JPH1152408A - Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element - Google Patents

Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element

Info

Publication number
JPH1152408A
JPH1152408A JP22570597A JP22570597A JPH1152408A JP H1152408 A JPH1152408 A JP H1152408A JP 22570597 A JP22570597 A JP 22570597A JP 22570597 A JP22570597 A JP 22570597A JP H1152408 A JPH1152408 A JP H1152408A
Authority
JP
Japan
Prior art keywords
tab
liquid crystal
crystal display
electrode
transparent electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22570597A
Other languages
Japanese (ja)
Inventor
Kazuya Miyagaki
一也 宮垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP22570597A priority Critical patent/JPH1152408A/en
Publication of JPH1152408A publication Critical patent/JPH1152408A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for using an anisotropic conductive film (or anisotropic conductive paste) by bonding electrodes which are formed on a tab(TAB) surface at given intervals and have irregularities on the surfaces and the transparent electrode of the liquid crystal display element with a setting type adhesive and also connecting them electrically. SOLUTION: The electrode (surface-roughened copper foil) 22 of TAB packaged on the transparent electrode 12 of a liquid crystal panel has irregularities. The adhesive is applied between a transparent electrode extraction part and the electrode of a TAB board 21. A thermosetting adhesive is used as this adhesive. The transparent electrode extraction part 12 to be mounted is coated with the thermosetting adhesive. The extraction part 12 of the transparent electrode and the electrode 22 of TAB are positioned. A projection part of the TAB electrode is pressed against the transparent electrode 12 by being pressed. Thus, the transparent electrode 12 and TAB are packaged without using an anisotropic conductive film or anisotropic paste, and the electrode pitch of the transparent electrode and the electrode pitch of TAB are both made small.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、TAB実装液晶表
示素子および液晶表示素子とTABの実装方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB-mounted liquid crystal display device and a liquid crystal display device and a method for mounting a TAB.

【0002】[0002]

【従来技術】従来、TABを液晶表示素子に実装する方
法としては、異方性導電膜を介して行なわれている。す
なわち、接続する透明電極、もしくはTABの電極部分
のどちらかに異方性導電膜を貼る。この異方性導電膜自
体のタック力が不十分である場合には、異方性導電膜の
端を粘着テープで留めても良い。次にTABもしくは透
明電極側基板を位置合わせしてヒートシールする。該ヒ
ートシールは、通常、仮圧着と本圧着の2工程でヒート
シールされる場合が多い。
2. Description of the Related Art Conventionally, TAB is mounted on a liquid crystal display element via an anisotropic conductive film. That is, an anisotropic conductive film is attached to either the transparent electrode to be connected or the TAB electrode portion. If the tack force of the anisotropic conductive film itself is insufficient, the end of the anisotropic conductive film may be fixed with an adhesive tape. Next, TAB or the transparent electrode side substrate is positioned and heat-sealed. In many cases, the heat sealing is usually performed in two steps of temporary compression bonding and main compression bonding.

【0003】現状では、接続される電極幅と異方性導電
膜の粒子径の比は、10対1程度である。近年、液晶パ
ネルの高密度化のため高密度実装の要求があるため、導
電粒子径も小さいものが開発されているが、最小でも5
μm前後である。従って、高密度化がますます進むと現
状の異方性導電膜では信頼性の高い接続は難しくなる。
At present, the ratio between the width of the electrode to be connected and the particle size of the anisotropic conductive film is about 10: 1. In recent years, there has been a demand for high-density packaging for high-density liquid crystal panels, and therefore, those having a small conductive particle diameter have been developed.
It is around μm. Therefore, as the densification progresses more and more, it becomes difficult to connect with high reliability with the current anisotropic conductive film.

【0004】[0004]

【発明が解決しようとする課題】本発明は異方性導電膜
(もしくは異方性導電ペースト)を使用せずにTABの
実装された液晶表示素子および該液晶表示素子へのTA
B実装方法を提供することにある。
SUMMARY OF THE INVENTION The present invention relates to a liquid crystal display device having a TAB mounted thereon without using an anisotropic conductive film (or an anisotropic conductive paste) and a method for applying a TAB to the liquid crystal display device.
B is to provide a mounting method.

【0005】[0005]

【課題を解決するための手段】本発明第1は、1対の透
明電極を有する基板が液晶分子を挟持して構成され、か
つTABの実装された液晶表示素子において、TAB面
に所定間隔をあけて形成され、かつ表面に凹凸を有する
電極と前記液晶表示素子の透明電極が硬化型接着剤によ
って接合され電気的に接続されていることを特徴とする
TAB実装液晶表示素子に関する。
According to a first aspect of the present invention, in a liquid crystal display device in which a substrate having a pair of transparent electrodes sandwiches liquid crystal molecules and a TAB is mounted, a predetermined interval is provided between the TAB surfaces. The present invention relates to a TAB-mounted liquid crystal display element, characterized in that an electrode formed with a gap and having irregularities on its surface and a transparent electrode of the liquid crystal display element are joined and electrically connected by a curable adhesive.

【0006】本発明第2は、TAB面に所定間隔を開け
て形成され、表面に凹凸を形成したTAB電極を、一対
の透明電極を有する基板が液晶分子を挟持して構成され
た液晶表示素子の透明電極の所定の位置に、前記両電極
の位置がずれない程度に加圧し接合させた後、光硬化型
または熱硬化型接着剤をTABに塗布し、光硬化または
熱硬化させることを特徴とする液晶表示素子とTABと
を実装する方法に関する。
A second aspect of the present invention is a liquid crystal display device comprising a TAB electrode formed at predetermined intervals on a TAB surface and having irregularities on its surface, and a substrate having a pair of transparent electrodes sandwiching liquid crystal molecules. After pressing and joining to a predetermined position of the transparent electrode to such an extent that the positions of the two electrodes do not shift, a photo-curing or thermosetting adhesive is applied to TAB and photo-cured or thermo-cured. To mount a liquid crystal display element and a TAB.

【0007】以下、本発明を図面に基づいて具体的に説
明する。 1.図1および2に本発明のTAB実装液晶表示素子の
1例を示す。この液晶表示素子は、液晶パネル10の透
明電極12に実装するTAB20の電極(表面が粗化さ
れた銅箔)22に凹凸を有する。該凹凸を形成する方法
は、電極面を削る方法でも良いし、凸部分を形成する方
法でも良い。電極面を削る方法としては、例えば紙ヤス
リを用いる方法が挙げられる。紙ヤスリなどで削る場
合、凹部分の大きさはランダムになるが、凹部分の間隔
の平均値はTAB電極間の10%以下にすると本発明の
効果が高い。接着剤を透明電極引き出し部分とTAB基
板21の電極の間に塗布する。この接着剤には熱硬化型
接着剤を用いる。また、できるだけ粘度の小さい接着剤
が望ましい。例えば、スリーボンド社製の3042は粘
度20cPで熱硬化型接着剤であるため使用できる。実
装する透明電極引き出し部分12に熱硬化型接着剤を塗
布する。塗布するときディスペンサを使えば必要以上に
接着剤を塗布することがない。透明電極の引き出し部分
12とTABの電極22の位置合わせを行う。一般的に
は両方にアライメントマークを施してこれらを位置合わ
せすることによって両方の電極の位置合わせを行う。ヒ
ートシール圧着機などによって接着部分を加圧・加熱す
る。接着剤はTAB側につけても、透明電極側とTAB
側の両方に付けても、本発明の効果に変わりはない。接
着剤の粘性が極端に大きいことがない限り、加圧するこ
とによってTAB電極のない部分に回り込む。またごく
少数の接着剤はTAB電極の凹部にも回り込む。TAB
電極の凸部分は加圧されたことによって透明電極12に
押し当てられる。以上の工程によって、従来実装で使わ
れる異方性導電膜もしくは異方性導電ペーストを使用す
ることなく透明電極12とTAB20の実装ができ、ま
た、透明電極の電極ピッチとTABの電極ピッチを共に
小さくしても実装可能になる。
Hereinafter, the present invention will be specifically described with reference to the drawings. 1. 1 and 2 show one example of a TAB-mounted liquid crystal display device of the present invention. This liquid crystal display element has irregularities on an electrode (copper foil whose surface is roughened) 22 of the TAB 20 mounted on the transparent electrode 12 of the liquid crystal panel 10. The method of forming the irregularities may be a method of shaving the electrode surface or a method of forming a convex portion. As a method of shaving the electrode surface, for example, a method using a paper file is used. When shaving with a paper file or the like, the size of the concave portion is random, but the effect of the present invention is high if the average value of the interval between the concave portions is 10% or less between the TAB electrodes. An adhesive is applied between the transparent electrode lead-out portion and the electrode of the TAB substrate 21. A thermosetting adhesive is used as this adhesive. Also, an adhesive having the lowest possible viscosity is desirable. For example, 3042 manufactured by Three Bond Co. can be used because it has a viscosity of 20 cP and is a thermosetting adhesive. A thermosetting adhesive is applied to the transparent electrode lead-out portion 12 to be mounted. If a dispenser is used when applying, the adhesive is not applied more than necessary. The alignment between the lead portion 12 of the transparent electrode and the electrode 22 of the TAB is performed. Generally, both electrodes are aligned by applying alignment marks to both and aligning them. The bonded part is pressurized and heated by a heat seal crimping machine or the like. Even if the adhesive is applied to the TAB side, the transparent electrode side and the TAB
Even if it attaches to both sides, there is no change in the effect of the present invention. As long as the viscosity of the adhesive is not extremely large, the adhesive wraps around the portion without the TAB electrode by applying pressure. Also, a very small number of adhesives also wrap around the recesses of the TAB electrode. TAB
The convex portion of the electrode is pressed against the transparent electrode 12 by being pressed. Through the above steps, the transparent electrode 12 and the TAB 20 can be mounted without using the anisotropic conductive film or the anisotropic conductive paste used in the conventional mounting. Even if it is small, it can be mounted.

【0008】2.図3は、本発明のTAB実装液晶表示
素子の他の例を示す。このTAB実装液晶表示素子は図
1および2において熱硬化型接着剤の代わりに光硬化型
接着剤を用いたものである。この光硬化型接着剤として
は、できるだけ粘性の小さいものが望ましく、例えば、
10〜1000cP程度のものが好ましい。このような
接着剤としては、例えばチバガイギー社製のXNR54
91が挙げられ、このものの粘度は420cPで、また
紫外線で硬化する。
[0008] 2. FIG. 3 shows another example of the TAB-mounted liquid crystal display device of the present invention. This TAB-mounted liquid crystal display element uses a photo-curing adhesive instead of the thermosetting adhesive in FIGS. It is desirable that the photo-curable adhesive has a viscosity as small as possible.
Those having about 10 to 1000 cP are preferred. Examples of such an adhesive include XNR54 manufactured by Ciba-Geigy.
91, which has a viscosity of 420 cP and cures with ultraviolet light.

【0009】3.図4および5にもとづいて、本発明の
液晶表示素子へのTABの実装方法を説明する。 (1)図4に示すものは実装する透明電極12の引き出
し部分に光硬化型接着剤32を塗布し、光照射してTA
Bの実装を行うものである。塗布するときディスペンサ
などを使えば必要以上に接着剤を塗布することがない。
透明電極12の引き出し部分とTAB電極22の位置合
わせを行う。一般的には両方にアライメントマークを施
してこれらを位置合わせすることによって両方の電極の
位置合わせを行う。接着部分を加圧するとともに、光硬
化型接着剤32の硬化させるための所定の波長の光3
3、34を照射する。加圧部材は、照射する光の波長で
透明性の高いものを使う必要がある。前述のXNR54
91を接着剤として使用する場合、加圧部材に合成石英
といった紫外線の透過率の高い部材を使うことが望まし
い。接着剤32の粘性が極端に大きいことがない限り、
加圧することによってTAB電極22のない部分に回り
込む。またごく少数の接着剤32は粗化されたTAB電
極22の凹部にも回り込む。TAB電極22の凸部分は
加圧されたことによって透明電極12に押し当てられ
る。以上の工程によって、従来実装で使われる異方性導
電膜もしくは異方性導電ペーストを使用することなく透
明電極12とTAB20の実装ができ、また、透明電極
の電極ピッチとTABの電極ピッチをともに小さくして
も実装可能になる。前記液晶パネルの透明電極に実装す
るTABの電極面の凹凸は、前記のように、例えば紙ヤ
スリで形成できるが、できるだけ細かく粗化する方がよ
い。前記接着剤32もできるだけ粘性の小さいものが望
ましい。 (2)図5に示すものは、実装する透明電極12の引き
出し部分に熱硬化型接着剤36を塗布して行う以外は、
図4に示すものと同様にして液晶表示素子にTABを実
装する。
3. With reference to FIGS. 4 and 5, a method of mounting TAB on the liquid crystal display device of the present invention will be described. (1) As shown in FIG. 4, a light-curing adhesive 32 is applied to a lead-out portion of a transparent electrode 12 to be mounted, and is irradiated with light to form a TA.
B is implemented. If a dispenser or the like is used when applying, the adhesive is not applied more than necessary.
Positioning of the lead portion of the transparent electrode 12 and the TAB electrode 22 is performed. Generally, both electrodes are aligned by applying alignment marks to both and aligning them. A light 3 having a predetermined wavelength for curing the light-curing adhesive 32 while pressing the bonding portion.
3 and 34 are irradiated. It is necessary to use a pressing member having high transparency at the wavelength of light to be irradiated. The aforementioned XNR54
When 91 is used as the adhesive, it is desirable to use a member having a high transmittance of ultraviolet light, such as synthetic quartz, as the pressing member. Unless the viscosity of the adhesive 32 is extremely large,
By pressurizing, it wraps around the portion without the TAB electrode 22. Also, a very small number of the adhesives 32 wrap around the recessed portions of the roughened TAB electrode 22. The convex portion of the TAB electrode 22 is pressed against the transparent electrode 12 by being pressed. Through the above steps, the transparent electrode 12 and the TAB 20 can be mounted without using the anisotropic conductive film or the anisotropic conductive paste used in the conventional mounting, and both the electrode pitch of the transparent electrode and the electrode pitch of the TAB can be reduced. Even if it is small, it can be mounted. The unevenness of the electrode surface of the TAB mounted on the transparent electrode of the liquid crystal panel can be formed by, for example, a paper file as described above, but it is preferable to roughen as finely as possible. The adhesive 32 is also desirably as viscous as possible. (2) The one shown in FIG. 5 is performed by applying a thermosetting adhesive 36 to the lead-out portion of the transparent electrode 12 to be mounted.
The TAB is mounted on the liquid crystal display device in the same manner as shown in FIG.

【0010】4.図6に示すように、液晶パネルの基板
11とTABとを、補強用接着剤または補強用テープ3
8で固定しても良い。本図のような構成のものは、接着
個所がTABの端部に集中している場合で、接着個所の
剥離強度が小さい場合に、特に効果的である。なお、図
6では、TABの電極22の表面と透明電極12の間に
隙間があるかのように記載されているが、これは接着剤
37が電極間の凹部にしみ込むことを強調したいための
記載で、実際には前記両電極は、凸部分では隙間なく接
触している。
[0010] 4. As shown in FIG. 6, the substrate 11 of the liquid crystal panel and the TAB are connected with a reinforcing adhesive or reinforcing tape 3.
8 may be fixed. The configuration as shown in this figure is particularly effective when the bonding location is concentrated at the end of the TAB and the peel strength at the bonding location is low. In FIG. 6, although it is described as if there is a gap between the surface of the TAB electrode 22 and the transparent electrode 12, this is for emphasizing that the adhesive 37 permeates into the concave portion between the electrodes. In the description, actually, the two electrodes are in contact with each other without any gap at the convex portion.

【0011】本発明の別の態様のTAB実装液晶表示素
子あるいは液晶表示素子へのTABの実装方法として
は、導電ペーストを用いたものが挙げられる。前記各図
に示す液晶パネル10の透明電極12に実装するTAB
20の電極面22に凹凸を形成し、極とTABの実装の
前に、TABの電極部分に導電ペーストを薄く塗布して
構成されるものである。前記導電ペーストは異方性導電
ペーストではなく、例えば銀ペーストやニッケルペース
トなどの導電性樹脂のようなものである。この導電ペー
ストは、以下のようにしてTABの電極部分に塗布され
る。すなわち、この塗布方法としては、例えば、平らな
基板の上に導電ペーストをムラなく薄く広げる。スピン
コートで広げても良いし、ローラーで広げても良い。次
に、薄く広げられた導電ペースト上にTABの電極部分
を押し当てて電極部分に導電ペーストを塗布する。この
導電ペーストの塗布されたTABを液晶パネルの透明電
極に押しつける。このように予め導電ペーストを電極表
面に付着させておくことで、接着後の接続抵抗値を小さ
く保つこともできる。なお、前記電極面の凹凸の形成
は、前記接着剤を使用する場合と同様にして行うことが
できる。
As another embodiment of the present invention, a TAB mounting liquid crystal display device or a method of mounting a TAB on a liquid crystal display device includes a method using a conductive paste. TAB mounted on the transparent electrode 12 of the liquid crystal panel 10 shown in each of the drawings.
The surface of the electrode 20 is formed with concavities and convexities, and a thin conductive paste is applied to the electrode portion of the TAB before mounting the pole and the TAB. The conductive paste is not an anisotropic conductive paste, but is, for example, a conductive resin such as a silver paste or a nickel paste. This conductive paste is applied to the TAB electrode portion as follows. That is, as this application method, for example, the conductive paste is spread evenly and thinly on a flat substrate. It may be spread by spin coating or may be spread by a roller. Next, the electrode portion of TAB is pressed on the thinly spread conductive paste to apply the conductive paste to the electrode portion. The TAB coated with the conductive paste is pressed against the transparent electrode of the liquid crystal panel. By previously attaching the conductive paste to the electrode surface, the connection resistance value after bonding can be kept low. The unevenness on the electrode surface can be formed in the same manner as in the case where the adhesive is used.

【0012】[0012]

【効果】異方性導電膜(もしくは異方性導電ペースト)
を使用せずに、液晶表示素子の透明電極とTABの電極
との接続不良を低減させ、前記両電極の剥離強度を高
め、かつ接続抵抗値を小さくしたTAB実装液晶表示素
子が得られた。
[Effect] Anisotropic conductive film (or anisotropic conductive paste)
A TAB-mounted liquid crystal display device was obtained without using a liquid crystal display device, in which poor connection between the transparent electrode of the liquid crystal display device and the TAB electrode was reduced, the peel strength of the two electrodes was increased, and the connection resistance was reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のTAB実装液晶表示素子の模式的平面
図である。
FIG. 1 is a schematic plan view of a TAB-mounted liquid crystal display device of the present invention.

【図2】図1の接着部分の拡大図である。FIG. 2 is an enlarged view of a bonding portion of FIG.

【図3】図1において、接着剤として光硬化型接着剤を
用いた場合の図である。
FIG. 3 is a diagram in a case where a photocurable adhesive is used as the adhesive in FIG.

【図4】図3の接着部分模式的断面拡大図である。FIG. 4 is an enlarged schematic cross-sectional view of a bonding portion of FIG. 3;

【図5】図4において、接着剤として熱硬化型接着剤を
用いた場合の図である。
FIG. 5 is a diagram when a thermosetting adhesive is used as the adhesive in FIG.

【図6】基板端部とTABを接着もしくはテープ貼りし
たTAB実装液晶表示素子の模式的断面図である。
FIG. 6 is a schematic cross-sectional view of a TAB-mounted liquid crystal display element in which a substrate end and a TAB are bonded or taped.

【符号の説明】[Explanation of symbols]

10 液晶パネル 11 パネル基板 12 透明電極(引き出し部分) 20 TAB 21 TAB基板 22 銅箔(表面が粗化された面) 23 熱硬化型接着剤塗布部分 31 光硬化型接着剤塗布部分 32 光硬化型接着剤 33 光照射 34 光照射 35 TABのIC 36 熱硬化型接着剤 37 接着剤(熱硬化型接着剤又は光硬化型接着剤) 38 補強用接着剤または補強用テープ DESCRIPTION OF SYMBOLS 10 Liquid crystal panel 11 Panel board 12 Transparent electrode (drawing part) 20 TAB 21 TAB board 22 Copper foil (surface roughened) 23 Thermosetting adhesive application part 31 Light curing adhesive application part 32 Light curing type Adhesive 33 Light irradiation 34 Light irradiation 35 TAB IC 36 Thermosetting adhesive 37 Adhesive (thermosetting or photocuring adhesive) 38 Reinforcing adhesive or reinforcing tape

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 一対の透明電極を有する基板が液晶分子
を挟持して構成され、かつTABの実装された液晶表示
素子において、TAB面に所定間隔をあけて形成され、
かつ表面に凹凸を有する電極と前記液晶表示素子の透明
電極が硬化型接着剤によって接合され、電気的に接続さ
れていることを特徴とするタブ(以下、TABとも言
う)実装液晶表示素子。
1. A liquid crystal display device comprising a substrate having a pair of transparent electrodes sandwiching liquid crystal molecules and having a TAB mounted thereon, the substrate being formed at predetermined intervals on a TAB surface,
A tab (hereinafter, also referred to as TAB) mounted liquid crystal display element, wherein an electrode having irregularities on its surface and a transparent electrode of the liquid crystal display element are joined and electrically connected by a curable adhesive.
【請求項2】 硬化型接着剤が光硬化型接着剤または熱
硬化型接着剤である請求項1記載のTAB実装液晶表示
素子。
2. The TAB-mounted liquid crystal display element according to claim 1, wherein the curable adhesive is a light curable adhesive or a thermosetting adhesive.
【請求項3】 一対の透明電極を有する基板が液晶分子
を挟持して構成され、かつTABの実装された液晶表示
素子において、TAB面に所定間隔をあけて形成され、
表面に凹凸ならびに該凹凸面上に導電ペーストを付着さ
せた電極と前記液晶表示素子の透明電極とを接合し電気
的に接続させていることを特徴とするTAB実装液晶表
示素子。
3. A liquid crystal display device comprising a substrate having a pair of transparent electrodes sandwiching liquid crystal molecules and having a TAB mounted thereon, the substrate being formed at predetermined intervals on the TAB surface,
A TAB-mounted liquid crystal display device, characterized by joining and electrically connecting an electrode having irregularities on its surface and a conductive paste adhered on the irregular surface to a transparent electrode of the liquid crystal display device.
【請求項4】 請求項1、2または3記載のTAB実装
液晶表示素子の基板端部とTABとを接着もしくはテー
プ貼りしたことを特徴とするTAB実装液晶表示素子。
4. A TAB-mounted liquid crystal display device according to claim 1, wherein the TAB is adhered or taped to the substrate end of the TAB-mounted liquid crystal display device.
【請求項5】 TAB面に所定間隔を開けて形成され、
表面に凹凸を形成したTAB電極を、一対の透明電極を
有する基板が液晶分子を挟持して構成された液晶表示素
子の透明電極の所定の位置に、前記両電極の位置がずれ
ない程度に加圧し接合させた後、光硬化型または熱硬化
型接着剤をTABに塗布し、光硬化または熱硬化させる
ことを特徴とする液晶表示素子とTABとを実装する方
法。
5. Formed at a predetermined interval on the TAB surface,
A TAB electrode having irregularities on its surface is added to a predetermined position of a transparent electrode of a liquid crystal display device in which a substrate having a pair of transparent electrodes sandwiches liquid crystal molecules to such an extent that the positions of the two electrodes do not shift. A method of mounting a liquid crystal display element and a TAB, comprising applying a light-curing or thermosetting adhesive to the TAB after pressing and joining, and curing the TAB with light.
JP22570597A 1997-08-07 1997-08-07 Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element Pending JPH1152408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22570597A JPH1152408A (en) 1997-08-07 1997-08-07 Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22570597A JPH1152408A (en) 1997-08-07 1997-08-07 Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element

Publications (1)

Publication Number Publication Date
JPH1152408A true JPH1152408A (en) 1999-02-26

Family

ID=16833518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22570597A Pending JPH1152408A (en) 1997-08-07 1997-08-07 Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element

Country Status (1)

Country Link
JP (1) JPH1152408A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002304130A (en) * 2001-04-04 2002-10-18 Smk Corp Connector
JP2008233141A (en) * 2007-03-16 2008-10-02 Epson Imaging Devices Corp Electro-optical device
US7663234B2 (en) 2004-01-27 2010-02-16 United Microelectronics Corp. Package of a semiconductor device with a flexible wiring substrate and method for the same
KR101001942B1 (en) 2008-12-18 2010-12-17 주식회사 나래나노텍 A Checking Method for Checking Bonding Status of Pattern Electrodes and A Bonding Structure of Pattern Electrodes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002304130A (en) * 2001-04-04 2002-10-18 Smk Corp Connector
US7663234B2 (en) 2004-01-27 2010-02-16 United Microelectronics Corp. Package of a semiconductor device with a flexible wiring substrate and method for the same
JP2008233141A (en) * 2007-03-16 2008-10-02 Epson Imaging Devices Corp Electro-optical device
KR101001942B1 (en) 2008-12-18 2010-12-17 주식회사 나래나노텍 A Checking Method for Checking Bonding Status of Pattern Electrodes and A Bonding Structure of Pattern Electrodes

Similar Documents

Publication Publication Date Title
JP3035021B2 (en) Liquid crystal display device and method of manufacturing the same
CN109143699A (en) A kind of display panel and its manufacturing method and display device
JP2000242190A (en) Method for packaging tcp film to display panel
JP3763607B2 (en) Method for manufacturing liquid crystal display device and liquid crystal display device
JPH1116502A (en) Electrode joining method for plasma display panel
JP2000068633A (en) Pressure-bonding method and pressure-bonding device
JPH1152408A (en) Tab packaged liquid crystal display element, and method for packaging tab on liquid crystal display element
JP2985640B2 (en) Electrode connector and method of manufacturing the same
JP2002075580A (en) Manufacturing method for anisotropic conductive film
JP2710576B2 (en) How to connect a liquid crystal display
JPH1013002A (en) Method for mounting semiconductor element
JP3336048B2 (en) Semiconductor element mounting method
JPH06235928A (en) Liquid crystal display device
JPH06265924A (en) Electro-optic device and its production
JP3324798B2 (en) Electro-optical device and method of manufacturing the same
JPH0997812A (en) Connection of circuit board
JPH08167441A (en) Electrical connection member and connection structure for liquid crystal panel
JP3241943B2 (en) Circuit connection method
JPH07283269A (en) Bonding method between electrode pattern and bump electrode pattern on circuit substrate
KR101358907B1 (en) Manufacturing method of display device
JP2003005208A (en) Lamination method for liquid crystal display panel
JPH1065332A (en) Anistropic conductive thin film and method for connection of polymer board using the same
JPS63165823A (en) Structure of liquid crystal cell
JP2008071748A (en) Connecting method
JP2001005020A (en) Structure for connecting electrode terminals of liquid crystal display panel