JPH11309670A - Both-surface polishing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To polish by a polishing disc while carrying out the small circular movement and rotate the polishing disc arbitrarily. SOLUTION: After setting a work 78 to a holding carrier 70, polishing discs 15, 25 are approached relatively by an approaching/separating means 30 and contacted to both surfaces of the work 78. By an eccentric rotation means 60, eccentric axial centers 14A, 24A are displacingly rotated around the rotation axial centers 10A, 20A and the polishing discs 15, 25 are displacingly rotated on the small circle around the rotational axial centers 10A, 20A and the simultaneous polishing of both surfaces for the work 78 is carried out uniformly at the entire area of both surfaces and by a constant polishing speed. The polishing discs 15, 25 can offset the lateral direction load by processing and rotated around the eccentric axial centers 14A, 24A by the rotation means 40.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-side polishing apparatus used for polishing both surfaces of various workpieces such as a liquid crystal glass plate, a metal plate, a semiconductor silicon substrate, and a ceramic substrate. is there.

[0002]

2. Description of the Related Art Conventionally, as a double-side polishing apparatus of this kind,
For example, a polishing apparatus disclosed in Japanese Patent Application Laid-Open No. 6-206159 is provided. In this conventional configuration, each vertical axis is revolved around a revolving axis by rotating the upper and lower support members in opposite directions by a revolving drive device, and each vertical axis is revolved about a revolving axis by a revolving drive device. Then, the polishing body group is rotated while revolving. Further, the holding carrier in which the object to be polished is penetrated is moved laterally, and is rotated around the axis displaced by the lateral movement. Therefore, the desired double-side polishing can be performed by moving the upper and lower polishing bodies close to each other in the direction along the revolving axis and bringing them into contact with both surfaces of the object to be polished.

After the intended double-side polishing has been performed in this way, the polished workpiece is taken out from the fitting hole of the holding carrier by raising and separating the upper support member, and a new workpiece is polished. Is set by fitting into the fitting hole.

[0004]

In the above-described conventional structure, the polishing body group revolves and rotates by a large circular motion, so that the polishing rate over the entire surface of the object to be polished is not constant, and Uniform polishing cannot be sufficiently performed, and moreover, the polishing body itself may have a loss or unevenness.

According to the first aspect of the present invention, the polishing by the polishing disk can be performed while moving (circularly moving) the polishing disk on a small circular locus, and the polishing disk can be arbitrarily rotated. It is intended to provide a device.

[0006]

In order to achieve the above-mentioned object, a double-side polishing apparatus according to the first aspect of the present invention is provided with a pair of workpieces held by a holding carrier in a state where both faces are sandwiched. Along with disposing the polishing discs, an approaching / separating means for moving these polishing discs relatively close to and away from each other is provided, and both polishing discs are provided so as to be freely rotatable on an eccentric axis rotatable around the rotation axis. With the eccentric shaft displaced, eccentric rotating means for rotating these eccentric shafts around the rotation axis are provided, and rotating means for rotating both polishing machines around the eccentric shaft are provided. It is what it was.

Therefore, according to the first aspect of the present invention, in a state where the two polishing machines are relatively separated by the approach / separation means,
The workpiece is set on the holding carrier. In this state, the two polishing discs are brought closer to each other by the approaching / separating means, whereby each polishing disc can be brought into contact with both surfaces of the workpiece.
Before and after such contact, the eccentric axis can be displaced and rotated (revolved) around the axis of rotation by rotation by the eccentric rotation means, and thereby both polishing machines can be moved on a small circle around the axis of rotation. Thus, the contact of the polishing machine with both surfaces of the workpiece can be performed uniformly over the entire surface of both surfaces with a constant polishing speed. At that time, the two polishing machines are displaced and rotated with the two eccentric shafts displaced from each other, so that the lateral load due to the processing can be offset. Then, during the polishing operation by the displacement rotation of both polishing disks, these polishing disks are rotated around the eccentric axis by a rotating means (rotation).
I can make it.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Reference numeral 1 denotes a frame, which comprises a box-frame-shaped lower frame 3 forming a lower space 2 and a box-frame-shaped upper frame 5 erected from one upper surface of the lower frame 3 to form an upper space 4. . The lower frame 3 has an opening 6 formed at the center of the upper plate, and the lower space 2 communicates with the upper space 4.

The frame 1 is provided with an upper rotating shaft 10 and a lower rotating shaft 20 in the vertical direction.
0, 20 are the rotation axes 10A, 2 located on the same line.
It is configured to be rotatable around 0A. That is, the upper rotation shaft 10 is rotatably supported by the upper cylinder 11 via the bearing 12, and the upper cylinder 11 is fixed to the free end of the upper support 13 from the upper frame 5 side. I have. The lower rotating shaft 20 is rotatably supported by a lower cylinder 21 via a bearing 22.
Is fixed to a free end of a lower support 23 provided continuously from the lower frame 3.

Eccentric shafts 14 and 24 are integrally provided on the opposite ends of the rotating shafts 10 and 20, respectively, and these eccentric shafts 14 and 24 are configured to be rotatable around the rotating shafts 10A and 20A. Is done. An upper polishing machine 15 is supported on the upper eccentric shaft 14 via a bearing 16 so as to freely rotate on an eccentric shaft 14A, and a lower polishing machine 25 is mounted on the lower eccentric shaft 24 with a bearing 26. And is freely rotatably supported on the eccentric shaft center 24A through the shaft.

An approach / separation means 30 for relatively moving the polishing machines 15 and 25 toward / away from each other is provided. The approach / separation means 30 includes a cylinder device 31 interposed between the upper end of the upper frame 5 and the base end of the upper support 13, and a guide rod (or guide rail) 32 for guiding the upper support 13 to move up and down. Constitutes one example. Therefore, by moving the cylinder device 31 in and out, the upper polishing plate 15 is moved closer to and away from the lower polishing plate 25. Note that the lower surface of the lower polishing plate 25 is
It is received by a slide receiving base 35 provided above.

A rotating means 40 is provided which can rotate the polishing machines 15, 25 in the same direction around the eccentric axes 14A, 24A at the same speed. That is, the rotation drive shaft 41 is provided from the lower space 2 to the upper space 4, and the rotation drive shaft 41 is rotatably supported on the frame 1 side via the bearing 42. A rotary drive device (motor) 43 is provided on the frame 1 side, and an output shaft 44 and the rotary drive shaft 41 are linked and connected via a winding link device 45.

A passive unit 4 is provided below the upper rotating shaft 10.
6a and a transmission gear portion 46b,
The upper cylindrical body 46 is rotatably fitted to the outside via a bearing 47. The upper cylindrical body 46 is interlocked with the rotation drive shaft 41 via a winding interlocking device 48 such as a timing belt including the passive portion 46a. Are linked.

The transmission gear 46b is connected to the upper polishing machine 1
5 is meshed with a ring-shaped internal gear body 49 integrated with the upper surface. At that time, the internal gear body 49 is formed to have a large diameter with respect to the transmission gear portion 46b, and
The internal gear body 49 is located on the eccentric shaft center 14A with respect to the transmission gear part 46b located on A, so that a part of the transmission gear part 46b is always meshed with the internal gear body 49. Is configured.

On the upper part of the lower rotating shaft 20, a passive part 50 is provided.
a and a transmission gear portion 50b, a lower tubular body 50 is rotatably fitted via a bearing 51, and the lower tubular body 50 is a timing belt type or the like including the passive portion 50a. It is interlocked and connected to the rotation drive shaft 41 via a winding interlocking device 52. In addition, the lower cylindrical body 5
Numeral 0 is located at the opening 6.

The transmission gear portion 50b is connected to the lower polishing plate 2
5 is meshed with a ring-shaped internal gear body 53 integrated with the lower surface. At this time, the internal gear body 53 is formed to have a large diameter with respect to the transmission gear portion 50b, and
The internal gear body 53 is located on the eccentric shaft center 24A with respect to the transmission gear portion 50b located on A, so that a part of the transmission gear portion 50b is always meshed with the internal gear body 53. Is configured. An example of the rotating unit 40 is configured by the above 41 to 53 and the like.

With the eccentric shafts 14A, 24A displaced by 180 degrees relative to the rotating shafts 10A, 20A, these eccentric shafts 14A, 24A are connected to the rotating shaft 10A.
An eccentric rotation means 60 for displacing and rotating at a constant speed in the same direction around A and 20A is provided.

That is, the rotary drive shaft 61 is provided from the lower space 2 to the upper space 4, and the rotary drive shaft 61 is provided.
Is rotatably supported by the frame 1 via a bearing 62. A rotary drive device (motor) 63 is provided on the frame 1 side, and an output shaft 64 and the rotary drive shaft 61 are interlocked and connected via a winding interlock device 65.

The upper part of the upper rotary shaft 10 and the rotary drive shaft 61 are operatively connected to each other via a winding interlocking device 66 such as a timing belt. Further, the lower part of the lower rotary shaft 20 and the rotary drive shaft 61 are interlockingly connected via a winding interlocking device 67 such as a timing belt type. An example of the eccentric rotation means 60 is constituted by the above 61 to 67 and the like.

On the frame 1 side, there is provided a holding carrier 70 through which a workpiece (polished object) 78 can be freely inserted. The holding carrier 70 is configured to be movable in the lateral direction. That is, the holding carrier 70 has a rectangular fitting hole 7.
A rectangular plate-shaped workpiece 78 can be inserted through the fitting hole 71. A pair of left and right guide rods 77 are disposed on the lower frame 3, and the holding carrier 70 is supported and guided by these guide rods 77 so as to be movable in the left and right directions.

Left and right moving means 72 for moving the holding carrier 70 left and right are provided. The left and right moving means 72 includes a moving motor 73 mounted on the lower frame 3 and an upward output shaft of the moving motor 73. And a link body 76 that connects the eccentric position of the disc body 75 and the free end of the holding carrier 70 so as to be relatively swingable.
Etc.

The operation of the above embodiment will be described below. In a state where the upper support 13 is raised by the contraction movement of the cylinder device 31 in the approach / separation means 30 and the upper polishing plate 15 is moved up and away from the lower polishing plate 25,
A rectangular workpiece 78 is set in the fitting hole 71 of the holding carrier 70 by fitting. At this time, the workpiece 78 is brought into contact with the lower polishing plate 25 via its lower surface.

In this state, the cylinder device 31 is extended and the upper polishing plate 15 is lowered via the upper support 13, so that the upper polishing plate 15 can lightly contact the upper surface of the workpiece 78. Before and after such contact, the rotation driving device 63 of the eccentric rotation means 60 is operated, and the polishing machines 15 and 25 are eccentrically rotated to perform intended polishing.

That is, the rotation of the rotation driving device 63 in the eccentric rotation means 60 is transmitted to the rotation driving shaft 61 via the winding interlock device 65, and the rotation of the rotation driving shaft 61 is further transmitted through the winding interlock device 66. And transmitted to the lower rotating shaft 20 via the winding interlocking device 67.

The rotation of the upper rotation shaft 10 causes the eccentric shaft 14A, that is, the upper eccentric shaft 14 to be displaced (revolved) A on a small circle around the rotation shaft 10A. At this time, relative rotation between the upper eccentric shaft 14 and the upper polishing machine 15 is allowed by the bearing 16. In addition, lower rotating shaft 2
By the rotation of 0, the eccentric shaft 24A, that is, the lower eccentric shaft 24 is displaced and rotated at a constant speed in the same direction as the upper eccentric shaft 14 on a small circle around the rotating shaft 20A. At this time, the relative rotation between the lower eccentric shaft 24 and the lower polishing machine 25 is allowed by the bearing 26.

The rotation of the moving motor 73 is performed by a crank mechanism including a disc 75 and a link 76.
The holding carrier 70 is reciprocated B in the left-right direction by the support and guide of the guide rod 77, instead of being pushed and pulled by the link body 76.

Based on the operation of each part as described above, both surfaces of the workpiece 78 are polished simultaneously. That is, the upper and lower polishing discs 15 and 25 are displaced and rotated at a constant speed in the same direction while being displaced by 180 degrees from each other, and the holding carrier 70 in which the workpiece 78 is penetrated reciprocates horizontally B. become.

Therefore, in this state, the cylinder device 3
By applying a load by extension of No. 1, the polishing machine 15,
Due to the combined movement of the revolution A on the small circle 25 and the reciprocating movement B of the workpiece 78, the abutments of the polishing plates 15, 25 on both surfaces of the workpiece 78 are uniformly and polished over the entire area of both surfaces. The speed can be kept constant, so that a uniform polishing process can be performed without remaining polishing.

Further, the upper and lower polishing disks 15 and 25 are displaced by 180 ° with respect to each other at the same speed in the same direction.
By doing so, the lateral load due to processing can be offset. In addition, since both surfaces of the workpiece 78 are polished simultaneously, in the case of polishing a plate-like object, a distorted plate-like object can be polished into a flat surface.

During the polishing operation by the displacement rotation A of the upper polishing plate 15 and the lower polishing plate 25 as described above,
The polishing machines 15 and 25 can be automatically and slowly rotated (rotated) C around the eccentric axes 14A and 24A by the rotating means 40.

That is, when the cylindrical bodies 46 and 50 are non-rotating and fixed, the internal gear bodies 49 and 53 that are integrally rotated together with the displacement rotation A of the polishing disks 15 and 25 become the cylindrical bodies 46 and 50. Transmission gear portions 46b, 5 which are integrally fixed with
0b is always partially meshed. At this time,
The internal gear bodies 49 and 53 and the transmission gear portions 46b and 50b have different numbers of teeth. Therefore, in order to absorb the difference in the number of teeth, the polishing disks 15 and 25 are moved in the same direction as the direction of the displacement rotation A. Then, the rotation (rotation) C is automatically performed slowly.

As a result, in the polishing disks 15 and 25, the polishing action position due to the displacement rotation A gradually changes in the direction of rotation C, so that it is possible to prevent the polishing disks 15 and 25 from being partially reduced or uneven. The rotation (rotation) C and rotation direction of the polishing machines 15 and 25 can be controlled by switching the rotation means 40 to drive. That is, the rotation of the rotation driving device 43 in the rotating means 40 is transmitted to the rotation driving shaft 41 via the winding interlocking device 45, and the rotation of the rotation driving shaft 41 is further transmitted to the winding interlocking devices 48 and 5.
2 to the cylindrical bodies 46 and 50.

The rotation of the cylindrical bodies 46, 50, that is, the rotation of the transmission gears 46b, 50b,
Internal gear bodies 49, 5 in which 6b, 50b are partially meshed
The grinding wheels 15, 25 integrated with the internal gear bodies 49, 53 are rotated around the eccentric axes 14A, 24A.

At this time, if the direction of applying rotation to the polishing disks 15 and 25 is the same as the rotation (rotation) C, the rotation C is increased. If the rotation applying direction is opposite to the rotation (rotation) C, the rotation C may be controlled to reduce the rotation C, to cancel the rotation C, to stop, or to rotate in the reverse direction. Further, the polishing disks 15 and 25 can be reciprocated by alternately performing the forward and reverse rotations.

As described above, by driving the rotating means 40, the rotation C, the number of rotations, and the rotation direction of the polishing disks 15, 25 can be controlled from outside. The rotation means 40
Can use any rotation method such as continuous rotation and intermittent rotation in addition to forward and reverse rotation.

Of the operations described above, when the polishing disks 15 and 25 are reciprocally rotated, the polishing disks 15 and 25 are particularly rotated.
As shown in the phantom line in FIG. 3, the polishing by the upper polishing material supply means 37 connected to the upper polishing plate 15 and the lower polishing material supply device 38 connected to the lower polishing plate 25
It can be performed while supplying (spraying) an abrasive (a polishing liquid such as water or oil).

Next, another embodiment of the present invention will be described with reference to FIG.
Explanation will be given based on FIG. That is, a disc-shaped holding carrier 80 is used, and the holding carrier 80 has round fitting holes 81 at a plurality of positions in the circumferential direction. The holding carrier 80 is rotated by the plurality of rollers 82 provided on the lower frame 3 side.
It is rotatably supported around 0A. On the lower frame 3 side, a holding carrier rotation driving device 83 is provided.

According to this alternative embodiment, the upper and lower polishing disks 15 and 25 are displaced and rotated A at the same speed in the same direction while being displaced by 180 degrees from each other, and the round plate-shaped workpiece 8 is rotated.
The holding carrier 80 in which the five groups are inserted is rotated around the rotation axes 10A and 20A by the holding carrier rotation driving device 83. As a result, both surfaces of the group of workpieces 85 can be polished at the same time with more reliable elements for uniform polishing. The number and the size of the workpieces 85 to be polished at the same time are arbitrarily set.

In both of the above embodiments, the rectangular plate-like workpiece 78 and the round plate-like workpiece 85 are polished, but they can handle workpieces of various shapes. The shapes of the fitting holes 71 and 81 are determined accordingly.

In both of the above-described embodiments, the rotation speed of the rotation driving device 63 in the eccentric rotation means 60, that is, the rotation speed of the polishing plates 15, 25 can be arbitrarily adjusted by operating the operation panel, for example. , Work 78,
It is possible to obtain as uniform a sliding speed as possible with respect to 85.

In both of the above embodiments, a plurality of double-side polishing apparatuses are installed, and various operations such as supply and removal of the workpieces 78 and 85 are performed by a common (one) robot. You may.

In both of the above-described embodiments, the upper and lower polishing disks 15 and 25 are disposed so as to be displaced from each other by 180 °. This 180 ° is the most preferable angle, and
It is not limited to this angle.

[0043]

According to the first aspect of the present invention, after the two polishing disks are relatively separated by the approaching / separating means,
With the work piece set on the holding carrier, the two polishing machines are relatively approached by the approach / separation means,
Each polishing machine can abut against both surfaces of the workpiece, and before and after such abutment, the eccentric rotation means can be displaced and rotated (revolved) around the rotation axis by rotation by the eccentric rotation means. The two polishing machines can be displaced and rotated on a small circle around the rotation axis, and the abutment of the polishing machines on both surfaces of the workpiece can be performed uniformly over the entire area of both surfaces and the polishing speed is kept constant. As a result, it is possible to perform a uniform polishing process with no remaining polishing. At that time, the lateral load due to the processing can be easily and suitably canceled by displacing and rotating the two polishing machines while the eccentric axes of the two polishing machines are mutually displaced. Then, during the polishing operation by the displacement rotation of the two polishing disks, these polishing disks can be rotated (rotated) around the eccentric axis by the rotating means, thereby preventing the polishing disks themselves from being partially reduced or uneven. it can.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention and is a partially cutaway side view of a double-side polishing apparatus.

FIG. 2 is a plan view of the double-side polishing apparatus.

FIG. 3 is a vertical sectional side view of a main part of the double-side polishing apparatus.

FIG. 4 is a plan view illustrating a polishing operation of the double-side polishing apparatus.

FIG. 5 shows another embodiment of the present invention, and is a longitudinal sectional side view of a main part of the double-side polishing apparatus.

FIG. 6 is a plan view of a main part of the double-side polishing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Upper rotating shaft 10A Rotating shaft 14 Upper eccentric shaft 14A Eccentric shaft 15 Upper polishing machine 20 Lower rotating shaft 20A Rotating shaft 24 Lower eccentric shaft 24A Eccentric shaft 25 Lower polishing machine 30 Approaching / separating means 40 Rotating means 43 Rotating drive Apparatus 46 Upper cylindrical body 46a Passive part 46b Transmission gear part 49 Internal gear body 50 Lower cylindrical body 50a Passive part 50b Transmission gear part 53 Internal gear body 60 Eccentric rotating means 63 Rotary driving device 70 Holding carrier 71 Fitting hole 72 left and right moving means 78 work piece 80 holding carrier 81 fitting hole 83 holding carrier rotation drive device 85 work piece A displacement rotation B reciprocating movement C rotation (rotation)

Claims (1)

[Claims] 1. A pair of polishing disks are arranged in a state where both surfaces of a workpiece held by a holding carrier are sandwiched, and approaching / separating means for relatively moving the polishing disks toward / away from each other is provided. , Provided rotatably on the eccentric shaft rotatable around the rotation axis, with both eccentric shafts displaced,
A double-side polishing apparatus comprising: eccentric rotating means for rotating these eccentric shafts around a rotation axis; and rotating means for rotating both polishing machines around the eccentric shaft.