an insulating ceramic layer or a composite layer thereof is formed in advance by a simple operation of bonding the external terminal to the external electrode of the electronic component element. it can.
【0017】なお、前記外部端子のコ字状又は箱状の形
状・寸法は、電子部品素子の形状、例えば直方体、立方
体等に合わせて設定する。The U-shaped or box-shaped shape and dimensions of the external terminals are set in accordance with the shape of the electronic component element, for example, a rectangular parallelepiped or a cube.
【0018】請求項4に記載の発明は、保安機能付き電
子部品の製造方法に関わり、電子部品素子に対の外部電
極材料を塗布する工程と、該電子部品素子の一方の外部
電極に熱溶融してガラス、絶縁性セラミック又はこれら
の複合材料になる無機材料を塗布する工程と、この電子
部品素子を所定温度で焼成し外部電極及び前記ガラス
層、セラミック層又はこれらの複合層を生成する工程
と、前記ガラス層上、セラミック層上又はこれらの複合
層上に、及び他方の外部電極上に外部端子を接続する工
程と、前記ガラス層上、セラミック層上又は複合層上に
接続した外部端子と当該外部電極とをヒューズで接続す
る工程とからなることを特徴とする。According to a fourth aspect of the present invention, there is provided a method of manufacturing an electronic component having a security function, wherein a step of applying a pair of external electrode materials to an electronic component element and a step of thermally melting one external electrode of the electronic component element are performed. Applying an inorganic material to become glass, insulating ceramic or a composite material thereof, and firing the electronic component element at a predetermined temperature to produce an external electrode and the glass layer, ceramic layer or a composite layer thereof. Connecting an external terminal on the glass layer, on the ceramic layer or on a composite layer thereof, and on the other external electrode, and connecting the external terminal on the glass layer, on the ceramic layer or on the composite layer And a step of connecting the external electrode and the external electrode with a fuse.
【0019】この製造方法によれば、電子部品素子に塗
布した外部電極材と、熱溶融してガラス、絶縁性セラミ
ック又はこれらの複合材となる無機材料とを同時に焼成
できる特徴がある。従来は樹脂等の絶縁性材料を使用し
ていたため、外部電極材と絶縁材である樹脂等を別々に
焼成及び硬化させる必要があり、複数の工程を要してい
た。According to this manufacturing method, there is a feature that the external electrode material applied to the electronic component element and the inorganic material which becomes a glass, an insulating ceramic or a composite material thereof by heat melting can be simultaneously fired. Conventionally, since an insulating material such as a resin is used, it is necessary to separately fire and cure the external electrode material and the resin or the like as the insulating material, which requires a plurality of steps.
【0020】[0020]
【発明の実施の形態】本発明の実施の形態の一例につい
て図面を参照して説明する。図1に示すように2個のセ
ラミックコンデンサ素子1は、その側面にそれぞれ銀ー
パラジウム(以下Ag−Pd)を主成分とする導電塗料
を塗布・乾燥させ、外部電極2を形成した。この2個の
コンデンサ素子1群の一方の外部電極2の上に、ほうけ
い酸亜鉛からなるガラス材料を塗布してガラス層3を形
成したのち、750℃で焼成した。この焼成によって、
前記外部電極2の導電塗料とガラス層3を構成するガラ
ス材料は同時に焼かれることとなる。An embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, two ceramic capacitor elements 1 were each coated with a conductive paint containing silver-palladium (hereinafter referred to as Ag-Pd) as a main component, and dried to form external electrodes 2. A glass material made of zinc borosilicate was applied on one of the external electrodes 2 of the two groups of capacitor elements 1 to form a glass layer 3 and then fired at 750 ° C. By this firing,
The conductive paint of the external electrode 2 and the glass material forming the glass layer 3 are simultaneously baked.
【0021】この2個のコンデンサ素子2群をエポキシ
樹脂からなる接着剤4で接着し、ガラス層3を設けた一
方の外部電極2の上にはコ字状の外部端子5を接着し
た。The two capacitor elements 2 were bonded with an adhesive 4 made of epoxy resin, and a U-shaped external terminal 5 was bonded on one of the external electrodes 2 provided with the glass layer 3.
【0022】また、対極となる他方の外部電極2には、
クリームはんだを内面に予め塗布したコ字状の外部端子
6を嵌め込み、加熱して外部電極2と接続させた。The other external electrode 2 serving as a counter electrode has
A U-shaped external terminal 6 in which cream solder was applied to the inner surface in advance was fitted, heated, and connected to the external electrode 2.
【0023】さらに、前記コ字状の外部端子5と外部電
極2との間を電流ヒューズ7で接続した。Further, a current fuse 7 connects between the U-shaped external terminal 5 and the external electrode 2.
【0024】以上述べたように、一方の外部電極2は、
ガラス層3を介してコ字状の外部端子5が固定されてお
り、この外部端子5は電流ヒューズ7で前記外部電極2
と接続され、他方の外部電極2は、コ字状の外部端子6
と接続されているから、コンデンサ素子1に過電流が継
続して流れた場合は、前記の電流ヒューズ7が溶断しコ
ンデンサが回路から切り離されるので、コンデンサや回
路に接続された他の電子部品等の発煙・発火、その他の
汚損、損傷を未然に防ぐことができる。As described above, one external electrode 2 is
A U-shaped external terminal 5 is fixed via the glass layer 3, and the external terminal 5 is connected to the external electrode 2 by a current fuse 7.
And the other external electrode 2 is connected to a U-shaped external terminal 6.
Therefore, if an overcurrent continues to flow through the capacitor element 1, the current fuse 7 is blown and the capacitor is disconnected from the circuit, so that the capacitor and other electronic components connected to the circuit can be used. Smoke, fire, and other pollution and damage can be prevented.
【0025】前記実施例では、電流ヒューズを使用した
場合について述べたが、電子回路等の状況により温度ヒ
ューズを用いても同様の効果を得ることができるし、外
部電極材料として用いたAg−Pdに代えてAg、ガラ
スとして用いたほうけい酸亜鉛に代えてほうけい酸アル
ミ又は絶縁性セラミック、或いはガラスとセラミックと
の複合材料を用いてもよい。In the above embodiment, the case where a current fuse is used has been described. However, similar effects can be obtained by using a temperature fuse depending on the situation of an electronic circuit or the like, and Ag-Pd used as an external electrode material can be obtained. In place of Ag, aluminum borosilicate or an insulating ceramic, or a composite material of glass and ceramic may be used in place of zinc borosilicate used as glass.
【0026】なお、外部端子5、6としてコ字状のもの
を使用した場合について述べたが、ヒューズを接続する
外部端子としては、図2に示すように、コ字状又は箱状
の一部に切り欠き部8を設け、該切り欠き部8から露出
した外部電極との間をヒューズで接続した形状の外部端
子5aや、また、他方の外部端子としては箱状からなる
ものを使用してもよい。そして、ヒューズを接続する外
部電極面は、前記実施例で示した電子部品素子の上面だ
けでなく、側面、前面、背面、下面の5面が接続可能で
ある。外部電極に対する外部端子の接続方向も、必ずし
も実施例のように電子部品素子の両側面から嵌め込むよ
うな接続に限定されるものではなく、電子部品素子の前
面や背面からの接続も可能である。以上述べたいずれの
場合も、コンデンサ素子のヒューズを接続する一方の外
部電極と外部端子との間にはガラス層、絶縁性セラミッ
ク層又はこれらの複合層が配されていることが必要であ
る。Although the case where U-shaped ones are used as the external terminals 5 and 6 has been described, as shown in FIG. An external terminal 5a having a shape in which a notch portion 8 is provided in the outer electrode and the external electrode exposed from the notch portion 8 is connected with a fuse, and a box-shaped external terminal is used as the other external terminal. Is also good. The external electrode surface to which the fuse is connected can be connected not only to the upper surface of the electronic component element shown in the above-mentioned embodiment but also to five surfaces of the side surface, the front surface, the rear surface, and the lower surface. The connection direction of the external terminal to the external electrode is not necessarily limited to the connection fitting from both sides of the electronic component element as in the embodiment, and the connection from the front surface or the rear surface of the electronic component element is also possible. . In any of the above-described cases, it is necessary that a glass layer, an insulating ceramic layer, or a composite layer thereof is disposed between one external electrode for connecting the fuse of the capacitor element and the external terminal.
【0027】さらに、図3に示すように、ヒューズを接
続する一方の外部端子5bに予めガラス層、絶縁性セラ
ミック層又はこれらの複合層3bを形成しておき、これ
を外部電極に接着等によって固定しても同様の効果を得
ることができる。このとき、ガラス層等3bの幅が外部
電極5bの幅と同じか、又は広いことが好ましい。Further, as shown in FIG. 3, a glass layer, an insulating ceramic layer or a composite layer 3b thereof is formed in advance on one external terminal 5b for connecting a fuse, and this is bonded to an external electrode by bonding or the like. The same effect can be obtained even if fixed. At this time, the width of the glass layer 3b or the like is preferably equal to or larger than the width of the external electrode 5b.
【0028】そして、上記実施例では電子部品としてセ
ラミックコンデンサの場合について述べたが、バリスタ
や抵抗器、又はこれらの組み合わせになる電子部品にも
適用することができる。In the above embodiment, the case where a ceramic capacitor is used as an electronic component has been described. However, the present invention can also be applied to a varistor, a resistor, or an electronic component that is a combination thereof.
【0029】[0029]
【発明の効果】以上述べたように、本発明になる電子部
品では、過電圧や電子部品の発熱による劣化が生じて
も、電子部品素子の一方の外部電極と外部端子との間に
接続したヒューズで回路を遮断するので、発煙・発火が
無く、また同一基板等に組み込まれた他の電子部品を汚
損したり、焼損することがない効果を得ることができ
る。As described above, in the electronic component according to the present invention, the fuse connected between one external electrode and the external terminal of the electronic component element can be used even if deterioration due to overvoltage or heat generation of the electronic component occurs. As a result, there is no smoke or ignition, and it is possible to obtain an effect that other electronic components incorporated in the same substrate or the like are not stained or burnt.
【0030】また、外部電極とその上に形成するガラス
層、絶縁性セラミック層又はこれらの複合層を同時に焼
成できるから、製造工程を短縮できる効果も有する。Further, since the external electrode and the glass layer, the insulating ceramic layer or the composite layer formed on the external electrode can be fired at the same time, the production process can be shortened.
【図1】本発明による電子部品の一実施例を示す斜視
図。FIG. 1 is a perspective view showing an embodiment of an electronic component according to the present invention.
【図2】本発明に使用する外部端子の他の実施例を示す
斜視図。FIG. 2 is a perspective view showing another embodiment of the external terminal used in the present invention.
【図3】本発明に使用する絶縁材層を形成した外部端子
を示す斜視図。FIG. 3 is a perspective view showing an external terminal on which an insulating material layer used in the present invention is formed.
【図4】従来の電子部品素子を示す正面図。FIG. 4 is a front view showing a conventional electronic component element.
1…セラミックコンデンサ素子 2…外部電極 3…ガラス層 4…接着剤 5…一方の外部端子 6…他方の外部端子 7…電流ヒューズ DESCRIPTION OF SYMBOLS 1 ... Ceramic capacitor element 2 ... External electrode 3 ... Glass layer 4 ... Adhesive 5 ... One external terminal 6 ... The other external terminal 7 ... Current fuse
Claims (4)
子、又は2個以上の電子部品素子を接着した電子部品素
子群と、該電子部品素子の一方の外部電極にガラス層、
絶縁性セラミック層又はこれらの複合層を介して固定し
た外部端子と、該外部端子と前記外部電極との間に接続
したヒューズと、前記電子部品素子の他方の外部電極に
接続した外部端子とからなる保安機能付き電子部品。An electronic component element having a pair of external electrodes, or an electronic component element group in which two or more electronic component elements are bonded, a glass layer on one external electrode of the electronic component element,
An external terminal fixed via an insulating ceramic layer or a composite layer thereof, a fuse connected between the external terminal and the external electrode, and an external terminal connected to the other external electrode of the electronic component element. Electronic components with security functions.
部に切り欠き部を設けた構成からなり、他方の外部端子
がコ字状又は箱状であることを特徴とする請求項1記載
の保安機能付き電子部品。2. The method according to claim 1, wherein one of the external terminals has a U-shape or a box-like shape and a cutout portion is provided in a part thereof, and the other external terminal has a U-shape or a box-shape. Item 2. An electronic component with a security function according to Item 1.
性セラミック層又はこれらの複合層を形成してあること
を特徴とする請求項1又は請求項2記載の保安機能付き
電子部品。3. The electronic component with a security function according to claim 1, wherein one of the external terminals has a glass layer, an insulating ceramic layer, or a composite layer thereof formed on the inner surface.
する工程と、該電子部品素子の一方の外部電極に熱溶融
してガラス、セラミック又はこれらの複合材料になる無
機材料を塗布する工程と、この電子部品素子を所定温度
で焼成し外部電極及びガラス層、絶縁性セラミック層又
はこれらの複合層を生成する工程と、前記ガラス層上、
セラミック層上又はこれらの複合層上に、及び他方の外
部電極上に外部端子を接続する工程と、前記ガラス層
上、セラミック層上又はこれらの複合層上に接続した外
部端子と当該外部電極とをヒューズで接続する工程とか
らなる保安機能付き電子部品の製造方法。4. A step of applying a pair of external electrode materials to the electronic component element, and a step of applying an inorganic material which becomes a glass, a ceramic, or a composite material thereof by thermally melting one external electrode of the electronic component element. And firing the electronic component element at a predetermined temperature to produce an external electrode and a glass layer, an insulating ceramic layer or a composite layer thereof, and
A step of connecting external terminals on the ceramic layer or on these composite layers, and on the other external electrode, and on the glass layer, on the ceramic layer or on these composite layers, the external terminals and the external electrodes; A method of manufacturing an electronic component with a security function, comprising the steps of: connecting an electronic component with a fuse.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9220784A JPH1154357A (en) | 1997-08-02 | 1997-08-02 | Electronic component with safety function and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9220784A JPH1154357A (en) | 1997-08-02 | 1997-08-02 | Electronic component with safety function and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1154357A true JPH1154357A (en) | 1999-02-26 |
Family
ID=16756527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9220784A Pending JPH1154357A (en) | 1997-08-02 | 1997-08-02 | Electronic component with safety function and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1154357A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2471079A2 (en) * | 2009-08-24 | 2012-07-04 | Kemet Electronics Corporation | Externally fused and resistively loaded safety capacitor |
JP2016134618A (en) * | 2015-01-20 | 2016-07-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Multilayer ceramic electronic component and mounting board thereof |
US10115523B2 (en) | 2016-09-21 | 2018-10-30 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and mounting structure of the same |
-
1997
- 1997-08-02 JP JP9220784A patent/JPH1154357A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2471079A2 (en) * | 2009-08-24 | 2012-07-04 | Kemet Electronics Corporation | Externally fused and resistively loaded safety capacitor |
EP2471079B1 (en) * | 2009-08-24 | 2016-01-06 | Kemet Electronics Corporation | Externally fused and resistively loaded safe capacitor |
JP2016134618A (en) * | 2015-01-20 | 2016-07-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Multilayer ceramic electronic component and mounting board thereof |
US10115523B2 (en) | 2016-09-21 | 2018-10-30 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and mounting structure of the same |
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