JPH0210791A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH0210791A JPH0210791A JP16141888A JP16141888A JPH0210791A JP H0210791 A JPH0210791 A JP H0210791A JP 16141888 A JP16141888 A JP 16141888A JP 16141888 A JP16141888 A JP 16141888A JP H0210791 A JPH0210791 A JP H0210791A
- Authority
- JP
- Japan
- Prior art keywords
- washer
- printed
- solder
- pattern
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 description 4
- 230000012447 hatching Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリントパターンをネジ等を使用して筐体に接
続するようにしたプリント板に関し、特にネジとの接触
状態を改良したプリント板に関す〔従来の技術〕
電子機器に使用されるプリント板では、プリント板のア
ースを筐体に接続するために、プリント板の取り付はネ
ジをアースパターンに接触させることが広く行われてい
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed board in which a printed pattern is connected to a housing using screws, etc., and particularly to a printed board with improved contact with the screws. Related [Prior Art] In printed boards used in electronic devices, in order to connect the ground of the printed board to the casing, it is widely practiced to attach the printed board by bringing screws into contact with the ground pattern.
第３図にアースパターンを設けたプリント板の部分図を
示す。図において、■はプリント基板であり、２はプリ
ントパターンであり、アースパターンを構成している。FIG. 3 shows a partial view of a printed board provided with a ground pattern. In the figure, ■ is a printed circuit board, and 2 is a printed pattern, which constitutes a ground pattern.
プリントパターン２は右上がりのハツチングで表示して
あり、その中心のプリント基板にネジ孔３が設けられて
いる。４はソルダレジストであり、右下がりのハツチン
グで示している。図に示すように、プリントパターン２
にはソルダレジスト４が塗布されていない。勿論、これ
はプリントパターン２を、プリント板の筐体への取り付
はネジに接触させるためである。The printed pattern 2 is indicated by hatching upward to the right, and a screw hole 3 is provided in the printed circuit board at the center thereof. 4 is a solder resist, which is indicated by hatching downward to the right. As shown in the figure, print pattern 2
The solder resist 4 is not applied to. Of course, this is because the printed pattern 2 is brought into contact with the screws when attaching the printed board to the housing.
しかし、第３図のプリント板で半田ディンプを行うと、
ソルダレジストがない部分は面積が広く半田は均一に付
着しない。第４図に半田デイツプを行ったプリント板の
断面図を示す。図において、■はプリント基板、２はプ
リントパターン、４はプリントパターン２上に付着した
半田、５はプリント板を筐体に取り付けるためのネジ、
６はワッシャー、７はスプリングワッシャー、８は筐体
にとりつけるスタンドである。勿論、半田デイツプはプ
リントパターン側を下にして行われる。However, if you perform solder dipping on the printed board shown in Figure 3,
The area without solder resist is large and the solder does not adhere uniformly. FIG. 4 shows a cross-sectional view of a printed board with solder dip. In the figure, ■ is a printed circuit board, 2 is a printed pattern, 4 is solder attached to the printed pattern 2, 5 is a screw for attaching the printed board to the housing,
6 is a washer, 7 is a spring washer, and 8 is a stand that is attached to the housing. Of course, solder dipping is performed with the printed pattern side facing down.
図に示すように、プリントパターン２上の半田４が不均
一に付着するために、ワッシャー６が傾き、ネジ５、ワ
ッシャー６、スプリングワッシャー７は一部分で接触す
ることになる。As shown in the figure, since the solder 4 on the printed pattern 2 adheres non-uniformly, the washer 6 is tilted, and the screw 5, washer 6, and spring washer 7 come into contact with each other at a portion.
ネジ５を締め付けたときに、スプリングワッシャー７の
切断部７ａが開いたままで、ネジ５あるいはワッシャー
６と平面的に接触せず、スプリングワッシャー７はその
機能を充分に発揮できず、振動等によりネジ５がゆるん
でしまい、プリントパターン２とスタッド８との接続が
不充分となる可能性がある。When the screw 5 is tightened, the cut portion 7a of the spring washer 7 remains open and does not make plane contact with the screw 5 or the washer 6, and the spring washer 7 cannot fully perform its function, causing the screw to tighten due to vibration etc. 5 may become loose, and the connection between the printed pattern 2 and the stud 8 may become insufficient.
第５図に従来の他のプリント板の例を示す。図において
、１はプリント基板、２はプリントパターンであり、右
上がりのハツチングで示している。FIG. 5 shows an example of another conventional printed board. In the figure, 1 is a printed circuit board and 2 is a printed pattern, which are indicated by hatching upward to the right.
４はソルダレジストを示し、右下がりのハツチングで塗
布されている範囲を示している。３はネジ孔である。こ
こでは、半田が付着する面を小さくするために、プリン
トパターン２上もソルダレジスト４を設け、４ａに示す
ように、プリントパターン２の円周上に円形のソルダレ
ジスト４のない部分を設ける。4 represents the solder resist, and the area where it is coated is shown by hatching downward to the right. 3 is a screw hole. Here, in order to reduce the surface to which solder is attached, a solder resist 4 is also provided on the printed pattern 2, and a circular portion without the solder resist 4 is provided on the circumference of the printed pattern 2, as shown in 4a.
第６図に第５図のプリント板の半田デイツプ後の断面を
示す。勿論、半田デイツプはプリントパターン側を下に
して行われる。図において、１はプリント基板、２はプ
リントパターン、３は半田、４はソルダレジストである
。このプリント板では第６図に示すように、半田３がソ
ルダレジスト４とプリントパターン２との間に入り、半
田が不均一になるのが避けられない。FIG. 6 shows a cross section of the printed circuit board shown in FIG. 5 after being soldered. Of course, solder dipping is performed with the printed pattern side facing down. In the figure, 1 is a printed circuit board, 2 is a printed pattern, 3 is solder, and 4 is a solder resist. In this printed board, as shown in FIG. 6, the solder 3 enters between the solder resist 4 and the printed pattern 2, and it is inevitable that the solder becomes non-uniform.
本発明はこのような点に鑑みてなされたものであり、ネ
ジとの接触状態を改良したプリント板を提供することを
目的とする。The present invention has been made in view of these points, and an object of the present invention is to provide a printed board with improved contact with screws.
本発明では上記課題を解決するために、プリントパター
ンをネジ等を使用して筐体に接続するようにしたプリン
ト板において、プリントパターンのワッシャーが接触す
る部分をパッド状にして、複数に分割したことを特徴と
するプリント板が、
提供される。In the present invention, in order to solve the above problem, in a printed board in which the printed pattern is connected to the housing using screws, etc., the part of the printed pattern that contacts the washer is made into a pad shape and divided into multiple pieces. A printed board characterized by the following is provided.
ワッシャーが接触するプリントパターンをパ・ノド状に
し、複数に分割することにより、パ・ノド１個に付着す
る半田の量を抑え、全体的に均一になるようにする。By making the printed pattern that the washer comes into contact with into a pa/knot shape and dividing it into a plurality of parts, the amount of solder adhering to each pa/knot is suppressed and the amount of solder is uniform throughout.
以下、本発明の一実施例を図面に基づいて説明する。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図は本発明の一実施例であるプリント板の部分図で
ある。図において、１はプリント基板である。２ａ〜２
１１はパッド状のプリントパターンであり、取り付は用
のネジのワッシャーと接触するように、円周状に設けて
あり、このプリントパターンをアースパターンとして、
プリント板のアースを筐体に落とすのに使用する。プリ
ントパターン２ａ等はプリント基板上の銅箔をエツチン
グ工程で、必要なパターンのみを残すことによって、生
成される。FIG. 1 is a partial view of a printed board that is an embodiment of the present invention. In the figure, 1 is a printed circuit board. 2a-2
11 is a pad-shaped printed pattern, which is provided in a circumferential manner so as to make contact with the washer of the screw for mounting, and this printed pattern is used as a grounding pattern.
Used to ground the printed circuit board to the housing. The printed patterns 2a and the like are generated by etching the copper foil on the printed circuit board, leaving only the necessary patterns.
第２図に本発明のプリント板の断面図を示す。FIG. 2 shows a sectional view of the printed board of the present invention.
■はプリント基板、２はプリントパターン、４は半田デ
イツプで付着した半田、５はネジ、６はワッシャー、７
はスプリングワッシャー、８はスタッドである。ここで
、プリントパターン２はアースパターンであり、プリン
トパターン２をネジ５を経由して、スタッド８で図示さ
れていない筐体に落としている。勿論、半田デイツプは
第２図のプリントパターン側を下にして行われる。図に
示すように、本発明によれば、半田４が均一にプリント
パターン２に付着し、ワッシャー６と半田４との接触が
均一に行われるため、ネジ締めを完全に行うことができ
る。■ is a printed circuit board, 2 is a printed pattern, 4 is solder attached with a solder dip, 5 is a screw, 6 is a washer, 7
is a spring washer, and 8 is a stud. Here, the printed pattern 2 is a ground pattern, and the printed pattern 2 is dropped into a housing (not shown) via a screw 5 and a stud 8. Of course, solder dipping is performed with the printed pattern side of FIG. 2 facing down. As shown in the figure, according to the present invention, the solder 4 is uniformly attached to the printed pattern 2, and the washer 6 and the solder 4 are brought into uniform contact, so that screw tightening can be performed completely.
以上説明したように本発明では、プリントパターンをバ
ッド状にし、これをネジ孔の周囲にほぼ均等に配置する
ことで、留めネジのワッシャーとプリントパターンに付
着した半田との接触が均一になるため、ワッシャーがイ
頃くことがなくなる。As explained above, in the present invention, the printed pattern is made into a pad shape and is arranged almost evenly around the screw hole, so that the washer of the fixing screw and the solder attached to the printed pattern come into uniform contact. , the washer will no longer get dirty.
従って、ネジ締めが完全に行えるため、振動等によりネ
ジがゆるむこともなく、充分な接続を確保できる。Therefore, since the screws can be completely tightened, the screws will not loosen due to vibrations, etc., and a sufficient connection can be ensured.
第１図は本発明の一実施例であるプリント板の部分図、
第２図は本発明のプリント板の断面図、第３図は従来の
アースパターンを設けたプリント板の部分図、
第４図は自動半田槽にかけた従来のプリント板の断面図
、
第５図は従来の他のプリント板の部分図、第６図は第５
図のプリント板の半田デイツプ後の断面である。
１−・−・・・・−・−・・・プリント基讐反２−・−
一−−−−−−−−−−プリントパターン３−−−・・
−・−・・−・・ネジ孔
４−・−・・・−・−半田
５−・−−一−−−−−−−−ネジ
６−・−−−−−−−−・・・・ワッシャー７−−−−
−・−ｍ−−−・−スプリングワッシャー８・・−・・
−・・−・−スタッド
特許出願人 ファナック株式会社
代理人 弁理士 服部毅巖
第１図
第２図
第４図FIG. 1 is a partial view of a printed board according to an embodiment of the present invention, FIG. 2 is a sectional view of a printed board of the present invention, FIG. 3 is a partial view of a printed board provided with a conventional ground pattern, and FIG. The figure is a cross-sectional view of a conventional printed board placed in an automatic soldering tank, Figure 5 is a partial view of another conventional printed board, and Figure 6 is a cross-sectional view of a conventional printed board.
This is a cross section of the printed board shown in the figure after being soldered. 1-・-・・−・−・Print base 2−・−
1---------Print pattern 3------...
−・−・・−・・Screw hole 4−・−・−・−Solder 5−・−−1−−−−−−−−−Screw 6−・−−−−−−−−−・・・Washer 7---
−・−m−−−・−Spring washer 8・・−・・
−・・−・−Stud patent applicant Fanuc Co., Ltd. agent Patent attorney Takeshi Hattori Figure 1 Figure 2 Figure 4
Claims (2)
するようにしたプリント板において、プリントパターン
のワッシャーが接触する部分をパッド状にして、複数に
分割したことを特徴とするプリント板。(1) A printed board in which a printed pattern is connected to a housing using screws or the like, characterized in that the portion of the printed pattern that contacts the washer is made into a pad shape and divided into a plurality of parts.
したことを特徴とする特許請求の範囲第１項記載のプリ
ント板。(2) The printed board according to claim 1, wherein the pad is arranged on a circumference that the washer comes into contact with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16141888A JPH0210791A (en) | 1988-06-29 | 1988-06-29 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16141888A JPH0210791A (en) | 1988-06-29 | 1988-06-29 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210791A true JPH0210791A (en) | 1990-01-16 |
Family
ID=15734722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16141888A Pending JPH0210791A (en) | 1988-06-29 | 1988-06-29 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210791A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487671U (en) * | 1990-11-30 | 1992-07-30 | ||
| JPH0555572U (en) * | 1991-12-24 | 1993-07-23 | 松下電工株式会社 | Contact for shield |
| JP2008135571A (en) * | 2006-11-28 | 2008-06-12 | Ricoh Co Ltd | Printed board |
| US8193453B2 (en) | 2008-09-10 | 2012-06-05 | Kabushiki Kaisha Toshiba | Electronic apparatus and printed wiring board |
| US8432702B2 (en) | 2008-09-10 | 2013-04-30 | Kabushiki Kaisha Toshiba | Electronic apparatus and printed wiring board |
| JP2014166112A (en) * | 2013-02-27 | 2014-09-08 | Minebea Co Ltd | Brushless motor |
| US9908343B2 (en) | 2012-12-15 | 2018-03-06 | Hewlett-Packard Development Company, L.P. | Control of printing systems to apply treatment |
| JP2019204852A (en) * | 2018-05-22 | 2019-11-28 | ファナック株式会社 | Printed circuit board |
-
1988
- 1988-06-29 JP JP16141888A patent/JPH0210791A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0487671U (en) * | 1990-11-30 | 1992-07-30 | ||
| JPH0555572U (en) * | 1991-12-24 | 1993-07-23 | 松下電工株式会社 | Contact for shield |
| JP2008135571A (en) * | 2006-11-28 | 2008-06-12 | Ricoh Co Ltd | Printed board |
| US8193453B2 (en) | 2008-09-10 | 2012-06-05 | Kabushiki Kaisha Toshiba | Electronic apparatus and printed wiring board |
| US8432702B2 (en) | 2008-09-10 | 2013-04-30 | Kabushiki Kaisha Toshiba | Electronic apparatus and printed wiring board |
| US9908343B2 (en) | 2012-12-15 | 2018-03-06 | Hewlett-Packard Development Company, L.P. | Control of printing systems to apply treatment |
| US10661580B2 (en) | 2012-12-15 | 2020-05-26 | Hewlett-Packard Development Company, L.P. | Control of printing systems to apply treatment |
| JP2014166112A (en) * | 2013-02-27 | 2014-09-08 | Minebea Co Ltd | Brushless motor |
| JP2019204852A (en) * | 2018-05-22 | 2019-11-28 | ファナック株式会社 | Printed circuit board |
| CN110519908A (en) * | 2018-05-22 | 2019-11-29 | 发那科株式会社 | Printed circuit board |
| US10973130B2 (en) | 2018-05-22 | 2021-04-06 | Fanuc Corporation | Printed wiring board |
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