JPH1140914A - Substrate linkage structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate linkage structure which can mount parts over the entire surface of the substrate and also can efficiently link the substrate together. SOLUTION: A drive substrate 12 is provided in its corners with counterbore holes 12a so that, when positioning pins 13b of spacers 13 are inserted into the respective holes 12a, the spacers 13 can be positioned. Each spacer 12 is mounted to the drive substrate 12 by means of a solder reflow. Each spacer 13 is provided in its upper part with internal threads 13c, a screw 15 is passed through a through-hole 11a made in each corner of a display substrate 11 and then threaded into the internal threaded part 13c opposite the hole 11a. By having each screws 15 threaded into the associated internal treaded parts 13c of the spacers 13 and tightened thereto, the display substrate 11 can be mounted to the respective spacers 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to, for example,
In a display unit using an ED (light emitting diode) lamp, a display board on which a large number of LED lamps are mounted and a drive board on which a driver for driving each LED lamp is mounted are spaced at a fixed distance by a spacer. The present invention relates to a board connection structure that is connected in parallel at a time.

[0002]

2. Description of the Related Art In a display unit using a large number of LED lamps, a display board on which a large number of LED lamps are mounted and a driver for driving each of the LED lamps mounted on the display board are mounted. And the drive substrates thus manufactured are individually manufactured, and a board connection structure is adopted in which the boards are connected in parallel at regular intervals. In such a board connection structure, a driving board having a driving driver mounted on the front surface thereof has a driving driver mounted on the front surface thereof, and a driving driver having a driving driver mounted on the front surface of the display substrate having a large number of LED lamps mounted thereon. Connections must be spaced at regular intervals to prevent damage.

FIG. 9A is a sectional view showing an example of a connection structure between a display substrate and a driving substrate, and FIG. 9B is an exploded sectional view showing the connection structure. Each corner of the display substrate 31 on which the LED lamp is mounted is provided with a through-hole 31a, and each of the corners of the drive substrate 32 on which a driver for driving each LED lamp is mounted. Holes 32a are provided respectively. Each through hole 31a of the display substrate 31 and each through hole 32 of the drive substrate 32
a hexagonal nut is disposed as a spacer 33 between the display substrate 31 and the display substrate 31 and the drive substrate 32, respectively.
Are linked by

FIG. 10A is a sectional view showing another example of the connection structure between the display substrate 31 and the drive substrate 32, and FIG.
FIG. 2 is an exploded cross-sectional view of the connection structure. Spacers 35 are arranged between the through holes 31a of the display substrate 31 and the through holes 32a of the drive substrate 32, respectively.
At each end surface of each spacer 35, a locking portion 35 a is inserted through the through hole 31 a of the display substrate 31 and the through hole 32 a of the driving substrate 32 to lock to the front surface of the display substrate 31 and the back surface of the driving substrate 32. Each is provided. Then, each locking portion 35a of the spacer 35 is
The display substrate 31 and the drive substrate 32 are connected to each other by spacers 35 in parallel with each other while being locked to the front surface of the drive substrate 1 and the back surface of the drive substrate 32, respectively.

[0005]

In the substrate connection structure shown in FIG. 9, the heads of the screws 34 project from the front surface of the display substrate 31 and the back surface of the drive substrate 32, respectively. There is a problem that components cannot be mounted and the front surface of the display substrate 31 and the back surface of the drive substrate 32 cannot be used efficiently. Similarly, in the board connection structure shown in FIG. 10, the respective locking portions 35 a of the spacers 35 project from the front surface of the display substrate 31 and the back surface of the drive substrate 32. Cannot mount electronic components, and cannot efficiently use the front surface of the display substrate 31 and the back surface of the drive substrate 32.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide a substrate connecting structure capable of efficiently utilizing the surface of a substrate without reducing the area on the substrate where electronic components are mounted. Is to provide.
Another object of the present invention is to provide a board connecting structure capable of significantly improving the efficiency of connecting work between boards.

[0007]

The substrate connecting structure according to the present invention is a substrate connecting structure in which a pair of substrates arranged in parallel with each other are connected in parallel at a predetermined interval by a plurality of spacers. That each spacer is attached to the first substrate in a state where it is inserted and positioned in a counterbore provided on the surface of the first substrate, and is mechanically attached to the second substrate. Features.

Each spacer is screwed to the second substrate. Each spacer is engaged with a surface of the second substrate through a through hole provided in the second substrate. Each spacer is attached to the first substrate by solder reflow.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view showing an example of an embodiment of a substrate connection structure of the present invention, and FIG. 2 is an exploded sectional view showing the substrate connection structure. This connection structure of substrates is employed in a display unit using a large number of LED (light emitting diode) lamps, and a large number of LEs.
A display substrate 11 on which a D lamp is mounted;
A driving board 12 on which electronic components such as a driving driver for each LED lamp provided in the LED lamp 1 are mounted, is connected by four spacers 13 in a parallel state at a predetermined interval.

A large number of LED lamps are mounted on the surface (upper surface) of the display substrate 11 in a predetermined arrangement. Each of the corners of the display substrate 11 has a through hole having a constant inner diameter and a circular cross section. 11a are provided. On the surface (upper surface) of the drive substrate 12 disposed below the display substrate 11, electronic components such as a driver for driving each LED lamp mounted on the upper surface of the display substrate 11 are mounted. Each corner of the substrate 12 is provided with a counterbore 12 a at a position corresponding to each through-hole 11 a of the display substrate 11. Each counterbore 12a
Has a circular cross section smaller in diameter than each of the through holes 11 a, and is formed at an appropriate depth so as not to penetrate the drive substrate 12.

The display substrate 11 and the drive substrate 12 are connected to each other in parallel at a predetermined interval by four cylindrical spacers 13. FIG. 3A is a perspective view of each spacer 13 from above, and FIG. 3B is a perspective view of each spacer 13 from below. Spacer 13
Has a spacer main body 13a having a columnar shape, and a positioning pin 13b provided so as to protrude downward at the center of the lower surface of the spacer main body 13a. The positioning pin portion 13b is formed in a columnar shape that can be inserted into each counterbore hole 12a provided on the surface of the drive board 12. Further, a female screw portion 13c is provided at the center of the upper surface of the spacer body portion 13a. The spacer 13 having such a configuration is integrally formed of metal.

Each spacer 13 is disposed on a solder pad 14 disposed at each corner of the drive board 12,
With the respective positioning pin portions 13b inserted into the counterbore holes 12a provided at each corner of the drive board 12, the drive board 12 is formed by solder reflow.
Each is attached to the surface. Spacers 13 attached to each corner of drive substrate 12
Each of the corners of the display substrate 11 is abutted on the upper surface of each of the screws, and each of the screws 15 inserted into each of the through holes 11a.
The display substrate 11 is mounted on the upper surface of each spacer 13 by being screwed to the female screw portion 13 c of each spacer 13.

With respect to the driving substrate 12, each spacer 13
Is mounted as follows. As shown in FIG. 4A, first, disk-shaped solder pads 14 are respectively arranged around counterbore holes 12 a provided at each corner of the drive substrate 12. At the center of each solder pad 14,
An opening is provided so that each counterbore 12 a provided in the drive substrate 12 is exposed.

When the solder pads 14 are arranged on the drive board 12, as shown in FIG. 4B, each of the solder pads 1 is moved by a metal mask 21 and a squeegee 22.
Solder paste is applied to the upper surface 4 and the surface of the drive substrate 12 on which electronic components such as a driver for driving the LED lamp are mounted. In this way, when the solder paste is applied to each of the solder pads 14 and a predetermined portion of the surface of the drive board 12, respectively, as shown in FIG. Each of the spacers 13 is mounted by an automatic mounter, and at the same time, an electronic component 16 such as an LED lamp driver is mounted on the surface of the drive substrate 12 where the solder paste is applied, by the automatic mounter. Each spacer 13 is mounted on each solder pad 14 in a state where the respective positioning pin portions 13b are inserted into the respective counterbore holes 12a of the drive substrate 12.

In such a state, the entire drive substrate 12 is put into a reflow furnace and the solder paste is hardened. As a result, the spacers 13 are soldered to the surface of the drive board 12, respectively, and the electronic components 16
Are soldered. Then, on the upper surface of each spacer 13, the display substrate 11 on which a number of LED lamps are mounted,
Each through hole 11a is placed in a state of facing the female screw portion 13c of each spacer 13, and each through hole 1 of the display substrate 11 is placed.
Screws 15 are inserted into the respective spacers 1a.
3 are screwed to the female screw portions 13c, respectively. As a result, the display substrate 11 is connected to the drive substrate 12 via each spacer 13.

In such a board connection structure, the drive board 1
Since the heads and the like of the screws do not protrude from the rear surface (lower surface) of the device 2, electronic components and the like can be mounted on the entire rear surface of the drive substrate 12. FIG. 5 is a cross-sectional view showing another example of the embodiment of the substrate connection structure of the present invention, and FIG. 6 is an exploded cross-sectional view showing the substrate connection structure. In this board connection structure, the display board 11 and the drive board 12 are
Without using the spacer 17 directly
Are linked. Each of the spacers 17 is shown in FIG.
(C) As shown in FIG.
The support 17 d is provided at the center of the upper surface of the support a in the through hole 11 a of the display substrate 11.
A pair of locking portions 17e that pass through the through holes 11a and lock on the surface of the display substrate 11 are provided at the tip of d.
Each locking portion 17e linearly extends obliquely downward from a position facing each other at the tip of the support 17d. Further, a female screw portion 17c is provided at a lower central portion of the upper portion 17a of the spacer body. Spacer body upper part 17a, support part 17d, and each locking part 17
e is integrally formed of a synthetic resin.

Under the spacer main body upper portion 17a, a spacer main body lower portion 17 made of a metal and having a columnar shape is provided.
f is attached. This spacer body lower part 17
f has an outer diameter similar to that of the upper portion 17a of the spacer main body, and has a male screw portion 17g screwed to the female screw portion 17c of the upper portion 17a of the spacer main body at the center of the upper surface thereof. At the center of the lower surface of the lower portion 17f of the spacer body, a positioning pin portion 17b is provided which is inserted into a counterbore hole 12a provided on the surface of the drive substrate 12.

Each of the spacers 17 having such a configuration is attached to a predetermined position on the surface of the drive board 12 by solder reflow in the same manner as in the above embodiment.
Then, the display substrate 11 is pressed against the spacers 17 such that the locking portions 17e of the spacers 17 pass through the respective through holes 11a of the display substrate 11. As a result, the locking portion 17e of each spacer 17 is
Are inserted into the through holes 11a and are locked on the surface of the display substrate 11, and the display substrate 11
Attached to.

In this embodiment, the spacer 17 having the locking portion 17e is configured such that the metal spacer main body lower part 17f is attached to the spacer main body upper part 17a so as to be mounted on the drive board 12 by solder reflow. However, the present invention is not limited to such a configuration. For example, as shown in FIG. 8, the pillars 17d and the respective locking portions 17e are integrally formed of a synthetic resin on the upper surface of the cylindrical spacer body 17h, and the spacers are formed. Main unit 17
The positioning pin portion 17c may be integrally formed of a synthetic resin on the lower surface of h, and the lower portion of the spacer body 17a including the positioning pin portion 17c may be covered with metal plating 17k.

[0020]

The board connecting structure of the present invention has
Since each spacer is attached while being inserted into a counterbore provided on the surface of one substrate, the entire back surface of the substrate can be effectively used for mounting electronic components and the like. Further, since each spacer is attached to the surface of the substrate by solder reflow, the spacer can be attached at the same time when the electronic component is mounted on the substrate, and workability is significantly improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a substrate connection structure of the present invention.

FIG. 2 is an exploded cross-sectional view showing the substrate connection structure.

3A is a perspective view from above of a spacer used in the substrate connecting structure, and FIG. 3B is a perspective view from below of the spacer.

FIGS. 4A to 4C are process diagrams at the time of manufacturing the substrate connection structure.

FIG. 5 is a sectional view showing another example of the embodiment of the substrate connection structure of the present invention.

FIG. 6 is an exploded sectional view showing the substrate connection structure.

7A is a perspective view from above of a spacer used for the substrate connecting structure, FIG. 7B is a perspective view from below of the spacer, and FIG. 7C is a cross-sectional view of the spacer. is there.

FIG. 8 is a cross-sectional view showing another example of a spacer used for the substrate connection structure.

FIG. 9A is a cross-sectional view showing an example of a conventional substrate connection structure, and FIG. 9B is an exploded cross-sectional view of the substrate connection structure.

10A is a cross-sectional view showing another example of a conventional substrate connection structure, and FIG. 10B is an exploded cross-sectional view of the substrate connection structure.

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 display substrate 11a through hole 12 drive substrate 12a through hole 13 spacer 13a spacer body 13b positioning pin 13c female screw 14 solder pad 15 screw 17 spacer 17a spacer body upper part 17b positioning pin 17c female screw 17d pillar 17e Stop 17f Spacer lower body 17g Male thread 17h Spacer main body 17k Metal plating

Claims (4)

[Claims] 1. A pair of substrates arranged in parallel with each other,
A substrate connection structure in which a plurality of spacers are connected in parallel at regular intervals, wherein each spacer is inserted into a counterbore hole provided in the surface of the first substrate and positioned in a first position. A board connection structure, being attached to a board and mechanically attached to a second board. 2. The substrate connecting structure according to claim 1, wherein each spacer is screwed to the second substrate. 3. The substrate connection structure according to claim 1, wherein each spacer is inserted into a through hole provided in the second substrate and is locked on a surface of the second substrate. 4. The board connection structure according to claim 1, wherein each spacer is attached to the first board by solder reflow.