JPH11311801A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a driving IC and a printed board from being fixed owing to resin coating by forming the printed board so that the side on a liquid crystal panel side except a part overlapping with at least the driving IC is separated from a resin-coated area. SOLUTION: The printed board 6 is arranged on the left-end side of a transparent substrate and a semiconductor device (driving IC) 5 is arranged over the printed board 6 and liquid crystal panel. The semiconductor device 5 is formed by mounting a semiconductor chip 5B on a flexible substrate 5A where a wiring layer with a terminal is formed. Then the printed board 6 is provided with a cut 6A on a side of the liquid crystal display panel side of the part except the part overlapping with the semiconductor device 5, e.g. the part between adjacent semiconductor devices 5. This cut 6A prevents resin 10 from running to the back side of the semiconductor device 5 (back side of flexible substrate 5A) and sticking on the printed board 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display panel, a printed circuit board, and a driving device.
C).

[0002]

2. Description of the Related Art In a liquid crystal display panel, a liquid crystal layer disposed between a pair of transparent substrates is light-modulated by an electric field for each pixel region, and signal wiring for generating an electric field in the pixel region is provided. It is a configuration that has been pulled out.

For this reason, a circuit for driving a liquid crystal display is required for each signal wiring separately from the liquid crystal display panel, and this circuit is formed into a semiconductor device, and an output thereof is input to each signal wiring. .

[0004] For this reason, a printed circuit board on which a power supply circuit and the like are mounted is arranged on the side of the liquid crystal display panel, and a semiconductor device (hereinafter, referred to as a driving IC) straddles the liquid crystal display panel and the printed circuit board. The input terminals are connected to terminals of a printed circuit board, and the output terminals are connected to terminals of a liquid crystal display panel.

Here, the drive IC is manufactured by a so-called tape carrier method, and has a configuration in which a semiconductor IC is mounted on a flexible substrate on which a wiring layer with terminals is formed.

In this case, it is common practice to apply a resin to a portion of the drive IC close to the side of the liquid crystal display panel.

The reason is that a solder resist is formed on the surface of the flexible substrate of the drive IC so that the terminals are exposed, but the drive IC is displaced when the drive IC is aligned with the liquid crystal display panel. Since a part of the terminal of the IC is exposed, the resin is applied in order to prevent a short circuit or the like due to foreign matter from the outside.

[0008]

However, in the liquid crystal display device configured as described above, when the resin is applied, the liquid crystal display device goes around from both ends of the driving IC (more precisely, the flexible substrate) to the back side, and It may adhere to the printed circuit board and solidify as it is.

In this case, for example, when connecting another connector to the connector mounted on the printed circuit board, the force concentrates on the fixed portion between the drive IC and the printed circuit board, and the flexible substrate in the fixed portion is connected. Have been pointed out as a result of the bending of the wiring layer.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a driving method by applying resin.
An object of the present invention is to provide a liquid crystal display device in which sticking between C and a printed circuit board is prevented.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows. That is, the liquid crystal display includes a liquid crystal display panel, a printed circuit board, and a drive IC. The drive IC is disposed across the liquid crystal display panel and the printed circuit board. The input terminal is connected to the terminal of the printed circuit board and the output terminal is connected to the output terminal. Is connected to a terminal of the liquid crystal display panel, and a resin is applied to a portion of the drive IC surface adjacent to the liquid crystal display panel, wherein the printed circuit board is
The liquid crystal display panel is formed so that at least a side of the liquid crystal display panel side other than a portion overlapping with the drive IC is separated from the resin application region.

In the liquid crystal display device configured as described above, even if the applied resin reaches the back surface from both sides of the drive IC, since the printed circuit board does not exist there, the resin adheres to the printed circuit board. Will not be.

Therefore, the drive IC and the printed circuit board are not fixed in a portion other than the terminal portion.

This means that the force generated when connecting another connector to the connector fixed to the printed circuit board is one.
It is transmitted to the whole drive IC without concentrating on the various places.

Accordingly, since the drive IC is curved but not bent, the disconnection of the wiring layer can be prevented.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the liquid crystal display device according to the present invention will be described below with reference to the drawings. Embodiment 1 FIG. First, FIG. 1 is a plan view showing a liquid crystal display panel to which the present invention is applied, for example, a liquid crystal display panel called a simple matrix system.

In FIG. 1, there are transparent substrates 1A and 1B which are arranged to face each other via a liquid crystal.
A and 1B have the right end and the lower end substantially the same in the figure, and the transparent substrate 1B is the transparent substrate 1 at the left end.
The transparent substrate 1A is formed to slightly protrude from the transparent substrate 1B at the upper end side while being formed to slightly protrude from A.

The areas of the transparent substrate 1A and the transparent substrate 1B facing each other are areas in which liquid crystal is sealed, and this area is defined by the sealing material 2 (indicated by a dashed line in the figure).

On the liquid crystal side surface of the transparent substrate 1A,
A plurality of wiring layers 3 extending in the y direction and extending in the x direction are formed, and a plurality of wiring layers 4 extending in the x direction and extending in the y direction are provided on the surface of the transparent substrate 1B on the liquid crystal side. Are formed.

The intersections of the wiring layer on the transparent substrate 1A side and the wiring layer on the transparent substrate 1B side each constitute a pixel region, and the light transmittance of the liquid crystal by the electric field due to the potential difference between each wiring layer in this pixel region. Can be controlled.

The wiring layer 3 provided on the transparent substrate 1A extends to a region protruding from the transparent substrate 1B, and a terminal for connecting to an external circuit is provided in this extended portion.

In this case, a plurality of wiring layers 3 adjacent to each other
Are grouped, and each of the wiring layers 3 is connected to the corresponding terminal so as to converge at a portion approaching the terminal.

This is because the terminals are connected to an external circuit composed of a semiconductor device, and the electrode pitch is formed smaller than the pitch of the wiring layer 3.

Similarly, the wiring layer 4 provided on the transparent substrate 1B extends to a region protruding from the transparent substrate 1A, and a terminal for connecting to an external circuit is provided in this extended portion. ing.

Also in this case, a plurality of wiring layers 4 adjacent to each other are grouped, and each of the wiring layers 4 is connected to the corresponding terminal so as to converge at a portion near the corresponding terminal. ing.

The reason is that the terminals are connected to an external circuit formed of a semiconductor device, and the electrode pitch is formed smaller than the pitch of the wiring layer 4.

FIG. 2 is a plan view showing an embodiment in which a semiconductor device (drive IC) 5 as an external circuit is connected to the above-mentioned liquid crystal display panel. FIG. 3 is a sectional view taken along the line III-III in FIG.

In FIG. 1, the semiconductor device 5 shows a liquid crystal drive circuit for supplying a signal to each wiring layer 4 of the transparent substrate 1B, and a plurality of semiconductor devices 5 are provided for each of the divided wiring layers.

In this case, a printed circuit board 6 is disposed on the left side of the transparent substrate 1B, and the semiconductor device 5 is disposed over the printed circuit board 6 and the liquid crystal display panel.

Here, the semiconductor device 5 is manufactured by, for example, a tape carrier method, and is formed by mounting a semiconductor chip 5B on a flexible substrate 5A on which a wiring layer with terminals is formed.

Here, although not shown, a wiring layer is formed on the surface of the flexible substrate 5A on which the semiconductor chip 5B is mounted, and this wiring layer transmits signals from the printed circuit board 5 to input electrodes of the semiconductor chip 5B. And a plurality of wiring layers for guiding signals from the output electrodes of the semiconductor chip 5B to terminals on the liquid crystal display panel side.

In the former wiring layer, the terminal connected to the terminal on the printed circuit board 6 side is formed on the side opposite to the surface on which the semiconductor chip 5B is mounted, whereas in the latter wiring layer, The terminal connected to the terminal on the liquid crystal display panel side is formed on the surface side on which the semiconductor chip 5B is mounted.

Each terminal of the semiconductor device 5
As shown in FIG. 3, the connection portion with the terminal on the liquid crystal display panel side is press-bonded via an anisotropic conductive film 8, and the connection portion with the terminal on the printed circuit board 6 side is fixed via solder 9. .

In this embodiment, as shown in FIG. 2, the printed circuit board 6 has a liquid crystal display at another portion except for a portion overlapping with the semiconductor device 5, for example, a portion between the semiconductor device 5 and the adjacent semiconductor device 5. A notch 6A is provided on the panel side.

The notch 6A is provided with a resin 10 to be described later.
Is the back side of the semiconductor device 5 (the back side of the flexible substrate 5A)
This is a means for preventing it from getting around and adhering to the printed circuit board 6, and its effect will be described later in detail.

The resin 10 is applied to a portion of the surface of the semiconductor device 5 (flexible substrate 5A) adjacent to the liquid crystal display panel. In this case, the coating is generally performed in one direction across the plurality of semiconductor devices 5 along the end surface of the liquid crystal display panel.

As described above, the resin 10 has a solder resist formed on the surface of the flexible substrate 5A of the semiconductor device 5 so that the terminals are exposed. Since a part of the terminal of the semiconductor device 5 is exposed from the liquid crystal display panel due to a positional shift at the time of alignment (particularly, a shift in the x direction in the figure), a short circuit due to foreign matter from the outside may be caused at this part. Provided to prevent.

FIG. 4 is a diagram showing the inconvenience when the notch 6A described above is not provided on the printed circuit board 6. As shown in FIG.

When there is no notch 6A as shown in the figure, when the resin 10 is applied, the resin 10 flows between the semiconductor device 5 and another semiconductor device 5 adjacent thereto. It will penetrate between the back side of the flexible substrate 5A and the surface of the printed circuit board 6.

When the resin 10 is solidified in such a state, a local fixing portion is formed between the flexible substrate 5A and the printed circuit board 6.

In this case, for example, when another connector is connected to the connector 12 mounted on the printed circuit board 6, the force concentrates on the fixing portion between the flexible board 5A and the printed circuit board 6, and the force is increased. As a result of bending of the flexible substrate 5A at the fixing portion, disconnection of the wiring layer on the flexible substrate 5A cannot be avoided.

In the above-described embodiment, the above-mentioned inconvenience is avoided by cutting out a portion which adheres to the printed circuit board 6 due to the inflow of the resin 10 in advance.

Further, in this embodiment, since the notch is sufficient without reducing the area of the printed circuit board 6, the electronic components to be incorporated in the printed circuit board 6 (especially on the back side) are not used. Because it can be installed as it is,
In particular, this is not inconvenient.

Embodiment 2 FIG . FIG. 5 shows another embodiment of the liquid crystal display device according to the present invention, and corresponds to FIG. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG.

The difference from the case of FIG.
Is arranged closer to the liquid crystal display panel.

In this case, there is an effect that the so-called frame of the liquid crystal display device can be reduced. here,
The frame refers to a region from the outer frame of the liquid crystal display device to the display portion, and has an effect such that the area of the display portion can be increased by reducing the size of the frame.

In the case of such a configuration, the printed circuit board 6
The above-mentioned notch 6A formed in the above is not necessarily limited to the notch 6A, but may be a hole 6B as shown in FIG.

Further, in this embodiment, since the notch is sufficient without reducing the area of the printed circuit board 6, the electronic components to be incorporated in the printed circuit board 6 (especially on the back side) are not used. Because it can be installed as it is,
In particular, this is not inconvenient.

Embodiment 3 FIG . FIG. 7 shows another embodiment of the liquid crystal display device according to the present invention, and corresponds to FIG. The sectional view taken along the line VIII-VIII in FIG.
Is shown in

The difference from the case of FIG.
Of the liquid crystal display panel side is relatively largely separated from the liquid crystal display panel.

The distance is sufficient if it can be separated from the application area of the resin 10.

This is because when the printed circuit board 6 is largely separated from the liquid crystal display panel, the so-called frame cannot be reduced.

Even in the case of such a configuration, it is possible to prevent the resin 10 from going around the back side of the semiconductor device 5 (the back side of the flexible substrate 5A) and attaching to the printed circuit board 6.

As described above, according to each of the above-described embodiments, it is possible to prevent the drive IC and the printed circuit board from sticking to each other by applying the resin.

In the above-described embodiment, a simple matrix type liquid crystal display device has been described.
The present invention is not limited to this, and it goes without saying that the present invention can be applied to, for example, an active matrix type liquid crystal display device. This is because the present invention has nothing to do with the driving method of the liquid crystal display device, and aims to eliminate the problem at the connection portion between the terminal and the semiconductor device.

[0056]

As will be apparent from the above description, according to the liquid crystal display device of the present invention, it is possible to prevent the drive IC from sticking to the printed circuit board by applying the resin.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a liquid crystal display panel applied to the present invention.

FIG. 2 is a plan view showing one embodiment of a configuration of a semiconductor device connected to a liquid crystal display panel and its vicinity.

FIG. 3 is a sectional view taken along the line III-III in FIG. 2;

FIG. 4 is an explanatory diagram showing the effect of the present invention.

FIG. 5 is a plan view showing another embodiment of the configuration of the semiconductor device connected to the liquid crystal display panel and its vicinity.

FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;

FIG. 7 is a plan view showing another embodiment of the configuration of the semiconductor device connected to the liquid crystal display panel and its vicinity.

8 is a sectional view taken along line VIII-VIIIV in FIG.

[Description of Signs] 1A, 1B: transparent substrate, 5: semiconductor device, 5A: flexible substrate, 5B: semiconductor chip, 6: printed board,
6A: Notch, 9: Solder.

Claims (6)

[Claims] 1. A liquid crystal display panel, a printed circuit board, and a driving IC, wherein the driving IC is disposed over the liquid crystal display panel and the printed circuit board, and an input terminal of the driving IC is connected to a terminal of the printed circuit board. A liquid crystal display device in which the output terminal is connected to a terminal of the liquid crystal display panel and a resin is applied to a portion of the surface of the drive IC adjacent to the liquid crystal display panel, wherein the printed board overlaps at least the drive IC A liquid crystal display device characterized in that the other side of the liquid crystal display panel except for the part is formed so as to be separated from the resin applied region. 2. The liquid crystal display device according to claim 1, wherein the printed circuit board is provided with a cutout on a side of the liquid crystal display panel other than a portion overlapping with the driving IC. . 3. The liquid crystal display device according to claim 1, wherein the printed circuit board has a hole on a side of the liquid crystal display panel other than a portion overlapping with the driving IC. 4. The liquid crystal display device according to claim 1, wherein the printed circuit board is formed such that a side on the liquid crystal display panel side is separated from a resin application region. 5. The liquid crystal display according to claim 1, wherein the drive IC is configured by mounting a semiconductor IC on a flexible substrate on which a wiring layer with terminals is formed. apparatus. 6. The flexible substrate has a semiconductor IC mounted on one surface thereof and is connected to a terminal of a liquid crystal display panel, and is connected to a terminal of a printed circuit board on the other surface. The liquid crystal display device according to claim 5, wherein