JPH11297877A - Method of mounting bump components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily detect a fracture position of a junction of each bump electrode in a short time by mutually connecting adjacent bump terminals in evaluating bump components to form, based on the emitting condition of a light emitting element, steps for detecting fracture positions. SOLUTION: By using an evaluating bump component having bump terminals 1 internally connected with one stroke wiring, one of all junctions is used as a common terminal and light emitting elements D each emitting by flowing a current in the junction 6 is added to other junctions 6. When the junction 6 between the bump component and substrate is normally connected, a current from a power source Vi flows via a resistance element R, light emitting element D, junction 6, carrier inner wiring 8 and bump terminal 1 to emit a light from the light emitting element D. If only the junction 6 is not normally connected because of fracture, no current flows from the power source Vi and corresponding light emitting element D does not light up, thereby detecting the fracture position of the junction 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for detecting a break in a joint between a substrate and a bump component having projecting terminals mounted on the substrate.

[0002]

2. Description of the Related Art FIG. 5 shows a structure of a bump component having a protruding terminal. In the drawing, reference numeral 1 denotes a protruding bump terminal made of solder or the like, and 2 denotes a bare LS.
This is a carrier part having therein a wiring part for connecting between the I chip and the LSI chip and the bump terminals 1 arranged in a matrix.

FIG. 6 shows a bump component as shown in FIG.
FIG. 5 shows a cross section of a bonding portion when mounted on a substrate, wherein 1 and 2 are the same as those in FIG. 5, 3b is a substrate made of glass epoxy, polyimide, ceramic, etc., 4 is a bump component Electrode on the substrate for bonding the substrate and the substrate 3, 5 is a connection material such as solder or conductive adhesive used for bonding the bump terminal 1 and the pad electrode 4, 6 is the bump terminal 1, connection material 5 and a bonding portion formed by the pad electrode 4.

Normally, manufacturers ship products to the market through processes of development, trial production evaluation, and production (mass production).

[0005] In a conventional electronic component (for example, using a package such as a flat pack or a DIP) before and after a bump component, in an insertion mounting method and a surface mounting method, in any process of development, trial production evaluation, and production, Substrate 3
After the mounting, the state of the joint 6 can be easily confirmed visually from the front and back surfaces of the substrate 3. However, when mounting the bump component, the bonding portion 6 is shaded by the carrier portion 2 of the bump component, so that the state of the bonding portion 6 cannot be visually confirmed. For this reason, since the state of the joint 6 cannot be confirmed during product production, mounting process conditions that ensure reliable electrical connection without breaking the joint 6 must be established in prototype evaluation.

Also, under the use environment conditions such as temperature, humidity, vibration, and shock required in the market where the product is shipped, the function and performance of the product are guaranteed during the use period required for each product. There must be. The period during which this function and performance must be guaranteed, that is, the product life depends on the environmental conditions of each field of use, such as for consumer equipment, industrial equipment, satellite mounting, and defense equipment. The same is true. In mounting the bump component, the reliability of the joint 6 with the substrate 3 is particularly important.
Due to the difference in the coefficient of thermal expansion between the bump component and the substrate 3, breakage of the joint 6 due to stress due to temperature change during the day and night or in the four seasons, breakage of the joint 6 due to corrosion due to temperature change or humidity change, and joint 6 due to vibration or impact Before starting production, trial and evaluation must be repeated to fully establish the mounting process conditions for bump components so that no breakage occurs during the service life of the product.

In order to determine the mounting process conditions, the material, size and shape of the carrier part 2 of the bump component, the material and shape and the number of bump terminals 1 of the bump component, the material of the substrate 3, the pad on the substrate 3 Unique characteristics such as the dimensions of the electrode 4 and the material and amount of the connection material 5 of the joint 6 and a great number of parameters (joining conditions) such as temperature conditions and environmental conditions at the time of joining such as time in the case of solder connection It is necessary to determine an optimal combination that satisfies the required product life under the environment in which the product is used from among combinations of these many parameters. As a bump component used for evaluation of a prototype for determining the mounting process conditions, a bump component for exclusive use in consideration of easiness of evaluation of the joint 6 may be used instead of an actual IC used for a product. ing.

FIGS. 7A and 7B are diagrams showing internal connections between bump terminals of a conventional bump component for evaluation made for trial production evaluation. FIG. 7A shows an example of the arrangement of external electrodes, and FIG. In the drawing, reference numeral 1 denotes the same as in FIG. 5; 2a, a carrier portion having an external electrode connected to the bump terminal 1 in a 1: 1 ratio above the carrier portion 2; A plurality of external electrodes 8 each connected 1: 1 are wirings in the carrier connecting the bump terminals 1 and the external electrodes 7.

FIG. 8 is a diagram showing internal connections between bump terminals of another conventional bump component for evaluation made for trial production evaluation, and FIG. 8A shows an example of a connection arrangement between the bump terminals 1.
(B) shows the internal connection. In the figure, 1 and 8 are the same as those in FIG. 7, and 2b is one of the plurality of bump terminals 1.
This is a carrier section that internally connects only between the two bump terminals 1.

FIGS. 9 to 11 are views showing a prototype evaluation method using the conventional bump parts for evaluation shown in FIGS. 7 and 8, respectively. In FIGS. 8 is the same as that of FIG. 8, the evaluation bump component 3 is mounted, the wiring 3 is provided on the substrate 3 on which the bump component is mounted, and is formed of glass epoxy, polyimide, ceramic, or the like. The substrate 10 is a resistance meter for detecting the breakage of the joint 6 between the evaluation bump component and the substrate 3 by a continuity check, and the reference numeral 11 is for detecting the breakage at the junction 6 between the bump component for evaluation and the substrate. The evaluation device includes a light emitting element D that emits light by passing a current, a resistance element R for limiting a current value to the light emitting element D, and a power supply Vi that supplies a current to the light emitting element D.

[0011] In the evaluation of the prototype, in order to establish the mounting conditions, after mounting under mounting process conditions of various combinations of parameters, the presence or absence of breakage of the joint 6 is determined one by one.
Check one. As a result, after conducting an environmental test simulating the use environment of the product for the combination of the parameters in which all the joints 6 did not break, it was confirmed whether the joints 6 were broken one by one. As a result, a combination of parameters in which no break occurs in all the joints 6 is determined to be the optimal mounting process condition.

[0012]

As shown in FIG. 9, in the conventional bump component mounting and evaluation method using the conventional bump component for evaluation shown in FIG. 7, a bump component having a bump terminal 1 having several hundred pins is used. In order to detect all the breaks in the joints 6, a continuity check for each bump terminal 1 was manually performed. However, this method has a problem that it requires a great deal of time and labor. Therefore, as a means for detecting breakage in a short time, as shown in FIG.
The light-emitting elements D corresponding to the respective joints 6 are provided outside, and the continuity check is performed based on the light-emitting state of the light-emitting elements D. However, the conventional evaluation bump parts as shown in FIG. Since the electrode 7 is very small, it is not easy to connect by normal soldering, and it is inevitable to adopt means such as wire bonding, and it is not easy to secure connection workability and connection reliability to the external electrode 7. was there.

Further, as shown in FIG. 11, in the conventional bump component mounting and evaluation method using the conventional evaluation bump components shown in FIG. 8, all the bump terminals 1 are connected by one stroke to check the continuity. Although it was possible to detect in a short time that the joint 6 was broken, it was not possible to determine in which bump terminal 1 the joint 6 was broken.

The present invention has been made in order to solve such a problem, and it is possible to easily detect the breaking position of the joint 6 for each bump terminal 1 in a short time as compared with the conventional bump component mounting evaluation method. The purpose is to.

[0015]

According to a first aspect of the present invention, there is provided a method of mounting a bump component, comprising: an evaluation bump component having a plurality of projecting bump terminals; an evaluation board on which the evaluation bump component is mounted; A step of significantly selecting a bonding condition consisting of an environment characteristic at the time of bonding, and a characteristic unique to each of the bonding members for bonding the bump component to the evaluation substrate, and under the selected bonding condition, Bonding each of the bump terminals of the bump component to the plurality of terminals of the evaluation substrate, detecting a break position at a joint between the bump terminal and the terminal, and selecting an optimal position based on the detection result. Obtaining the bonding condition, based on the obtained optimum bonding condition, having the same unique characteristics as the evaluation bump component and the evaluation substrate. Mounting a bump component and a board, comprising: a plurality of light emitting elements connected in series to the respective bump terminals; and a power supply for supplying a current to the respective light emitting elements. In the evaluation bump component, adjacent bump terminals are connected to each other inside the evaluation bump component, and the step of detecting the break position is performed based on a light emitting state of the light emitting element.

In the bump component mounting method according to a second aspect of the present invention, in the first aspect, the light emitting element is connected to the power supply in series, and the evaluation bump component is configured such that adjacent bump terminals are connected to each other. An external terminal is provided at a position off the bonding surface of the bump terminal while being connected, and the external terminal is connected to the bump terminal and connected in series to the power supply.

According to a third aspect of the present invention, there is provided the bump component mounting method according to the first or second aspect, wherein the light emitting element is:
This is provided on the evaluation bump component.

Still further, the bump component mounting method according to the fourth invention provides an evaluation bump component having a plurality of projecting bump terminals, an evaluation board on which the evaluation bump component is mounted, and the evaluation bump component. The step of significantly selecting each unique characteristic of the bonding member to be bonded to the evaluation substrate and the bonding condition consisting of the environmental conditions at the time of bonding, under the selected bonding condition, Joining each of the bump terminals to the plurality of terminals of the evaluation board, detecting a break position at a joint between the bump terminal and the terminal, and determining an optimal joining condition based on the detection result. Acquiring, based on the acquired optimal joining conditions,
Mounting the bump component and the substrate having the same specific characteristics as the evaluation bump component and the evaluation substrate, a method of mounting the bump component, wherein a plurality of resistors connected between the respective terminals; A power supply connected in parallel to a resistor, wherein the evaluation bump component has two bump terminals connected thereto, and the step of detecting the break position is performed based on a light emitting state of the light emitting element. Is what is done.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a diagram of a bump component mounting evaluation method showing Embodiment 1 of the present invention. The case of a pin is taken as an example.
In the figure, 1,3-6,8,9,11, D, R and V
i is the same as that in FIG. 10 of the related art, and 2c is a carrier portion in which all the terminals of the bump terminals 1 are internally connected by one-stroke wiring.

By using the evaluation bump component of the present invention in which all terminals of the bump terminal 1 are internally connected by one-stroke wiring as described above, one of all the joints 6 is used as a common terminal,
A light emitting element D that emits light by passing a current through another junction 6 is added. When the joint 6 between the bump component and the substrate is properly connected, the current from the power supply Vi is supplied to the resistor R, the light emitting element D, the joint 6, the wiring 8 in the carrier, and the bump terminal 1 serving as a common terminal. Through the light-emitting element D
Emits light. However, the bonding portion 6 to which the light emitting element D is connected
If only the connection is not successful due to the break,
Since no current flows from the power supply Vi, the corresponding light emitting element D does not emit light. In addition, when the joints of the bump terminals 1 serving as the common terminals are not properly connected due to breakage, no current flows from the power supply Vi to all the joints 6, so that all the light emitting elements D do not emit light.

As described above, by visually checking the combination of the light emitting state of the light emitting element D corresponding to the joint 6 of the bump component for evaluation, the breakage of the joint 6 for each bump terminal 1 can be determined one by one. It is possible to easily detect the broken position of the joint 6 in a short period of time without conducting a continuity check by hand or using a connection method such as wire bonding.

Embodiment 2 FIG. 2 is a diagram of a bump component mounting evaluation method according to a second embodiment of the present invention. For ease of explanation, a case where the number of bump terminals of the evaluation bump component is 6 pins will be described. This is an example.
In the figure, 1,3-6,8,9,11, D, R and V
i is the same as that of FIG. 1 of the first embodiment, and 2d is a common external circuit for internally connecting all the terminals of the bump terminal 1 with one-stroke wiring and drawing out the internally connected wiring from the surface other than the bump terminal surface to the outside. This is a carrier section provided with terminals 12.

As described above, a book provided with a common external terminal 12 for internally connecting all the terminals of the bump terminal 1 with one-stroke wiring and for drawing out the internally connected wiring from the surface other than the bump terminal surface of the carrier portion to the outside. Using the evaluation bump component of the present invention, a light emitting element D that emits light by flowing a current at each joint 6 is added. When the joint 6 between the bump component and the substrate is properly connected, the current from the power supply Vi is applied to the resistor R, the light emitting element D, the joint 6, the wiring 8 in the carrier,
The light flows through the common external terminal 12, and the light emitting element D emits light. However, when the joint 6 is not connected normally due to breakage, no current flows from the power supply Vi.
The corresponding light emitting element D does not emit light. In the case of the evaluation bump component having the carrier portion 2c according to the first embodiment, the bump terminal used as the common terminal is directly connected to the power supply Vi without connecting the light emitting element D (see FIG. 1). However, only when the terminal is broken, the breakage of the other bump terminals occurring simultaneously cannot be detected, and it is necessary to switch the connection and re-inspect. However, in the evaluation bump component of this embodiment, each bump terminal is connected to the light emitting element D, and the bump terminal that has been broken without leakage can be detected.

As described above, by visually checking the light emitting state of the light emitting element D corresponding to the joint 6 of the bump component for evaluation, the breakage of the joint 6 for each bump terminal 1 can be reduced by one.
It is possible to easily detect the broken position of the joint 6 in a short time and without any leakage, without conducting a continuity check manually and without using a connection method such as wire bonding.

Third Embodiment FIG. 3 is a diagram of a bump component mounting evaluation method according to a third embodiment of the present invention. For ease of explanation, a case where the number of bump terminals of the evaluation bump component is six is described. This is an example.
In the figure, 1, 3 to 6, 9, 11, 12, D, R, and Vi are the same as those in FIG. 2 of the second embodiment, and 2e denotes a light emitting element that emits light by passing a current for each bump terminal 1. D is a carrier part provided above the carrier part, and the common external terminal 12 of the light emitting element D is provided on a surface other than the bump terminal surface.

As described above, according to the present invention, the light emitting element D which emits light by passing a current is provided for each bump terminal 1, and the common external terminal 12 of the light emitting element D is provided on a surface other than the bump terminal surface of the carrier portion. A power supply Vi is applied to each joint 6 using the evaluation bump component. When the joint 6 between the bump component and the substrate is properly connected, the current from the power supply Vi flows through the joint 6, the resistance element R, the light emitting element D, and the common external terminal 12, and the light emitting element D emits light. However, when the joint 6 is not connected normally due to breakage, no current flows from the power supply Vi, and the corresponding light emitting element D does not emit light.

As described above, by visually checking the light emitting state of the light emitting element D corresponding to the joint 6 of the evaluation bump component, the breakage of the joint 6 for each bump terminal 1 can be reduced by one.
It is possible to easily detect the breakage of the joint 6 in a short time without conducting a continuity check manually and without using a connection method such as wire bonding. Further, since the light emitting element D is incorporated in the evaluation bump terminal in advance, even when the arrangement of the evaluation bump component on the substrate 3 is changed due to a design change or the like, the power supply Vi is not applied.
By simply changing the connection between the substrate and the substrate 3, it is possible to easily detect breakage without newly providing the light emitting element D and the resistance element R.

Fourth Embodiment FIG. 4 is a diagram of a bump component mounting evaluation method according to a fourth embodiment of the present invention, in which the number of bump terminals of the evaluation bump component is six for ease of explanation. This is an example.
In the figure, 1,3 to 5,8,9 and Vi are the conventional FIG.
0 and FIG. 11, 6 a to 6 f are joints corresponding to the bump terminals 1, and 13 are different in resistance values connected between the joints 6 for detecting breakage of the joint 6. This is an evaluation device for measuring the output voltage Vo divided by the resistance elements R1 to R6.

In the conventional component mounting and evaluation method using the bump component for evaluation shown in FIG. 8 in which only the two bump terminals 1 of the bump terminals 1 are internally connected as described above, When the junction 6 between the substrate and the substrate is properly connected, the resistance elements R1, R3, and R5 are short-circuited by the wiring 8 in the carrier of the bump component, so that the output voltage Vo is represented by "Equation 1". The voltage value is measured. However, when the joint 6 is not normally connected due to the break, the output voltage Vo corresponding to the broken joint 6 is measured. “Table 1” shows an example of the output voltage Vo corresponding to the joint 6 where the fracture has occurred.

[0030]

(Equation 1)

[0031]

[Table 1]

As described above, by measuring the output voltage Vo divided by the resistance elements R1 to R6, a combination of a plurality of break locations can be obtained. It is possible to easily detect the breakage of the joint 6 in a short time without conducting the continuity check manually.

[0033]

According to the first to third aspects of the present invention, the breakage of the bonding portion for each bump terminal is not manually checked one by one and the connection method such as wire bonding is not used. By visually checking the light emitting state of the light emitting element corresponding to the joint, it is possible to easily detect the break position of the joint in a short time.

According to the fourth aspect of the invention, the output voltage divided by the resistance element is measured without manually checking the rupture of the bonding portion for each bump terminal one by one by hand. Thus, it is possible to easily detect the breaking position of the joint.

[Brief description of the drawings]

FIG. 1 is a diagram showing Embodiment 1 of a bump component mounting evaluation method according to the present invention.

FIG. 2 is a diagram showing Embodiment 2 of a bump component mounting evaluation method according to the present invention.

FIG. 3 is a diagram showing a third embodiment of a bump component mounting evaluation method according to the present invention;

FIG. 4 is a diagram showing Embodiment 4 of a bump component mounting evaluation method according to the present invention.

FIG. 5 is a diagram showing a structure of a bump component having a protruding terminal.

FIG. 6 is a diagram showing a cross section of a joint when a bump component is mounted on a substrate.

FIG. 7 is a diagram showing internal connections between bump terminals of a conventional bump component for evaluation.

FIG. 8 is a diagram showing internal connections between bump terminals of a conventional bump component for evaluation.

FIG. 9 is a diagram showing a mounting evaluation method using a conventional bump component for evaluation.

FIG. 10 is a diagram illustrating a mounting evaluation method using a conventional bump component for evaluation.

FIG. 11 is a diagram showing a mounting evaluation method using a conventional bump component for evaluation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bump terminal 2 Carrier part 3 Substrate 4 Pad electrode 5 Connection material 6 Joint part 7 External electrode 8 Carrier wiring 9 Substrate wiring 10 Resistance meter 11 Evaluation device 12 Common external terminal 13 Evaluation device D Light emitting element Vi power supply

Claims (4)

[Claims] 1. An evaluation bump component having a plurality of projecting bump terminals, an evaluation board on which the evaluation bump component is mounted, and a bonding member for joining the evaluation bump component to the evaluation board. A step of significantly selecting a bonding condition consisting of a unique characteristic and an environmental condition at the time of bonding, a plurality of bump terminals of the evaluation bump component having the respective bump terminals of the evaluation bump component under the selected bonding condition. Bonding to each of the terminals, detecting a breaking position at a bonding portion between the bump terminal and the terminal, obtaining an optimum bonding condition based on the detection result, and obtaining the optimum bonding condition. Mounting the bump component and the substrate having the same specific characteristics as the evaluation bump component and the evaluation substrate based on the In the method of mounting a product, the method further comprises: a plurality of light emitting elements connected in series to the respective bump terminals; and a power supply for supplying a current to each of the light emitting elements. A method of mounting a bump component, wherein adjacent bump terminals are connected to each other and the step of detecting the break position is performed based on a light emitting state of the light emitting element. 2. The light emitting element is connected to the power supply in series, and the evaluation bump component is connected to an adjacent bump terminal and connected to an external terminal at a position separated from a bonding surface of the bump terminal. 2. The method according to claim 1, wherein the external terminal is connected to the bump terminal, and is connected in series to the power supply. 3. The bump component mounting method according to claim 1, wherein the light emitting element is provided on the evaluation bump component. 4. An evaluation bump component having a plurality of projecting bump terminals, an evaluation substrate on which the evaluation bump component is mounted, and a bonding member for bonding the evaluation bump component to the evaluation substrate. A step of significantly selecting a bonding condition consisting of a unique characteristic and an environmental condition at the time of bonding, a plurality of bump terminals of the evaluation bump component having the respective bump terminals of the evaluation bump component under the selected bonding condition. Bonding to each of the terminals, detecting a breaking position at a bonding portion between the bump terminal and the terminal, obtaining an optimum bonding condition based on the detection result, and obtaining the optimum bonding condition. Mounting the bump component and the substrate having the same specific characteristics as the evaluation bump component and the evaluation substrate based on the In the method of mounting a component, the method comprises: a plurality of resistors connected between the respective terminals; and a power supply connected in parallel to the resistors, wherein the bump component for evaluation has two bump terminals connected to each other. The method of mounting a bump component, wherein the step of detecting the breaking position is performed based on a light emitting state of the light emitting element.