JPH1140645A - Cluster tool type paper sheet processor having ultrasonic floating carrying mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cluster tool type paper sheet processor, having an ultrasonic floating carrying mechanism with superior sealability whose structure can be simplified and miniaturized in which particles being dust will not be generated by removing a rotating part or a contact or sliding part, and the degree of vacuum in a load lock chamber will not be deteriorated. SOLUTION: An ultrasonic floating carrying mechanism, constituted of a receiving position deciding piece 702a, an ultrasonic oscillator 704a, and an ultrasonic oscillating means for oscillating the ultrasonic oscillator is provided in a load lock chamber 73 , and the frequencies and phase of high-frequency oscillation currents impressed to the ultrasonic oscillating means are controlled in a state such that the load lock chamber 73 is filled with N2 gas. Thus, ultrasonic oscillation constituted of progressive waves is generated in the ultrasonic oscillator 704a, and an object W to be processed placed on the receiving position deciding piece is floatingly-carried to a processor 4 or a center robot 1 on the ultrasonic oscillation constituted of the progressive waves.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cluster tool type single-wafer processing apparatus provided in an ultrasonic levitation transport mechanism.

[0002]

2. Description of the Related Art A multi-chamber type processing apparatus called a cluster tool is known as a processing apparatus for single-wafer type semiconductor products such as wafers and liquid crystal (LCD) glass. This cluster tool type single-wafer processing equipment is a system that enables equipment of different equipment manufacturers, connection of different processes, and integration of process modules unique to each company. A plurality of processing devices that are in charge of different processes are arranged around the device, and each of the processing devices and the center robot are connected to each other by a vacuum spare chamber called a load lock chamber. A processing object such as a wafer is taken in and out of the apparatus, and each processing is performed in a predetermined atmosphere without exposing the processing object to outside air.

FIG. 6 shows a configuration example of the cluster tool type single wafer processing apparatus. FIG. 6 is a schematic plan view of a cluster tool type single wafer processing apparatus for realizing a series of processing of cleaning, drying, and thin film formation of a wafer.
A center robot 1 having a vacuum chamber structure serving as a transfer relay base is arranged in the center of the apparatus, and a loader 2 for loading a wafer, an unloader 3 for unloading a wafer, and cleaning / drying of a wafer are provided around the center robot 1. Spin dryer 4 for forming desired thin film on wafer surface C
VD (Chemical Vapor Deposition) device 5 _1, 5 _2, together with arranging the necessary equipment for a series of processing such stocker 6 for temporarily storing the wafer, in order to block the outside air ingress, should the center robot 1 Do processor lock chamber _71, called the load lock chamber between ~
7 is obtained by connecting each with _4.

[0004] The load lock chamber 7 _{1-7 4,}
A transport mechanism for transporting a wafer as an object to be processed is provided therein, and shutter-type valves 8a and 8b for airtightly separating the inside of the chamber are provided on a partition wall portion between adjacent apparatuses. , These two valves 8a, 8
By controlling the opening and closing of b in synchronism with the feed control of the transfer mechanism, the wafer can be freely taken in and out while airtightness in the apparatus is maintained.

The operation of the above-described apparatus will be described by taking, for example, a case where a wafer is sent from the center robot 1 to the spin dryer 4. First, a load lock chamber 7 connecting the center robot 1 and the spin dryer 4 is described. ₃ of the left and right valves 8a, closed 8b, a vacuum load lock chamber 7 ₃ by not to the illustrated vacuum pump. Then, opening the valve 8a of the vacuum state since the load lock chamber 7 ₃ of the center robot 1 side, put the wafer on the center robot 1 on the conveying mechanism of the load lock chamber 7 _3.

Next, the valve 8a on the center robot 1 side
After closing the opening the spin dryer apparatus 4 side of the valve 8b, feeding the wafer on a spin dryer apparatus 4 by the transport mechanism of the load lock chamber 7 _3. The spin dryer 4 spin-cleans and spin-drys the fed wafer according to a predetermined procedure, and then returns the processed wafer to the center robot 1 again by a transport operation reverse to the above. In this way, various processes can be executed without exposing the wafer to the outside air at all.

[0007]

However, in the case of the conventional cluster tool type single wafer processing apparatus described above, the wafer transfer mechanism incorporated in each load lock chamber uses a transfer table on which the wafer is mounted by rotating the transfer table. In most cases, the feed screw type reciprocates, and the robot type reciprocates a robot driven by a motor on rollers and guide rails, and the structure is complicated and it is difficult to reduce the size. In addition, since there are rotating parts and contact / sliding parts, particles that become contaminants are likely to be generated, and these particles adhere to the surface of the substrate and contaminate the substrate, and furthermore, a rotating shaft part penetrating inside and outside the device. There is a problem that air is likely to enter the chamber due to poor sealing or deterioration of the device, which hinders securing a degree of vacuum in the apparatus. In the case of the robot type, it is necessary to design a robot that does not interfere with the center robot, but there is a problem that it is difficult to design such a robot.

The present invention has been made to solve the above problems, and has a simple structure and a small size.
In addition, since there are no rotating parts or contact / sliding parts, there is no generation of particles that become contaminants, and there is no decrease in the degree of vacuum in the load lock chamber. It is an object of the present invention to provide a cluster tool type single-wafer processing apparatus provided with:

[0009]

According to a first aspect of the present invention, in a cluster tool type single wafer processing apparatus, a load lock chamber for connecting a center robot to a desired processing apparatus is provided. A pair of left and right receiving positioning pieces for mounting the processing object, which are connected and parallel to each other by connecting the valve on the center robot side and the valve on the processing apparatus side, and are positioned inside the pair of left and right receiving positioning pieces. A pair of left and right ultrasonic vibrating plates arranged in parallel at a position slightly lower than the receiving positioning piece, and respectively connected to appropriate positions on the lower surfaces of the pair of left and right ultrasonic vibrating plates; and An ultrasonic levitation transport mechanism comprising a plurality of ultrasonic excitation means for performing longitudinal vibration in a direction perpendicular to the surface of the plate is provided, and the load lock chamber is filled with an inert gas. In the state, the ultrasonic vibration composed of a traveling wave is caused on the pair of left and right ultrasonic vibration plates by controlling the frequency and phase of the high-frequency excitation current applied to the ultrasonic excitation means, and on the receiving positioning piece. The placed processing object is floated and conveyed toward a processing device or a center robot by being placed on the ultrasonic vibration composed of the traveling wave.

According to a second aspect of the present invention, in the processing apparatus of the first aspect, the ultrasonic exciting means is connected to the ultrasonic vibrator, and one end is connected to a vibration end face of the ultrasonic vibrator. Further, the other end is constituted by an ultrasonic horn connected to the lower surface of the ultrasonic vibration plate, and the ultrasonic horn is air-tightly fixed to a lower surface of the load lock chamber by a flange and a seal material at an appropriate position thereof. It is characterized by the following.

[0011]

When a processing object such as a wafer or LCD glass is sent from the center robot into the load lock chamber, the processing object is first placed on a pair of left and right receiving positioning pieces. After the load lock chamber is filled with an inert gas such as N ₂ gas, a high frequency excitation current having a controlled frequency and phase is applied to the ultrasonic excitation means, so that the left and right ultrasonic vibration plates travel to the pair of left and right ultrasonic vibration plates. Ultrasonic vibration composed of waves is generated, and the object to be processed placed on the receiving positioning piece is placed on the ultrasonic vibration composed of the traveling wave and levitated and conveyed toward a processing apparatus or a center robot.

As described above, in the present invention, since the wafer is levitated and conveyed by the ultrasonic type levitating and conveying mechanism having a simple structure, the size of the conveying mechanism can be reduced. In addition, since the object to be processed is carried by ultrasonic levitation conveyance, there is no rotating part or contact / sliding part for conveyance, and no particles serving as contaminants are generated. Also, since the ultrasonic excitation means is fixed to the lower bottom surface of the load lock chamber via the flange and the seal member, perfect airtightness can be maintained, and the degree of vacuum in the load lock chamber is reduced as in the conventional case. Such a thing disappears.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this embodiment,
Shows an example of a case incorporating the ultrasonic levitation transport mechanism of the present invention to spin dryer apparatus 4 and the load lock chamber 7 ₃ portions in FIG. 6, substantially示縦sectional view of FIG. 1 is partial, 2 FIG. 3 is a schematic plan view of the portion, FIG. 3 is an explanatory diagram of a positional relationship between the ultrasonic vibration plate and the receiving positioning piece, and FIG. 4 is an explanatory diagram of a transport operation of the ultrasonic levitation transport mechanism. In each drawing, the same parts as those in FIG. 6 described above are denoted by the same reference numerals.

As shown in FIGS. 1 and 2, the center robot 1 has a fork 101 that can rotate, expand and contract, and move up and down for carrying a wafer W.
01 on the pivot carrying the wafer W, by stretching and vertical movement, the load lock chamber 7 ₁ to _7-4, CD
The V devices 5 ₁ and 5 ₂ and the stocker 6 (see FIG. 6) are configured so that the wafer W can be freely taken in and out.

[0015] The load lock chamber 7 ₃ is provided with a center robot 1 side of the partition wall portion 701a and the spin dryer apparatus 4 side of the partition wall portions each valve 8a and 8b to 701b, which controls the opening and closing of the two valves 8a, 8b The center robot 1 and the spin dryer 4
It is configured to be able to freely open or shut off between the two.

[0016] The load lock chamber 7 _3, together with the receiving and mounting the wafer W sent from the center robot 1 side or spin dryer apparatus 4 side, pair which also serves as a side guide at the time of wafer levitating conveyor The receiving positioning pieces 702a and 702b are fixedly connected to each other in parallel at predetermined intervals, connecting the valves 8a and 8b. The upper surface of the pair of receiving positioning pieces 702a and 702b has a concave step 703a which is slightly larger than the outer diameter of the wafer W and whose concave portion is closed in an arc shape on the center robot 1 side. , 703b are formed and the wafer W
Is stably placed on the receiving and positioning pieces 702a and 702b by being placed in the steps 703a and 703b.

The pair of receiving positioning pieces 702a,
Inside the 702b, a pair of ultrasonic vibration plates 704a and 704b are arranged at a position slightly lower than the positioning piece in parallel with the positioning piece. One ultrasonic vibration plate 7
Reference numeral 04a denotes an ultrasonic horn 706a, 706b which amplifies and transmits ultrasonic vibrations of the ultrasonic vibrators 705a, 705b at two places near both ends on the lower surface thereof by welding or screwing with an appropriate method. It is fixed. Also,
The other ultrasonic vibrating plate 704b also has ultrasonic vibrators 705c and 705d
Ultrasonic horn 706 that amplifies and transmits ultrasonic vibrations
a, 706b are fixed to the distal end portion by an appropriate method such as welding or screwing. Ultrasonic horns 706a to 706
d is a flange 7 at a position serving as a node of ultrasonic vibration.
It is hermetically fixed to the lower bottom portion of the load lock chamber 7 ₃ with a sealant 708, such as 07 and the packing.

FIG. 3 shows the ultrasonic vibration plate 704a (70
4b) and the relative positioning of the receiving positioning piece 702a (702b) in the vertical direction. The receiving positioning piece 702a (702b) needs to be a mounting table when the wafer W is not levitated, and not to hinder the transfer of the wafer W when the wafer W is levitated. Therefore, the receiving positioning piece 702
a (702b) is an ultrasonic vibration plate 704a (704b)
Height (for example, 0.5 mm)
１ ／ H (半 分 0.25 m, for example)
m). As a result, when the wafer W is not levitated, the wafer W is stably placed on the receiving and positioning piece 702a (702b) as shown by a solid line. When the wafer W is levitated, the wafer W is received as shown by a two-dot chain line. The sheet is conveyed in a floating state while being guarded left and right by the positioning pieces 702a (702b).

Further, the lower bottom portion of the load lock chamber 7 _3, a vacuum suction pipe 709, the inert gas supply pipe 710 for supplying an inert gas such as N ₂ (nitrogen) gas are pipes, If necessary, air or gas in the chamber is evacuated to create a vacuum state, or the chamber can be filled with N ₂ gas which is a transmission medium for ultrasonic vibration.

The ultrasonic transducers 705a to 705d are
When a high-frequency excitation current is supplied from a high-frequency oscillator (not shown), ultrasonic vibration occurs in a longitudinal vibration mode indicated by an arrow a. This ultrasonic vibration is generated by the ultrasonic horn 705a.
After the amplitude is amplified by .about.705d, the ultrasonic vibration plate 704
a, 704b and transmitted to the ultrasonic vibration plates 704a, 704b.
4b vibrates ultrasonically.

At the time of the ultrasonic vibration, the amplitude and phase of the high-frequency excitation current applied to each of the ultrasonic vibrators 705a to 705d are controlled to thereby control the ultrasonic vibrating plates 704a,
The ultrasonic wave 704b can be ultrasonically vibrated in a traveling wave mode in which the peaks and valleys of the vibration advance in a certain direction. Therefore, the wafer W is placed on the pair of ultrasonic vibrating plates 704a and 704b that ultrasonically vibrate in the traveling wave mode.
Is mounted, the wafer W is lifted upward by the vibration sound pressure, and is carried on the traveling wave toward the spin dryer 4 side or the center robot 1 side.

The spin dryer 4 is a device for cleaning and drying the transferred wafer W.
Its interior, the load lock chamber 7 ₃ receives positioning piece is deployed within 704a, receives positioning piece 401a to be similar structure and 704b, 401b
Together but are oppositely arranged, the receiving positioning piece 401a, between 401b, becomes the same structure as the ultrasonic levitation transport mechanism that is deployed in the load lock chamber 7 in ₃ ultrasonic levitation transport mechanism That is, the ultrasonic vibration plates 402a and 402b, the ultrasonic horns 419a to
419 d, an ultrasonic vibrator 403 a to 403 d, a flange 404, and an ultrasonic levitation transport mechanism including a sealing material 405 are provided. Then, the ultrasonic vibration plate 402
A spin holder 406 for cleaning and drying the wafer W while rotating the wafer W thereon is provided below the terminal sides of the wafers a and 402b.

The spin holder 406 is rotatably driven by a motor (not shown), and is vertically movable by a lifting mechanism (not shown).
And three-forked wafer mounting pieces 408a, 408b, 408c concentrically fixed to the upper end of the rotating shaft 407. When not in use, as shown by a solid line in FIG. While being lowered to a position lower than the vibration plates 402a and 402b, when viewed from above, one of the wafer mounting pieces, for example, the wafer mounting piece 408a as shown in FIG. , 402b
Is stopped in the position just in the middle of At the time of the cleaning / drying process, as shown by a two-dot chain line in FIG. 2, it rises to a predetermined height through the space between the left and right ultrasonic vibration plates 402a and 402b, and rotates with the wafer W mounted thereon. It is driven.

Further, above the center of the spin holder 406 at the ascending position, a chemical solution for cleaning / drying, water, N ₂ gas or the like is sequentially sprayed toward the rotating wafer surface to spin-clean and dry. And a drain cup 411 for collecting a cleaning liquid such as a chemical solution or water sprayed from the nozzle 409 and discharging the cleaning liquid from the drain pipe 410 around the outer periphery of the spin holder 406. It is arranged so as to enclose the spin holder 406.

Furthermore, the lower bottom portion of the spin dryer apparatus 4, similarly to the load lock chamber 7 _3, vacuum suction tube 412 and the N ₂ gas inert gas supply pipe 413 for supplying an inert gas such as is the pipe The apparatus is configured so that air or gas in the apparatus can be evacuated as necessary to make a vacuum state, or filled with N ₂ gas as a transmission medium of ultrasonic vibration.

[0026] Next, the operation of the device, sent to the spin dryer apparatus 4 of the wafer W from the center robot 1 via the load lock chamber 7 _3, spin dryer apparatus 4
The case where the cleaning and drying processes of the wafer W are performed will be described as an example.

[0027] Prior to the start of processing, the valve 8a which is provided right and left of the partition wall portion 701a of the load lock chamber 7 _3, in 701b, closed 8b, pull the air or gas in the chamber by the vacuum suction pipe 709, the chamber Is brought into a vacuum state. This is for transferring the wafer W under the same vacuum atmosphere as the center robot 1 maintained in a vacuum state.

[0028] When the load lock chamber 7 ₃ is in a vacuum state, the center robot 1 carrying the wafer W that has been conveyed through the loader 2 (see FIG. 6) on the fork 101, the left side of the load lock chamber 7 ₃ Valve Extend your arms toward 8a. When the transfer operation is started, the left valve 8a separating the center robot 1 is automatically opened by a controller (not shown), and the fork 101 passes through the opened valve 8a. receiving positioning piece 70 of the load lock chamber 7 ₃ Te
2a and 702b.

After reaching a predetermined position, the Hawk 1
By pulling back 01 descends by a predetermined distance, receives positioning piece 702a in the wafer W to the load-lock chamber 7 ₃ had resting on Hawk 101, 702b of the concave stepped portion 703a, placed on 703b. When Hawk 101 central robot 1 is pulled back to the center robot within 1, the valve 8a is closed, the load lock chamber 7 in ₃ is sealed in a vacuum state again. Thus, the wafer W is sent to the load lock chamber 7 in ₃ in the vacuum from the center robot 1 in a vacuum state.

Next, blowing N ₂ gas from the inert gas supply pipe 710 into the load lock chamber 7 _3, meet the load lock chamber 7 ₃ by N ₂ gas is an inert gas. Meanwhile, the spin dryer apparatus 4, to create an inert gas atmosphere for cleaning and drying, and the N ₂ gas is supplied from the inert gas supply pipe 412, high N ₂ gas than normally atmospheric pressure outside Is filled with In addition,
Gas pressure in the load lock chamber 7 _3, in order to prevent flow into the mixed N ₂ gas, such as dust from the spin dryer apparatus 4 side, N ₂ of the spin dryer apparatus 4
It is set slightly higher than the gas pressure. The load lock chamber 7 ₃ and N filling the spin dryer apparatus 4
_{The two} gases serve as a transmission medium of ultrasonic vibration for the ultrasonic levitation transfer of the wafer W described below.

Next, by opening the valve 8b that隔成between the load lock chamber 7 ₃ of the spin dryer apparatus 4 in an airtight manner, and communicates the load lock chamber 7 ₃ of the spin dryer apparatus 4.

[0032] In this state, each ultrasonic transducer 705a~705d load lock chamber 7 ₃ for each of the ultrasonic transducers 403a~403d spin dryer apparatus 4, from the high frequency oscillator short for illustration, the The supply of a high-frequency excitation current whose frequency and phase are controlled is started. Thereby, each of the ultrasonic transducers 705a to 705d, 403
In a to 403d, ultrasonic vibration is started in a longitudinal vibration mode indicated by an arrow (a) in the figure. The ultrasonic vibration in the longitudinal mode is generated by ultrasonic horns 706a, 706b, and 419, respectively.
a to 419d, each ultrasonic vibration plate 70
4a to 704d and 402a to 402d, the respective ultrasonic vibration plates 704a to 704d and 402a to 402d start ultrasonic vibration according to the phase.

At the time of this ultrasonic vibration, if the phases of the ultrasonic excitation signals supplied to the respective ultrasonic vibrators 705a to 705d and 403a to 403d are shifted by a predetermined amount, as shown in FIG. right from the left side and so the peaks and valleys of the ultrasonic vibration is →→, that is, each of the ultrasonic vibration of the ultrasonic vibration of the traveling-wave mode to continue to progress toward from the load lock chamber 7 ₃ to spin dryer apparatus 4 The child can be caused to wake up by children 705a to 705d and 403a to 403d.

Therefore, the ultrasonic vibration plates 704a, 704
The wafer W mounted on the pair of left and right receiving positioning pieces 702a, 702b provided above the upper side 4b is lifted upward by sound pressure due to ultrasonic vibration of the ultrasonic vibration plates 704a, 704b. It is levitated and conveyed at a predetermined speed toward the spin dryer device 4 on a wave.

The wafer W is placed on the ultrasonic vibration plate 704.
The reason that the wafer W is not placed directly on the receiving and positioning pieces 702a and 702b provided thereon but placed on the receiving positioning pieces 702a and 702b is that the wafer W
b, when the ultrasonic vibration plate starts vibrating and before the wafer W is ultrasonically levitated, the wafer W
This is to prevent the generation of particles that become contaminants due to strong collision of the ultrasonic vibration plate with the ultrasonic vibration plate. Thereby, the inside of the apparatus can be maintained more clear.

When the wafer W reaches the position directly above the spin holder 406, this is detected by a position sensor (not shown) or time control or the like, and each ultrasonic transducer 705 is detected.
The high-frequency excitation current supplied to a to 705d and 403a to 403d is cut off. When the high-frequency excitation current is cut off, the ultrasonic vibrators 705a to 705d, 403
a to 403d lose their levitation force and transfer force, and the wafer W
Is received at the position directly above the spin holder 406 and is lowered and placed on the positioning pieces 403a and 403b.

Next, after closing the valve 8b, the spin holder 406 is raised to the cleaning / drying processing position indicated by the two-dot chain line by a lifting mechanism (not shown). Spin holder 4
06 is a trifurcated wafer mounting piece 408a, 408b,
408c, any one of the wafer mounting pieces, for example, the wafer mounting piece 408a, rises between the ultrasonic vibration plates 402a and 402b, so that the spin holder 406 moves the ultrasonic vibration plates 402a and 402b. It does not collide with the receiving positioning pieces 403a and 403b.

When the spin holder 406 carrying the wafer W reaches the position indicated by the two-dot chain line, the spin holder 406 is rotated at a predetermined speed by a motor (not shown). Then, a chemical solution, water, N ₂ gas, and the like are sequentially sprayed from the nozzle 409 toward the rotating wafer W, and spin cleaning and drying by centrifugal force are performed. A cleaning solution such as a chemical solution or water blown off by centrifugal force from the surface of the wafer W is collected in the waste liquid cup 411 and discharged to the outside from the drain pipe 410.

When the washing / drying process is completed, the spin holder 406 is moved to one of the wafer mounting pieces, for example, the wafer mounting piece 408a as shown in FIG.
The vehicle is stopped so as to be exactly in the middle between a and 402b, and then lowered to the original position shown by the solid line in FIG.

When the spin holder 406 is lowered as described above, the forked wafer mounting pieces 408a and 408
b and 408c, the wafer W is received on the way and received by the positioning pieces 403a and 403b.
It is placed on the receiving positioning pieces 403a, 403b.

[0041] Then, opening the valve 8b that隔成between the load lock chamber 7 ₃ hermetically in this state, each of the ultrasonic transducers 70 of the load lock chamber 7 ₃
And 5A～705d, for each ultrasonic transducer 403a~403d spin dryer apparatus 4, the high frequency excitation of the phase change and upon transporting the wafer W from the load lock chamber 7 ₃ to spin dryer apparatus 4 was reversed Start supplying current.

Thus, each of the ultrasonic vibrators 705a to
705d, 403A～403d, in FIG. 4, the ultrasound leftward from the mountain and right so that the →→ valley of vibration, i.e., progresses toward the spin dryer apparatus 4 into the load lock chamber 7 ₃ An ultrasonic vibration consisting of a traveling wave is generated. Receiving positioning pieces 403a, 4
Placed on the wafer W on 03b is levitated conveyed toward the load lock chamber 7 ₃ side by ultrasonic vibration comprising the traveling wave. Then, when returning to the position shown by the solid line in FIG.
Is received again and placed on the positioning pieces 702a and 702b.

[0043] Then, closing the valves 8b, pulling the vacuum suction tube 709 with N ₂ gas in the load lock chamber 7 _3, a vacuum state in the chamber. Then, the left valve 8a is opened, and the fork 10 of the center robot 1 is opened.
1 is extended, the wafer W is placed thereon, and returned to the center robot 1. When the wafer W is returned to the center robot 1, the valve 8a is closed.

The wafer W which again returned to the center robot 1 in this manner is sent like CDV device 5 ₁ serving next processing unit, 5 ₂ (see FIG. 6) is subjected to subsequent processing.

[0045] Figure 5 shows another example of the configuration of the receiving positioning piece provided in the load lock chamber 7 _3. In this example, as shown in FIG.
Further, other receiving positioning pieces 702c and 702d are additionally provided below the a and 702b, and these two sets of receiving positioning pieces are vertically movable as shown in FIG. 5B. With such a two-stage structure, it is possible to have a stock function of the wafer W into the load lock chamber 7 _3.

In the above example, the wafer W is taken as an example of an object to be processed. However, the object to be processed is not limited to this.
Any semiconductor product that can be processed in a single-wafer manner is applicable.

In the above example, two ultrasonic vibrators are provided for one ultrasonic vibration plate, but two or more ultrasonic vibrators may be provided.

[0048] Further, while an example has been shown where installed the ultrasonic levitation transport mechanism to the load lock chamber 7 ₃ parts, other load lock chamber _71, 7 _2, 7 ₄ (FIG. 6
Of course, it can be installed in the same manner also for the section (see). Which of the load lock chambers should be installed may be determined according to the system specifications.

[0049] In the above example, is provided to face the ultrasonic levitation transport mechanism also comprising a similar structure to the CDV apparatus 4 connected to the load lock chamber 7 _3, depending on the type of processor connected to the load lock chamber It is not necessary to provide such an ultrasonic levitation transport mechanism in the processing apparatus. That is, it is not necessary to provide an ultrasonic levitation transport mechanism in all load lock chambers and processing apparatuses, and it is sufficient to provide an ultrasonic levitation transport mechanism in the required load lock chamber and its processing apparatus. It is.

Further, in the illustrated example, the center robot 1
And has been shown the case of arranging the one load lock chamber 7 ₃ between the spin dryer apparatus 4, if a plurality cascading the load lock chamber, the moisture from the enemy spin dryer apparatus 4 to a vacuum Intrusion can be more reliably prevented.

[0051]

As described above, according to the first aspect of the present invention, a valve on the center robot side and a valve on the processing apparatus side are provided in the load lock chamber connecting the center robot and a desired processing apparatus. And a pair of left and right receiving positioning pieces for placing the object to be processed, which are stretched in parallel between the pair, and a position located inside the pair of right and left receiving positioning pieces and slightly lower than the receiving positioning pieces. A pair of left and right ultrasonic diaphragms arranged in parallel to each other, connected to appropriate positions on the lower surface of the pair of left and right ultrasonic diaphragms,
Further, an ultrasonic levitation transport mechanism including a plurality of ultrasonic excitation means for causing the ultrasonic vibration plate to perform longitudinal vibration in a direction perpendicular to the surface thereof is provided, and the load lock chamber is filled with an inert gas. In the state, the ultrasonic vibration composed of a traveling wave is caused on the pair of left and right ultrasonic vibration plates by controlling the frequency and phase of the high-frequency excitation current applied to the ultrasonic excitation means, and on the receiving positioning piece. Since the mounted object to be processed is floated and conveyed toward the processing device or the center robot by being placed on the ultrasonic vibration composed of the traveling wave, the conveyance mechanism can be downsized. Further, since there is no rotating portion or contact / sliding portion for transport, particles which are most problematic for semiconductor processing are not generated. Furthermore, since there is no mechanically large moving part, the transport mechanism and the center robot do not interfere with each other, and it is possible to perform a reliable transport operation.

According to the second aspect of the present invention, the ultrasonic exciting means is connected to the ultrasonic vibrator, one end of the ultrasonic vibrator is connected to the vibration end face of the ultrasonic vibrator, and the other end is connected to the ultrasonic vibrator. An ultrasonic horn connected to the lower surface of the diaphragm, and the ultrasonic horn is air-tightly fixed to the lower bottom surface of the load lock chamber by a flange and a seal material at an appropriate position, so that the rotating shaft penetrates the inside and outside of the device. Air does not enter the chamber due to poor sealing or deterioration of the part, complete airtightness can be maintained, and there is no reduction in the degree of vacuum in the load lock chamber as in the past. .

[Brief description of the drawings]

FIG. 1 is a schematic longitudinal sectional view of an embodiment of the present invention.

FIG. 2 is a schematic plan view of FIG.

FIG. 3 is an explanatory diagram of a positional relationship between an ultrasonic diaphragm and a receiving piece.

FIG. 4 is an explanatory diagram of a transport operation of the ultrasonic levitation transport mechanism.

FIG. 5 is a schematic cross-sectional view illustrating another example of the structure of a wafer receiving and positioning piece.

FIG. 6 is a schematic plan view showing a configuration example of a cluster tool type single wafer processing apparatus.

[Explanation of symbols]

W wafer (processed object) 1 center robot 2 loader 3 unloader 4 spin dryer apparatus 5 _1, 5 ₂ CVD apparatus 6 stocker 7 _{1-7 4} load lock chambers 8a, b valves 401a, b receive positioning piece 402a, b ultrasonic Vibrating plate 403a-d Ultrasonic vibrator 404 Flange 405 Sealing material 406 Spin holder 407 Rotation axis 408a-d Wafer placing piece 409 Nozzle 410 Drain pipe 411 Drain cup 412 Vacuum suction pipe 413 Inert gas supply pipe 419a-d Ultrasonic horn 702a, b Receiving positioning piece 703a, a Recessed step 704a-d Ultrasonic vibration plate 705a-d Ultrasonic vibrator 706a-d Ultrasonic horn 707 Flange 708 Seal material 709 Vacuum suction pipe 710 Inert gas supply pipe

Claims (2)

[Claims] 1. A processing object loaded in a load lock chamber connecting a center robot and a desired processing apparatus, which is connected in parallel between a valve on the center robot side and a valve on the processing apparatus side and parallel to each other. A pair of left and right receiving positioning pieces for placement, and a pair of left and right ultrasonic diaphragms positioned inside the pair of left and right receiving positioning pieces and arranged in parallel at a position slightly lower than the receiving positioning pieces, An ultrasonic levitation system comprising a plurality of ultrasonic excitation means connected to appropriate positions on the lower surfaces of a pair of left and right ultrasonic vibration plates, respectively, and for causing the ultrasonic vibration plates to perform longitudinal vibration in a direction perpendicular to the surface thereof. A transfer mechanism is provided, and in a state where the load lock chamber is filled with an inert gas, the frequency and phase of the high-frequency excitation current applied to the ultrasonic excitation means are controlled to control the left and right. A pair of ultrasonic vibration plates are caused to generate ultrasonic vibration composed of a traveling wave, and a processing target placed on the receiving positioning piece is placed on the ultrasonic vibration composed of the traveling wave and directed toward a processing device or a center robot. A cluster tool type single-wafer processing apparatus provided with an ultrasonic levitation transport mechanism, which is adapted to levitate and transport. 2. The ultrasonic exciting means is connected to an ultrasonic vibrator and one end thereof is connected to a vibration end face of the ultrasonic vibrator.
And the other end is composed of an ultrasonic horn connected to the lower surface of the ultrasonic vibration plate, and the ultrasonic horn is air-tightly fixed to the lower bottom surface of the load lock chamber by a flange and a seal material at an appropriate position. A cluster tool type single wafer processing apparatus provided with the ultrasonic levitation transport mechanism according to claim 1.