JPH11326431A - Inspecting method for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control a condition for an inspection device all the time, and to reduce reinspection caused by abnormality of the inspection device. SOLUTION: This method is provided with a self-diagnostic process (1-5) for diagnosing the presence of abnormally functioning condition for own inspection device in every optionally set number of inspection pieces, and a reinspection process (1-10) for reinspecting again only the set number of inspection pieces after a function of the inspection device is returned to a normal condition when the function of the device is determined to be abnormal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting an electronic component, which comprises a step of self-diagnosing whether or not an inspection apparatus is functioning properly for each arbitrarily set number of inspections.

[0002]

2. Description of the Related Art A conventional method for inspecting an electronic component of this type will be described with reference to the drawings. FIG. 6 is a flowchart for explaining the inspection method. That is, in this inspection method, first, in step (6-1), the power of the inspection apparatus is manually turned on. Next, in a step (6-2), a check is made as to whether or not the self-test function is operating normally by a calibration circuit built in the test apparatus itself.

In such a case, for example, if the voltage between both ends when a constant current is supplied to a predetermined standard resistor is within a permissible value as compared with a predetermined value, the process proceeds to the next step (6-3). Then, the inspection and measurement of the inspection object are started. On the other hand, if the result is out of the range of the allowable value, an abnormality is displayed in the step (6-7), and an adjustment is made so that the function of the inspection apparatus itself is returned to normal. Actually, as shown in FIG. 4, the products 2 to be inspected are placed on the belt conveyor 1 of the inspection device that moves intermittently, and each of the products 2 The above-mentioned self-diagnosis is performed in parallel for each of the inspection stations (A, B, C, D, E...) Provided.

[0004] Then, necessary corrections are made to the inspection stations determined not to be operating normally. If all the inspection stations are normal (GO display), the measurement is performed in the above-mentioned step (6-3). Be started. And
The inspection object 2 is intermittently moved by the belt conveyor 1, and different inspection items are sequentially inspected from the inspection station A to the inspection station E during the stop period of the belt conveyor 1.

At the end of the inspection, the process proceeds to step (6-4),
The calibration circuit of the inspection apparatus is operated again to check whether all the inspection stations are functioning properly. If it is determined that the inspection device is functioning normally, the process proceeds to step (6-5), where the inspection-completed product is transported to the next process (step (6-5)). Turn off the power (step (6-6)).

On the other hand, if it is determined in step (6-4) that any of the inspection stations is not functioning normally, all the products from the start of measurement to the end of measurement are re-inspected in step (6-8). I do.

[0007]

As described above, in the conventional inspection method, the calibration circuit for confirming the function of the inspection apparatus is generally performed at the beginning and the end of the inspection, and is performed before the start of the measurement. When the measurement is started with normal (OK) confirmation, and “OK” is confirmed again in the function confirmation after the completion of the inspection, it has been determined that all the inspected products have been inspected normally. However, if the function confirmation inspection after the inspection is “NG”, it means that there is an abnormality in the inspection equipment, and all products that have been inspected are subject to re-inspection. The efficiency was reduced.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and constantly manages the state of each inspection station of an inspection apparatus, detects an abnormality of the inspection apparatus at an early stage, and performs inspection. It is an object of the present invention to provide an electronic component inspection method capable of reducing the total number of product re-inspections and improving the inspection efficiency.

[0009]

An electronic component inspection method according to the present invention is an electronic component inspection method in which characteristics of electronic components such as semiconductor elements and resistors are automatically inspected by an inspection apparatus. A self-diagnosis step of diagnosing whether or not the self-inspecting apparatus is functioning properly for each number; and, if the function of the examination apparatus is determined to be abnormal by the self-diagnosing step, the function of the examination apparatus is changed After returning to a normal state, a re-inspection step of re-inspection of only the previously set number of inspections is included.

[0010] In the electronic component inspection method according to the present invention, the self-diagnosis step is performed using a standard sample product which is predetermined in advance.

Further, the method for inspecting an electronic component according to the present invention comprises:
The inspected product stops and moves intermittently, and inspects a plurality of inspection items for the inspected product during the stop period of the inspected product. It is characterized by being performed.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for inspecting an electronic component according to the present invention will be described below with reference to the drawings. FIG. 1 is a flowchart showing a procedure of an electronic component inspection method according to the first embodiment of the present invention.
In FIG. 1, first, the power supply of the inspection apparatus is turned on in a step (1-1). Next, the process proceeds to step (1-2), where the operation of the calibration circuit for checking the function of the inspection device is started, and in the case of [NG], an error is displayed (step (1-9)). The above is the same as in the prior art. Next, in the step (1-3), self-diagnosis is performed at the start of measurement.

This step is actually performed according to the procedure shown in FIG. That is, the switching unit 4 connected to the inspection device 3 automatically switches to the self-diagnosis station side 5 to measure the characteristic value of the self-diagnosis sample product. In this case, for example, if the product to be inspected is a semiconductor device, at the start of a new lot, characteristics are measured under the measurement conditions of the lot, and the measured values are stored as standard values. In addition, since a plurality of inspection items are actually inspected by a plurality of inspection stations 3, a standard self-diagnostic sample product corresponding to each inspection station and the inspection item is prepared.
The measured value is stored in a personal computer (PC).

Next, the switch 4 automatically switches to the measuring station side 6, and the process shifts to the step (1-4) in FIG. 1 to start the measurement of the inspection object. In the above case, the count number of the inspected product is set in advance, and when the count value reaches the expected count number, the switching unit 4 switches to the self-diagnosis measurement station 5 again, and the first self-diagnosis sample product The property is measured again. Then, the value is compared with the first measurement value stored in the PC, and if the value is within a predetermined range, it is determined that the inspection apparatus is functioning normally and “GO” is determined.
And switch to the measuring station side 6 by the switch 4;
Returning to the step (1-4), the inspection of the inspection object is continued.

The above cycle is repeated for each predetermined number of counts. When the inspection of one lot is completed, the process proceeds to step (1-6), and the measurement is stopped. Perform a final self-diagnosis and if it is "GO",
In step (1-8), the power of the inspection apparatus is cut off to end the inspection.

On the other hand, as a result of the self-diagnosis after the predetermined number of counts, when it is determined that the function of the inspection apparatus is abnormal, an abnormality is displayed in step (1-9) and the inspection apparatus, that is, the abnormality is determined. After the displayed function of the inspection station is normally restored, in the step (1-10), only the inspected product is re-inspected from "OK" at the start of measurement to "NG" in the self-diagnosis. In this way, by dividing one lot into a plurality of parts and performing a self-diagnosis of the function test of the test apparatus itself, when a function abnormality of the test apparatus is discovered in the final stage, the whole lot is re-tested. As a result, inspection man-hours can be reduced and inspection efficiency can be improved.

FIG. 5 is a time chart showing an example of the measurement timing. In the figure, a indicates the drive timing of the inspection apparatus, and the transport and stop of the inspection object are repeated, and the inspection apparatus is driven intermittently. b indicates the timing of the normal measurement of the inspection object, and the normal measurement is performed during the stop period of the inspection device. In addition, c indicates the timing of the self-diagnosis measurement, which is performed during the transport of the inspected product. Therefore, the inspection efficiency can be improved as a whole as compared with the case where the self-diagnosis time is separately set while the inspection object is stopped. d indicates a determination signal of the self-diagnosis result. If the determination result is “NG”, a stop signal is output to stop the entire inspection apparatus.

Next, FIG. 3 shows another embodiment of the present invention. In the previous embodiment, in the self-diagnosis step, the measurement station for self-diagnosis is switched to use a standard sample product for self-diagnosis. However, this embodiment is characterized in that a calibration circuit built in the inspection apparatus itself is used without using such a sample product. The inspection procedure in the above case is roughly as follows.

That is, in step (3-1), the power of the inspection apparatus is turned on, and then, the process proceeds to step (3-2), where the calibration circuit for checking the function of the inspection apparatus built in the inspection apparatus itself is operated.
If there is no abnormality in the function, the result is “GO”, and the measurement of the inspected product is started in step (3-3).

Next, when the predetermined number of counts is reached, the measurement of the product to be inspected is terminated (step (3-4)), and the process returns to step (3-2) to confirm the function of the inspection device. Here, if normality is confirmed, the inspection is continued, and the measurement of the DUT is performed up to the next count number. The above cycle is repeated by dividing one lot into a plurality. If an abnormality is found in step (3-2), the result is "NG",
After the abnormality is displayed in the step (3-6) and the function of the inspection apparatus is normally restored, the measurement is performed again through the above-described steps. According to the above-described embodiment, since the calibration circuit built in the inspection apparatus itself is used, there is no need to separately prepare a standard sample product, and there is an advantage that complexity can be avoided.

[0021]

As described above, according to the present invention, a self-diagnosis step for checking whether or not the function of the inspection apparatus is operating normally is provided in the course of the inspection step. In that case, only the inspected products before this stage are re-inspected. For this reason, the inspection labor can be reduced significantly and the inspection efficiency can be improved as compared with the labor of the complete inspection performed when an abnormality of the inspection device is found at the final stage of the inspection of all the inspections. There are excellent effects such as being able to.

[Brief description of the drawings]

FIG. 1 is a flowchart showing an embodiment of an electronic component inspection method according to the present invention.

FIG. 2 is a flowchart showing details of a procedure in the inspection method.

FIG. 3 is a flowchart showing another embodiment of the electronic component inspection method of the present invention.

FIG. 4 is an explanatory diagram of an inspection device for implementing the above inspection method.

FIG. 5 is a timing chart of the inspection apparatus.

FIG. 6 is a flowchart showing a conventional electronic component inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Belt conveyor 2 Product to be inspected 3 Inspection device 4 Switching device 5 Self-diagnosis measurement station 6 Measurement station 1-2 Calibration circuit operation start process for inspection device function check 1-3 Self-diagnosis process at measurement start 1-4 Measurement start process 1-5 Self-diagnosis process during measurement 1-6 Measurement stop process 1-7 Self-diagnosis process at the end of measurement 1-8 Power-off process of inspection equipment 1-9 Abnormality display process 1-10 Self-diagnosis OK-NG product re-inspection process

Claims (3)

[Claims] 1. An electronic component inspection method for automatically inspecting characteristics of electronic components such as a semiconductor element and a resistor by an inspection device, wherein the inspection device operates normally for each arbitrarily set number of inspections. A self-diagnosis step of diagnosing whether or not the function of the inspection apparatus is determined to be abnormal by the self-diagnosis step, and after returning the function of the inspection apparatus to a normal state, only the number of inspections previously set again And a reinspection step of reinspection of the electronic component. 2. The electronic component inspection method according to claim 1, wherein the self-diagnosis step is performed using a predetermined standard sample product. 3. The inspection apparatus intermittently repeats stop-movement, inspects a plurality of inspection items for an inspection object during a stop period of the inspection apparatus, and the self-diagnosis step includes: 3. The electronic component inspection method according to claim 1, wherein the inspection is performed during the movement of the electronic component.