JPH11293891A - Base for bonding tile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a base easy to machine and to provide almost uniform adhesive strength for the entire surface of a tile. SOLUTION: A plurality of tile-bonding projecting parts 15 each projecting toward the front surface of a base 11 and having an adhesive hole 22 therein are formed on the tile bonding part 19 of the base 11 and a plurality of air- layer-forming projecting parts 15 are formed on the opposite side, the base 11 having guide projections 13 formed to project from its surface, for locking the lower part of a tile. The base 11 is made of such a metal as is resistant to rusting. The guide projections 13 are formed by shearing the base 11 in a transverse, parallel direction and punching the portions between the sheared parts so that the portions are extruded toward the front surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a tile-attaching substrate.

[0002]

2. Description of the Related Art Some buildings have tile walls as outer and inner walls. Conventionally, such a tile wall has been constructed by, for example, pressure bonding a tile on a mortar base using an adhesive mortar.

However, since the mortar base is heavy, there is a problem that sufficient strength is required for a building. In addition, there is a problem that the plastering work on the base of the mortar takes a considerable number of days, and moreover, it takes about one week to ten days for the mortar to dry and solidify after the construction, so that the construction period becomes long. Furthermore, since the tile is attached to the mortar base using the bonding mortar as described above, there is a problem that a heavy tile may sag or fall before being fixed. Was. In addition, there is a problem that considerable skill is required for orderly arrangement of tiles on a mortar base.

[0004] In order to solve the above problem, a tile sticking substrate as disclosed in Japanese Utility Model Publication No. 7-35003 has been proposed. The tile attaching substrate is shown in FIG.
As shown in FIG. 13, a substrate material 2 such as a stainless steel or aluminum thin plate which can be attached to a base plate 1 constituting a wall surface using screws (not shown) is provided, and a large number of substrates are provided on the entire surface of the substrate material 2 on average. By forming the through hole 3 of the above, and bending the substrate material 2 toward the front surface side, the guide ridge 5 extending in the horizontal direction and capable of locking the lower surface of the tile 4 is formed with the vertical dimension of the tile 4. A plurality of grooves 6 are formed in the longitudinal direction at substantially equal intervals, and a plurality of grooves 6 extending in the horizontal direction are formed between the guide protrusions 5 by bending the substrate material 2 toward the back surface side. In the drawing, reference numeral 7 denotes an adhesive applied to the back surface of the tile 4, and reference numerals 8 and 9 denote adhesive surfaces of the substrate 2.

[0005] According to such a configuration, the substrate material 2 having a large number of through holes 3 formed on the entire surface thereof is brought into contact with the base plate 1 constituting the wall surface, and the substrate material 2 is formed by using screws (not shown). The substrate material 2 is fixed to the base plate 1 by fastening between the concave strip 6 and the base plate 1. After that, the adhesive 7 is applied to the back surface along the guide ridge 5 projectingly formed on the substrate material.
Is applied so that the tiles 4 coated with are applied. At this time, the adhesive 7 is filled into the recess 6 and
The tiles 4 escape from the periphery of the tiles 4 in all directions, and partially escape to the back side through the through holes 3. Thus, the substrate material 2
By using a mortar, a mortar base is not required, and the weight of the wall surface can be reduced and the construction period can be shortened. Moreover, the substrate material 2
With the guide ridges 5 formed in this manner, it is possible to prevent the tiles 4 from sagging and dropping, and to arrange the tiles 4 neatly without skill.

[0006]

However, the above-mentioned substrate for tile attachment has the following problems. That is, as a means for forming the guide ridges 5 and the concave ridges 6 on the substrate material 2, a drawing process by a press is usually used.
Since the substrate for tile attachment has a complicated uneven shape,
It is necessary to use a material having a remarkably high elongation rate for the substrate material 2, and accordingly, the material cost increases.

In particular, the bonding surface 8 of the substrate 2 and the guide ridge 5
If the corner 10 between the top and the bottom of the tile 4 is not sharp, the tile 4 slips and falls as shown by the imaginary line in FIG. 13, and the tile 4 must be held down until the adhesive 7 hardens. However, forming the corner 10 at an acute angle involves difficulties in press working and mechanical properties of the material.

In order to provide a plurality of guide ridges 5 having different intervals depending on the size of the tile 4 to be used, it is necessary to prepare a large number of press dies. Costly.

Further, in press working, there is a limit to the size of the mold, so that a too long tile-attaching substrate cannot be produced. Therefore, a large number of joints are formed between the tile-attaching substrates at the time of construction, but it is difficult to align the tile-attaching substrates, and if there is a misalignment, the tile wall is not beautifully finished.

In addition, there is a problem that the adhesive strength of the tile 4 to the substrate material 2 becomes uneven at each part, and a strong adhesive state cannot be obtained. That is, in the case of FIGS. 12 and 13,
At the center of the tile 4, the bonding surface 9 is widened, and the adhesive 7 sufficiently escapes from the through-hole 3 to the rear surface side to form a nail head-like mass and exerts a locking force, so that a high bonding strength is obtained. Can be On the other hand, in the upper and lower portions of the tile 4, the area of the adhesive surface 8 is relatively small, and the adhesive 7 easily escapes in four directions. Since a nail-like mass cannot be formed, only a weak adhesive strength can be obtained. Further, since the back surface of the through hole 3 is closed by the base plate 1 in the recess 6, the adhesive 7 cannot escape to the back surface, so that a nail-head-like mass is not formed and locking force cannot be obtained. .

In addition, the above configuration has a problem that the tile 4 cannot be mounted when the base plate 1 has an r-shaped curved surface. That is, in the r-shaped concave curved surface, the interval between the adjacent guide ridges 5 becomes narrow, so that the tile 4 cannot be inserted between them, and in the r-shaped convex curved surface, the space between the adjacent guide ridges 5 becomes small. This is because the interval is widened and the tiles 4 easily fall off from the guide ridges 5.

The present invention has been made in view of the above-mentioned problems of the above-described structure, and is easy to process, can obtain substantially uniform adhesive strength over the entire surface of the tile, and can save expensive adhesive. It is intended to provide a substrate for tile attachment.

[0013]

SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a tile having an adhesive through-hole which is projected to one side from a tile bonding portion of a substrate material on which a guide projection for locking a lower portion of the tile is projected. A fundamental feature is that a plurality of bonding projections are formed.

More specifically, a configuration is conceivable in which the tile bonding protrusion is a burring hole having an adhesive through hole at the top of a tapered peripheral portion. In addition, the guide protrusions shear the substrate material in the horizontal direction in parallel,
A configuration or the like in which a punching process is performed so as to alternately extrude between the sheared portions to the respective sides of the front surface and the back surface can be considered. Further, a configuration is conceivable in which a plurality of protrusions for air layer formation are formed on the substrate material so as to protrude to the side opposite to the surface on which the tile-bonding protrusions are formed, and form an air layer between the wall surfaces.

With the above configuration, the following operation can be obtained. That is, when constructing a tile wall, a board material is attached to the wall surface,
Thereafter, while being locked to the guide projection formed on the substrate material, a tile coated with an adhesive is attached to the back surface. At this time, a tile bonding protrusion projecting to the sticking surface side was formed on the substrate material, and an adhesive through hole was formed in the tile bonding protrusion, so that the adhesive first passed through the adhesive through hole. It escapes to the opposite side, and a lump larger than the adhesive through hole is formed inside the tile bonding projection. After that, the surplus adhesive is filled in the gap between the back surface of the tile and the tile bonding portion, and the surplus adhesive escapes to the four sides of the tile.

As described above, the use of the above-mentioned substrate material eliminates the need for a mortar base, thereby making it possible to reduce the weight of the wall surface and shorten the construction period. Moreover, the guide projections formed on the substrate material can prevent the tiles from sagging and falling, and can arrange the tiles neatly without requiring skill.

Furthermore, the guide projections are formed by ordinary punching and the like, and the tile bonding projections can be formed by ordinary extrusion processing such as burring. It can be easily manufactured without the necessity.

Accordingly, the degree of freedom for the material of the substrate material is increased, and the cost can be reduced accordingly.
Further, by forming the guide projections into a punched configuration, the acute angle of the corner between the general surface of the substrate material and the upper portion of the punched portion does not matter, and therefore, the tile does not slip at this portion.

Further, in the case of manufacturing a product having a different guide protrusion interval according to the size of the tile to be used, it is possible to adjust the feed amount of the substrate material or to adjust the timing of punching or the like. There is no need to prepare many molds.

[0020] Further, since processing such as punching and burring is performed by repeatedly using a small mold,
It is possible to make long tile application substrates. Therefore, at the time of construction, the number of joints between the tile-attaching substrates is reduced, and displacement of the tile-attaching substrate is less likely to occur, so that the tile wall can be beautifully finished.

In addition, since a tile bonding protrusion projecting to the front surface side is formed on the substrate material and an adhesive through hole is formed in the tile bonding protrusion, the adhesive first passes through the adhesive through hole. Escape to the back side to form a lump larger than the adhesive through hole inside the tile bonding projection, and then the excess adhesive is filled into the gap between the back surface of the tile and the tile bonding part, Excess adhesive will escape to all sides of the tile. Therefore, the adhesive passing through the adhesive through-hole can be formed into a large lump regardless of the location, so that substantially equal locking effects can be obtained between the upper and lower portions and the center portion of the tile, and the tile substrate material can be obtained. Adhesive strength to the surface can be made uniform.

Further, by forming a plurality of air layer forming projections on the substrate material, which protrude to the side opposite to the tile bonding projection forming surface and form an air layer between the tile wall and the wall surface, the drying of the wall surface is promoted. An effect, a high drainage property, a heat insulating effect, and a soundproofing effect can be obtained.

In addition, in the above configuration, even when the base plate has an r-shaped curved surface, the spacing between adjacent guide protrusions hardly increases or decreases, so that tiles can be mounted. .

[0024]

Embodiments of the present invention will be described below. FIG. 1 and FIG. 2 show a first embodiment of the configuration of the present invention. In the figure, reference numeral 11 denotes a base plate 12 constituting a wall surface
, A guide projection for locking the lower portion of the tile 14, a projection 15 for tile bonding formed on the surface of the substrate 11, and a side opposite to the projection. The air layer forming projections 16 are formed so as to protrude, and the adhesive 16 applied to the back surface of the tile 14 is shown.

The substrate material 11 is made of a metal material that does not easily rust.

The guide projection 13 is, for example,
1 was sheared in parallel in the lateral direction, and punched so as to extrude between the sheared portions to the surface side. Needless to say, a configuration may be employed in which a portion between the sheared portions is punched so as to be alternately extruded toward the front surface and the back surface. The plurality of guide projections 13 are formed in the horizontal direction at intervals substantially equal to or smaller than the horizontal dimension of the tiles 14 and at intervals substantially equal to the vertical dimensions of the tiles 14. A plurality is formed in the vertical direction.

The tile bonding projection 15 forms an adhesive through hole 18 in the substrate material 11 by, for example, burring, and protrudes a peripheral portion 17 of the adhesive through hole 18 to the front side or the back side. In this way, the whole is tapered. The air layer forming projections 15 are formed in the same manner. However, a plurality of air layer forming projections 15 are formed on the substrate material 11 so as to protrude to the side opposite to the surface on which the tile bonding projections 15 are formed so that an air layer can be formed between the wall surfaces. Form. And the two protrusions 1
5 is formed almost uniformly on the tile bonding portion 19 between the guide projections 13. Further, the protrusion amount of the tile bonding protrusion 15 is set to be smaller than the protrusion amount of the guide protrusion 13.

When constructing a tile wall, a substrate material 11 is attached to a base plate 12 constituting a wall surface by using screws (not shown). Thereafter, the tiles 14 to which the adhesive 16 has been applied are adhered to the back surface while being locked to the guide projections 13 formed on the substrate material.

At this time, a tile bonding projection 15 projecting to the front surface side is formed on the substrate material 11 and an adhesive through hole 18 is formed in the tile bonding projection 15, so that the adhesive 16 It escapes to the back side through the adhesive through hole 18 to form a nail head-like mass inside the tile bonding projection 15.
After that, the surplus adhesive 16 is filled in the gap between the back surface of the tile 14 and the tile bonding portion 19, and the surplus adhesive 16 escapes to the four sides of the tile 14.

As described above, the use of the substrate material 11 eliminates the need for a mortar base, and makes it possible to reduce the weight of the wall surface and shorten the construction period. In addition, the guide protrusions 13 formed on the substrate material 11 can prevent the tiles 14 from sagging or dropping, and can neatly arrange the tiles 14 without skill.

Further, the guide projection 13 is formed by ordinary punching, and the tile bonding projection 15 and the air layer forming projection 15 can be formed by ordinary extrusion such as burring. There is no need to bend the entire substrate material 11 and it can be easily manufactured.

Accordingly, the degree of freedom for the material of the substrate material 11 is increased, and the cost can be reduced accordingly. In addition, since the guide projection 13 is formed by punching as described above, the acute angle of the corner between the general surface of the substrate material 11 and the upper part of the guide projection 13 does not matter, and therefore, in this portion, No slippage of the tiles 14 occurs.

Further, in the case of manufacturing a product in which the interval between the guide projections 13 is different depending on the size of the tile 14 to be used,
Since it can be performed by adjusting the feed amount of the substrate material 11 or adjusting the timing of punching, it is not necessary to prepare a large number of press dies.

Further, since processes such as punching and burring are performed by repeatedly using a small mold,
It is possible to make long tile application substrates. Therefore, at the time of construction, the number of joints between the tile-attaching substrates is reduced, and displacement of the tile-attaching substrate is less likely to occur, so that the tile wall can be beautifully finished.

Further, since a tile bonding projection 15 projecting to the front surface side is formed on the substrate material 11 and an adhesive through hole 18 is formed in the tile bonding projection 15, the adhesive 16
It escapes to the back side through the adhesive through hole 18 to form a nail-head-like mass inside the tile bonding projection 15. Thereafter, the surplus adhesive 16 is filled in the gap between the back surface of the tile 14 and the tile bonding portion 19, and the surplus adhesive 16 is further filled with the tile 1.
4 escapes in all directions. Therefore, the adhesive hole 1
Since the adhesive 16 that has passed through 8 can be formed into a large lump regardless of the location, almost the same nail head effect can be obtained between the upper and lower portions and the central portion of the tile 14, and the tile 14 Adhesive strength can be made uniform.

Furthermore, a plurality of air layer forming projections 15 are formed on the substrate material 11 so as to protrude to the side opposite to the surface on which the tile bonding projections 15 are formed, and form an air layer between the wall surface and the base material 11. Since the air layer 38 is formed between the plate material 11 and the base plate 12, the effect of promoting drying on the wall surface can be obtained. In other words, when the wall is made of concrete, it is generally said that it takes about 5 years for the concrete to completely dry after casting. And the like, and the tile 14 falls on the outdoor side. In the present embodiment, since the air layer 38 allows moisture contained in the concrete to escape, drying of the wall surface is promoted, and an effect of preventing dew condensation on the indoor side,
The effect of preventing the tiles 14 from falling on the outdoor side can be obtained.

The air layer 38 can provide high drainage. In other words, provided that the air layer 38 is provided on the condition that the air-permeable and moisture-permeable waterproof paper is used for the base plate 12 or a waterproof liquid having the same effect is applied to the base plate 12,
The rainwater that has entered from the joint flows downward through the narrow air layer 38 between the base material 11 and the base plate 12, and is discharged to the bottom of the wall surface. This can prevent the efflorescence phenomenon and the peeling phenomenon of the tile 14.

The air layer 38 can provide a heat insulating effect. As a result, the influence of the outside air temperature or the heat of irradiation with sunlight can be cut off.

Further, a soundproofing effect can be obtained by the air layer 38. Thus, noise generated indoors and outdoors can be reduced.

In addition, in the above configuration, even when the base plate 1 has an r-shaped curved surface, the spacing between the adjacent guide projections 13 hardly increases or decreases, so that the tiles 14 can be mounted. Become like

FIGS. 3 (a) and 3 (b) show a second embodiment of the structure of the present invention, in which a tile bonding projection 21 and an air layer formation projection 21 are connected to a V-shaped bridge. It is what it was. Accordingly, the guide projection 20 is a V-shaped bridge.

In such a case, the adhesive through holes 22 are formed in the upper and lower two places of the tile bonding protrusion 21 constituted by the bridge, and the two adhesive through holes 22 are formed in the tile bonding protrusion 21. Since the adhesive 16 enters into a loop-shaped mass, a larger locking force can be obtained. Except for the above, the configuration is the same as that of the above-described embodiment, and the same operation and effect can be obtained.

FIGS. 4 (a) and 4 (b) show a third embodiment of the present invention, in which the tile bonding projection 24 is a substantially circular bridge, and this circular bridge is used. An adhesive through hole 25 is formed at two upper and lower locations. Further, the air layer forming projections 24 formed on the opposite surface side
Has a similar configuration. Accordingly, the guide projection 23 is a substantially arc-shaped bridge. Except for the above, the second embodiment has the same configuration as that of the second embodiment, and the same operation and effect can be obtained. In each of the above embodiments, the guide projections 13, 2
The bridges forming the projections 21 and 24 for bonding the tiles 0 and 23 and the projections 21 and 24 for forming the air layer may be any of a flat type, a V-shaped type, and an arc type, and these may be appropriately combined. You may do it.

FIGS. 5 and 6 show a fourth embodiment of the present invention, in which a tile-adhesion projection 27 is passed through a round head-shaped extruded portion by a cross-shaped cut-out of an adhesive. This is a stub having a hole 28. The air layer forming projection 27 formed on the opposite side has the same configuration.

In such a case, the adhesive 16 enters the tile bonding projection 27 from the adhesive through hole 28 formed by the cross-shaped cut and becomes a lump larger than the adhesive through hole 28. A stopping effect can be obtained. Reference numeral 29 denotes a guide projection 26 which is an arc-shaped bridge,
Is a through-hole formed in a portion serving as a joint.

As described above, the guide protrusion 26 and the substrate 1
By forming the through-hole 29 in the portion serving as the first joint, the adhesive 16 enters through the through-hole 29 and forms a nail-shaped lump on the back surface side of the substrate material 11, so that the locking force is further improved. Can be expected. Except for the above, the configuration is the same as that of the above-described embodiment, and the same operation and effect can be obtained.

FIGS. 7 (a) and 7 (b) show a fifth embodiment of the present invention, in which a tile bonding projection 31 and an air layer formation projection 31 are punched pockets. It is. Further, the guide projection 30 is formed as a punched pocket.

In this case, the adhesive flows into the tile bonding projection 31 through the adhesive bonding hole 32 formed above the tile bonding projection 31 which is a punched pocket, and the adhesive flows through the adhesive bonding hole. Since the mass is larger than 32, a large locking effect can be obtained. Except for the above, the configuration is the same as that of the above-described embodiment, and the same operation and effect can be obtained.

FIGS. 8 (a) and 8 (b) show a sixth embodiment of the present invention, in which a tile bonding projection 34 and an air layer formation projection 34 are provided with an adhesive passing upward. This is a punched pocket having a hole 35, and the guide projection 33 is cut and raised. Except for the above, the fifth embodiment has the same configuration as that of the fifth embodiment, and has the same operation and operation.
The effect can be obtained.

FIGS. 9 to 11 show a seventh embodiment of the present invention, in which a tile bonding projection 40 and a corresponding air layer forming projection 41 are formed on a substrate material 11. Are formed by extrusion on the front side and the back side, respectively. Except for the above, the configuration is the same as that of the above embodiment, and the same operation and effect can be obtained.

It should be noted that the present invention is not limited to only the above-described embodiments, and that other combinations of the above-described embodiments are possible, and that other combinations are possible without departing from the gist of the present invention. Of course, various changes can be made. For example, the tile 14 of the present invention includes various wall materials such as bricks, natural stones, artificial stones, and composite plates including metal plates.

[0052]

According to the configuration of the present invention described in detail above, the use of the substrate material eliminates the need for a mortar base,
It is possible to reduce the weight of the wall and shorten the construction period. Moreover, the guide projections formed on the substrate material can prevent the tiles from sagging and falling, and can arrange the tiles neatly without requiring skill.

Further, the guide projections are formed by ordinary punching and the like, and the tile bonding projections can be formed by ordinary extrusion processing such as burring. It can be easily manufactured without the necessity. Therefore, the degree of freedom for the material of the substrate material is increased, and the cost can be reduced accordingly. In addition, by making the guide projection a punched configuration,
The acute angle of the corner between the general surface of the substrate material and the upper part of the guide protrusion is no longer a problem, so that no slippage of the tile occurs at this point.

In the case of manufacturing a product having a different guide protrusion interval according to the size of the tile to be used, it can be performed by adjusting the feed amount of the substrate material or the timing of punching or the like. There is no need to prepare many molds.

Further, since processes such as punching and burring are performed by repeatedly using a small mold, a long tile bonding substrate can be produced. Therefore, at the time of construction, the number of joints between the tile-attaching substrates is reduced, and displacement of the tile-attaching substrate is less likely to occur, so that the tile wall can be beautifully finished.

Also, since a tile bonding projection projecting to the front surface side is formed on the substrate material and an adhesive through hole is formed in the tile bonding projection, the adhesive first passes through the adhesive through hole. Escape to the back side to form a lump larger than the adhesive through hole inside the tile bonding projection, and then the excess adhesive is filled into the gap between the back surface of the tile and the tile bonding part, Excess adhesive will escape to all sides of the tile. Therefore, the adhesive passing through the adhesive through-hole can be formed into a large lump regardless of the location, so that substantially equal locking effects can be obtained between the upper and lower portions and the center portion of the tile, and the tile substrate material can be obtained. Adhesive strength to the surface can be made uniform.

Further, by forming a plurality of projections for forming an air layer on the substrate material projecting to the rear surface side and forming an air layer between the substrate and the wall surface, a drying promoting effect on the wall surface, a high drainage property, heat insulation, An effect and a soundproofing effect can be obtained.

In addition, in the above configuration, even when the base plate has an r-shaped curved surface, the interval between the adjacent guide projections hardly increases or decreases, so that the tile can be mounted. .

[Brief description of the drawings]

FIG. 1 is a perspective view showing a tile bonding substrate according to a first embodiment of the present invention.

FIG. 2 is a side sectional view of FIG.

FIG. 3 is a perspective view showing a tile bonding substrate according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a tile attaching substrate according to a third embodiment of the present invention.

FIG. 5 is a front view showing a tile attaching substrate according to a fourth embodiment of the present invention.

FIG. 6 is a side view of FIG. 5;

FIG. 7 is a perspective view showing a tile bonding substrate according to a fifth embodiment of the present invention.

FIG. 8 is a perspective view showing a tile attaching substrate according to a sixth embodiment of the present invention.

FIG. 9 is a front view showing a tile attaching substrate according to a seventh embodiment of the present invention.

FIG. 10 is a side view of FIG. 9;

FIG. 11 is a cross-sectional view of a portion of the tile bonding protrusion of FIG. 9;

FIG. 12 is a perspective view showing a tile bonding substrate according to a conventional example.

FIG. 13 is a side sectional view of FIG. 12;

[Explanation of symbols]

11
Substrate material 12
Base plate 13, 20, 23, 26, 30, 33
Guide projection 14
Tiles 15,21,24,27,31,34
Tile adhesive projections 18, 22, 25, 28, 32, 35
Adhesive through hole 19
Tile bonding part 15, 21, 24, 27, 31, 34, 41
Air layer forming projection 38
Air layer

Claims (4)

[Claims] 1. A plurality of tile bonding projections projecting to one surface side and having an adhesive through hole are formed on a tile bonding portion of a substrate material having a guide projection locking a lower portion of a tile. Characteristic tile bonding substrate. 2. The tile bonding substrate according to claim 1, wherein the tile bonding projection is a burring hole having an adhesive through hole at the top of a tapered peripheral portion. 3. The method according to claim 1, wherein the guide projections are formed so as to shear the substrate material in a lateral direction in a parallel manner, and to punch out between the sheared portions alternately toward the front surface and the back surface. The tile bonding substrate according to claim 1 or 2. 4. A plurality of air layer forming projections, which protrude to the side opposite to the tile bonding projection forming surface and form an air layer between the wall and the wall surface, are formed on the substrate material. 1
4. The substrate for attaching a tile according to claim 3.