JPH11353449A - Method and device for producing ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the curing time of an adhesive by enclosing the IC units between two sheet members via an adhesive and with application of heat and pressure, cutting adhered sheet members into a single sheet and supplying water to the single sheet via a humidification zone. SOLUTION: The IC units 6 which are individually taken out are put between the 1st and 2nd sheet members 1 and 4, and both members 1 and 4 are intermittently pressed and heated at a thermal press part 72. Thus, the adhesive consisting of gel thermosetting resin of the members 1 and 4 is cured to enclose the units 6. Then an image receiving layer coating liquid 33 is applied on one of both sides of a film substrate 11 at a coating part 90. Meanwhile, a writing layer coating liquid 63 is applied on another side of the substrate 11. Thus, an image receiving layer and a writing layer are formed. Then the members 1 and 4 are cut into the single sheet member 85 at a cutting part 84, and the water is supplied to the members 85 via a humidification zone 95.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card having an IC unit and an apparatus for manufacturing an IC card.

[0002]

2. Description of the Related Art An IC card containing an IC unit includes:
For example, an ID card such as an employee ID card or a student ID card used to prove the identity of an individual has a face image and description information on the front surface, and a writing layer on the back surface that can be written with a writing instrument or the like.

[0003] Such an IC card has a built-in IC unit, is sandwiched between at least two sheets of material via an adhesive, and then heat and / or pressure is applied to enclose the IC unit. Some are cut into single sheets to make cards.

[0004]

When a reactive hot melt, for example, is used as the adhesive, it takes time until the adhesive is completely cured so that the adhesive can be cut out, and is stored in a semi-finished state. Was required, and production time was confused due to curing time management and the like.

[0005] For this reason, it takes time until the adhesive is completely cured, and for example, it has been necessary to store the semi-finished product for several days before cutting out. In addition, in order to shorten the curing time of the adhesive, it has been found that the adhesive needs to be replenished with water, and it is conceivable to devise the device.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is intended to improve the stability of quality by shortening the curing time of an adhesive, to improve the productivity, and to cure the adhesive. It is an object of the present invention to provide an IC card manufacturing method and an IC card manufacturing apparatus capable of reducing a storage space of an IC card.

[0007]

Means for Solving the Problems In order to solve the above problems and achieve the object, the present invention has the following constitution.

According to the first aspect of the present invention, there is provided an IC unit having a built-in IC unit, sandwiched between at least two sheets by an adhesive, and then applying heat and / or pressure to encapsulate the IC unit. A method of manufacturing an IC card, which is then cut into single sheets to make a card, wherein after the single sheet is cut, water is supplied through a humidification zone. ].

According to the first aspect of the present invention, after the sheet is cut into single sheets, the moisture is replenished through the humidification zone, whereby the curing time of the adhesive can be shortened and the stability of quality is improved. In addition, the productivity can be improved, and the storage space for curing the adhesive can be reduced.

[0010] The invention according to claim 2 is characterized in that "the single sheet is suspended in the humidification zone.
The manufacturing method of the described IC card. ].

According to the second aspect of the present invention, by suspending the single sheet, moisture can be efficiently supplied to the single sheet and the curing time of the adhesive can be reduced.

According to a third aspect of the present invention, there is provided the method of manufacturing an IC card according to the first aspect, wherein, in the humidification zone, the single sheets are put into a storage tray with an interval therebetween. ].

According to the third aspect of the present invention, the sheet is put in the storage tray with an interval between the sheets, whereby the water is efficiently supplied to the sheet and the curing time of the adhesive is shortened. be able to.

According to a fourth aspect of the present invention, there is provided an IC unit having a built-in IC unit, sandwiched between at least two sheets of material via an adhesive, and then applying heat and / or pressure to encapsulate the IC unit. A method of manufacturing an IC card, which comprises cutting a sheet into a sheet and converting the sheet into a card, wherein water is supplied when the sheet is cut and stored. ].

According to the fourth aspect of the present invention, when the sheet is cut and stored in a single sheet, water is replenished,
The curing time of the adhesive can be shortened, the stability of quality is improved, the productivity is improved, and the storage space for curing the adhesive can be reduced.

According to a fifth aspect of the present invention, there is provided an IC according to the fourth aspect, wherein a water-containing porous member is interposed between the sheets, and water is replenished from the porous member. Card manufacturing method. ].

According to the fifth aspect of the present invention, the time for curing the adhesive can be shortened by interposing a water-containing porous member between the individual sheets to replenish the water.

According to a sixth aspect of the present invention, there is provided the method according to the fourth aspect, wherein a humidifying member for replenishing moisture is interposed between the sheets, and the humidifying member replenishes moisture.
Manufacturing method of C card. ].

According to the sixth aspect of the invention, the humidifying member for replenishing moisture is interposed between the sheets to replenish moisture, thereby shortening the curing time of the adhesive.

According to a seventh aspect of the present invention, there is provided an IC card manufacturing method according to the fourth aspect, wherein water is supplied to the single sheet. ].

According to the seventh aspect of the present invention, by supplying water to the single sheet, the curing time of the adhesive can be shortened.

[0022] The invention according to claim 8 is that "the IC unit is built in, sandwiched between at least two sheets of material via an adhesive, and then heat and / or pressure is applied to enclose the IC unit. An IC card manufacturing apparatus for cutting a sheet into a sheet and converting the sheet into a card, comprising a humidifying zone for replenishing the sheet with moisture.
Card manufacturing equipment. ].

According to the eighth aspect of the present invention, after the sheet is cut into sheets, water is supplied through the humidification zone, whereby the curing time of the adhesive can be shortened, and the stability of quality can be improved. In addition, the productivity can be improved, and the storage space for curing the adhesive of the device can be reduced.

According to a ninth aspect of the present invention, there is provided an IC card manufacturing apparatus according to the eighth aspect, wherein the humidifying zone has a sheet suspending means for suspending the single sheet. 』
It is.

According to the ninth aspect of the present invention, it is possible to efficiently supply water to the single sheet and shorten the curing time of the adhesive with a simple or simple structure for hanging the single sheet.

According to a tenth aspect of the present invention, there is provided an IC according to the eighth aspect, wherein the humidifying zone has a storage tray for storing the single sheet at intervals.
Card manufacturing equipment. ].

According to the tenth aspect of the present invention, with a simple or structure in which the single sheets are inserted into the storage tray with an interval therebetween, moisture is efficiently supplied to the single sheets, and the curing time of the adhesive is reduced. Can be shortened.

[0028] The invention according to claim 11 is that the IC unit is embedded and sandwiched between at least two sheets of material via an adhesive, and then the IC unit is sealed by applying heat and / or pressure. An IC card manufacturing apparatus for cutting an individual sheet into a card and thereafter providing a card, comprising a water replenishing means for replenishing water when cutting and storing the sheet. ].

According to the eleventh aspect of the present invention, when the sheet is cut and stored in a single sheet, by adding water, the curing time of the adhesive can be shortened, and the stability of quality is improved. In addition, the productivity can be improved, and the storage space for curing the adhesive of the device can be reduced.

According to a twelfth aspect of the present invention, there is provided the apparatus for manufacturing an IC card according to the eleventh aspect, wherein the water replenishment means interposes a porous member containing water between the sheets. . ].

According to the twelfth aspect of the present invention, it is possible to shorten the curing time of the adhesive by interposing a water-containing porous member between the sheets to replenish water. The storage space for single sheets can be reduced.

According to a thirteenth aspect of the present invention, there is provided the IC card manufacturing apparatus according to the eleventh aspect, wherein the moisture replenishing means interposes a humidifying member for replenishing moisture between the sheets. ].

According to the thirteenth aspect of the present invention, the humidifying member for replenishing moisture is interposed between the sheet sheets to replenish moisture, thereby shortening the curing time of the adhesive. The storage space for leaf sheets can be reduced.

According to a fourteenth aspect of the present invention, there is provided an IC card manufacturing apparatus according to the eleventh aspect, wherein the water replenishment means has a water supply means for supplying water to the single sheet. ].

According to the fourteenth aspect of the present invention, by supplying water to the single sheet, the curing time of the adhesive can be shortened, and the storage space for the single sheet can be reduced.

[0036]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of an IC card manufacturing method and an IC card manufacturing apparatus according to the present invention.

FIG. 1 is a sectional view showing an IC card. I
The C card CA has a thickness of, for example, 1 mm or less, and is used to prove an individual's identity such as an employee ID card or a student ID card.
And the second sheet materials 1 and 4, and the adhesive layer 3 interposed between the first and second sheet materials 1 and 4. The first sheet material 1 is composed of a film support 11 and an image receiving layer 2 for printing images and description information formed on the surface of the film support 11. The second sheet material 4 includes a film support 12 and a writing layer 5 formed on the surface of the film support 11. IC chip 6a in the adhesive layer 3
And an IC unit 6 having an antenna 6b.

The adhesive constituting the adhesive layer is preferably a hot melt adhesive, and more preferably the hot melt adhesive is a reactive type.

As the hot melt adhesive used for the IC card of the present invention, a commonly used hot melt adhesive can be used. The main components of the hot melt adhesive include, for example, ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer,
Examples include polyolefins. As a polyamide-based hot melt adhesive, there is a macromelt series manufactured by Henkel Co., Ltd., and as a thermoplastic elastomer-based hot melt adhesive, Kariflex TR manufactured by Shell Chemical Company is used.
And Clayton series, Asahi Kasei Corporation's Tufprene, Fi
restoneSynthetic Rubber a
nd Latex Tuffden, Phillips P
Etroleum Solprene 400 series. Examples of polyolefin hot melt adhesives are Sumitomo Chemical's Sumitics, Chisso Petrochemical's Vistack, Mitsubishi Yuka's Yucatak, Henkel's Macromelt Series, Mitsui Petrochemical's Tuffmer, Ube Lexen's APAO, and Eastman Chemical's. East bond,
Hercules A-FAX and the like.

In the present invention, the hot melt adhesive is preferably of a reactive type. Reactive hot melt adhesive (hereinafter, referred to as
The reactive adhesive) is a type of adhesive in which the resin is melted and bonded, and then moisture is absorbed to cure the resin. Its characteristics are that it has a hardening reaction compared to ordinary hot melt, has a long bondable time as required, and has a high softening temperature after bonding, so it is durable and suitable for processing at low temperatures. Is mentioned. As an example of the reactive adhesive, there is an adhesive whose main component is a urethane polymer containing an isocyanate group at the molecular end, and the isocyanate group reacts with moisture to form a crosslinked structure. As a reactive adhesive usable in the present invention, Sumitomo 3M TE
030, TE100, Hibon 4 manufactured by Hitachi Chemical Polymer Co., Ltd.
820, Bondmaster 17 manufactured by Kanebo UNS Co.
Series 0, Macroplast made by Henkel
QR 3460 and the like.

Here, I using a hot melt adhesive was used.
An example of a method for manufacturing a C card will be described. In manufacturing an IC card, first, a hot melt adhesive is applied to a front and back sheet to a predetermined thickness by an applicator. As a coating method, an ordinary method such as a roller method, a T-die method, and a die method is used. The IC unit is mounted between the upper and lower sheets coated with the adhesive. Before mounting, the applied adhesive may be heated in advance by a heater or the like. Then, press the IC unit attached between the upper and lower sheets with a press heated to the bonding temperature of the adhesive for a predetermined time, or while transferring the sheet in a constant temperature layer at a predetermined temperature instead of pressing with a press. You may appeal with a roll. It is effective to perform vacuum pressing in order to prevent air bubbles from entering during bonding. After laminating with a press or the like, it is punched into a predetermined shape and cut into a card shape to make a card. When a reactive adhesive is used as the adhesive, the adhesive is cured for a predetermined time and then cut into cards. It is effective to form a hole for supplying water necessary for the reaction around the card size of the sheets bonded together to promote curing.

It is also preferable that the adhesive constituting the adhesive layer is a thermosetting adhesive. Examples of the thermosetting adhesive include a polyurethane-based, unsaturated polyester-based, and epoxy-based adhesive. Among them, epoxy type is preferable.
Epoxy adhesives include Sumitomo 3M Sco
tch-Weld series, EP-00 manufactured by Cemedine
1. Araldite series manufactured by Ciba-Geigy Japan, 2000, 2100 series manufactured by Three Bond, Bond E series and quick set series manufactured by Konishi, and Esdyne series manufactured by Sekisui Chemical.

FIG. 2 is a diagram showing an IC card manufacturing apparatus. The IC card manufacturing apparatus 20 includes the first sheet material 1
Feed shaft 21 for feeding the roll-shaped film support 11
The film support 11 sent out from the sending shaft 21 is supplied over a guide roller 23 and a drive roller 24. Guide roller 23 and drive roller 2
4, an extrusion die 40 facing the film support 11 is arranged, and a drying unit 41 is arranged at a stage subsequent to the extrusion die 40. The extrusion die 40 emits the thermosetting resin, and the drying unit 41 passes through the film support 11,
The solvent of the thermosetting resin is vaporized to form an adhesive layer.

Further, the IC card manufacturing apparatus 20 is provided with a delivery shaft 50 for delivering the roll-shaped film support 12 of the second sheet material 4, and the film support 12 delivered from the delivery shaft 50 serves as a guide. The roller 51 and the driving roller 52 are supplied over the roller.

An extrusion die 42 facing the film support 12 is disposed between the guide roller 51 and the driving roller 52.
A drying section 43 is arranged at the subsequent stage of the second section. The extrusion die 42 emits the thermosetting resin, and the drying unit 43 passes through the film support 12 to vaporize the solvent of the thermosetting resin to form an adhesive layer.

The first sheet material 1 thus formed and the second sheet material 4 are conveyed along the conveyance path 70 in contact with each other from a state where they are separated and opposed. At a position where the first sheet material 1 and the second sheet material 4 face each other, IC units 6 are taken out and inserted one by one.

In the transport path 70 of the IC card manufacturing apparatus 20, along the transport direction of the first sheet material 1 and the second sheet material 4, a sheet pressurizing and heating unit 72, a coating unit 90, and a cutting unit The section 84, the heating zone 95, the punching section 73, and the cutting section 74 are arranged along the transport direction.

The sheet pressurizing and heating section 72 has a flat hot press upper mold 72a and a hot press lower mold 72b which are arranged to face the conveying path 70 up and down. The molds 72b are provided so as to be movable in directions of coming and coming from each other.

The hot press upper mold 72a and lower mold 72b are not flat molds, but may be heat rollers.
In consideration of cracking of the IC unit 6, a flat press type is used, avoiding a roller which is close to line contact and to which an excessive bending force is applied even with a slight deviation.

In the coating section 90, the image receiving layer coating liquid container 30 is provided above the transport path 70, and a supply roller 31a is provided in the image receiving layer coating liquid container 30.
a through the intermediate roller 31b, the image receiving layer coating liquid 33 is supplied to the coating roller 32, and the image receiving layer coating liquid 33 is coated on one surface side of the film support 11 by the reverse rotation of the coating roller 32, and the reverse coating method is used. An image receiving layer is formed on the surface.

In the application section 90, a writing layer coating liquid container 60 is provided below the transport path 70, and a supply roller 61a is provided in the writing layer coating liquid container 60. 61b via writing layer coating solution 6
3 is supplied to the application roller 62, and the writing layer coating liquid 63 is applied to one surface side of the film support 12 by the reverse rotation of the application roller 62, and the writing layer is formed on the surface by the reverse coater method.

The cutting section 84 has a cutter upper die 84a and a cutter lower die 84b which are disposed oppositely above and below the transport path 70. The cutter upper die 84a is provided so as to be vertically movable.
And the second sheet materials 1 and 4 are cut to form a single sheet 85
Create

The heating zone 95 is provided in front of the punching section 73. The heating zone 95 cuts a single sheet 85 and then supplies water through the humidification zone 95. Heating zone 95
Has a sheet supply means 95a, a sheet hanging means 95b, a sheet receiving means 95c, and a humidifier 95d. The sheet supply means 95a includes a plurality of blades 95 on the rotation shaft 95a1.
a2 is provided, and the sheet 85 is put on the blade 95a2 and rotated to supply the sheet 85 to the sheet suspending means 95b. The sheet suspending means 95b is connected to the belt 9
5b1 is provided with a locking member 95b2.
The sheet 85 is suspended and transported at b2. The sheet receiving means 95c includes a plurality of blades 95c2 provided on a rotating shaft 95c1. The sheet receiving device 95c places the sheet 85 on the blade 95c2, rotates the sheet 95, and supplies the sheet 85 to the punching unit 73. The humidifier 95d is disposed below the sheet suspending means 95b, and has a simple or structure for suspending the single sheet 85.
Moisture can be efficiently supplied to the single sheet 85, and the curing time of the adhesive can be reduced.

The punching section 73 comprises a card punching upper die 73a and a card punching lower die 73b which are disposed to face the upper and lower sides of the transport path 70. The upper card punching die 73a is vertically movable, and is integrated after the sheet material 85 is completely heat-welded, and then punched to the size of the IC card CA. Below the card punching die 73b, there is provided a storage section 73c for sequentially stacking and storing, for example, 4 to 100 IC cards CA extracted from the single sheet material 85.

The cutting section 74 has a cutter upper mold 74a and a cutter lower mold 74b which are disposed oppositely above and below the transport path 70, and the cutter upper mold 74a is provided so as to be movable up and down.
The sheet material 85 of the waste material punched from the card CA is cut and collected in the waste material storage part 74c.

After the sheet 85 is cut into pieces as described above, the moisture is replenished through the humidifying zone 95, whereby the curing time of the adhesive can be shortened, and the stability of quality can be improved.
In addition, the productivity is improved, and the storage space for curing the adhesive can be reduced.

Next, a method of manufacturing an IC card will be described. First, the film support 11 of the first sheet material 1 is sent out by the rotation of the sending shaft 21. Then, an extrusion die 4 is provided on the back side of the film support 11.
The thermosetting resin is applied according to 0, and then the solvent of the coating liquid on both sides is vaporized through the drying unit 41 to form an adhesive layer on both sides.

On the other hand, the film support 12 of the second sheet material 4 is sent out by the rotation of the sending shaft 50. Then, a thermosetting resin is applied to the back side of the film support 12 by an extrusion die 42, and then passes through a drying unit 43 to vaporize a solvent of a coating solution on both sides to form an adhesive layer on both sides. Is done.

The first and second sheet materials 1 and 4 having the adhesive layers formed on both surfaces as described above are further fed and opposed to each other, and between the first and second sheet materials 1 and 4. The IC units 6 taken out one by one are inserted. Thereafter, the first and second sheet materials 1 and 4 are intermittently heated under pressure by the hot press section 72. Thereby, the gel-like thermosetting resin of the first and second sheet materials 1 and 4 is cured, and the IC unit 6 is enclosed.

Next, after the IC unit is sealed in an adhesive of a curable resin interposed between the first sheet material 1 and the second sheet material 4, the film support 1 is coated by the coating unit 90.
1, the film support 1 is rotated by the reverse rotation of the application roller 32.
The image receiving layer coating liquid 33 is applied to one surface of the substrate 1, and an image receiving layer is formed on the surface by a reverse coater method.

The film support 1 is applied by the coating section 90.
2, the film support 1 is rotated by the reverse rotation of the application roller 62.
The writing layer coating liquid 63 is applied to one surface of the second layer 2, and a writing layer is formed on the surface by a reverse coater method. In the cutting section 84, the first and second sheet materials 1 and 4 are cut by the up-and-down movement of the upper cutter 84a to create a single sheet material 85.

Next, after the sheet 85 is cut into pieces, the moisture is replenished through the humidification zone 95, whereby the curing time of the adhesive can be shortened.
The IC card CA punched out to the size of the IC card CA by the 3a and the card punching down mold 73b
5 in order. The sheet material 85 is fed through the humidification zone 95 to replenish the water, and the two sheet materials 1 and 4 and the adhesive layer 3 are cut in a uniform hardness to prevent generation of chips and whiskers. The quality can be stabilized and the yield can be improved. In the cutting section 74, I
Waste material sheet material 85 punched from C card CA
Is cut and collected in the waste material storage 74c.

FIG. 3 is a diagram showing another embodiment of the IC card manufacturing apparatus. In this embodiment, the same components as those in the embodiment of FIG. In this embodiment, the humidification zone 95
And the single sheet 85 is put into the storage tray 95e with an interval therebetween. In this way, by putting the single sheet 85 into the storage tray 95e with a large space therebetween, it is possible to efficiently supply moisture to the single sheet 85 with a simple structure and shorten the curing time of the adhesive. .

FIG. 4 is a diagram showing another embodiment of the IC card manufacturing apparatus. In this embodiment, there is provided a water replenishing means 86 for replenishing water when cutting and storing the single sheet 85. The water replenishing means 86 interposes a porous member 86 a containing water between the single sheets 85. By thus interposing the porous member 86a containing water between the single sheets 85 and replenishing the water, the curing time of the adhesive can be reduced, and the single sheet 85 can be shortened.
Storage space can be reduced.

FIG. 5 is a diagram showing another embodiment of the IC card manufacturing apparatus. In this embodiment, there is provided a water replenishing means 86 for replenishing water when cutting and storing the single sheet 85. The water replenishing means 86 interposes a humidifying member 86 b for replenishing water between the single sheets 85. In this manner, the humidifying member 86b for replenishing moisture is interposed between the single sheets 85 to replenish moisture,
The curing time of the adhesive can be reduced, and the sheet 8
5 storage space can be reduced.

FIG. 6 is a diagram showing another embodiment of the IC card manufacturing apparatus. In this embodiment, the coating unit 90
The sheet heating section 91 is arranged at the subsequent stage. The sheet heating unit 91 has a flat heated upper mold 91a and a heated lower mold 91b that are disposed to face each other in the vertical direction of the transport path 70, and the heated upper mold 91a and the heated lower mold 91b are moved in a direction in which they come into contact with and separate from each other. The sheet is movably provided, and heats the sheet after the application unit 90.

At a subsequent stage of the sheet heating section 91, a water replenishing means 86 for replenishing water is provided. In the water replenishing means 86, water containers 86c and 86d are provided above the transport path 70, and water is supplied from the water container 86c to supply rollers 86e and 86e.
86f, the water is supplied to the upper surface of the sheet 85, and water is supplied from a water container 86d by a supply roller 86g.
5 is supplied to the lower surface. By supplying water to the single sheet 85 in this manner, the curing time of the adhesive can be reduced, and the storage space for the single sheet 85 can be reduced.

[0068]

As described above, according to the first aspect of the present invention, an IC unit is built in, sandwiched between at least two sheets of material via an adhesive, and then heat and / or pressure is applied. The IC unit is enclosed, and then cut into single sheets to make a card. After cutting into single sheets, water is supplied through a humidification zone to shorten the curing time of the adhesive, thereby improving quality. Is improved, the productivity is improved, and the storage space for curing the adhesive can be reduced.

According to the second aspect of the present invention, by suspending the single sheet in the humidification zone, it is possible to efficiently supply moisture to the single sheet and shorten the curing time of the adhesive.

According to the third aspect of the present invention, the sheet is placed in the storage tray with a space between the sheets in the humidification zone.
Moisture can be efficiently supplied to the sheet, and the curing time of the adhesive can be shortened.

According to the fourth aspect of the present invention, the IC unit is built in, sandwiched between at least two sheets by an adhesive, and then the IC unit is sealed by applying heat and / or pressure. Although it is cut into single sheets to make a card, when it is cut into single sheets and stored, by adding water, the curing time of the adhesive can be shortened, the stability of quality is improved, In addition, the productivity is improved, and the storage space for curing the adhesive can be reduced.

According to the fifth aspect of the present invention, the time for curing the adhesive can be shortened by interposing a water-containing porous member between the individual sheets to replenish the water.

According to the sixth aspect of the present invention, the humidifying member for replenishing moisture is interposed between the sheets to replenish moisture, so that the curing time of the adhesive can be shortened.

According to the seventh aspect of the present invention, by supplying water to the single sheet, the curing time of the adhesive can be shortened.

According to the eighth aspect of the present invention, the IC unit is built in, sandwiched between at least two sheets by an adhesive, and then heat and / or pressure is applied to encapsulate the IC unit. Although it is cut into single sheets to make a card, after cutting into single sheets, it is possible to shorten the curing time of the adhesive by performing water replenishment through the humidification zone,
The stability of the quality is improved, the productivity is improved and the storage space for hardening the adhesive of the device can be reduced.

According to the ninth aspect of the present invention, the humidification zone has a simple or structure in which a single sheet is hung, can supply water efficiently to the single sheet, and can shorten the curing time of the adhesive.

According to the tenth aspect of the present invention, the humidification zone has a simple or structure in which a single sheet is inserted into a storage tray with an interval therebetween, and supplies moisture to the single sheet efficiently, and cures the adhesive. Can be shortened.

According to the eleventh aspect of the present invention, the IC unit is built in, sandwiched between at least two sheets by an adhesive, and thereafter, the IC unit is sealed by applying heat and / or pressure. Although it is cut into single sheets to make a card, when it is cut into single sheets and stored, by adding water, the curing time of the adhesive can be shortened, the stability of quality is improved, Moreover, the productivity can be improved, and the storage space for curing the adhesive of the device can be reduced.

According to the twelfth aspect of the present invention, the moisture replenishment means can reduce the curing time of the adhesive by interposing a moisture-containing porous member between the sheets to replenish the moisture. The storage space for single sheets can be reduced.

According to the thirteenth aspect of the present invention, the moisture replenishing means interposes a humidifying member for replenishing moisture between the sheets to replenish the moisture, thereby shortening the curing time of the adhesive. In addition, the storage space for single sheets can be reduced.

According to the fourteenth aspect of the present invention, the water replenishing means can supply water to the single sheet, thereby shortening the curing time of the adhesive and reducing the storage space for the single sheet. it can.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an IC card.

FIG. 2 is a diagram showing an IC card manufacturing apparatus.

FIG. 3 is a diagram showing another embodiment of the IC card manufacturing apparatus.

FIG. 4 is a diagram showing another embodiment of the IC card manufacturing apparatus.

FIG. 5 is a diagram showing another embodiment of the IC card manufacturing apparatus.

FIG. 6 is a diagram showing another embodiment of an apparatus for manufacturing an ID card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st sheet material 2 image receiving layer 3 adhesive 4 2nd sheet material 5 writing layer 6 IC unit 6a IC chip 6b antenna 70 conveyance path 72 sheet pressurization heating part 73 punching part 74 cutting part 90 application part 95 application Hot Zone CA IC Card

 ──────────────────────────────────────────────────続 き Continued from the front page (72) Inventor Takao Tsuda 1 Sakuracho, Hino-shi, Tokyo Konica Corporation

Claims (14)

[Claims] An IC unit is built in, sandwiched between at least two sheet materials via an adhesive, and thereafter heat and / or pressure is applied to enclose the IC unit, and then cut into single sheets. A method for manufacturing an IC card, which comprises cutting the single sheet and replenishing water through a humidification zone. 2. The method for manufacturing an IC card according to claim 1, wherein said single sheet is suspended in said humidification zone. 3. In the humidification zone, the single sheet is
2. The method for manufacturing an IC card according to claim 1, wherein the IC card is placed in a storage tray with a gap therebetween. 4. A built-in IC unit, sandwiched between at least two sheet materials via an adhesive, and then applying heat and / or pressure to enclose the IC unit, and then cut into single sheets. A method for producing an IC card, comprising: adding water when cutting and storing the sheet into the single sheet. 5. The method for manufacturing an IC card according to claim 4, wherein a porous member containing water is interposed between the sheets, and water is replenished from the porous member. 6. The method for manufacturing an IC card according to claim 4, wherein a humidifying member for replenishing moisture is interposed between the sheets, and the replenishing of moisture is performed by the humidifying member. 7. The method for manufacturing an IC card according to claim 4, wherein water is supplied to said single sheet. 8. A built-in IC unit, sandwiched between at least two sheets of material via an adhesive, and then applying heat and / or pressure to enclose the IC unit, and then cut into single sheets. An apparatus for manufacturing an IC card, comprising: a humidifying zone for replenishing the sheet with water. 9. The IC card manufacturing apparatus according to claim 8, wherein said humidifying zone has sheet hanging means for hanging said single sheet. 10. The humidifying zone includes:
9. The IC card manufacturing apparatus according to claim 8, further comprising a storage tray for storing the storage space with an interval therebetween. 11. An integrated circuit unit having at least two
In an IC card manufacturing apparatus, a sheet material is sandwiched via an adhesive, heat and / or pressure is applied to enclose the IC unit, and then the sheet is cut into single sheets to make a card. IC having water replenishing means for replenishing water when cut and stored in leaf sheets
Card manufacturing equipment. 12. The IC card manufacturing apparatus according to claim 11, wherein said water replenishing means interposes a porous member containing water between the sheets. 13. The IC card manufacturing apparatus according to claim 11, wherein said moisture replenishing means interposes a humidifying member for replenishing moisture between the sheets. 14. An IC card manufacturing apparatus according to claim 11, wherein said water replenishing means has a water supply means for supplying water to said single sheet.