JP2006108213A - Printed wiring board - Google Patents

Printed wiring board Download PDF

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Publication number
JP2006108213A
JP2006108213A JP2004289762A JP2004289762A JP2006108213A JP 2006108213 A JP2006108213 A JP 2006108213A JP 2004289762 A JP2004289762 A JP 2004289762A JP 2004289762 A JP2004289762 A JP 2004289762A JP 2006108213 A JP2006108213 A JP 2006108213A
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JP
Japan
Prior art keywords
substrate
printed wiring
wiring board
board
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004289762A
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Japanese (ja)
Inventor
Mayumi Kono
真由美 河野
Atsushi Kobayashi
淳 小林
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2004289762A priority Critical patent/JP2006108213A/en
Publication of JP2006108213A publication Critical patent/JP2006108213A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board on which a light-emitting diode can be mounted simultaneously with other electronic components, without having especially to provide the mounting time for the diode. <P>SOLUTION: The printed wiring board is provided with the light-emitting diode 7, arranged on a substrate 4 to be split and leads 14 which electrically connect a main flat substrate 1 and the substrate 4 to be split to each other. After the light-emitting diode 7 and the leads 14, arranged on the main flat substrate 1 and the substrate 4 to be split, are mounted on the substrates 1 and 4 by soldering, the substrate 4 is split from the substrate 1 by means of a splitting section 3; and at the same time, the substrate 4 is fixed at a prescribed angle to the substrate 1 via the leads 14. Consequently, the electronic components, arranged on the main flat substrate 1 and the light-emitting diode 7 arranged on the substrate 4 to be split, can be mounted simultaneously on the substrates 1 and 4 through soldering. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光ダイオードを搭載したプリント配線板にかかるものである。   The present invention relates to a printed wiring board on which a light emitting diode is mounted.

従来、プリント配線板上に発光ダイオードを実装する際、発光ダイオードを所定の位置に固定するために、樹脂材等により形成した固定器具を用いていた(例えば、特許文献1参照)。   Conventionally, when a light emitting diode is mounted on a printed wiring board, a fixing device formed of a resin material or the like has been used to fix the light emitting diode at a predetermined position (for example, see Patent Document 1).

図6は、従来のプリント配線板を示す斜視図である。図6に示すように、発光ダイオードは固定器具10の上部10aと下部10bとに挟持されている。プリント配線板11には固定用孔部12とリード用孔部13が形成されている。固定器具10の脚部が固定用孔部に挿入されると共に、発光ダイオード7のリード部14がリード用孔部13に挿入され、それぞれプリント配線板11に固定される。
実開平5−18047号公報
FIG. 6 is a perspective view showing a conventional printed wiring board. As shown in FIG. 6, the light emitting diode is sandwiched between the upper part 10 a and the lower part 10 b of the fixing device 10. The printed wiring board 11 is formed with a fixing hole 12 and a lead hole 13. The leg portion of the fixing device 10 is inserted into the fixing hole portion, and the lead portion 14 of the light emitting diode 7 is inserted into the lead hole portion 13 and fixed to the printed wiring board 11.
Japanese Utility Model Publication No. 5-18047

しかしながら、上記従来技術では、発光ダイオードを固定器具に取り付け後、プリント配線板へ実装をおこなっていたため、ほかの電子部品と同時に実装できないことから、電子部品の実装時間に発光ダイオード実装の時間が余分に必要となるという課題があった。   However, in the above prior art, since the light emitting diode is mounted on the printed wiring board after being mounted on the fixture, it cannot be mounted at the same time as other electronic components. There was a problem that was necessary.

本発明は、前記従来の課題を解決するもので、発光ダイオードだけの実装時間を特別に設ける必要がない、他の電子部品と同時に実装することが可能なプリント配線板を提供することを目的とする。   SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a printed wiring board that can be mounted simultaneously with other electronic components, and does not require a special mounting time for only a light emitting diode. To do.

前記従来の課題を解決するために、本発明のプリント配線板は、電子部品が配される主平面基板と、前記主平面基板に一体に設けられ前記主平面基板に対して分割部で分割可能な分割用基板とを有するプリント配線板であって、前記分割用基板に配置された発光ダイオードと、前記主平面基板にレジスト加工未処理のパターンを備え、これによって、主平面基板に配された電子部品と、分割用基板に配された発光ダイオードとを同時に半田実装を行う。   In order to solve the above-described conventional problems, the printed wiring board of the present invention can be divided into a main plane board on which electronic components are arranged and a main plane board that is provided integrally with the main plane board by a dividing portion. A printed wiring board having a substrate for dividing, comprising: a light emitting diode disposed on the substrate for dividing; and a pattern not subjected to resist processing on the main plane substrate, thereby being arranged on the main plane substrate. The electronic component and the light emitting diode arranged on the dividing substrate are simultaneously solder-mounted.

本発明のプリント配線板は、主平面基板に配された電子部品と、分割用基板に配された発光ダイオードとを同時に半田実装することができる。   In the printed wiring board of the present invention, the electronic component disposed on the main planar substrate and the light emitting diode disposed on the dividing substrate can be simultaneously solder-mounted.

第1の発明は、電子部品が配される主平面基板と、前記主平面基板に一体に設けられ前記主平面基板に対して分割部で分割可能な分割用基板とを有するプリント配線板において、発光ダイオードを配された前記分割用基板に、前記主平面基板に配置された穴に前記分割用基板とに配置された凸部を挿入して、所定の角度に固定するものである。これによって、主平面基板に配された電子部品と、分割用基板に配された発光ダイオードとを同時に半田実装を行う。   1st invention is a printed wiring board which has the main plane board by which an electronic component is arranged, and the substrate for division which is provided in one with the main plane board, and can be divided by a division part to the main plane board, A convex portion arranged on the division substrate is inserted into a hole arranged on the main plane substrate, and fixed to a predetermined angle on the division substrate on which the light emitting diodes are arranged. As a result, the electronic components arranged on the main planar substrate and the light emitting diodes arranged on the dividing substrate are simultaneously solder-mounted.

第2の発明は、前記第1の発明で記載した主平面基板と、分割用基板を電気的に接続するためにレジスト未処理のパターンを設ける形態となる。   The second invention is a form in which a resist-unprocessed pattern is provided to electrically connect the main planar substrate described in the first invention and the dividing substrate.

以下、本発明の実施の形態について、図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(実施の形態1)
図1は、本発明の実施の形態1におけるプリント配線板の構成を示す斜視図である。図2、図3は、本発明の実施の形態1におけるプリント配線板の使用状況を示す模式図である。
(Embodiment 1)
FIG. 1 is a perspective view showing a configuration of a printed wiring board according to Embodiment 1 of the present invention. 2 and 3 are schematic diagrams showing the usage state of the printed wiring board according to Embodiment 1 of the present invention.

図1において、1は電子部品が配され、さらに基板上に凹穴2を設けた主平面基板であり、4は主平面基板1に一体に設けられ主平面基板1に対して分割部3で分割可能な分割用基板である。6は主平面基板1と分割用基板4、凸部5とを有するプリント配線板である。分割部3はスリットおよびミシン目から構成されている。図2において、7は分割用基板4に配置された発光ダイオードであり、1に配置された電子部品と同時に発光ダイオード7も半田実装されるものである。また、図3では、図1で示した分割部3で主平面基板1と分割基板4で、主平面基板1の凹穴2に凸部5を挿入したことを示す。これにより、分割用基板4および発光ダイオード7を主平面基板1に対して所定の角度に固定するものである。   In FIG. 1, reference numeral 1 denotes a main plane substrate in which electronic components are arranged and further provided with a concave hole 2 on the substrate. It is a dividing substrate that can be divided. Reference numeral 6 denotes a printed wiring board having the main plane substrate 1, the dividing substrate 4, and the convex portion 5. The division part 3 is comprised from the slit and the perforation. In FIG. 2, reference numeral 7 denotes a light emitting diode arranged on the dividing substrate 4, and the light emitting diode 7 is also solder-mounted at the same time as the electronic component arranged in 1. 3 shows that the projection 5 is inserted into the concave hole 2 of the main plane substrate 1 in the main plane substrate 1 and the division substrate 4 in the division section 3 shown in FIG. As a result, the dividing substrate 4 and the light emitting diode 7 are fixed at a predetermined angle with respect to the main planar substrate 1.

(実施の形態2)
図4は、本発明の実施の形態2におけるプリント配線板の構成を示す斜視図であり、図5は、本発明の実施の形態2におけるプリント配線板の使用状況を示す模式図である。
(Embodiment 2)
FIG. 4 is a perspective view showing the configuration of the printed wiring board according to the second embodiment of the present invention, and FIG. 5 is a schematic diagram showing the usage state of the printed wiring board according to the second embodiment of the present invention.

図4においては、凹凸形状分割部8から構成された主平面基板1と、分割用基板4を有するプリント配線板6を示す。凹凸形状に分割した主平面基板1と分割用基板4を嵌合させている。これにより、分割用基板4および発光ダイオード7を主平面板1に対して所定の角度に固定するものである。   In FIG. 4, a printed wiring board 6 having a main plane substrate 1 constituted by the uneven shape dividing portion 8 and a dividing substrate 4 is shown. The main flat substrate 1 and the dividing substrate 4 which are divided into irregular shapes are fitted. Thus, the dividing substrate 4 and the light emitting diode 7 are fixed to the main flat plate 1 at a predetermined angle.

さらに図5において、主平面基板1と分割用基板4をレジスト未処理のパターン9を介して電気的接続が可能となり、専用の固定器具を装着する必要がないため、固定器具が不要となる。   Further, in FIG. 5, the main planar substrate 1 and the dividing substrate 4 can be electrically connected via the untreated resist pattern 9, and it is not necessary to attach a dedicated fixing device, so that the fixing device is not necessary.

以上のように、本実施の形態によると、発光ダイオード7に固定器具を装着する必要がないため、主平面基板に実装された電子部品と同時に半田実装を行うことが可能となる。   As described above, according to the present embodiment, since it is not necessary to attach a fixing device to the light emitting diode 7, it is possible to perform solder mounting simultaneously with the electronic components mounted on the main planar substrate.

以上のように、本発明にかかるプリント配線板は、主平面基板に配された電子部品と、分割用基板に配された発光ダイオードとを同時に半田実装することが可能となるので、発光ダイオードを搭載したプリント配線板を装着可能な電子機器に適用できる。   As described above, the printed wiring board according to the present invention can simultaneously solder-mount the electronic components arranged on the main planar substrate and the light emitting diodes arranged on the dividing substrate. It can be applied to electronic devices that can be equipped with a mounted printed wiring board.

本発明の実施の形態1におけるプリント配線板を示す斜視図The perspective view which shows the printed wiring board in Embodiment 1 of this invention 本発明の実施の形態1におけるプリント配線板の使用状況を示す模式図The schematic diagram which shows the use condition of the printed wiring board in Embodiment 1 of this invention 本発明の実施の形態1におけるプリント配線板の使用状況を示す他の模式図The other schematic diagram which shows the use condition of the printed wiring board in Embodiment 1 of this invention 本発明の実施の形態2におけるプリント配線板を示す斜視図The perspective view which shows the printed wiring board in Embodiment 2 of this invention. 本発明の実施の形態2におけるプリント配線板の使用状況を示す模式図The schematic diagram which shows the use condition of the printed wiring board in Embodiment 2 of this invention 従来のプリント配線板を示す斜視図A perspective view showing a conventional printed wiring board

符号の説明Explanation of symbols

1 主平面基板
2 凹穴
3 分割部
4 分割用基板
5 凸部
6 プリント配線板
7 発光ダイオード
8 凹凸形状スリット
9 レジスト未処理パターン
10 固定器具
10a 固定器具上部
10b 固定器具下部
11 プリント配線板
12 固定用孔部
13 リード用孔部
14 リード部
DESCRIPTION OF SYMBOLS 1 Main plane board | substrate 2 Concave hole 3 Dividing part 4 Dividing board 5 Convex part 6 Printed wiring board 7 Light emitting diode 8 Uneven shape slit 9 Resist unprocessed pattern 10 Fixing tool 10a Fixing tool upper part 10b Fixing tool lower part 11 Printed wiring board 12 Fixing Hole 13 lead hole 14 lead

Claims (2)

電子部品が配される主平面基板と、前記主平面基板に一体に設けられ、前記主平面基板に対して分割部で分割可能な分割用基板とを有するプリント配線板であって、前記主平面基板に穴を設け、前記分割用基板の凸部を前記主平面基板の穴に挿入し、前記分割用基板に配置された発光ダイオードを、前記主平面基板と所定の角度に固定することを特徴とする、プリント配線板。 A printed wiring board having a main plane board on which electronic components are arranged, and a dividing board that is provided integrally with the main plane board and can be divided by a dividing portion with respect to the main plane board, A hole is provided in the substrate, the convex portion of the dividing substrate is inserted into the hole of the main planar substrate, and the light emitting diode disposed on the dividing substrate is fixed to the main planar substrate at a predetermined angle. A printed wiring board. 主平面基板と分割基板にレジスト処理をしていないパターンを備え、前記パターンを介して前記主平面基板と前記分割基板を電気的に接続することを特徴とする、請求項1記載のプリント配線板。 2. The printed wiring board according to claim 1, wherein the main plane board and the divided board are provided with a pattern that is not subjected to resist treatment, and the main plane board and the divided board are electrically connected through the pattern. .
JP2004289762A 2004-10-01 2004-10-01 Printed wiring board Pending JP2006108213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004289762A JP2006108213A (en) 2004-10-01 2004-10-01 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004289762A JP2006108213A (en) 2004-10-01 2004-10-01 Printed wiring board

Publications (1)

Publication Number Publication Date
JP2006108213A true JP2006108213A (en) 2006-04-20

Family

ID=36377607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004289762A Pending JP2006108213A (en) 2004-10-01 2004-10-01 Printed wiring board

Country Status (1)

Country Link
JP (1) JP2006108213A (en)

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