JPH1130645A - Semiconductor device tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an integrated circuit tester that prevents the temperature of an integrated circuit heated up to the specified one from going down during the test. SOLUTION: A boxy body 70 made up by an adiabator is installed on top of a performance board PB, and an IC socket SK and a socket guide 35 are stored in a space surrounded by this boxy body 70 and the performance board PB. A through hole 71, where a sample integrated circuit to be conveyed by a movable rod 60R of a Z-axis drive device is retractable in an inner part of the said boxy body, is formed in an upper wall of the boxy body 70, and further, a switching plate 72 being shiftable in the horizontal direction is set up in an upper part of the said boxy body, and when the said movable rod is situated at the outside of the boxy body a by this switching plate 72, the through hole 71 is locked up and the inside of the boxy body is kept up into a state of being almost adiabatically insulated. Moreover, in a state that the sample integrated circuit comes into contact with the IC socket, a closing member 64 blockage a through hole 72A of the switching plate 72 is installed there, holding the inside of the boxy body into an adiabatic state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method of transporting a semiconductor device (eg, a semiconductor integrated circuit) for testing,
The present invention also relates to a semiconductor device test apparatus to which a semiconductor device transfer processing apparatus (generally called a handler) for classifying semiconductor devices that have been tested based on test results is connected. The present invention relates to an improvement in a section for testing and measuring a semiconductor device under test conveyed to a test section.

[0002]

2. Description of the Related Art As is well known, a semiconductor integrated circuit (hereinafter, referred to as a semiconductor integrated circuit)
2. Description of the Related Art A semiconductor device test apparatus (generally called an IC tester) for testing various semiconductor devices including an IC (hereinafter referred to as an IC) includes a semiconductor device under test (generally a DU).
T) is transferred to a test section, and the semiconductor device under test is electrically and mechanically brought into contact with a device test socket of a semiconductor device test apparatus (hereinafter referred to as an IC tester) arranged in the test section. In many cases, a semiconductor device transfer processing device (hereinafter, referred to as a handler) for transferring a tested semiconductor device from a test section to a predetermined location after the test is connected.

An IC tester to which the present invention is applied is of a type to which a handler is connected. First, an example of this type of IC tester will be described with reference to FIG. 4 and FIG. In the following, an IC tester for testing an IC, which is a typical example of a semiconductor device, will be described for the sake of simplicity. FIGS. 4 and 5 are a side view partially showing a schematic configuration of an IC tester suitable for testing an IC having a large number of pins and mainly including a logic circuit and an analog circuit, and a plan view of a handler. It is.

[0004] The IC tester shown in FIG. 4 mainly includes a tester main body MF (referred to as a main frame in this technical field) accommodating an electric circuit device, a handler HAND having a transport mechanism for transporting the IC, and It is electrically connected to the tester main body MF, but is configured separately and has a handler HA
And a test head TSH mounted on a test section of the ND.

The handler HAND has a base 10 on which a first XY transfer device 20 and a second XY
An IC transport mechanism including the transport device 30, a Z-axis driving device (a device for moving an article in a vertical direction (up and down direction in FIG. 4)) and the like are mounted. The base 10 has an extended portion projecting leftward in the horizontal direction in the figure, and the test head TSH is arranged in a space SP below the extended portion. Further, a through hole 11 through which the IC under test can sufficiently pass is formed in the extension portion of the base 10, and the IC under test is formed.
Is lowered through the through-hole 11 and the test head TS
H is brought into contact with the IC socket SK mounted thereon.

The IC under test conveyed to the test section by the IC conveying mechanism of the handler HAND is, as described above,
The IC under test is electrically contacted with the IC socket SK attached to the test head TSH of the C tester. As a result, the IC under test is electrically connected to the tester main body MF through the test head TSH and the cable group KU. In this state, the test head T is transmitted from the tester main body MF through the cable group KU.
A test signal of a predetermined pattern supplied to the SH is applied to the IC under test, and then a response signal read from the IC under test is the test head TSH and the cable group KU.
To the tester main body MF to measure the electrical characteristics of the IC under test.

In the test head TSH, the I under test
A driver group for supplying a test signal of a predetermined pattern to C;
A comparator group for determining whether an output signal read from the IC under test is a high (H) logic signal or a low (L) logic signal having a predetermined voltage value, a power supply line, and the like are housed therein. These elements and power supply lines are electrically connected to the tester main body FM through a cable group KU.

When the test is completed, the tested ICs are transported from the IC socket SK to a predetermined location by the IC transport mechanism of the handler HAND, and then classified based on the data of the test results. FIG. 5 is a plan view showing a schematic configuration of the IC tester shown in FIG. 4, particularly a handler HAND.
This handler HAND is placed on a substantially rectangular base 10,
First and second two XY transporting devices (transporting an article in both the X-axis direction and the Y-axis direction) in a manner opposed to each other in the longitudinal direction (left-right direction in the figure, this direction is defined as an X-axis direction). 20 and 30 that can perform the operations.

The first XY transfer device 20 is a pair of parallel first X-axes extending a predetermined length in the X-axis direction along both long sides from the vicinity of the left end in the drawing of the base 10 in the drawing. The direction rails 21A and 21B are interposed between the first X-axis direction rails 21A and 21B in directions perpendicular to the first direction rails 21A and 21B (vertical direction in the figure, this direction is referred to as a Y-axis direction). 21B
A first movable arm 26 erected along the first movable arm 26 so as to be movable in the X-axis direction along with the first movable arm 26 movably in a direction along the first movable arm 26 (Y-axis direction). -Y transport head 24.

The second XY transfer device 30 includes a pair of parallel second X-axis members extending a predetermined length in the X-axis direction along the two long sides from the vicinity of the right end in the drawing of the substrate 10. Direction rails 31A and 31B, and are interposed between the second X-axis direction rails 31A and 31B in a direction orthogonal to the second X-axis direction rails 31A and 31B, respectively.
A second movable arm 40 erected movably in the X-axis direction along B, and attached to the movable arm 40 in a direction along the second movable arm 40, that is, movably in the Y-axis direction. A second XY transfer head (not shown).

Accordingly, the first XY transfer head 24 can be moved by the first XY transfer device 20 having the above-described configuration to an arbitrary area within a substantially rectangular area A indicated by a two-dot chain line between the pair of X-axis direction rails 21A and 21B. Position to the second X-
The Y transport head can be moved by the second XY transport device 30 having the above configuration to an arbitrary position in a substantially rectangular area B shown by a two-dot chain line between the pair of X-axis direction rails 31A and 31B. Therefore, the area A is a transportable area of the first XY transport device 20, and the area B is a second XY transport device 30.
Is a transportable area.

In the lower area of the drawing in the area A, an empty tray storage section 46 for stacking and storing empty trays, a supply tray 41 storing ICs to be tested (ICs to be tested), Classification trays 42, 43, 44, and 45 for sorting and storing ICs according to test results.
Trays 42 and 43 are arranged in order from right to left in the figure, and the upper two areas in the figure in area A include the remaining two sort trays 44 and 45 and the IC under test.
A heat plate 50, which is a plate-like heating device for heating the plate to a predetermined temperature, is arranged in order from left to right. The trays 41 to 45 and the empty tray storage 4
6. Arrangement of heat plate 50 and classification trays 42 to 45
It is needless to say that the number and the like are merely examples and can be changed as needed.

In the area B, a test section TS of the IC tester is arranged. An IC socket to which an IC under test is electrically connected is attached to the test section TS. The example handler is for two ICs under test at a time.
Is configured so that you can test
Two sockets are attached to the test section TS.

Further, the illustrated handler includes first and second buffer stages BF1 and BF2 which reciprocate in the X-axis direction between a predetermined position in the area A and a predetermined position in the area B. The first buffer stage BF1 reciprocates in the X-axis direction between a region adjacent to the right side of the heat plate 50 in the region A and a predetermined position in the region B, and the second buffer stage BF2 stores an empty tray in the region A. It reciprocates in the X-axis direction between a region adjacent to the right side of the portion 46 and a predetermined position in the region B.

The first buffer stage BF1 performs an operation of moving the IC under test heated to a predetermined temperature from the region A to the region B, and the second buffer stage BF2 carries out an operation of transferring the tested IC from the region B to the region A. Perform The presence of these buffer stages BF1 and BF2 allows the first and second XY transfer devices 20 and 30 to perform a transfer operation without interfering with each other.

The first XY transfer device 20 includes
Transporting C from the supply tray 41 to the heat plate 50 for applying a predetermined temperature stress to the IC under test, and then transporting the IC under test heated to the predetermined temperature onto the first buffer stage BF1; The second buffer stage BF2 is configured to carry out the operation of transferring the tested ICs conveyed from the area B from the area B to the predetermined sorting tray from the second buffer stage BF2.

On the other hand, the second XY transport device 30 transports the IC under test transported into the area B by the first buffer stage BF1 to the test section TS, and transports the tested IC to the test section TS. To the second buffer stage BF
2 is carried out.
The heat plate 50 is made of, for example, a plate-like metal material, and has a plurality of IC storage recesses (pockets) 51 for storing the IC under test.
The IC under test is transported from the supply tray 41 by the first XY transport device 20. These IC storage recesses 51
Are usually formed in a matrix form having a plurality of rows and a plurality of columns. The heat plate 50 is disposed by being heated to a temperature slightly higher than the temperature given to the IC under test.
Is heated to a predetermined temperature in the IC housing concave portion on the heat plate 50, and is conveyed to the test section TS through the first buffer stage BF1.

Each of the first XY transfer device 20 and the second XY transfer device 30 has a Z-axis driving device (a device for transferring an IC in a vertical direction (a Z-axis direction orthogonal to the X axis and the Y axis)). The Z-axis drive device is used to perform an operation of picking up an IC from the tray, the heat plate 50, or the test unit TS (socket), and a process of lowering the IC on the tray, the heat plate 50, or the test unit TS.

FIG. 6 shows a schematic configuration of an example of a Z-axis driving device mounted on the first XY conveyance device 20. The movable arm 26 extending in the Y-axis direction of the first XY transfer device 20 is a hollow member having a substantially inverted U-shaped cross section.
A screw shaft 22 and a guide shaft 23, which also extend in parallel with the Y-axis direction, are housed in the hollow portion. The screw shaft 22 and the guide shaft 23 extend through the main body of the first XY transfer head 24 in the Y-axis direction, and the screw portion screwed with the screw portion of the screw shaft 22 is the first XY. It is formed on the main body of the transport head 24. The guide shaft 23 has no threaded portion, so that the main body of the first XY transfer head 24 is slidable with respect to the guide shaft 23, and the guide shaft 23 is in the Y-axis direction of the first XY transfer head 24. Acts to stabilize the movement of

With this configuration, when the screw shaft 22 is driven to rotate, the first XY transfer head 24 moves along the movable arm 26 in a stable state in the Y-axis direction. The movement of the first XY transfer head 24 in the X-axis direction is the same as that of the movable arm 26 described above.
This is done by axial movement. An arm 24A protruding in the horizontal direction (the X-axis direction in FIG. 5) from the upper part of the main body of the first XY transfer head 24 is provided, and in this example, as shown in FIG.
First, second, third, and fourth four air cylinders S
1, S2, S3, S4 are mounted vertically downward. In FIG. 6, the second air cylinder S2 is hidden behind the first air cylinder S1 and cannot be seen. Similarly, the fourth air cylinder S4 is hidden behind the third air cylinder S3 and cannot be seen. . A vacuum suction head is attached to the lower end of the movable rod of each of the air cylinders S1 to S4.

The illustrated Z-axis drive 60 includes first and second
The air cylinders S1 and S2 and the third and fourth air cylinders S3 and S4 are respectively operated in pairs, and are configured to adsorb and transport two ICs at a time, but this is only an example. . One set of the first and second air cylinders S1 and S2 transfers the IC under test heated to a predetermined temperature by the heat plate 50 to the first buffer stage BF.
Used when transporting to 1. For this reason, the vacuum suction head 6 attached to the first and second air cylinders S1 and S2 is designed so that the temperature of the heated IC under test does not drop.
1 (shown with the IC under test sucked) is equipped with a heater (not shown). Third of the other set
The vacuum suction head 62 attached to the fourth air cylinders S3 and S4 is not equipped with a heater, and is used when transporting an IC at a normal temperature. That is, it is used when the IC is transported from the supply tray 41 to the heat plate 50, and when the tested IC is stored in one of the corresponding classification trays 42, 43, 44, and 45 from the second buffer stage BF2. You.

The movable arm 40 of the second XY transfer device 30
A Z-axis driving device having the same configuration as the Z-axis driving device 60 described above is also provided on a second transfer head (not shown) attached to the second conveyance head. However, the second XY transport device 30 is the first XY transport device.
Since the movable arm 40 is disposed in a positional relationship facing the Y transfer device 20, the movable arm 40 has a shape symmetrical to the movable arm 26 shown in FIG. The arm 40 has an open left side), and four air cylinders are attached to the left side of the movable arm 40. In the second transport head, the first and second air cylinders and the third and fourth air cylinders are operated in pairs, respectively, and are configured to adsorb and transport two ICs at a time. Further, one set of air cylinders is used to transfer the IC under test heated to a predetermined temperature to the first set.
It is used when transporting from the buffer stage BF1 to the test section TS. For this reason, the vacuum suction heads attached to these air cylinders are equipped with heaters so that the temperature of the heated IC under test does not drop. The vacuum suction head attached to the other set of air cylinders is not equipped with a heater, and is used when transporting an IC at room temperature. That is, it is used when transferring the IC from the test unit TS to the second buffer stage BF2. Of course, the configuration of the Z-axis driving device can be variously changed.

An IC tester of the type described above is configured to heat an IC under test to a predetermined temperature by a heat plate 50 and to test the IC heated to the predetermined temperature while maintaining the temperature. . Using a thermostat that can maintain the IC under test heated to a predetermined temperature,
The test section TS is arranged inside this thermostat and the IC under test is
Since an IC tester of the type that performs the above test is very expensive, there is a great demand for an IC tester of a type using a simple heating means such as the above-described heat plate 50.

On the other hand, the IC socket SK attached to the test head TSH is generally provided with a socket guide for accurately guiding the IC under test carried by the handler HAND to the IC socket SK. 7 and 8 show a detailed structure of one example. FIG.
Are mainly test head TSH, IC socket SK,
FIG. 8 is a schematic sectional view showing an arrangement relationship between the socket guide 35 and FIG. A connector 32 (hereinafter, referred to as a frog ring) called a frog ring is attached to the upper portion of the test head TSH.
2, a performance board PB is mounted.

The frog ring 32 is a test head TSH
And a performance board PB are electrically connected to each other in a predetermined connection relationship. A large number of pogo contact pins 33 project from the surface of the frog ring 32 at predetermined intervals in an annular shape. It is attached to the frog ring 32 in this state. A pogo contact pin 33 (hereinafter, referred to as a pogo pin) is a movable contact pin supported by a spring so as to be movable in a direction perpendicular to the surface of the frog ring 32, and these contact pins are normally kept in contact with the frog ring 32 by a spring. Is biased in a direction to protrude from the surface of the lens. Therefore, these pogo pins 33 are in contact with the corresponding terminal portions formed on the lower surface of the performance board PB. These pogo pins 3
Numeral 3 is electrically connected to terminals led to the lower surface of the frog ring 32, and these terminals are connected to the test head TSH.
Is electrically connected to the corresponding cable 34 inside the.

In this example, two IC sockets SK are mounted on the upper surface of the performance board PB.
The terminal portions of the performance board PB that are in contact with the pogo pins 33 are electrically connected to the respective terminals of the IC socket SK by the printed wiring of the performance board PB. Therefore, each terminal of the IC socket SK is a printed wiring (conductor) and a terminal portion of the performance board PB,
Test head TS through pogo pin 33 and cable 34
H and is electrically connected.

A socket guide 35 is mounted above the periphery of the IC socket SK. This socket guide 35
As shown in FIG. 8, is formed of a substantially rectangular plate-shaped metal block larger by a predetermined dimension than the plane space occupied by the two IC sockets SK, and the IC is located at a position corresponding to the upper part of each IC socket SK. An insertion hole 35A is formed. The IC under test is inserted into the socket guide 35 through the IC insertion holes 35A, and is brought into contact with the IC socket SK.

The Z-axis driving device attached to the second XY transport device 30 moves the IC under test in the vertical direction (up-down direction) in order to contact the IC socket SK as described above. In FIG. 7, for the sake of simplicity, the movable rod 60R of the Z-axis driving device to which the suction head is attached is shown.
Only one is shown. Opposite edges of each IC insertion hole 35A (edges facing in the longitudinal direction of the socket guide 35 in the illustrated example) are provided at substantially central portions thereof, one by one.
Each of the guide pins 35B is attached in a state of protruding upward. These guide pins 35B hold the IC under test and move down to move the movable rod 60R of the Z-axis driving device.
Works to guide to the proper position. On the other hand, a plate-like guide member 63 is attached at a position at a predetermined height of the movable rod 60R, and a guide hole 63A is formed through the guide member 63 at a position corresponding to the guide pin 35B. These guide holes 63A have an inner diameter in which the guide pins 35B fit tightly. Therefore, when the movable rod 60R descends and the guide pins 35B fit into the guide holes 63A of the guide member 63, the head of the movable rod 60R is fitted to the guide holes. The IC under suction held is accurately guided and descends, and the pins of the IC under test are brought into contact with the corresponding contact pins of the IC socket SK. That is, the IC under test can be accurately aligned with the IC socket SK.

The guide member 63 is provided with two pairs of protrusions 63B protruding downward from the lower surface thereof. When the pins of the IC under test are brought into contact with the corresponding contact pins of the IC socket SK, these are provided. The projecting portion 63B presses the pins of the IC under test from above to ensure electrical contact between the pins. In this example, since the pins of the IC under test are led out in four directions as shown in FIG. 8, two pairs of protrusions 63B are provided, but a frame-shaped protrusion may be used instead of two pairs. When the pins of the IC under test are led out in two directions, only a pair of protrusions may be provided. Needless to say, at least a portion of the protruding portion that contacts the pin of the IC under test is formed of an insulating material.

[0030]

Conventionally, a heater 36 is mounted on the socket guide 35, the socket guide 35 is heated by the heater 36, and the temperature of the IC under test heated by the heat plate 50 is tested. So that it does not drop during. However, as shown in FIG.
5A is open to the atmosphere, and the socket guide 35 itself is also directly exposed to the atmosphere. Therefore, the heat dissipation is intense, and even if the heat capacity of the heater 36 is increased, the heat plate 50 applies a high temperature (125 ° C. or more) to the IC under test. When the temperature stress of (2) is applied, it is difficult to maintain the IC under test at this high temperature.

The socket guide 35 is connected to a common potential point of the IC tester and electromagnetically shields the periphery of each IC socket SK. However, the upper part of the IC insertion hole 35A is open. , Performance Board P
Since no special electromagnetic shield is applied to the printed wiring on the surface of B or the IC under test, these have a structure that is free from external noise including noise generated by the handler itself.

If the IC under test is a device with a large number of pins containing a logic circuit, an analog circuit, etc., and the logic circuit or analog circuit of these devices is to be tested in a high frequency range, the IC under test, the IC socket If the printed wiring and the like on the upper surface of the SK and the surface of the performance board are exposed, there is a high possibility that the SK is affected by external noise. Under the influence of external noise, IC under test
A serious drawback is that accurate tests and measurements cannot be performed.

A first object of the present invention is to provide a semiconductor device test apparatus capable of preventing a temperature of a semiconductor device under test heated to a predetermined temperature from decreasing during a test. A second object of the present invention is to provide a semiconductor device test apparatus capable of testing a semiconductor device under test without being affected by external noise.

[0034]

According to the present invention, as described in claim 1, a device socket mounted on a test head and a semiconductor which surrounds the device socket and is conveyed by Z-axis driving means. A semiconductor device test apparatus comprising: a socket guide constituted by a thermally conductive block for aligning a device with the device socket; and a heating source for heating the socket guide, wherein a heat insulator surrounding the device socket and the socket guide is provided. A through-hole formed on the upper surface of the box-shaped body, and through which the semiconductor device conveyed by the Z-axis driving means passes through the inside of the box-shaped body; A semiconductor device test comprising an opening / closing member for closing and opening a through hole formed on an upper surface Location is provided, the above-described object can be attained.

In the first embodiment, as described in claim 4, the opening / closing member has a portion for closing a through hole formed on the upper surface of the box-shaped body and an opening for opening. It is a plate-shaped member, and is arranged on the upper surface of the box-shaped body so as to be movable in the horizontal direction. The device socket may be mounted on a performance board mounted on the test head, and the box may surround the device socket and the socket guide on the performance board. I have.

In the first modification, the opening / closing member may be arranged so that the semiconductor device conveyed by the Z-axis driving means contacts the device socket inside the box-shaped body. A closing member that closes a through hole formed on the upper surface of the box-shaped body when the member is made to operate, and is mounted on the Z-axis driving unit. Even if the closing member is fixed to a predetermined position of the Z-axis driving means, as described in claim 6, as described in claim 7, it is perpendicular to the Z-axis driving means. It may be movably mounted. Further, the closing member is provided in claim 8.
As described in, even if it is composed of heat insulating material,
As described in claim 9, it may be constituted by an electromagnetic shielding material, or as described in claim 10, may be constituted by a heat insulating material including an electromagnetic shielding material. In addition, the lower surface of the closing member has
As described in 1, the airtight member is mounted.

In a second modified example, as described in claim 11, the opening / closing member is constituted by a pair of opposed plate-like members, and on the upper surface of the box-like body, on both sides of the through-hole opposed to each other. They are arranged and are movable in directions approaching and moving away from each other. The pair of opposed plate-shaped members may be formed of a heat insulating material as described in claim 12, may be formed of an electromagnetic shielding material as described in claim 13, or may be formed of Item 14
As described in the above, it may be constituted by a heat insulating material including an electromagnetic shielding material.

In the first embodiment, the opening of the plate-shaped opening / closing member is moved to a position to open a through hole formed on the upper surface of the box-shaped body, and is conveyed by the Z-axis driving means. When the incoming semiconductor device is brought into contact with the device socket inside the box, the closing member for closing the opening of the plate-like opening / closing member is provided with the Z-axis. It is mounted on the driving means.

The closing member for closing the opening of the plate-shaped opening / closing member may be fixed to a predetermined position of the Z-axis driving means, as described in claim 16. Alternatively, it may be mounted movably with respect to the Z-axis driving means. Further, the closing member may be formed of a heat insulating material as described in claim 18, may be formed of an electromagnetic shielding material as described in claim 19, or may be formed of As described in the above, it may be constituted by a heat insulating material including an electromagnetic shielding material. In addition, the lower surface of the closing member has
As described in 2, the airtight member is mounted.

In a second embodiment, as described in claim 3, the device socket is mounted on a socket board arranged at a predetermined interval above a performance board attached to the test head. Attached, the box surrounds the device socket and socket guide on the socket board.

In the third embodiment, as described in claim 23, an electromagnetic shielding material is included in the heat insulating material of the box-shaped body.
, A metal mesh. Further, the closing member is formed of a heat insulating material including an electromagnetic shielding material, and the airtight member mounted on the lower surface of the closing member is formed of a conductive material. In addition, the plate-like opening / closing member is made of a conductive material, and the closing member for closing the opening of the plate-like opening / closing member is made of a heat insulating material including an electromagnetic shielding material as described in claim 26. The hermetic member configured and mounted on the lower surface of the closing member is formed of a conductive material.

According to the above configuration, the inside of the box is kept at a constant temperature and is electromagnetically shielded.
There is no danger of extraneous noise entering during the test. In addition, in each embodiment, the heating source for heating the socket guide to a predetermined temperature is an electric heater mounted on the socket guide as described in claim 27, but as described in claim 28, The inside of the socket guide or box may be heated by another heating source such as air or gas heated to a predetermined temperature.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below in detail with reference to FIGS. FIG. 1 is a schematic sectional view showing a configuration of a main part of a first embodiment of an IC tester according to the present invention. In FIG. 1,
Parts and elements corresponding to those in FIGS. 7 and 8 are denoted by the same reference numerals, and description thereof will be omitted unless necessary.

In the first embodiment of the present invention, in an IC tester of the type described above with reference to FIGS. 4 to 8, a box-shaped body (case) 7 is mounted on a performance board PB.
The IC socket SK and the socket guide 35 already described with reference to FIGS. 7 and 8 are housed in a space surrounded by the box-shaped body 70 and the performance board PB. The box 70 is made of a heat insulating material such as a resin containing glass, a polyimide resin, or a silicon-based resin, and thermally shields the IC socket SK and the socket guide 35 from the outside air.

In the upper wall of the box-shaped body 70, through holes 71 are respectively formed at positions opposed to the two IC sockets SK housed therein in this example. These through holes 71 are selected to have a size that allows the movable rod 60 </ b> R of the Z-axis driving device and the guide member 63 attached thereto to enter and exit the inside of the box 70. In addition, the box-shaped body 7
An opening 71B is also formed in the bottom wall of the box-shaped body 7 so as to close the opening 71B.
0 is attached to the inner bottom surface. Although the opening 71B is smaller than the socket guide 35, the dimensions of the two IC sockets SK attached to the performance board PB are selected so as to be arranged in the opening 71B (to be present in the opening 71B). You.

Therefore, when the movable rod 60R is lowered by operating the Z-axis driving device, the IC under test sucked to the head at the tip of the movable rod 60R is moved by the movable rod 6R.
By the lowering of 0R, the guide member 63 is conveyed from the upper part of the box-shaped body 70 through the through hole 71 to the inside of the box-shaped body 70.
Guide hole 63A and socket 3 guide pin 3
5B is accurately positioned by fitting, and the pins of the IC under test are securely pressed against the corresponding contact pins of the IC socket SK. A predetermined test is executed in this state, and when the test is completed, the tested IC is carried out of the through-hole 71 to the outside of the box-shaped body 70 while being attracted to the head of the movable rod 60R by the upward movement of the movable rod 60R. Is done.

An opening / closing plate 72 movable in the left-right direction (X1 ← → X2) in FIG. The opening / closing plate 72 has through holes 7 of the same size at positions corresponding to the through holes 71 formed in the upper wall of the box-shaped body 70.
2A is formed, and the through-hole 71 of the box 70 is opened and closed by driving the open / close plate 72 in the left-right direction by a linear drive source 73 such as an air cylinder.

When the movable rod 60 of the Z-axis driving device is located outside the box 70, the opening / closing plate 72 is moved in the X1 direction by the pushing operation of the linear drive source 73. The through hole 71 is closed at a portion of the opening / closing plate 72 where the through hole 72A does not exist. Therefore, the inside of the box 70 is substantially insulated. In a state where the opening / closing plate 72 closes the through hole 71 of the box-shaped body 70, when the movable rod 60R starts sucking the IC under test and starts descending, the linear driving source 73 moves the opening / closing plate 72 in the X2 direction by a suction operation. Let it. When the opening / closing plate 72 moves in the X2 direction, the through-holes 72A of the opening / closing plate 72 match the through-holes 71 of the box-shaped body 70, and the through-holes 71 of these box-shaped bodies 70 are opened (the state shown in FIG. 1). ). Therefore, the IC under test adsorbed by the movable rod 60R passes through the through-hole 72A of the opening / closing plate 72 and the through-hole 71 of the box-shaped body 70 by the lowering of the movable rod 60R, and is conveyed into the box-shaped body. It is securely pressed against the socket SK.

A closing member 64 for closing the through hole 72A of the opening / closing plate 72 when the IC under test is in contact with the IC socket SK is attached to the movable rod 60R. An airtight member (sealant) 64A is mounted. Therefore, the IC under test
When the contact is made with the IC socket SK, the closing member 64 and the airtight member 64A close the through hole 72A of the opening / closing plate 72, and the inside of the box-shaped body 70 is kept in an insulated state. In addition,
The closing member 64 is attached to the movable rod 60R so as to be slidable in the up-down direction. With the IC under test in contact with the IC socket SK, the closing member 64 is lowered by an appropriate drive source to penetrate the opening / closing plate 72. The hole 72A may be configured to be hermetically closed.

Although the closing member 64 is formed of a heat insulating material in this embodiment, the heat insulating effect can be enhanced only by closing the through hole 72A of the opening / closing plate 72. Therefore, the closing member 64 need not necessarily be formed of a heat insulating material. Absent. After the end of the test, when the movable rod 60R is lifted and the tip having adsorbed the tested IC is carried out from the inside of the box 70 to the outside, the opening / closing plate 72
Is moved again in the X1 direction by the pushing operation of the linear drive source 73, whereby the through-hole 71 of the box 70 is
Is closed again by the opening / closing plate 72. By adopting a structure in which the IC socket SK and the socket guide 35 are thermally isolated from the outside air in this manner, the socket guide 35 is heated by the heater 36 mounted on the socket guide 35.
Is heated, the socket guide 35 is sufficiently heated because it is insulated from the outside air, and has a desired high temperature, for example, 150 ° C.
The temperature of the socket guide 35 can be raised to about the temperature. As a result, the inside of the box-shaped body 70 is also maintained at a high temperature, and even if a temperature stress of 125 ° C. or more is applied to the IC under test heated in the The temperature can be maintained.

Further, instead of the heater 36, the inside of the socket guide 35 or the box 70 is heated by another heating source such as air (hot air) or gas (hot gas) heated to a predetermined temperature. However, since the temperature of the IC under test during the test can be maintained, there is an advantage that various heat sources can be used. In the above embodiment, when the IC under test comes into contact with the IC socket SK, the through-hole 72A of the opening / closing plate 72 is closed by the closing member 64 and the airtight member 64A so that the inside of the box 70 is kept insulated. The through-hole 7 in the upper wall of the box 70
Since 1 is actually a small hole, the through hole 72A of the opening / closing plate 72 is also small. For this reason, even if the through-hole 72A of the opening / closing plate 72 is not closed by the closing member 64 and the airtight member 64A, the inside of the box-shaped body 70 is substantially insulated, and the temperature of the heated IC under test is measured during the test. Since it can be held, it is not always necessary to close the through hole 72A of the opening / closing plate 72.

Further, the closing member 6 can be used without using the opening / closing plate 72.
4 and the through-hole 71 of the box 70 by the airtight member 64A.
Even if it is configured to directly close, the inside of the box-shaped body 70 is completely insulated during the test of the IC under test, so that the heated temperature of the IC under test must be maintained during the test. Can be. Further, the opening / closing plate 72 has a double-door structure (a structure in which a pair of opening / closing plates are arranged to face each other and open / close in a direction approaching and away from each other). For example, when the movable rod 60R is located outside the box 70, the pair of open / close plates is closed to close the through holes 71 in the upper wall of the box 70, and the movable rod 60R is lowered. When opening, a pair of opening and closing plates are opened to open each through hole 71 of the box-shaped body 70,
Further, when the IC under test comes into contact with the IC socket SK, if the pair of opening and closing plates are moved in a direction approaching each other to a position where the IC comes into contact with the movable rod 60R, the closing member 64 and the airtight member 64A are used. The inside of the box-shaped body 70 can be maintained in a good heat insulating state without necessity. Therefore, also in this case, the heated IC under test
Can be maintained during the test.

FIG. 2 is a schematic sectional view showing the structure of a main part of a second embodiment of the IC tester according to the present invention. A socket board 37 is mounted at a predetermined interval above a performance board PB. The IC socket SK is directly mounted on the board 37, and a wire or cable 3 is connected between the performance board PB and the socket board 37.
8 shows a case where the present invention is applied to an IC tester having a structure electrically connected. 2, parts and elements corresponding to those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted unless necessary. Note that an adapter socket may be interposed between the socket board 37 and the IC socket SK. In some cases, the performance board PB and the socket board 37 are electrically connected by a connect board.

The socket board 37 is a socket guide 35
Plate 3 having a through hole 39A large enough to insert
9 is fixed. That is, the socket board 37 is attached to the lower surface of the support plate 39 so as to close the through hole 39A, and the IC socket SK and the socket guide 35 are held in a state of protruding upward through the through hole 39A. The support plate 39 is provided with a through hole 11 formed in the base 10 of the handler.
Is attached to the lower surface of the base 10 so as to close the base.
Therefore, the IC socket SK mounted on the socket board 37 and the socket guide 35 mounted on the upper part of the periphery of the IC socket SK are supported in a state of protruding into the through hole 11 formed in the base 10 of the handler. In FIG. 2, one IC socket SK is shown for the sake of simplicity, but there are many cases in which two or more IC sockets are attached.

In the second embodiment, the support plate 3
A box-shaped body (case) 70 is mounted on the upper surface 9 so as to surround the through hole 39A, and an IC is substantially enclosed by the box-shaped body 70 and the socket board 37.
The socket SK and the socket guide 35 are housed, and these members are thermally isolated from the outside air. In the second embodiment, the box-shaped body 70 has a structure in which the bottom surface is opened, but it is needless to say that the box-shaped body 70 is formed of the same heat insulating material as that in the first embodiment.

As in the first embodiment, the box 70
In this example, a through hole 71 is formed in the upper wall at a position facing one IC socket SK housed in this example. The through-hole 71 is provided in the movable rod 60 of the Z-axis driving device.
R and the guide member 63 attached to the R
The size is selected so that it can enter and exit the inside of the zero. In addition, an opening / closing plate 72 that can move in the left-right direction in the figure is disposed above the box-shaped body 70. The opening / closing plate 72 is formed with a through hole 72A of the same size at a position corresponding to the through hole 71 formed in the upper wall of the box-shaped body 70, and the opening / closing plate 72 is driven by a linear drive such as an air cylinder. Source 73
When it is pushed rightward from the position shown in the figure, the through hole 71 of the box-shaped body 70 is opened. The driving operation of the opening / closing plate 72 is the same as that in the first embodiment, and the description thereof is omitted here.

Also in this embodiment, the IC under test is I
A heat insulating closing member 64 that closes the through hole 72A of the opening / closing plate 72 in a state of being in contact with the C socket SK is attached to the movable rod 60R, and a sealing member (sealing material) is provided on the lower surface of the closing member 64. 64A is mounted. The closing member 64 may be fixed to a predetermined position of the movable rod 60R or slidably attached to the movable rod 60R in the up-down direction. The through hole 72A of the opening / closing plate 72 may be hermetically closed by lowering the 64 by an appropriate driving source.

With this configuration, the IC socket SK
When the socket guide 35 is heated by a heater attached to the socket guide 35 or another heating source such as hot air heated to a predetermined temperature, the socket guide 35 is thermally isolated from the outside air. Is sufficiently heated to the desired high temperature, e.g.
The socket guide 35 can be raised to a temperature of about ° C. As a result, the inside of the box-shaped body 70 is also maintained at a high temperature, and even if a temperature stress of 125 ° C. or more is applied to the IC under test heated by the heat plate 50, the high temperature is maintained during the test. The temperature can be maintained. Thus, the same operation and effect as those of the first embodiment can be obtained.

Also in the second embodiment, the through-hole 7 of the opening / closing plate 72 is formed by the closing member 64 and the airtight member 64A.
Even if the 2A is not closed, the inside of the box-shaped body 70 is substantially insulated, and the heated temperature of the IC under test can be maintained during the test. Is not necessary. The opening and closing plate 72
, The through hole 71 of the box 70 may be directly closed by the closing member 64 and the airtight member 64A, or a pair of open / close plates may be formed, for example, on the left and right of the through hole 71 of the box 70. Even with a double-door structure arranged on both sides, the heated temperature of the IC under test can be maintained during the test.

FIG. 3 is a schematic sectional view showing a configuration of a main part of a third embodiment of the IC tester according to the present invention. In the third embodiment, the box 70 is formed of a member having not only a heat insulating effect but also an electromagnetic shielding effect, and the IC under test, the IC socket SK, and the IC housed inside the box 70 are provided. While insulating the socket guide 35 from the outside air, the IC under test, the IC socket SK, and the socket guide 35 are electromagnetically shielded by the box-like body 70 including the surface of the performance board PB where the printed wiring is exposed, These elements and members, or the exposed wiring patterns and the like are configured so as not to be affected by external noise including noise generated by the handler itself.

In the third embodiment, in the IC tester having the structure shown in FIG. 1, for example, a metal mesh 74 is embedded in the entire wall of the heat insulating material constituting the box-shaped body 70, and the heat insulating closing member 64 is further provided. The metal mesh 74 is embedded in the whole inside. For example, a member having a heat insulating effect and an electromagnetic shielding effect can be easily formed by sandwiching a metal mesh 74 between two heat insulating materials and integrating both heat insulating materials by using an appropriate adhesive or by fusing. Can be formed.

The metal mesh 74 is electrically connected to a common potential point on, for example, the performance board PB, and electromagnetically shields the inside of the box 70. Of course, the metal mesh 74 may be electrically connected to a common potential point other than the performance board PB. Also, the closing member 6
In order to also provide an electromagnetic shielding action to the
The airtight member 64A attached to the lower surface of the is a conductive member,
The airtight member 64A and the metal mesh 74 embedded in the closing member 64 are electrically connected. Further, the opening / closing plate 72
Is formed by a conductive member such as a metal plate, and is electrically connected to a common potential point.

As a result, when the closing member 64 is lowered to close the through hole 72A of the opening / closing plate 72, the airtight member 64A and the opening / closing plate 72 are electrically connected, and the metal mesh 74 embedded in the closing member 64 is connected to the common potential. It can be electrically connected to a point. Therefore, the closing member 64 can have both the heat insulating function and the electromagnetic shielding function. The embodiment shown in FIG. 3 is a case where the present invention is applied to the IC tester having the configuration shown in FIG. 1. However, the present invention can be similarly applied to the IC tester having the configuration shown in FIG. Needless to say, this is obtained. In FIG. 3, the same reference numerals are given to parts and elements corresponding to those in FIG.

As described above, by making the material forming the box-shaped body 70 a material having both heat insulating properties and an electromagnetic shielding action, the inside of the box-shaped body 70 can be maintained at a high temperature. By the effect, it is possible to prevent noise from entering the inside of the box 70 during the test. Therefore, the advantage that the reliability of the test can be improved is obtained.

In the above description, an example in which the present invention is applied to an IC tester for testing an IC, which is a typical example of a semiconductor device, has been described.
It goes without saying that the present invention can be applied to various semiconductor device test apparatuses for testing semiconductor devices other than the above, and the same operation and effect can be obtained.

[0066]

As apparent from the above description, according to the present invention, at least the device socket and the socket guide are surrounded by the box in a state insulated from the outside air. By heating with a heating source, the temperature of the socket guide can be raised to a desired high temperature. Therefore, there is a remarkable advantage that the semiconductor device under test to which the temperature stress has been applied can be tested while maintaining the high temperature stress even if the temperature stress is high.

Further, according to the present invention, the electromagnetic shielding effect is added to the box-like body in addition to the heat insulating effect. Therefore, the semiconductor device under test can be prevented from being affected by the external noise during the test due to the electromagnetic shielding effect. . Therefore,
In particular, when testing an IC having a built-in logic circuit or analog circuit that is easily affected by noise, the advantage that the reliability of the test can be improved can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a configuration of a main part of a first embodiment of an IC tester according to the present invention.

FIG. 2 is a schematic sectional view showing a configuration of a main part of a second embodiment of the IC tester according to the present invention.

FIG. 3 is a schematic sectional view showing a configuration of a main part of a third embodiment of the IC tester according to the present invention.

FIG. 4 is a partial cross-sectional side view showing an overall schematic configuration of an example of an IC tester to which the present invention is applied.

FIG. 5 is a plan view for explaining a configuration of a handler of the IC tester shown in FIG. 4;

6 is an enlarged cross-sectional view for explaining a configuration of a Z-axis driving device of the IC tester shown in FIG.

FIG. 7 is a schematic cross-sectional view of the IC tester shown in FIG. 4, mainly showing a positional relationship among a test head, an IC socket, and a socket guide.

FIG. 8 is a plan view of the socket guide shown in FIG. 7;

[Explanation of symbols]

 MF tester main body TSH test head HAND handler SK IC socket PB performance board 10 base 11 through hole 20 first XY transfer device 30 second XY transfer device 32 frog ring 35 socket guide 35A IC insertion hole 35B guide pin 36 heater 37 Socket board 39 Support plate 39A Through hole of support plate 50 Heat plate 51 IC housing recess 60 Z-axis drive device 60R Movable rod of Z-axis drive device 63 Guide plate 63A Guide hole 63B Projection 64 Closing member 64A Airtight member 70 Box shape Body 71 Box-shaped through hole 71B Box-shaped opening 72 Opening / closing plate 72A Opening / closing plate through-hole 74 Metal mesh

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] June 8, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0024

[Correction method] Change

[Correction contents]

On the other hand, the IC socket SK attached to the test head TSH is generally provided with a socket guide for accurately guiding the IC under test carried by the handler HAND to the IC socket SK. 7 and 8 show a detailed structure of one example. FIG.
Are mainly test head TSH, IC socket SK,
FIG. 8 is a schematic sectional view showing an arrangement relationship between the socket guide 35 and FIG. At the top of the test head TSH annular signaling (Signal ring) and connector 32 (hereinafter, referred to as signal <br/> ring) called is attached, this signaling 3
2, a performance board PB is mounted.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0025

[Correction method] Change

[Correction contents]

The signal ring 32 is a test head TSH
And a performance board PB are electrically connected to each other in a predetermined connection relationship. A large number of pogo contact pins 33 protrude from the surface of the signal ring 32 in a ring at predetermined intervals. Sig in state
It is attached to the null ring 32. Pogo contact pins 33 (hereinafter referred to as pogo pins) are sig
A contact pin surface and movably supported movable in the vertical direction of the null ring 32, these contact pins normally are under biasing force in a direction to protrude from the surface of the signaling 32 by a spring. Therefore, these pogo pins 33 are in contact with the corresponding terminal portions formed on the lower surface of the performance board PB. These pogo pins 3
Numeral 3 is electrically connected to terminals led to the lower surface of the signal ring 32, and these terminals are connected to the test head TSH.
Is electrically connected to the corresponding cable 34 inside the.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] Explanation of sign

[Correction method] Change

[Correction contents]

[Description of Signs] MF Tester Main Body TSH Test Head HAND Handler SK IC Socket PB Performance Board 10 Base 11 Through Hole 20 First XY Transfer Device 30 Second XY Transfer Device 32 Signal Ring 35 Socket Guide 35A IC Insertion Hole 35B Guide pin 36 Heater 37 Socket board 39 Support plate 39A Support plate through hole 50 Heat plate 51 IC storage recess 60 Z-axis drive 60R Z-axis drive movable rod 63 Guide plate 63A Guide hole 63B Projection 64 Closure member 64A Airtight member 70 Box-shaped body 71 Box-shaped body through hole 71B Box-shaped body opening 72 Opening / closing plate 72A Opening / closing plate through-hole 74 Metal mesh

Claims (28)

[Claims] 1. A device socket attached to a test head, and a thermally conductive block surrounding the device socket and aligning a semiconductor device conveyed by a Z-axis driving means with the device socket. In a semiconductor device test apparatus including a socket guide and a heating source for heating the socket guide, a box-shaped body formed of a heat insulating material surrounding the device socket and the socket guide; and a box formed on an upper surface of the box-shaped body A through hole through which the semiconductor device conveyed by the Z-axis driving means passes through the inside of the box, and an opening / closing member for closing and opening the through hole formed on the upper surface of the box. A semiconductor device test apparatus characterized by the above-mentioned. 2. The device socket according to claim 1, wherein the device socket is mounted on a performance board mounted on the test head, and the box surrounds the device socket and the socket guide on the performance board. The semiconductor device test apparatus according to claim 1. 3. The device socket is mounted on a socket board arranged at a predetermined interval above a performance board mounted on the test head, and the box-shaped body is mounted on the socket board. 2. The semiconductor device test apparatus according to claim 1, wherein the apparatus surrounds the device socket and the socket guide. 4. The opening / closing member is a plate-shaped member having a portion for closing a through hole formed on an upper surface of the box-like body and an opening for opening the same. The semiconductor device test apparatus according to any one of claims 1 to 3, wherein the semiconductor device test apparatus is movably arranged on the semiconductor device. 5. The device according to claim 1, wherein the opening / closing member is configured such that when the semiconductor device conveyed by the Z-axis driving means is brought into contact with the device socket inside the box-shaped body,
The semiconductor device according to any one of claims 1 to 3, wherein the semiconductor device is a closing member that closes a through hole formed in an upper surface of the box-shaped body, and is mounted on the Z-axis driving unit. Testing equipment. 6. The semiconductor device test apparatus according to claim 5, wherein said closing member is fixed to a predetermined position of said Z-axis driving means. 7. The apparatus according to claim 5, wherein the closing member is movably mounted on the Z-axis driving means.
A semiconductor device test apparatus according to claim 1. 8. The semiconductor device test apparatus according to claim 5, wherein said closing member is made of a heat insulating material. 9. The semiconductor device test apparatus according to claim 5, wherein said closing member is made of an electromagnetic shielding material. 10. The semiconductor device test apparatus according to claim 5, wherein said closing member is made of a heat insulating material including an electromagnetic shielding material. 11. The opening / closing member is constituted by a pair of opposed plate-like members, is disposed on opposite sides of the through-hole on the upper surface of the box-shaped body, and is movable in directions approaching and moving away from each other. The semiconductor device test apparatus according to claim 1, wherein: 12. The semiconductor device test apparatus according to claim 11, wherein said pair of opposing plate members are made of a heat insulating material. 13. The semiconductor device test apparatus according to claim 11, wherein said pair of opposed plate members are made of an electromagnetic shielding material. 14. The semiconductor device test apparatus according to claim 11, wherein said pair of opposed plate members are formed of a heat insulating material including an electromagnetic shielding material. 15. The semiconductor device which is moved to a position where an opening of the plate-shaped opening / closing member opens a through hole formed in an upper surface of the box-shaped body and is conveyed by the Z-axis driving means. 5. The Z-axis drive means, wherein a closing member for closing an opening of the plate-shaped opening / closing member when the device socket is brought into contact with the device socket inside the box-shaped body. A semiconductor device test apparatus according to claim 1. 16. The semiconductor device test apparatus according to claim 15, wherein a closing member that closes an opening of the plate-shaped opening / closing member is fixed to a predetermined position of the Z-axis driving unit. 17. The semiconductor device test apparatus according to claim 15, wherein a closing member for closing an opening of the plate-shaped opening / closing member is movably mounted on the Z-axis driving means. . 18. The semiconductor device test apparatus according to claim 15, wherein the closing member for closing the opening of the plate-shaped opening / closing member is made of a heat insulating material. 19. The semiconductor device test apparatus according to claim 15, wherein the closing member for closing the opening of the plate-shaped opening / closing member is made of an electromagnetic shielding material. 20. The semiconductor device test apparatus according to claim 15, wherein the closing member for closing the opening of the plate-shaped opening / closing member is made of a heat insulating material including an electromagnetic shielding material. 21. The semiconductor device test apparatus according to claim 5, wherein an airtight member is mounted on a lower surface of the closing member. 22. The semiconductor device test apparatus according to claim 15, wherein an airtight member is attached to a lower surface of a closing member that closes an opening of the plate-shaped opening / closing member. 23. The apparatus according to claim 1, wherein the box-like body is made of a heat insulating material including an electromagnetic shielding material.
4. The semiconductor device test apparatus according to any one of items 3 to 3. 24. The semiconductor device test apparatus according to claim 23, wherein the electromagnetic shielding material contained in the box-shaped heat insulating material is a metal mesh. 25. The apparatus according to claim 21, wherein the closing member is made of a heat insulating material including an electromagnetic shielding material, and the airtight member mounted on the lower surface of the closing member is made of a conductive material. Semiconductor device test equipment. 26. The plate-like opening / closing member is made of a conductive material, the closing member for closing an opening of the plate-like opening / closing member is made of a heat insulating material including an electromagnetic shielding material, and a lower surface of the closing member. 3. The airtight member mounted on the first member is made of a conductive material.
3. The semiconductor device test apparatus according to 2. 27. The apparatus according to claim 1, wherein the heating source is a heater mounted on the socket guide.
The semiconductor device test apparatus according to any one of the above. 28. The semiconductor device test apparatus according to claim 1, wherein the heating source is air or gas heated to a predetermined temperature.