JPH11345813A - Chip feeding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip feeding apparatus for uniformly blowing warm air to the entire lower face of a wafer sheet and expanding the overall wafer sheet. SOLUTION: A warm air diffusing member 50 is provided between a wafer sheet 33 and a hot gun 34. The warm air blown up from the hot gun 34 is diffused by the warm air diffusing member 50. Then, the warm air is blown at the entire lower face of the wafer sheet 33 uniformly to warm the entire wafer sheet 33. An expanding unit 40 is operated to push a ring 42 downward and causes the wafer sheet 33 to expand. In this way, chips (P) on the wafer sheet 33 are separated from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip supply device for supplying chips on a wafer to a transfer head.

[0002]

2. Description of the Related Art Chips of a wafer are attached to a wafer sheet stretched over a wafer ring, and are pushed up from below by pins of a push-up unit, and the pushed-up chips are vacuum-adsorbed by a nozzle of a transfer head. It is to be picked up. Then, the picked-up chip is mounted on a substrate such as a printed circuit board or a lead frame after correcting the displacement.

A wafer sheet is stretched on a wafer ring. When chips on the wafer sheet are close to each other,
It is difficult to push up the chip with the pins of the push-up unit. Therefore, in order to separate the chips attached on the wafer sheet from each other, the wafer sheet is expanded using an expand unit. Further, the expansion of the wafer sheet by the expand unit may be performed in a place different from the chip push-up unit or in a side portion of the chip push-up unit.

[0004] In the latter case, warm air is blown up from a hot gun provided below the wafer sheet, and the warm air is used to warm and soften the wafer sheet, and then the wafer sheet is mechanically pulled to expand. ing.

[0005]

In recent years, the size of a wafer sheet has been increasing. When expanding such a large wafer sheet, the warm air must be uniformly blown to the entire lower surface of the wafer sheet to uniformly warm the entire wafer sheet, thereby uniformly expanding the entire wafer sheet. However, with a conventional hot gun, it is difficult to evenly blow warm air over the entire lower surface of a large wafer sheet, so that the entire wafer sheet cannot be sufficiently expanded, and all chips must be separated sufficiently and sufficiently. It was difficult.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip supply apparatus capable of sufficiently blowing the hot air evenly over the entire lower surface of a wafer sheet to sufficiently expand the entire wafer sheet.

[0007]

According to the present invention, there is provided an expand unit for expanding a wafer sheet stretched over a wafer ring, and a blower which is disposed below the wafer sheet expanded by the expand unit and blows up hot air. A hot gun for warming the wafer sheet, a movable table for transferring the wafer after the expansion of the wafer sheet by the expanding unit to a position above the chip push-up unit, and a hot air blown from the hot gun provided between the wafer sheet and the hot gun. A chip supply device comprising: a hot air diffuser that diffuses wind and blows the entire lower surface of the wafer sheet.

Preferably, the hot air diffuser has a shape in which a substantially conical body is inverted, and a hot air guide surface having a different gradient is formed on an outer surface thereof.

Preferably, the hot air diffuser comprises a plurality of fins rotated by the hot air blown from the hot gun.

[0010] In the above configuration, the warm air blown up from the hot gun is diffused by the warm air diffuser, and is blown onto the entire lower surface of the wafer sheet to uniformly warm the entire wafer sheet. Then, the wafer sheet is mechanically pulled and expanded to separate the chips on the wafer sheet from each other. The wafer with the expanded wafer sheet is sent above the chip push-up unit and supplied to the transfer head.

[0011]

(Embodiment 1) FIG. 1 is a perspective view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, FIG. 2 is a side view of the expand unit and a hot gun, and FIG. FIG. 4 is a perspective view of the diffuser and the hot gun, and FIG. 4 is a sectional view of the same hot air diffuser.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a transport path of a lead frame 10, above which a first transfer head 1 is provided.
1, a second transfer head 12 and a bond application head 13 are provided. The first transfer head 11, the second transfer head 12, and the bond application head 13 are the same movable table 1.
4 and is driven by a driving unit (not shown) to simultaneously reciprocate in a direction orthogonal to the transport path 1.

The first transfer head 11 picks up the chip P provided in the chip supply device 30 by vacuum suction at the lower end of the nozzle 15, and transfers the chip P onto the displacement correction table 22. The chip P transferred to the table 22 is pressed against the chip 23 for correcting the position shift, and the position shift of the chip P is corrected. The second transfer head 12 vacuum-adsorbs and picks up the chip P on the misalignment correction table 22 at the lower end of the nozzle 16 and transfers the chip P onto the lead frame 10. The bond application head 13 is provided with the nozzle 2
A bond is discharged from No. 4 and applied to the lead frame 10. The chip P is mounted on this bond by the second transfer head 12. Note that another type such as a transfer pin type may be used as the bond application head.

Reference numeral 25 denotes an X table, and 26 denotes a Y table. The position of the transport path 1 is adjusted by moving the transport path 1 in the X direction or the Y direction. Reference numeral 27 denotes a first camera, which recognizes the chips P on the wafer sheet of the chip supply device 30. Reference numeral 28 denotes a second camera that recognizes the lead frame 10 and the chip P transferred on the lead frame 10. Reference numeral 3 denotes a magazine in which the lead frames 10 are stored. The lead frames 10 are sent out from the magazines 3 to the transport path 1 one by one. The lead frame 10 on which the chip P is mounted
Is collected in the other magazine 2.

Next, the chip supply device 30 will be described. In FIG. 1, reference numeral 31 denotes a movable table on which an expanding unit 40 is provided. The expand unit 40 holds the wafer 32. The expand unit 40 moves on the movable table 31 in the direction of arrow A, and selectively moves the wafer 32 to a position above the hot gun 34 and a position above the chip push-up unit 37. The push-up unit 37 is disclosed in, for example, Japanese Patent Laid-Open No. 2-689.
No. 38, for example, a pin is lifted from a pepper pot 38 and a chip P on a wafer sheet is raised.
Thrust up. The first transfer head 11 vacuum-adsorbs the chip P pushed up by the pin to the lower end of the nozzle 15 and picks up the chip P.

In FIG. 2, a wafer 32 has a large number of chips P adhered on a wafer sheet 33. The wafer sheet 33 is stretched on a wafer ring 41. The wafer sheet 33 is mounted on a ring 42. The wafer ring 41 is supported by a holding ring 43. A vertical feed screw 44 is inserted into the retaining ring 43. The ring 42 is connected to a nut body 45 mounted on the upper end of the feed screw 44. The feed screw 44 has a pulley 46
The pulley 46 is attached to the timing belt 4.
7 is tuned.

One (left side in FIG. 2) feed screw 44
Is rotated by a motor 48. 49 is a transmission belt. When one feed screw 44 rotates, the rotation is transmitted to the other (right side in FIG. 2) feed screw 44 via the timing belt 47. When the feed screw 44 rotates forward and backward, the nut body 45 moves up and down along the feed screw 44. When the nut body 45 is lowered, the ring 42 is also lowered, the wafer sheet 33 is expanded, and the chips P stuck on the upper surface thereof are separated from each other.

In FIG. 2, the hot gun 34 is a cylindrical body, and a heater 35 is built therein. Air is sent from the duct 36 to the hot gun 34 (see the broken arrow). The supplied air is heated by the heater 35, and the warm air blows upward from the upper end of the hot gun 34. The duct 36 is connected to an air supply unit (not shown).

A hot air diffuser 50 is provided between the wafer 32 and the hot gun 34. The hot air diffuser 50 has a shape in which a substantially conical body is inverted, and a plurality of grooves 51 for guiding hot air are formed on the surface thereof in a vertical direction. The groove 51 guides the warm air blown up from below to diffuse upward. The hot air diffuser 50 is mounted on a bracket 52.

This electronic component mounting apparatus is configured as described above, and the operation will be described next. When the wafer sheet 33 is stretched on the wafer ring 41, the wafer sheet 33 is positioned above the hot gun 34. FIG. 2 shows the state at this time. So from the duct 36 hot gun 3
The air is sent to 4 and is heated by the heater 35 and blown up. In FIG. 4, the air blown upward is diffused by the hot air diffuser 50 and is blown against the lower surface of the wafer sheet 33.

In FIG. 4, the gradient of the surface B of the groove 51 of the hot air diffuser 50 is steeper than the gradient of the outer surface A.
The outer surface A and the surface B serve as hot air guide surfaces. Therefore, the warm air that hits the outer surface A greatly spreads outward as indicated by the dashed arrow a, and warms the outer peripheral portion of the wafer sheet 33. The warm air hitting the surface B of the groove 51 is indicated by a dashed arrow b
As shown in the figure, the wafer 51 is guided in the groove 51 and rises almost directly upward to warm the vicinity of the center of the wafer sheet 33. Therefore, warm air is blown almost uniformly over the entire lower surface of the wafer sheet 33, and the entire wafer sheet 33 is uniformly heated. Thus, by forming the warm air guide surfaces having different gradients on the surface of the warm air diffuser 50, the warm air blown up from below is diffused over the entire lower surface of the wafer sheet 33 to uniformly warm the entire lower surface. be able to.

In FIG. 2, the motor 48 is driven to rotate the feed screw 44, the nut body 45 is lowered, and the peripheral edge of the wafer sheet 33 is pushed down by the ring 42 to expand the wafer sheet 33. Thus, the chips P stuck on the wafer sheet 33 are separated from each other. When the wafer sheet 33 is expanded as described above, the blowing of warm air from the hot gun 34 is stopped, and the movable table 31 is driven to drive the wafer sheet 33.
Is moved above the chip push-up device 37.

Next, the pins P are protruded from the pepper pot 38 to push up the chips P on the wafer sheet 33, and the chips P of the first transfer head 11 are vacuum-adsorbed and picked up. The chip P picked up by the first transfer head 11 is transferred to the position shift correction table 22 and the position shift is corrected.
6 is picked up by vacuum suction and the lead frame 1
Transferred to 0.

(Embodiment 2) FIG. 5 is a perspective view of a hot air diffuser and a hot gun according to Embodiment 2 of the present invention. The hot air diffuser 53 includes a plurality of fins 54. Hot gun 3
When the hot air is blown up from the wafer sheet 4, the hot air diffuser 53 rotates, and the hot air rises while being diffused widely, and the wafer sheet 3 rises.
3 is uniformly blown onto the entire lower surface to uniformly warm the entire wafer sheet 33. Therefore, as in the case of Embodiment 1,
The motor 48 is driven to expand the wafer sheet 33.

[0025]

According to the present invention, the warm air blown up from the hot gun is diffused by the warm air diffuser and is blown onto the entire lower surface of the wafer sheet to uniformly warm the entire wafer sheet. A reasonably uniform expansion allows all chips to be pulled apart from one another, and in particular even large wafer sheets can be uniformly heated.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view of the expanding unit and the hot gun according to the first embodiment of the present invention.

FIG. 3 is a perspective view of a hot air diffuser and a hot gun according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of the hot air diffuser according to the first embodiment of the present invention.

FIG. 5 is a perspective view of a hot air diffuser and a hot gun according to a second embodiment of the present invention.

[Explanation of symbols]

 33 Wafer sheet 34 Hot gun 40 Expanding unit 50,53 Hot air diffuser 51 Groove 54 Fin

Claims (3)

[Claims] 1. An expand unit for expanding a wafer sheet stretched over a wafer ring, a hot gun disposed below the wafer sheet expanded by the expand unit and warming the wafer sheet by blowing up hot air, and an expand gun. A movable table for transferring the wafer after the expansion of the wafer sheet by the unit to a position above the chip push-up unit, and a lower surface of the wafer sheet disposed between the wafer sheet and the hot gun to diffuse hot air blown up from the hot gun. A chip supply device, comprising: a hot air diffuser that blows the entire surface. 2. The hot air diffuser has a shape in which a substantially conical body is inverted, and a warm air guide surface having a different gradient is formed on an outer surface thereof. Chip feeder. 3. The chip supply device according to claim 1, wherein said hot air diffuser comprises a plurality of fins rotated by hot air blown from said hot gun.