JP2000001067A - Manufacture of id card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently harden a reaction type hot-melt adhesive interposed between sheet materials in the degree of not adhering to a blade by detecting a carbonic acid gas amount or the like generated from the adhesive, and possibly cutting the sheet in a card shape when the amount becomes a predetermined amount. SOLUTION: The method for manufacturing an ID card for sealing an IC unit 6 in an adhesive layer interposed between a first sheet material 1 and a second sheet material 4 comprises the steps of sealing or placing the unit 6 in or on a reaction type hot-melt adhesive formed on the material 1, then sticking the material 4 thereto, then cutting it in a sheet-like state for storage, then detecting a carbonic acid gas amount or accumulated amount generated from the adhesive in the storage state, and cutting the sheet in a card shape when the amount becomes predetermined. Further, the method also comprises the steps of sticking the material 4 on the material 1 after sealing or placing the unit 6 in or on the adhesive formed on the material 1, thereafter cutting it in the sheet-like state for storage, detecting a hardening degree of the adhesive in the storage state, and cutting the sheet in the card shape at the time of becoming a predetermined hardening degree.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an ID card including an IC unit having an IC chip and an antenna.

[0002]

2. Description of the Related Art An ID card is used to prove the identity of an individual, such as an employee ID card or a student ID card. Such an ID card contains an IC unit having an IC chip and an antenna. Some have a writing layer which has a face image and description information and which can be written on the back side with a writing instrument or the like as necessary.

As a method of manufacturing such an ID card,
For example, a first sheet material having an image receiving layer and an IC unit having an IC chip and an antenna are encapsulated or placed in advance or in or on an adhesive layer formed on the first sheet material, Are laminated from the side of the adhesive that holds the IC unit in or above the adhesive, pressed and heated by a press on a flat plate, and cut into a card shape.

[0004]

As described above, the IC is embedded in the adhesive interposed between the first sheet material and the second sheet material.
Although a method of making an IC card by enclosing and bonding units is known, an ID card which does not deteriorate in a high temperature state, for example, in a car under hot weather, has been desired. On the other hand, the present inventors provided a heat-resistant and easy-to-handle card manufacturing method by using a reactive hot melt.

[0005] The method of bonding using a reactive hot melt is preferable because it can withstand high temperatures, but carbon dioxide gas CO ₂ is generated during the reaction of curing the adhesive and it takes about one week to complete curing. This is a problem when increasing the number of ID cards produced. In addition, even with general epoxy resin adhesives, there was variation in reaching the hardness required for cutting due to changes in the surrounding environment.

In the case of a reactive hot melt, if carbon dioxide gas CO ₂ accumulates between the first sheet material and the second sheet material to cause irregularities, especially when a face image is recorded, The quality (image quality) has deteriorated. In particular, in the case of recording a face image by the thermal sublimation type, if carbon dioxide gas CO ₂ accumulates between the first sheet material and the second sheet material to cause unevenness, the quality (image quality) is significantly deteriorated, The problem is even greater.

The present invention has been made in view of such a point, and the adhesive interposed between the first sheet material and the second sheet material causes the card to be largely deformed or adhered to the blade by cutting. Hardens enough to prevent
Since the D card can be sent to the cutting process, it can be mass-produced and the quality (image quality) is prevented from deteriorating.
It is intended to provide a method for manufacturing a card.

[0008]

Means for Solving the Problems In order to solve the above problems and achieve the object, the present invention has the following constitution.

According to a first aspect of the present invention, there is provided a method for manufacturing an ID card in which an IC unit is sealed in an adhesive layer interposed between a first sheet material and a second sheet material. After enclosing or placing the IC unit in or on the reactive hot melt adhesive formed on the sheet material, the second
The sheet material is stuck, then cut and stored in a sheet shape, and then, in the stored state, the amount of carbon dioxide gas generated from the adhesive or the amount of cumulative generation is detected. A method for manufacturing an ID card, wherein the ID card can be cut into a card shape. ].

According to the first aspect of the present invention, the sheet is cut into a sheet and stored, and thereafter, in the stored state, the amount of carbon dioxide gas or the cumulative amount of gas generated from the reactive hot melt adhesive is detected, and the predetermined amount is detected. When the amount of generated carbon dioxide gas is reached, the sheet can be cut into a card shape, so that the adhesive interposed between the first sheet material and the second sheet material may cause the card to be greatly deformed or adhered to the blade by cutting. The ID card can be hardened sufficiently so as not to be hardened, and the ID card can be sent to the cutting process at an early stage, so that a large amount can be produced, and the quality (image quality) can be prevented from deteriorating.

According to a second aspect of the present invention, there is provided a method for manufacturing an ID card in which an IC unit is sealed in an adhesive layer interposed between a first sheet material and a second sheet material. After enclosing or placing the IC unit in or on the adhesive formed on the sheet material, the second sheet material is pasted, then cut into a sheet shape, laminated in a predetermined number, and stored. A method for manufacturing an ID card, comprising: detecting a degree of curing of an adhesive in a stored state; ].

According to the second aspect of the present invention, a predetermined number of sheets are cut and laminated, stored, and then the degree of cure of the adhesive is detected in the stored state. Since it can be cut into a card shape from the beginning, it is hardened sufficiently so as not to adhere to the blade, and since the ID card can be sent to the cutting process early, a large amount can be produced, and the quality (image quality) is prevented from deteriorating. be able to.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method for manufacturing an ID card according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an ID card. I
The D card CA is used for certifying an individual's identity such as an employee ID card or a student ID card.
And an adhesive layer 3 interposed between the first and second sheet materials 1 and 4. An image receiving layer 2 for printing images and written information is provided on the surface of the first sheet material 1, and a writing layer 5 is provided on the surface of the second sheet material 4. An IC unit 6 having an IC chip 6a and an antenna 6b is sealed in the adhesive layer 3.

FIG. 2 shows an apparatus for manufacturing an ID card. The ID card manufacturing apparatus 20 includes the first sheet material 1
Feed shaft 21 for feeding the roll-shaped film support 11
The film support 11 sent out from the sending shaft 21 is supplied over a guide roller 23 and a drive roller 24. Guide roller 23 and drive roller 2
4, an extrusion die 40 facing the film support 11 is disposed, and a drying unit 41 is disposed downstream of the extrusion die 40. The extrusion die 40 emits the thermosetting resin, and the drying unit 41 passes through the film support 11,
The solvent of the thermosetting resin is vaporized to form an adhesive layer.

The ID card manufacturing apparatus 20 is provided with a delivery shaft 50 for delivering the roll-shaped film support 12 of the second sheet material 4, and the film support 12 delivered from the delivery shaft 50 serves as a guide. The roller 51 and the driving roller 52 are supplied over the roller.

An extrusion die 42 facing the film support 12 is disposed between the guide roller 51 and the driving roller 52.
A drying section 43 is arranged at the subsequent stage of the second section. The extrusion die 42 emits the thermosetting resin, and the drying unit 43 passes through the film support 12 to vaporize the solvent of the thermosetting resin to form an adhesive layer.

The first sheet material 1 thus formed and the second sheet material 4 are conveyed along the conveyance path 70 while coming into contact with each other from a state where they are separated from each other. At a position where the first sheet material 1 and the second sheet material 4 face each other, IC units 6 are taken out and inserted one by one.

In the conveying path 70 of the ID card manufacturing apparatus 20, the sheet pressurizing and heating unit 71, the coating unit 90, and the coating liquid are arranged along the conveying direction of the first sheet material 1 and the second sheet material 4. The drying unit 95 and the cutting unit 74 are arranged along the transport direction.

The sheet pressurizing and heating section 71 is provided with a first protective film supply section 71 which is disposed above and below the transport path 70 so as to face each other.
a and a second protection film supply unit 71b, and the first and second protection film supply units 71a and 71b
1a1 and 71b1 and winding shafts 71a2 and 71b2,
The first and second protective films 28 and 29 are supplied in the direction of the arrow.

The sheet pressurizing and heating section 71 has a hot press section 72 disposed vertically above and below the transport path 70, and the hot press section 72 is disposed vertically above and below the transport path 70. Mold hot press upper mold 72a and vacuum heat press lower mold 72b
Consists of Hot press upper mold 72a and hot press lower mold 72b
Are provided so as to be movable in directions of coming and coming from each other.

The hot press upper mold 72a and lower mold 72b can be heat rollers instead of flat molds.
In consideration of cracking of the IC unit 6, a flat press type is used, avoiding a roller which is close to line contact and to which an excessive bending force is applied even with a slight deviation.

In the coating section 90, the image receiving layer coating liquid container 30 is provided above the transport path 70, and a supply roller 31a is provided in the image receiving layer coating liquid container 30.
a through the intermediate roller 31b, the image receiving layer coating liquid 33 is supplied to the coating roller 32, and the reverse rotation of the coating roller 32 applies the image receiving layer coating liquid 33 to one surface side of the film support 11, and the reverse coating method is used. An image receiving layer is formed on the surface.

In the coating section 90, a writing layer coating liquid container 60 is provided below the transport path 70, and a supply roller 61a is provided in the writing layer coating liquid container 60. 61b via writing layer coating solution 6
3 is supplied to the application roller 62, and the writing layer coating liquid 63 is applied to one surface side of the film support 12 by the reverse rotation of the application roller 62, and the writing layer is formed on the surface by the reverse coater method.

The coating liquid drying section 95 includes a film support 11,
The solvent in the image receiving layer and the writing layer is vaporized by passing the solution through layer 12 to form a coating layer on both sides.

The cutting section 74 comprises an upper cutter 74a and a lower cutter 74b which are disposed above and below the conveying path 70, and the upper cutter 74a is provided so as to be movable up and down. , 4 are cut into a sheet in a state of being thermally welded, and a predetermined number of sheets are stacked and stored in the storage section 85.

Next, a method of manufacturing an ID card will be described. First, the film support 11 of the first sheet material 1 is sent out by the rotation of the sending shaft 21. Then, an extrusion die 4 is provided on the back side of the film support 11.
The thermosetting resin is applied according to 0, and then the solvent of the coating liquid on both sides is vaporized through the drying unit 41 to form an adhesive layer on both sides.

On the other hand, the rotation of the delivery shaft 50 causes the film support 12 of the second sheet material 4 to be delivered. Then, a thermosetting resin is applied to the back side of the film support 12 by an extrusion die 42, and then passes through a drying unit 43 to vaporize a solvent of a coating solution on both sides to form an adhesive layer on both sides. Is done.

The first and second sheet materials 1, 4 having the adhesive layers formed on both sides in this manner are further fed and opposed to each other, and between the first and second sheet materials 1, 4. The IC units 6 taken out one by one are inserted. After that, the first protective film 28 and the second protective film 29
Are fed between the hot press upper mold 72a and the film support 11, and the hot press lower mold 72b and the film support 12,
The first and second protective films 28 and 29 and the first and second sheet materials 1 and 4 are intermittently heated by the hot press 72 under pressure. Thereby, the gel-like thermosetting resin of the first and second sheet materials 1 and 4 is cured, and the IC unit 6 is enclosed.

Next, after enclosing the IC unit in an adhesive layer of a curable resin interposed between the first sheet material 1 and the second sheet material 4, the coating unit 90 applies the IC unit to the film support 11. By the reverse rotation of the application roller 32, the image receiving layer coating liquid 33 is applied to one surface side of the film support 11, and the image receiving layer is formed on the surface by the reverse coater method. The image receiving layer may be formed on the surface of the film support 11 in advance.

Further, the film support 1 is
2, the film support 1 is rotated by the reverse rotation of the application roller 62.
The writing layer coating liquid 63 is applied to one surface of the second layer 2, and a writing layer is formed on the surface by a reverse coater method. As the film supports 11 and 12 pass through the coating liquid drying section 95, the solvent of the image receiving layer and the writing layer is vaporized.

Next, the image receiving layer and the writing layer are formed, and the first and second sheet materials 1 and 4 are cut into sheets 84 by driving the cutter upper mold 74a and the cutter lower mold 74b, and the sheets are stored. A predetermined number of sheets are stacked and stored in the unit 85.

The first embodiment of the present invention is shown in FIG.
As shown in the figure, the IC unit is sealed in an adhesive interposed between the first sheet material 1 and the second sheet material 4 and bonded, and then cut into a sheet shape and laminated in a predetermined number. save. In this embodiment, the IC unit 6 is encapsulated or placed in or on a reactive hot melt adhesive formed on the first sheet material 1 and then the second sheet material 4 is attached thereto. Cut into sheets and save.

Thereafter, the amount of carbon dioxide gas or the cumulative amount of carbon dioxide generated from the adhesive in the stored state is detected, and when a predetermined amount of carbon dioxide gas is generated, the sheet can be cut into a card shape.

As shown in FIG. 3A, this storage may be carried out by stacking in a closed chamber 100, or
(B) As shown in FIG.
1 and may be closed and stored. The closed chamber 100 and the storage case 110 are provided with a carbon dioxide gas amount detection sensor 120 for detecting the amount of carbon dioxide gas generated when the reactive hot melt adhesive reacts and cures in the stored state.

As shown in FIG. 3 (c), the amount of carbon dioxide gas generated from a predetermined amount of the reactive hot-melt adhesive in one sheet material cut into a sheet is reduced as time passes. When the predetermined carbon dioxide gas amount x1 is reached, after the predetermined time t1 at that time, even if the time elapses, the amount of generation is small and the hardness becomes the predetermined hardness. For this reason, the total amount of carbon dioxide gas that is predicted to be generated with respect to the reactive hot melt adhesive amount of one sheet material cut into a sheet is measured in advance,
The amount of carbon dioxide gas generated per unit time with respect to the amount when the hardness reaches a predetermined value is set according to the number of sheets.

Therefore, when the amount of carbon dioxide gas generated from a predetermined number of sheet members becomes equal to or less than a predetermined predetermined amount, the carbon dioxide gas is stacked in the closed chamber 100 and stored.
The first sheet material 1 and the second sheet material 4 which are laminated and sealed in a sheet and stored are taken out and taken out.
The cutting unit 73 cuts the card into a card shape to create an ID card CA.

In this manner, the sheet is cut into a sheet and stored. After that, in the stored state, the amount of carbon dioxide or the cumulative amount of carbon dioxide generated from the reactive hot melt adhesive is detected. Since the card can be cut into a card shape, the adhesive interposed between the first sheet material 1 and the second sheet material 4 hardens sufficiently by cutting so that the card is not significantly deformed or adheres to the blade. , And early I
Since the D card can be sent to the cutting process, a large amount can be produced, and furthermore, the quality (image quality) can be prevented from deteriorating. In addition to this embodiment, the press completion or other by weighing the accumulated generation amount of CO ₂ from a particular point in time, estimating the curing level from the pre-cured degree, which issued to the table and CO ₂ cumulative emissions You may.

The second embodiment of the present invention will be described with reference to FIG.
As shown in the figure, the IC unit is sealed in an adhesive interposed between the first sheet material 1 and the second sheet material 4 and bonded, and then cut into a sheet shape and laminated in a predetermined number. save. In this embodiment, the IC unit 6 is encapsulated or placed in or on the adhesive formed on the first sheet material 1, and then the second sheet material 4 is attached thereto, and then cut into sheets. Then, a predetermined number of sheets are stacked and stored. As shown in FIG. 4A, this storage is performed by stacking the storage case 210 on the storage case 210 and making the weight 211 flat.

The IC unit is sealed in an adhesive interposed between the first sheet material 1 and the second sheet material 4 and bonded together. As shown, transparent portions 1a and 4a are provided at the ends of the first sheet material 1 and the second sheet material 4, respectively. At the ends of the first sheet material 1 and the second sheet material 4, the curing degree detection sensor 220 is positioned as shown in FIG. 4C corresponding to the transparent parts 1 a, 4 a. Infrared rays are transmitted through transparent parts 1a and 4a.
And the light is received by the light receiving section 220b, and the degree of cure of the adhesive is detected in the stored state based on the amount of light received. As described above, the degree of curing of the adhesive is detected in the storage state, and when the degree of curing becomes equal to or higher than a predetermined degree, the sheet is cut into a card shape.

As shown in FIG. 4D, the degree of curing of the adhesive increases with time, but the predetermined hardness y
When it becomes 1, the hardness does not increase after the predetermined time t2 at that time even if the time elapses. Accordingly, when the hardness reaches a predetermined value y1, the first sheet material 1 and the second sheet material 4 bonded together in a sheet shape are taken out of the storage case 210, and cut into a card shape by the cutting unit 73, and then cut into a card shape.
Create a D card CA.

As described above, a predetermined number of sheets are cut and laminated and stored. After that, the degree of curing of the adhesive is detected in the stored state, and when the degree of curing becomes higher than the predetermined degree, the sheet is cut into a card shape. As a result, the ID card can be hardened sufficiently so that it does not adhere to the blade, and the ID card can be sent to the cutting process at an early stage.

When the degree of curing of the adhesive is about 95 degrees, when cutting into a card shape, the adhesive is not adhered to the cutting blade, so that the cutting becomes impossible and the end of the card is not crushed. .

In this embodiment, when the sublimation dye ink is heated by the thermal head and thermally diffused,
For example, vinyl chloride, polyacetal, polybutyral, and the like are known as good image receiving layers. Generally, these materials for the image receiving layer 2 are formed into powders, dissolved in a solvent such as isocyanate, applied by a gravure coater or the like, and then passed through a drying unit to volatilize the solvent. The image receiving layer preferably contains a metal ion-containing compound described in Japanese Patent Application No. 8-226895, pp. 5-22.

The film support 11 is composed of a resin film such as polyethylene terephthalate, polyethylene naphthalate, polypropylene, polystyrene, ABS, polyvinyl chloride, etc., and is mixed with white pigment to enhance the formed image. , Bubbles are folded into a honeycomb structure, for example, polyethylene terephthalate (PE)
T) or polypropylene (PP).

In order to form an image on the image receiving layer 2, the thermal diffusion amount of the sublimation dye ink is controlled by changing the pulse width applied to the thermal head so that a gradation is provided for each dot by the thermal head. At this time, if the film support 11 has a honeycomb structure containing air bubbles, the contact with the thermal head becomes uniform, and the heat insulating property is good, so that the dots can be cut well and a good image can be obtained.

In the present invention, the ID card CA has a first sheet material having an image receiving layer on one surface and a second sheet material superposed on each other via an adhesive layer with the image receiving layer outside. In addition, a form in which the IC member is sealed inside the adhesive layer is preferable. Therefore, the surface properties of the ID card surface may be set based on the surface of the image receiving layer of the first sheet material.

The adhesive constituting the adhesive layer is preferably a hot melt adhesive, and more preferably the hot melt adhesive is a reactive type.

As the hot melt adhesive used for the ID card of the present invention, a commonly used hot melt adhesive can be used. The main components of the hot melt adhesive include, for example, ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer,
Examples include polyolefins. As a polyamide-based hot melt adhesive, there is a macromelt series manufactured by Henkel Co., Ltd., and as a thermoplastic elastomer-based hot melt adhesive, Kariflex TR manufactured by Shell Chemical Company is used.
And Clayton series, Asahi Kasei Corporation's Tufprene, Fi
restoneSynthetic Rubber a
nd Latex Tuffden, Phillips P
Etroleum Solprene 400 series. Examples of polyolefin hot melt adhesives include Sumitomo Chemical's Sumitics, Chisso Petrochemical's Vistack, Mitsubishi Yuka's Yucatak, Henkel's Macromelt Series, Mitsui Petrochemical's Tuffmer, Ube Lexen's APAO, and Eastman Chemical's. East bond,
Hercules A-FAX and the like.

In the present invention, the hot melt adhesive is preferably of a reactive type. Reactive hot melt adhesive (hereinafter, referred to as
The reactive adhesive) is a type of adhesive in which the resin is melted and bonded, and then moisture is absorbed to cure the resin. Its characteristics are that it has a hardening reaction compared to ordinary hot melt, has a long bondable time as required, and has a high softening temperature after bonding, so it is durable and suitable for processing at low temperatures. Is mentioned. As an example of the reactive adhesive, there is an adhesive whose main component is a urethane polymer containing an isocyanate group at the molecular terminal, and the isocyanate group reacts with moisture to form a crosslinked structure. As a reactive adhesive usable in the present invention, Sumitomo 3M TE
030, TE100, Hibon 4 manufactured by Hitachi Chemical Polymer Co., Ltd.
820, Bondmaster 17 manufactured by Kanebo UNS Co.
Series 0, Macroplast made by Henkel
QR 3460 and the like.

Here, I using a hot melt adhesive was used.
An example of a method for manufacturing a D card will be described. In producing the ID card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, an ordinary method such as a roller method, a T-die method, and a die method is used. The IC unit is mounted between the upper and lower sheets coated with the adhesive. Before mounting, the applied adhesive may be heated in advance by a heater or the like. Then, press the IC unit attached between the upper and lower sheets with a press heated to the bonding temperature of the adhesive for a predetermined time, or while transferring the sheet in a constant temperature layer at a predetermined temperature instead of pressing with a press. You may appeal with a roll. It is effective to perform vacuum pressing in order to prevent air bubbles from entering during bonding. After laminating with a press or the like, it is punched into a predetermined shape and cut into a card shape to make a card. When a reactive adhesive is used as the adhesive, the adhesive is cured for a predetermined time and then cut into cards. It is effective to form a hole for supplying water necessary for the reaction around the card size of the sheets bonded together to promote curing.

It is also preferable that the adhesive constituting the adhesive layer is a thermosetting adhesive. Examples of the thermosetting adhesive include polyurethane, unsaturated polyester, and epoxy. Of these, epoxy is preferred.
Epoxy adhesives include Sumitomo 3M Sco
tch-Weld series, EP-00 manufactured by Cemedine
1, Araldite series manufactured by Ciba-Geigy Japan, 2000, 2100 series manufactured by Three Bond, Bond E series and quick set series manufactured by Konishi, Esdine series manufactured by Sekisui Chemical, and the like.

In this embodiment, a thermosetting resin or a reactive hot melt adhesive is used as the adhesive. As the thermosetting resin, a gel epoxy resin generally called B-stage epoxy is used.

As the reactive hot melt adhesive, He is used.
Polyamide-based hot-melt adhesive such as macromelt series manufactured by nkel, Calflex TR and Quinton series manufactured by Shell Chemical Co., Ltd., Tufprene manufactured by Asahi Kasei Corporation, Firestone Synthetic
Rubber and Latex Tuffden,
A thermoreversible elastomer-based reactive hot melt adhesive such as Phillips Petroleum's Solprene 400 series is preferred, and Sumitomo Chemical's Sumic, Chisso Petrochemical's Vistax, Mitsubishi Yuka's Yucatak, Reactive hot-melt bonding of polyolefins such as Macromelt series manufactured by Henkel, Tuffmer manufactured by Mitsui Petrochemical, APAO manufactured by Ube Lexen, Eastman Bond manufactured by Eastman Chemical, and A-FAX manufactured by Hercules. And TE030 and TE1 manufactured by Sumitomo 3M Limited.
00, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bondmaster 170 series manufactured by Kanebo NSC,
Macroplast QR346 manufactured by Henkel
A reactive hot-melt adhesive such as 0 is preferred, and a reactive hot-melt adhesive of an ethylene / vinyl acetate copolymer system and a polyester-based reactive hot-melt adhesive are preferred. The reactive hot melt adhesive has a property of absorbing moisture and hardening after bonding. The reaction type hot melt adhesive is 80 ° C.
It has the advantage of high stability under high temperature use of ° C.

It is preferable that an image is formed on the surface of the image receiving layer of the first sheet material by sublimation heat transfer, and it is particularly convenient to form an authentication identification image and a pattern of a part or the whole of the image receiving layer.

The distance from the surface of the first sheet material in contact with the adhesive layer to the IC member embedded in the adhesive layer is preferably at least 100 μm, more preferably at least 120 μm.

The image receiving layer of the first sheet material preferably contains a metal ion-containing compound. The metal ion-containing compound is very preferred in that it can form a complex with the transferred dye to form an image having excellent storage stability. Metal ion-containing compounds are, in particular, the I- of the periodic table
Compounds containing divalent or higher polyvalent metal ions belonging to Group VIII are preferred. As the metal, I to I of the periodic table
All of the divalent or higher polyvalent metals belonging to Group VIII can be mentioned. Among them, Al, Co, Cr, Cu, F
e, Mg, Mn, Mo, Ni, Sn, Ti and Zn are preferable, and Ni, Cu, Co, Cr and Zn are particularly preferable. The compound containing a metal ion is preferably an inorganic or organic salt of the metal and a complex of the metal. Among them, examples of the inorganic salt of the metal include metal halides (chloride, bromide and iodide), and the complex complex of the metal can be represented by the following general formula.

[M (Q₁) K (Q₂) M (Q₃) N] p + p (L⁻Wherein M is a metal ion of Ni, Cu, Co, Cr and Zn.
And Q₁~ Q ₃Is coordinated with the metal ion
Represent coordinating compounds that can be combined with each other.
Is described in, for example, "Chelate Chemistry (5) (Nankodo)"
Can be selected from the coordination compounds. That
Of these, a particularly preferable one is one which has a coordinate bond with a metal.
List coordination compounds having at least one amino group.
More specifically, ethylene diamine and its
Derivatives, glycinamide and its derivatives, picolinami
And its derivatives. Also, L₋Is
A counter anion capable of forming a complex, such as Cr, SO₄, C
IO₄, R-SO₃(R = alkyl group is allyl group)
Inorganic compound anions and benzenesulfonic acid derivatives, al
Organic compound anions such as a sulfonic acid derivative;
But particularly preferred is the tetraphenylboron anion
And its derivatives, and alkylbenzenesulfonic acid
Nion and its derivatives. k is an integer of 1, 2 or 3
M represents 1, 2 or 0, and n represents 1 or 0,
These compounds have a tetradentate or hexadentate complex represented by the above general formula.
Determined by coordination or Q₁~ Q₃Coordination
Determined by the number of children. p represents 1, 2 or 3
You.

The metal ion-containing compounds of this type include:
Examples include those exemplified in U.S. Pat. No. 4,987,049. The addition amount of the compound containing a metal ion is preferably 0.5 to 20 g / m ² , and 1 to 10 g / m ^2.
g / m ² is more preferred.

The metal complex represented by the above general formula will be described below.
However, the present invention is not limited to these.
No. 1. [Cu (NH₂CH₂CH₂NH₂)₂]
²⁺[(C₆H₅)₄B]^-2 2. [Ni (NH₂CH₂CH₂NH₂)₃]
²⁺[(C₆H₅)₄B]^-2 3. [Co (NH₂CH₂CH₂NH₂)]²⁺[(C
₆H₅)₄B]^-2 4. [Zn (NH₂CH₂CH₂NH₂)₃]
²⁺[(C₆H₅)₄B]^-2 5. [Ni (C₂H₅NHCH₂CH₂NH₂)₃]
²⁺[(C₆H₅)₄B] ^-2 6. [Ni (C₂H₅NHCH₂CH₂NHC₂H₅)
₃]²⁺[(C₆H₅) ₄B]^-2 7. [Ni (NH₂CH₂CH₂NHCH₂CH₂NH
₂)₂]²⁺[(C₆H ₅)₄B]^-2 8. [Ni (NH₂CH₂CH₂CH₂NH₂)₃]
²⁺[(N-C₄H₉)₄B]^-2 9. [Ni (C₂H₅NHCH₂CH₂NH₂)₂(N
H₂CH₂CH₂NH ₂)²⁺[(C₆H₅)₄B]
^-2 Further, in the present invention, a preferable example of the metal complex
The following general formula can be further exemplified.

M ²⁺ (X ⁻ ) _{2 In the} formula, M represents a metal ion of Ni, Cu, Co, Cr and Zn, and X represents the following general formula (1) which can form the above formula with the metal ion. Represents the coordinated coordination compound represented.

[0062]

In the formula, Z represents an alkyl group, an aryl group, an aryloxycarbonyl group, an alkoxy group, an alkoxycarbonyl group, a halogen atom and a hydrogen atom. R and R ′ represent an alkyl group and an aryl group, which may be the same or different, and R and Z or R ′
And Z may combine to form a sum, but when Z is a hydrogen atom, R and R 'are not both methyl.

The M is Ni, Cu, Co, Cr and Zn.
Of these, Ni and Zn are preferred from the viewpoint of the color of the compound containing the metal ion itself and the color tone of the chelated dye. X represents a coordination compound represented by the general formula (1) that can form the formula with the metal ion. Further, the compound containing a metal ion may have a neutral ligand depending on the central metal, and H ₂ O is mentioned as a typical ligand.

The following are specific examples of the compound containing a metal ion represented by the above general formula.

The amount of the compound containing a metal ion of this type is usually 0.5 to 20 g / m ² , preferably 1 to ²⁰ g / m ^2.
~15g / ^{m 2} is more preferable. Specific examples of the general formula include compounds described in JP-A-6-127156.

The details of the compounds contained in the above-mentioned metal ions are described in Japanese Patent Application No. 8-226895, pp. 5 to
It is described on page 22 and is preferably used in the present invention.

The film support 12 may have any function as its original required function. However, when the card is heated under pressure, the upper and lower materials are more symmetrical in terms of less warpage and flatness. As a result, the film support 11 is made of the same bubbled white PET as the film support 11.

The writing layer 5 is formed, for example, by dispersing calcium carbonate, silica fine particles and the like in a polyester emulsion. Like the image receiving layer 2 of the first sheet material 1, the writing layer 5 is dissolved in a solvent and applied by a gravure coater or the like. After that, it is formed by passing through a drying unit and evaporating the solvent. The thickness of the writing layer 5 is also substantially the same as that of the image receiving layer 2.

The first sheet material 1 and the second sheet material 4 are not limited to long sheets but may be single sheets.
Further, the curable resin provided on the first sheet material 1 and the second sheet material 4 is not limited to the thermosetting resin, but may be a hot melt or an ultraviolet curable resin.

After the IC unit 6 is sealed in the curable resin layer interposed between the first sheet material 1 and the second sheet material 4, the image receiving layer 2 is formed on the front surface and the writing layer 5 is formed on the back surface. However, the present invention is not limited to this, and the sheet of the image receiving layer 2 and the sheet of the writing layer 5 may be attached to each other. Thus, after enclosing the IC unit 6 in the curable resin layer,
The image receiving layer 2 and the writing layer 5 can be easily and reliably provided by coating or laminating the image receiving layer 2 on the front surface and the writing layer 5 on the back surface.

Further, a method of sealing an IC unit in an adhesive interposed between the first sheet material 1 and the second sheet material 4 and bonding them together, for example, particularly by using a reactive hot melt, Although preferred withstand even high temperatures, it is carbon dioxide CO ₂ in the reaction of the adhesive is curing occurs and,
It may take, for example, about one week until complete curing.
This was a problem when increasing the production number of D cards.

Further, the carbon dioxide gas CO ₂ is supplied to the first sheet material 1.
If it accumulates between the sheet material and the second sheet material 4 to cause irregularities, the quality (image quality) deteriorates, particularly when a face image is recorded. If the gas CO ₂ accumulates between the first sheet material 1 and the second sheet material 4 to cause irregularities, the quality (image quality) deteriorates remarkably and the problem is great, but the adhesive hardens sufficiently. In addition, an ID card can be produced in large quantities at an early stage, and an ID card with no quality (image quality) deterioration can be manufactured.

[0074]

As described above, according to the first aspect of the present invention, the sheet is cut and stored in a sheet shape, and thereafter, the amount of carbon dioxide gas or the amount of accumulated gas generated from the reactive hot melt adhesive in the stored state is detected. When a predetermined amount of carbon dioxide gas is generated, the sheet can be cut into a card shape. Therefore, the adhesive interposed between the first sheet material and the second sheet material may cause the card to be greatly deformed by cutting. The ID card can be hardened sufficiently so that it does not adhere to the blade, and the ID card can be sent to the cutting process at an early stage, so that it is possible to produce a large amount of the ID card and prevent deterioration in quality (image quality).

According to the second aspect of the present invention, a predetermined number of sheets are cut into sheets, laminated and stored, and then the degree of curing of the adhesive is detected in the stored state. The ID card can be cut in a short time so that it hardens sufficiently to prevent it from adhering to the blade, and the ID card can be sent to the cutting process at an early stage, so that a large amount can be produced and quality (image quality) can be prevented from being deteriorated. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing an ID card.

FIG. 2 is a view showing an ID card manufacturing apparatus.

FIG. 3 is a diagram illustrating a method of manufacturing the ID card according to the first embodiment.

FIG. 4 is a view for explaining a method of manufacturing an ID card according to claim 2;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first sheet material 2 image receiving layer 4 second sheet material 5 writing layer 6 IC unit CA ID card

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Tomomi Yoshizawa 1 Sakuracho, Hino-shi, Tokyo Konica Corporation (72) Inventor Hiroshi Watanabe 1 Sakuramachi, Hino-shi, Tokyo Konica Corporation F-term (reference 2C005 HA30 HB01 JA26 KA02 KA03 KA38 KA42 KA46 LA03 LA08 LA09 LA26 LB08 MA40 MB01 NA08 NA09 NB13 NB37 PA03 PA04 PA22 PA23 RA04 RA08 RA09 RA16 RA30 5B035 AA00 AA04 BA05 BB00 BB09 BB11 BC01 CA01

Claims (2)

[Claims] 1. A method for manufacturing an ID card in which an IC unit is sealed in an adhesive layer interposed between a first sheet material and a second sheet material, wherein the IC unit is formed on the first sheet material. After enclosing or placing the IC unit in or on the reactive hot melt adhesive, the second sheet material is attached,
Thereafter, the sheet is cut and stored in the form of a sheet, and thereafter, the amount of carbon dioxide gas or the cumulative amount of gas generated from the adhesive in the stored state is detected. A method for manufacturing an ID card. 2. A method of manufacturing an ID card in which an IC unit is sealed in an adhesive layer interposed between a first sheet material and a second sheet material, wherein the IC unit is formed on the first sheet material. After enclosing or placing the IC unit in or on the adhesive, a second sheet material is pasted, then cut into sheets, laminated and stored for a predetermined number, and then cured in the stored state. A method of manufacturing an ID card, comprising detecting a degree of curing and, when the degree of curing becomes equal to or more than a predetermined degree of curing, cutting the sheet into a card shape.