JPH05346455A - In-circuit tester jig - Google Patents

Abstract

PURPOSE:To improve workability, cost and reliability in the manufacture of jig by realizing automatic interconnection of POGO pins. CONSTITUTION:POGO pins 9 held in a pin holder 4 on the side to be measured and POGO pins 10 held in a pin holder 7 on the measuring side are arranged, in large number, on the upper and lower stages of a jig. A relay board 6 connecting corresponding pins 9, 10 is interposed between the upper and lower stages. A wiring 18 for electrically interconnecting corresponding pins is formed on the relay board 6. The POGO pins 9 on the side to be measured and the POGO pins 10 on the measuring side are pressed, respectively, against the wiring 18, and the POGO pins to be connected are connected electrically through the wiring 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an in-circuit tester jig for electrically inspecting electronic components while mounted on a printed circuit board, and more particularly to a connecting jig interposed between a measuring system and a measured system. Regarding improvement.

[0002]

2. Description of the Related Art Generally, an IC mounted on a printed circuit board.
An in-circuit tester is used for the electrical inspection of.
This in-circuit tester presses pogo pins against the nodes of the printed circuit board to be electrically connected to the measurement system, and checks for the presence or absence of ICs, missing parts inspection, different parts inspection, and direction confirmation. Various inspections such as a direction inspection and a characteristic value inspection such as chip resistance are performed.

By the way, as shown in FIG. 2, in the in-circuit tester, in order to have versatility, the pin holder 4,
A connection jig is used in which the pogo pins 9 and 10 held in 7 are used in two upper and lower stages. The upper pogo pin 9 is a pogo pin for the system under measurement having a pin arrangement that matches the node of the printed circuit board 2 under measurement on which the IC 1 is mounted, and it is necessary to separately prepare each type of printed circuit board 2 under measurement. The lower pogo pin 10 is a pogo pin for a measurement system having a fixed pin array corresponding to the electrode 11 of the electrode substrate 8.

As described above, the upper pogo pin array and the lower pogo pin array do not correspond in physical position. Therefore, in order to electrically inspect the printed circuit board 2 to be measured through the pogo pins 9 and 10, it is necessary to electrically connect the corresponding pogo pins 9 and 10 in the upper and lower stages, which are different from each other.
Conventionally, manual wire wrapping 14 has been used for electrical connection between the pogo pins 9 and 10.

[0005]

However, the above-mentioned conventional techniques that rely on wire wrapping have various problems as described below.

(1) The number of nodes on the printed circuit board to be measured is very large, and it is necessary to set pins for all of them for inspection. With a large number of pins, the number reaches about 2500 to 3000. If the pin-to-pin connection is performed by wire wrapping, the workability of jig production is extremely poor, it takes time, the time required for delivery is long, and the produced jig is very expensive.

(2) Even if the jig becomes expensive in this way, if printed boards of the same kind are mass-produced, the overall cost including the pin holder and the like will be reduced, so that importance is given to that extent. Although not available, high prices have become a very important issue in recent years due to the trend toward high-mix low-volume production. For example, a jig for measuring this may be higher than a printed circuit board. This situation must be improved even if it is improper in view of the balance with the printed circuit board price.

(3) Further, since the connecting work is performed manually, there is a risk of connecting wrong pins, which is unreliable.

An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art by interposing a relay substrate between the pins, to make the in-circuit tester highly reliable in a short time and of high reliability. To provide a jig.

[0010]

The in-circuit tester jig of the present invention is a test in which one end is pressed against each node, which is arranged corresponding to a node of a printed circuit board under measurement on which an electronic component such as an IC is mounted. The pin holders on the measurement system side that hold the pins and the electrodes on the electrode board that are connected to the measurement system that electrically tests the electronic components mounted on the printed circuit board under measurement are arranged corresponding to one end of each electrode. The measurement system side pin holder that holds the pressed test pin is provided, and the measurement system side test pin and the measurement system side test pin and the measurement system side test pin are held between the test pin held by the measurement system side pin holder and the measurement system side pin holder. The other ends of the side test pins are pressed against each other, and a relay board is provided in which wirings for electrically connecting corresponding pins to be interconnected are formed.

The electronic parts include integrated parts such as ICs or composite parts, as well as individual parts such as transistors, capacitors and resistors. The printed circuit board to be measured may be a single layer or a multilayer. The test pin is a pogo pin that is pressed against a node on the substrate with a spring or the like to make an electrical connection. The test-system-side test pin has a different pin arrangement depending on the print-circuit board to be measured, and the test-system-side test pin has a pin arrangement fixed by the system regardless of the print-circuit board to be measured. The wiring of the relay board is formed by printed wiring, and the wiring may be a single layer or a multilayer.

[0012]

The arrangement of the test pins on the measured system side is determined in advance corresponding to the nodes of the printed circuit board to be measured, and the pin holder on the measured system side holding the pin is formed. Also, the measured system side test pin and the measured system to which this measured system side test pin should be connected to the relay board provided between the measured system side test pin and the measured system side test pin arranged corresponding to the electrodes. A wiring for connecting the corresponding pins is formed in advance so that the side test pins are electrically connected to each other only by pressing the pins.

Then, one end of the measured system side test pin is pressed against the node of the measured printed circuit board, and one end of the measured system side test pin is pressed against the electrode of the electrode substrate. When the test pin on the system to be measured and the other end of the test pin on the system to be measured are pressed against the wiring formed on the relay board from each surface, the electrodes of the measurement system and the printed circuit board to be measured without wire wrapping. Is electrically connected to the node, and an electrical inspection by the measurement system can be performed.

[0014]

EXAMPLE An example of the present invention will be described below with reference to FIG. FIG. 1 shows a sectional structure of a connection jig of an in-circuit tester according to this embodiment. The jig is composed of an upper stage on the side of the system to be measured and a lower stage on the side of the measurement system, and a relay board 6 which is a main part of the present invention is interposed between them.

The upper row shows a number of I's, which are electronic components on the top.
Printed circuit board 2 to be measured on which C1 is mounted and to be measured
Is attached, and the reinforcing plate 3 is secondly applied to the back surface of the printed circuit board 2 to be measured. The reinforcing plate 3 is provided as necessary, but it reinforces the strength of the measured printed circuit board 2 so as to sufficiently withstand the pressing force applied to the measured printed circuit board 2 when the pogo pin 9 is pressed. is there. Holes are formed in the reinforcing plate 3 at positions corresponding to the total number of nodes formed on the back surface of the printed circuit board 2 to be measured, and one end of the pogo pin 9 is inserted through the hole, so that the pogo pin 9 One end of it is pressed against the node. The pogo pin 9 is held by a third pin holder (pogo pin holder) 4 on the side of the system to be measured, the middle portion of the pin is embedded in the through hole opened in the pin holder 4, and the upper and lower ends are vertically fixed in a fashionable manner. .. A spring 1 is provided at both ends of the pogo pin 9 held by the pin holder 4 on the measured system side.
5 is provided, and the elastic force of the spring 15 is used for pressing. The springs 15 do not necessarily have to be provided at both ends, and either one may be provided.

At the bottom, the electrode substrate 8 for connecting the jig and the measurement system 13 via the lead wire 12 is arranged at the bottom. The measurement system 13 is a main body of an in-circuit tester that electrically inspects the IC 1 mounted on the printed circuit board 2 to be measured, sends an inspection signal to the printed circuit board 2 to be measured, and is inspected from the printed circuit board 2 to be measured. It is designed to receive signals. The electrode substrate 8 is provided with a large number of fixed electrodes 11 whose arrangement is standardized. The electrodes 11 are elastically held and embedded by a spring 17, and when the pogo pin 10 is pressed, the elasticity of the pin 11 causes the pin 10 to move. Enhances the contactability of. The pogo pins 10, which are arranged corresponding to the electrodes 11 of the electrode substrate 8 and whose one end is pressed against the electrodes 11, are held by the measurement system side pin holder (pogo pin holder) 7 on the second surface and inside the through hole opened in the pin holder 7. It is vertically fixed with a shape in which the middle part is embedded and with its upper and lower ends protruding. A spring 16 is provided at the other end (upper end) of the pogo pin 10 held by the measurement system side pin holder 7, and the elastic force of the spring 16 is used for pressing.

As described above, a large number of pogo pins 9 and 10 are erected on the upper and lower stages of the jig and arranged so that their axial directions are aligned. However, the pogo pins 10 erected corresponding to the positions of the electrodes 11 on the lower stage and the pogo pins 9 erected corresponding to the node positions of the measured printed circuit board 2 on the upper stage have a physical position between the pins. As described above, they do not correspond to each other.

Between such an upper stage and a lower stage, that is, between the pogo pin 9 held by the pin holder 4 to be measured and the pogo pin 10 held by the pin holder 7 on the measuring system,
A relay board 6 is provided to connect these corresponding pins. Wirings 18 are formed on the relay board 6 to electrically connect corresponding pins that are desired to be connected to each other, and the other ends of the measured system side pogo pin 9 and the measured system side pogo pin 10 are pressed against the wirings 18, respectively. When applied, the pogo pins to be connected are electrically connected via the wiring 18. A reinforcing plate 5 for reinforcing the relay board 6 is applied to the front surface or the back surface of the relay board 5, if necessary.

Now, in the above structure, if the upper and lower stages of the jig are pressed from above or below or the upper stage is pressed to the lower stage, one end (upper end) of the pogo pin 9 is in the upper stage.
Is pressed against the node on the back surface of the measured wave printed circuit board 2 by the spring 15 to be electrically connected. In the lower stage, one end (lower end) of the pogo pin 10 is pressed against the surface of the electrode 11 of the electrode substrate 8 by the spring 16 to be electrically connected. And, in the middle stage, the other end (lower end) of the pogo pin 9
Is pressed against the front surface side of the wiring 18 of the relay board 6 by the spring 15, and the other end (upper end) of the pogo pin 10 is pressed against the back surface side of the wiring 18 of the relay board 6 by the spring 16 to electrically connect the pogo pins. Connected to each other. As described above, in this embodiment, if the relay board 6 having the wiring 18 corresponding to the printed circuit board 2 to be measured is prepared in advance, the pogo pins to be connected can be electrically connected by pressing without wire wrapping work.

By the way, the relay board 6 on which the wiring 18 is formed
Is manufactured as follows. The position of the relay board 6 on which the pogo pins 9 or 10 are to be set depends on the printed board 2 to be measured.
It is known from the CAD data when designing the pin holder 4 to be measured, which is made on the basis of the above node, and the CAD data when designing the measurement pin holder that is predetermined corresponding to the position of the electrode 11. Therefore, the wiring can be designed based on the data. Since the produced relay board 6 is a dedicated board that is composed only of wiring on which no elements or parts are mounted, it can be manufactured at a very low cost. In this case, a particularly known automatic wiring system, that is, an automatic router can be used. This is because the number of wirings required on the relay board 6 is smaller than that of a printed circuit board that is a normal object to be measured, and is about 1/10, which is optimal for design and manufacture by an autorouter. If the wiring of the relay board 6 is automatically designed by an autorouter, the labor of pattern design can be significantly reduced, the jig manufacturing efficiency can be further improved, and the jig manufacturing cost can be reduced.

As described above, according to this embodiment, the upper and lower pogo pins can be automatically connected without wire wrapping simply by interposing the relay substrate 6 prepared in advance, and the relay substrate can be easily manufactured. effective.

(1) Even if the number of nodes on the printed circuit board increases, the pins are automatically connected by pressing the upper and lower jigs, so the workability is extremely good and the time is short.
Since the time required for delivery is also short, the jig is very cheap.

(2) When the cost of the jig becomes low in this way, it is possible to optimize the balance with the board price of the printed board, which tends to be of a large variety and small in quantity.

(3) Further, since the production of the relay board and the connection through the relay board can be automatically performed, troubles such as connection mistakes are eliminated, and the reliability is improved.

[0025]

According to the present invention, the relay board having the wiring for electrically connecting the corresponding pins is provided between the measured system side test pin and the measured system side test pin. By simply pressing the measured system side test pin and the measured system side test focus, the desired test pins can be electrically connected. Therefore, as compared with the conventional method in which manual work by wire wrapping is performed, the connection can be automated, so that the workability is dramatically improved, and connection mistakes are eliminated, so that the reliability is high and the manufacturing cost is low.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a main part of an in-circuit tester jig according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a main part of an in-circuit tester jig according to a conventional example.

[Explanation of symbols]

 1 IC (electronic component) 2 Printed board under test 4 Test pin holder under test (pogo pin holder) 6 Relay board 7 Test pin holder under test (pogo pin holder) 8 Electrode board 9 Pogo pin (test pin under test) 10 Pogo pin (measurement system side test pin) 11 Electrode 12 Lead wire 13 Measurement system 18 Wiring

Claims (1)

[Claims] 1. A pin holder for a system to be measured, which holds test pins arranged corresponding to nodes of a printed circuit board on which electronic components are mounted and whose one end is pressed against each node, and mounted on the printed circuit board to be measured. The measurement system side pin holder that holds the test pins that are arranged corresponding to the electrodes on the electrode substrate that is connected to the measurement system that electrically tests the electronic components The other end of the measured system side test pin and the other side of the measured system side test pin should be pressed between the test pin held by the measured system side pin holder and the measured system side pin holder, and should be interconnected. An in-circuit tester jig having a relay board on which wiring for electrically connecting corresponding pins is formed.